JP2003282609A - Semiconductor device for fingerprint recognition and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve operability upon contacting a finger with a fingerprint detecting area, in a semiconductor device for effecting the fingerprint recognition by tracing a finger on the fingerprint recognition area of a semiconductor element for fingerprint recognition and the manufacturing method thereof. <P>SOLUTION: In the semiconductor device for fingerprint recognition having the semiconductor element 11 provided with the fingerprint recognition area 15 for effecting the fingerprint recognition, an external connecting terminal 13, and a wiring board 12 for electrically connecting the semiconductor element 11 to the external connecting terminal 13, the semiconductor element 11 is connected to the wiring board 12 through a flip chip. Further, an opening part 16 is formed on the wiring board 12 while the opening part 16 is constituted so as to be opposed to the fingerprint recognition area 15. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device for fingerprint recognition and a method for manufacturing the same, and more particularly to a semiconductor device for fingerprint recognition which performs fingerprint recognition by tracing a fingerprint recognition area of a semiconductor element for fingerprint recognition with a finger. It relates to a manufacturing method.

[0002] In recent years, there has been a growing interest in security, and even small electronic devices such as laptop type personal computers and portable terminals are provided with devices for preventing unauthorized use by third parties. ing.

As such an unauthorized use prevention device, there is provided a device for identifying an appropriate user or an unauthorized user by recognizing a fingerprint by using a semiconductor device for fingerprint recognition and thereby preventing unauthorized use. ing.

Since the semiconductor device for fingerprint recognition is incorporated in a small electronic device as described above, it is necessary to reduce the size, and since it recognizes the fingerprint of the operator, the usability of the operator is improved. Need to let.

[0005]

2. Description of the Related Art Conventionally, there are an optical detection method and a capacitance detection method as a fingerprint detection method using a fingerprint collation system. Among them, the electrostatic capacitance type detection method is a method of detecting an electrostatic capacitance value between an electrode formed in a fingerprint detection area of a semiconductor element for fingerprint recognition and a finger. The semiconductor device for fingerprint recognition to which this electrostatic capacitance type detection method is applied is easy to be miniaturized, and thus is being applied to small electronic devices and the like.

In this electrostatic capacitance type fingerprint recognizing semiconductor device, since a finger is brought into contact with an electrode and traced (swept) in one direction, it is necessary to expose the fingerprint detection region of the semiconductor element to the outside. Therefore, an opening is formed in the sealing resin that seals the semiconductor element, and the fingerprint detection area is exposed to the outside of the device through the opening.

As the package structure of the fingerprint recognition semiconductor device, a general semiconductor device package structure is used, and specifically, a BGA (Ball Grid Array) type package structure is often used.

[0008]

As described above, in the electrostatic capacitance type detection method, since it is necessary to touch the fingerprint detection area (electrode) of the semiconductor element with a finger, it is installed in the fingerprint recognition semiconductor device. It is necessary to expose the fingerprint detection area of the semiconductor element from the sealing resin. However, the fingerprint detection area of the semiconductor element is formed on the circuit formation surface side of the semiconductor element, and the electrode is also formed on this circuit formation surface.

In the case of the BGA type package structure, the semiconductor element and the substrate on which the semiconductor element is mounted are electrically connected by wires. For this reason, when wires are to be arranged on the circuit formation surface of the semiconductor element having the fingerprint detection area, it is necessary to form the encapsulating resin at a height higher than the height of the wire loop (that is, so that the wires are encapsulated). Occurs.

Therefore, the conventional semiconductor device for fingerprint recognition has a problem in that the opening for inserting the finger is deep and the operability when the finger touches the fingerprint detection area (electrode) is poor. As a result, there are cases in which the finger cannot properly swipe the fingerprint detection area, and in this case, there is a problem that the fingerprint detection accuracy may decrease.

The present invention has been made in view of the above points, and an object thereof is to provide a semiconductor device for fingerprint recognition, which can improve operability when a finger touches a fingerprint detection region, and a manufacturing method thereof. To do.

[0012]

In order to solve the above problems, the present invention is characterized by taking the following means.

According to a first aspect of the invention, a semiconductor element having a fingerprint recognition area for performing fingerprint recognition, an external connection terminal,
In a semiconductor device for fingerprint recognition, which has a connection member that electrically connects the semiconductor element and the external connection terminal,
An opening is formed at a position corresponding to the fingerprint recognition area of the connecting member, and the semiconductor element is flip-chip bonded to the connecting member.

According to the above invention, since the semiconductor element is flip-chip bonded to the connecting member, the height of the semiconductor device for fingerprint recognition can be reduced as compared with the structure in which the semiconductor element is wire-bonded to the connecting member. Further, since the fingerprint recognition area provided in the semiconductor element and the opening formed in the connection member can be brought close to each other, it is easy for the operator's finger to come into contact with the fingerprint recognition area, and the operability during fingerprint recognition is improved. be able to.

Further, in the semiconductor device for fingerprint recognition according to claim 1, the connection member may be a wiring board.

According to a second aspect of the present invention, in the semiconductor device for fingerprint recognition according to the first aspect, a sealing resin for sealing the semiconductor element is further provided, and the connecting member is made of the sealing resin. It is characterized in that it is configured to be exposed.

According to the above invention, since the semiconductor element is sealed with the sealing resin, the reliability can be improved. Further, since the connection member is exposed from the sealing resin when the resin is sealed, the fingerprint recognition area provided on the semiconductor element is located close to the outside, and the operator's finger touches the fingerprint recognition area. Therefore, the operability in fingerprint recognition can be improved.

According to a third aspect of the present invention, in the semiconductor device for fingerprint recognition according to the second aspect, the external connection terminals are post-shaped terminals and are arranged so as to be located in the sealing resin, and A part of the external connection terminal is exposed from the sealing resin.

According to the above-mentioned invention, the external connection terminals, which are post-shaped terminals, are supported by the sealing resin, so that the external connection terminals are not separated from the sealing resin, and the semiconductor device for fingerprint recognition is provided. The reliability can be improved. Since a part of the external connection terminal is exposed from the sealing resin, electrical connection can be established at this exposed portion.

According to a fourth aspect of the present invention, in the semiconductor device for fingerprint recognition according to the third aspect, the external connection terminal has a surface opposite to a surface of the sealing resin on which the substrate is arranged. It is characterized in that the structure is exposed from.

According to the above invention, the external connection terminal is exposed not on the surface of the encapsulating resin substrate (that is, the surface of the semiconductor element on which the fingerprint detection area is provided) but on the opposite surface. It will be the configuration. Therefore, since the external connection terminal, the wiring connected to the external connection terminal, and the like do not exist on the surface touched by the finger during fingerprint recognition, usability of the semiconductor device for fingerprint recognition can be improved.

Further, in the semiconductor device for fingerprint recognition according to the first aspect of the present invention, the connection member can be formed of a lead frame, and the connection member and the external connection terminal can be integrated.

With this structure, the connecting member can be realized by an inexpensive lead frame, and the lead terminals to be external connection terminals can be collectively formed at the time of molding the lead frame.

According to a fifth aspect of the present invention, in the method of manufacturing a fingerprint recognition semiconductor device for manufacturing the fingerprint recognition semiconductor device according to the fourth aspect, a fingerprint recognition area for performing fingerprint recognition of the semiconductor element and the external portion are provided. The present invention is characterized by including a step of coating the tip end portion of the connection terminal with a flexible member and performing transfer molding in the coated state to form the sealing resin.

According to the above invention, since the fingerprint recognition area is covered with the flexible member and the transfer molding is performed,
The fingerprint recognition area is not damaged when the sealing resin is formed, and unnecessary resin does not adhere, so that the yield of semiconductor devices for fingerprint recognition can be improved.

Further, since transfer molding is performed by covering the tip of the external connection terminal with a flexible member, the external connection terminal can be reliably exposed from the sealing resin,
This can also improve the yield of the fingerprint recognition semiconductor device.

Further, in the method for manufacturing a semiconductor device for fingerprint recognition according to the fifth aspect, a buffer film can be used as the flexible member.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention, a semiconductor device 10A for fingerprint recognition (hereinafter, simply referred to as a semiconductor device).
Is shown. The semiconductor device 10A shown in the figure is mounted in a small electronic device such as a personal computer or a mobile terminal, and has a function of preventing unauthorized use by a third party by performing fingerprint recognition. This semiconductor device 1
OA is generally composed of a semiconductor element 11, a wiring board 12, external connection terminals 13, a sealing resin 14, and the like.

The semiconductor element 11 is an element compatible with the electrostatic capacitance type detection method, and therefore has a fingerprint recognition area 15 for tracing (sweeping) a finger during fingerprint recognition. Electrodes for capacitance detection are formed in the fingerprint recognition area 15, and thus the fingerprint recognition area 15 is formed on the circuit formation surface (upper surface in the figure) of the semiconductor element 11. Electrode pads are formed on the circuit formation surface, and bumps 17 are formed on the electrode pads.
The bump 17 is formed of, for example, a gold bump.

The wiring board 12 functions as a connecting member for electrically connecting the semiconductor element 11 and the external connection terminal 13. The semiconductor element 11 is the wiring board 1
2 is flip-chip bonded.

As the wiring board 12, a glass epoxy board is used in this embodiment. However, the wiring board 1
2 is not limited to the glass epoxy substrate, and other resin substrate or ceramic substrate can be used.

The surface of the wiring board 12 is exposed from the sealing resin 14 described later, and the back surface of the wiring board 12 faces the semiconductor element 11. The wiring board 12 is configured to have the opening 16 and the wiring 18.

The opening 16 is formed so as to face the fingerprint recognition area 15 of the semiconductor element 11. The sealing resin 14 is not formed between the opening 16 and the fingerprint recognition area 15. Therefore, the fingerprint recognition area 15 is exposed to the outside through the opening 16. Therefore, by inserting the finger into the opening 16, the finger can be brought into contact with the fingerprint recognition region 15 of the semiconductor element 11, and the fingerprint can be recognized.

The wiring 18 is the semiconductor element 1 of the wiring board 12.
It is formed on the surface opposite to 1. The wiring 18 is printed on the wiring board 12. The semiconductor element 11 is flip-chip bonded at one end using the bump 17 and the external connection terminal 13 is formed at the other end.

The external connection terminal 13 has a post shape (columnar shape) in this embodiment, and is arranged at the outer peripheral position of the semiconductor element 11. The external connection terminal 13 is supported by being embedded in the sealing resin 14, and the tip portion 19 of the external connection terminal 13 projects from the back surface 14 a of the sealing resin 14. Tip portion 19 protruding from the back surface 14a
Are electrically connected to a mounting board on which the semiconductor device 10A is mounted. As described above, in this embodiment, since the post-shaped external connection terminal 13 is supported by the sealing resin 14, the external connection terminal 13 does not come off from the sealing resin 14, and the reliability of the semiconductor device 10A is improved. Can be improved.

The encapsulating resin 14 is, for example, an epoxy resin, protects the semiconductor element 11 and also serves as the external connection terminal 1.
It plays the function of supporting 3. In this way, the semiconductor device 1
The reliability of the semiconductor device 10A can be improved by sealing and protecting the semiconductor device 1 with the sealing resin 14. The sealing resin 14 is not formed at the position facing the fingerprint recognition area 15 of the semiconductor element 11 as described above.

As described above, the semiconductor device 10A according to the present embodiment has a structure in which the semiconductor element 11 is flip-chip bonded to the wiring board 12. With this configuration, it is not necessary to provide a space for forming a wire loop on the circuit formation surface of the semiconductor element 11 as compared with a configuration in which the semiconductor element 11 and the wiring board 12 are wire-bonded, and thus the semiconductor device 10A The height can be reduced.

Further, in the semiconductor device 10A according to this embodiment, the opening 16 is formed in the wiring board 12, and the opening 1 is formed.
6 is configured to face the fingerprint recognition area 15 of the semiconductor element 11. Further, as described above, the semiconductor element 11 and the wiring board 12 are flip-chip bonded to each other, so that the semiconductor element 11 and the wiring board 12 are close to each other. Therefore, it becomes possible to bring the opening 16 and the fingerprint recognition area 15 close to each other, and it becomes easier for a finger of a person who wants to perform fingerprint recognition to come into contact with the fingerprint recognition area 15, thereby improving operability during fingerprint recognition. You can

Further, in the semiconductor device 10A according to the present embodiment, the external connection terminal 13 is from the rear surface 14a of the sealing resin 14, that is, the surface of the sealing resin 14 opposite to the surface on which the wiring board 12 is arranged. The structure is exposed from. With this configuration, the external connection terminal 13 is sealed with the sealing resin 14
The surface is not exposed to the surface on which the wiring substrate 12 is provided (that is, the surface on which the fingerprint detection area 15 of the semiconductor element 11 is provided), but is exposed to the back surface 14a of the sealing resin 14 on the opposite side.

Therefore, the semiconductor device 10A has a structure in which the external connection terminal 13 and the wiring connected to the external connection terminal 13 are not present on the surface side where the fingerprint recognition area 15 is formed. This allows
Since the fingerprint recognition area 15 is close to the opening 16 of the wiring board 12 and the fingerprint recognition area 15 can be exposed at a position close to the outside, usability of the semiconductor device 10A can be improved.

Next, second to fourth embodiments of the present invention will be described. 2 shows a semiconductor device 10B which is the second embodiment of the present invention, FIG. 3 shows a semiconductor device 10C which is the third embodiment of the present invention, and FIG. 4 shows the fourth embodiment of the present invention.
The semiconductor device 10D which is an example is shown. Incidentally, FIG.
4 to 4, the same components as those used in the description of the first embodiment and shown in FIG. The same applies to FIG. 5 and subsequent figures.

A semiconductor device 1 according to the second embodiment shown in FIG.
0B is characterized in that a solder ball 20 is formed on the tip portion 19 of the external connection terminal 13 in the semiconductor device 10A shown in FIG. Further, the semiconductor device 10C shown in FIG. 3 is different from the semiconductor device 10A shown in FIG.
The solder precoat portion 2 is provided on the tip portion 19 of the external connection terminal 13.
1 is formed. According to the semiconductor devices 10B and 10C of the second or third embodiment,
Since the solder balls 20 or the solder precoat portions 21 are provided, it is possible to improve the mountability when mounting the semiconductor devices 10B and 10C on the mounting substrate.

A semiconductor device 1 according to a fourth embodiment shown in FIG.
0D is characterized by using a lead frame 22 in place of the wiring board 12 and the external connection terminal 13 used in the semiconductor device 10A according to the first embodiment. The lead frame 22 is made of a well-known lead frame material such as 42 alloy and has a structure in which a plurality of outer lead portions 23 and inner lead portions 24 are integrally formed.

The semiconductor element 11 is flip-chip bonded to the inner lead portion 24 of the lead frame 22. Further, the outer lead portion 23 extends to the outside of the sealing resin 14 and is configured to be bent in a gull wing shape in order to support surface mounting. Further, the sealing resin 14 has an opening 16 formed therein.
Reference numeral 6 is configured to face the fingerprint recognition area 15 of the semiconductor element 11.

Further, the inner lead portion 24 is made of the sealing resin 1
However, the thickness of the sealing resin 14 above the inner lead portion 24 is set to be as thin as possible within a range in which mechanical strength can be maintained. As a result, the thickness of the sealing resin 14 at the site where the opening 16 is formed can be reduced, and the fingerprint recognition area 15 can be brought closer to the outside.

In the semiconductor device 10D according to this embodiment, an inexpensive lead frame material such as 42 alloy can be used as the lead frame 22, and the inner lead portion 24 and the outer lead portion 23 are collectively pressed by press working. It can be processed into The processing technique of the lead frame 22 is an already established technique, and can be processed at low cost by utilizing the existing semiconductor manufacturing equipment.
Therefore, by using the lead frame 22, the cost of the semiconductor device 10D can be reduced.

Subsequently, the semiconductor device 10 having the above structure
A method for manufacturing A to 10D will be described. In the following description, the method for manufacturing the semiconductor device 10B according to the second embodiment will be described as an example.

To manufacture the semiconductor device 10B, the wiring board 12 is first prepared. This wiring board 12 is, for example, F
It is a substrate made of glass epoxy such as R-4, and its thickness is
The thing of about 0.1 mm is selected. This wiring board 12
The openings 16 and the wirings 18 are formed in advance.

The opening 16 is punched by press working when the wiring board 12 is manufactured. The wiring 18 is a copper wiring and is formed in a predetermined pattern for connecting the above-mentioned bonding position of the semiconductor element 11 (bonding position of the bump 17) and the formation position of the external connection terminal 13 by using an etching technique. It

For convenience of illustration and description, FIGS.
In FIG. 0, a portion corresponding to one semiconductor device 10B is shown in an enlarged manner. However, in reality, so-called multi-cavity fabrication is performed. Therefore, until the dicing process shown in FIG. A plurality are formed at the same time.

After the wiring board 12 is prepared, a resist (not shown) is subsequently applied onto the wiring board 12. The height of the resist is set to be higher than the height of the semiconductor element 11 when the semiconductor element 11 is mounted as described later. Specifically, the height is, for example, 150 μm greater than the height of the semiconductor element 11 in the joined state.
It is set to be higher than the above.

Subsequently, the resist is exposed and developed, and the resist is removed only at the positions where the external connection terminals 13 are formed. Then, the formation process of the external connection terminal 13 is performed using this resist as a mask. The formation of the external connection terminal 13 is performed by using a plating method. The plating method may be either electroplating or electroless plating. When the electric field plating method is applied, the wiring 18
Is used as wiring for power supply.

When the external connection terminal 13 is formed as described above, the resist is removed by performing an ashing process. By performing the above processing, as shown in FIG. 5, the external connection terminal 1 is formed on the wiring 18 of the wiring board 12.
3 is formed.

After the external connection terminals 13 are formed as described above, a process of joining the semiconductor element 11 to the wiring board 12 is subsequently performed. Specifically, the bumps 17 are formed in advance on the electrode portions of the semiconductor element 11, and the semiconductor element 11 is flip-chip bonded to the wiring board 12 using a chip mounter. In FIG. 6, the semiconductor element 11 is the wiring board 12.
7 shows a state immediately before the flip chip bonding, and FIG. 7 shows a state in which the semiconductor element 11 is flip chip bonded to the wiring substrate 12.

As described above, the semiconductor element 11 is an element compatible with the electrostatic capacitance type detection method, and therefore, the fingerprint recognition area 15 for tracing the finger at the time of fingerprint recognition is formed on the circuit formation surface. . The fingerprint recognition area 15 is configured to face the opening 16 formed in the wiring board 12 when the semiconductor element 11 is flip-chip bonded to the wiring board 12.

When the mounting process of the semiconductor element 11 is completed as described above, the wiring board 12 on which the semiconductor element 11 is mounted is mounted on the mold 25 as shown in FIG.
Transfer molding is performed to form the. The mold 25 includes an upper mold 26 and a lower mold 27, and the lower mold 27 has a nest 28 incorporated therein. The nest 28 is configured to be movable in the vertical direction in the figure as shown by the arrow.

When the wiring board 12 is mounted on the mold 25, the fingerprint recognition area 15 of the semiconductor element 11 is mounted so as to face the nest 28 through the opening 16. Therefore,
The external connection terminal 13 when mounted on the mold 25
Has a structure extending upward.

In this embodiment, when the wiring board 12 is mounted in the mold 25, the first buffer film 30 is provided in the cavity of the upper die 26, so that the external connection terminal 13 is mounted in the mounted state of the wiring board 12. Are configured to come into contact with the first cushioning film 30. Further, the second buffer film 31 is provided in the cavity of the lower mold 27, so that the wiring board 12 is configured to contact the second buffer film 31 when the wiring board 12 is mounted. When the wiring board 12 is mounted in the mold 25, the nest 2
8 moves upward, whereby the second buffer film 31 comes into contact with the fingerprint recognition area 15 of the semiconductor element 11 through the opening 16.

First and second buffer films 30, 31
Is a resin film having flexibility and heat resistance. Therefore, the first and second buffer films 30,
Even if 31 is provided, the first and second buffer films 30, 3
1 is not damaged. Further, since the first and second cushioning films 30 and 31 have flexibility as described above, they exert a cushioning effect when the upper die 26 and the lower die 27 are clamped. Therefore, it is possible to prevent the wiring board 12 and the external connection terminals 13 from being damaged during the clamping.

The thickness of the first buffer film 30 is
During the above clamping, the external connection terminal 13 is 100μ
It is set to a thickness of about m. In this way, the resin is compression-injected into the mold 25 and the transfer molding is performed in a state in which the tip portion of the external connection terminal 13 bites into the first buffer film 30. As a result, the sealing resin 14 that protects the semiconductor element 11 and supports the external connection terminals 13 is formed.

FIG. 9 shows the wiring board 12 on which the sealing resin 14 is formed. As described with reference to FIG. 8, the sealing resin 14 is formed in a state where the tip portion of the external connection terminal 13 bites into the first buffer film 30. Now, assuming that the amount of biting into the first buffer film 30 of the external connection terminal 13 is h, the portion h of the external connection terminal 13 that bites into the first buffer film 30 is not embedded in the sealing resin 14. Therefore, the tip portion 19 of the external connection terminal 13 projects from the back surface 14a of the sealing resin 14 by the dimension h.

When the sealing resin 14 is formed, the fingerprint recognition area 15 is in contact with the second buffer film 31. Therefore, during transfer molding, the fingerprint recognition area 15 becomes the second buffer film 31.
As a result, the production yield of the semiconductor device 10B can be improved. Further, since the sealing resin 14 is formed in a state where the fingerprint recognition area 15 is covered with the second buffer film 31, it is possible to prevent unnecessary resin from adhering to the fingerprint recognition area 15 during this formation.

Then, as shown in FIG. 10, solder balls 20 are formed on the tip portions 19 of the external connection terminals 13 exposed from the sealing resin 14. At this time, even if the external connection terminals 13 have variations in coplanarity, the solder balls 20 can make the coplanarities uniform. Note that the external connection terminals 13 may be subjected to a polishing treatment before the solder balls 20 are formed, so that the coplanarity is made uniform.

When the formation process of the solder balls 20 is completed as described above, the wiring board 12 is mounted on the dicing device, and the dicing blade 32 is used to perform the individualizing process as shown in FIG. As a result, the wiring board 12 is divided into individual semiconductor devices 10B, and the semiconductor device 10B shown in FIG. 2 is manufactured.

In the manufacturing method described above, the external connection terminal 1
Although 3 is formed by the plating method, the formation of the external connection terminals 13 is not limited to the plating method, and other methods can be applied. For example, the pole-shaped external connection terminal 13 is manufactured in advance, and this is connected to the wiring 1
8 may be fixed by welding.

Regarding the above description, the following items will be further disclosed.

(Supplementary Note 1) A semiconductor for fingerprint recognition having a semiconductor element having a fingerprint recognition area for fingerprint recognition, an external connection terminal, and a connecting member for electrically connecting the semiconductor element and the external connection terminal. In the device, a semiconductor device for fingerprint recognition, characterized in that an opening is formed at a position corresponding to the fingerprint recognition region of the connection member, and the semiconductor element is flip-chip bonded to the connection member.

(Supplementary Note 2) The semiconductor device for fingerprint recognition according to Supplementary Note 1, wherein the connection member is formed of a wiring board.

(Supplementary Note 3) In the semiconductor device for fingerprint recognition according to Supplementary Note 2, a sealing resin for sealing the semiconductor element is further provided, and the connecting member is exposed from the sealing resin. Characteristic semiconductor device for fingerprint recognition.

(Supplementary Note 4) In the semiconductor device for fingerprint recognition according to Supplementary Note 3, the external connection terminal is a post-shaped terminal and is disposed so as to be located in the sealing resin, and one of the external connection terminals is disposed. A semiconductor device for fingerprint recognition, wherein a part is exposed from the sealing resin.

(Supplementary Note 5) In the semiconductor device for fingerprint recognition according to Supplementary Note 4, the external connection terminals are exposed from the surface of the sealing resin opposite to the surface on which the substrate is provided. A semiconductor device for fingerprint recognition, which is characterized by:

(Supplementary Note 6) In the semiconductor device for fingerprint recognition described in Supplementary Note 1, the connection member is formed of a lead frame, and the connection member and the external connection terminal are integrally formed. Fingerprint recognition semiconductor device.

(Supplementary Note 7) In the semiconductor device for fingerprint recognition according to any one of Supplementary Notes 1 to 6, the semiconductor element is configured to perform fingerprint recognition by a capacitance type detection method. Fingerprint recognition semiconductor device.

(Supplementary Note 8) In the method for manufacturing a fingerprint recognizing semiconductor device for producing the fingerprint recognizing semiconductor device according to Supplementary Note 5, a fingerprint recognizing region for recognizing a fingerprint of the semiconductor element and a tip portion of the external connecting terminal are provided. A method of manufacturing a semiconductor device for fingerprint recognition, comprising the steps of covering with a flexible member, performing transfer molding in the covered state, and forming the sealing resin.

(Supplementary Note 9) In the method for producing a semiconductor device for fingerprint recognition according to supplementary note 8, the flexible member is a buffer film.

[0077]

As described above, according to the present invention, various effects described below can be realized.

According to the first aspect of the invention, the height of the semiconductor device for fingerprint recognition can be reduced, and the operability can be improved because the operator's finger can easily come into contact with the fingerprint recognition area. it can.

According to the second aspect of the present invention, since the fingerprint recognition area provided on the semiconductor element is close to the outside, it is easy for the operator's finger to come into contact with the fingerprint recognition area. Operability can be improved.

According to the third aspect of the invention, since the external connection terminals that are post-shaped terminals are supported by the sealing resin, the external connection terminals do not separate from the sealing resin. The reliability of the semiconductor device for fingerprint recognition can be improved.

Further, according to the invention of claim 4, since the external connection terminal and the wiring connected to the external connection terminal are not present on the surface touched by the finger during fingerprint recognition, the usability of the semiconductor device for fingerprint recognition is improved. Can be improved.

When the connecting member is formed of a lead frame and the connecting member and the external connection terminal are integrally formed, the connecting member can be realized by an inexpensive lead frame. The lead terminals to be the external connection terminals can be collectively formed at the time of molding the lead frame.

According to the fifth aspect of the present invention, since the fingerprint recognition area is covered with the flexible member and the transfer molding is performed, the fingerprint recognition area is damaged at the time of forming the sealing resin, and unnecessary resin is removed. Since the adhesion does not occur and the external connection terminals can be reliably exposed from the sealing resin, the yield of the semiconductor device for fingerprint recognition can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor device for fingerprint recognition which is a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a semiconductor device for fingerprint recognition which is a second embodiment of the present invention.

FIG. 3 is a sectional view showing a fingerprint recognition semiconductor device according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a semiconductor device for fingerprint recognition which is a fourth embodiment of the present invention.

FIG. 5 is a diagram for explaining a step of forming an external connection terminal in the method of manufacturing the semiconductor device for fingerprint recognition which is an embodiment of the present invention.

FIG. 6 is a diagram for explaining a step of mounting a semiconductor element on a wiring board in the method of manufacturing a semiconductor device for fingerprint recognition which is an embodiment of the present invention (No. 1).

FIG. 7 is a diagram for explaining the step of mounting the semiconductor element on the wiring board in the method of manufacturing the semiconductor device for fingerprint recognition which is an embodiment of the present invention (No. 2).

FIG. 8 is a diagram for explaining a step of forming a sealing resin in the method of manufacturing the semiconductor device for fingerprint recognition which is an embodiment of the present invention (No. 1).

FIG. 9 is a diagram for explaining a step of forming a sealing resin in the method of manufacturing the semiconductor device for fingerprint recognition which is an embodiment of the present invention (No. 2).

FIG. 10 is a diagram for explaining a step of disposing solder balls on the external connection terminals in the method of manufacturing the semiconductor device for fingerprint recognition which is an embodiment of the present invention.

FIG. 11 is a diagram for explaining a step of dividing the semiconductor device into individual pieces in the method of manufacturing the fingerprint recognition semiconductor device according to the embodiment of the present invention.

[Explanation of symbols]

10A to 10D semiconductor device 12 wiring board 13 External connection terminal 14 Sealing resin 15 Fingerprint recognition area 16 openings 17 bumps 18 wiring 20 solder balls 21 Solder precoat part 22 Lead frame 25 mold 28 Nesting 30 First buffer film 31 Second buffer film 32 dicing blade

Claims (5)

[Claims] 1. A semiconductor device for fingerprint recognition, comprising: a semiconductor element having a fingerprint recognition area for fingerprint recognition; an external connection terminal; and a connection member electrically connecting the semiconductor element and the external connection terminal. A semiconductor device for fingerprint recognition, characterized in that an opening is formed at a position corresponding to the fingerprint recognition area of the connection member, and the semiconductor element is flip-chip bonded to the connection member. 2. The semiconductor device for fingerprint recognition according to claim 1, further comprising a sealing resin that seals the semiconductor element, and the connection member is exposed from the sealing resin. A semiconductor device for fingerprint recognition. 3. The semiconductor device for fingerprint recognition according to claim 2, wherein the external connection terminal is a post-shaped terminal and is arranged so as to be located in the sealing resin, and a part of the external connection terminal. A semiconductor device for fingerprint recognition, wherein the semiconductor device is exposed from the sealing resin. 4. The semiconductor device for fingerprint recognition according to claim 2, wherein the external connection terminal is exposed from a surface of the sealing resin opposite to a surface on which the substrate is provided. A semiconductor device for fingerprint recognition, which is characterized in that 5. The method of manufacturing a semiconductor device for fingerprint recognition according to claim 4, wherein the semiconductor device for fingerprint recognition is manufactured by a fingerprint recognition region having a fingerprint recognition region for performing fingerprint recognition of the semiconductor element and the external connection terminal. The method for manufacturing a semiconductor device for fingerprint recognition, comprising: a step of coating the tip end of the above with a flexible member, performing transfer molding in the coated state, and forming the sealing resin.