JP2003086724A - Semiconductor device and fingerprint detector - Google Patents

Semiconductor device and fingerprint detector

Info

Publication number
JP2003086724A
JP2003086724A JP2001272425A JP2001272425A JP2003086724A JP 2003086724 A JP2003086724 A JP 2003086724A JP 2001272425 A JP2001272425 A JP 2001272425A JP 2001272425 A JP2001272425 A JP 2001272425A JP 2003086724 A JP2003086724 A JP 2003086724A
Authority
JP
Japan
Prior art keywords
fingerprint
package member
element
conductive wiring
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001272425A
Other languages
Japanese (ja)
Inventor
Koki Kitaoka
Masao Yasuda
幸喜 北岡
昌生 安田
Original Assignee
Sharp Corp
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp, シャープ株式会社 filed Critical Sharp Corp
Priority to JP2001272425A priority Critical patent/JP2003086724A/en
Publication of JP2003086724A publication Critical patent/JP2003086724A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Abstract

PROBLEM TO BE SOLVED: To provide a fingerprint detector which can be made smaller and thinner even when an opening to the outside, a memory device, and the like are provided, and to manufacture the device at a lower cost. SOLUTION: This fingerprint detector 101 has a fingerprint detecting device 1 and a memory device 12 mounted in a package formed by combining an upper resin member 102 and a lower resin member 103. A fingerprint detecting portion 9 of the fingerprint device 1 is exposed from an opening 7 of the upper resin member 102 to detect the geometrical information of a fingerprint 20 and convert it into an electrical signal. When the geometrical information detected by the fingerprint detecting device 1 is compared with information stored in the memory device 12 beforehand, personal authentication or the like can be carried out by using a fingerprint 20. Since the fingerprint detecting device 1 and the memory device 12 are mounted in an integral package, this detector can be made smaller and thinner, and can be manufactured at a significantly lower cost than in the case where devices are separately mounted on a wiring board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a fingerprint detection device mounted in a package having an opening for fingerprint detection and the like.

[0002]

2. Description of the Related Art In recent years, with the spread of the Internet,
The digitization and networking of information is progressing rapidly,
At the same time, the importance of managing corporate information and personal information is increasing. In order to use such information safely, it is necessary to authenticate the user's qualification by some method when accessing the information. Conventionally, an authentication number is set in advance for each user, and a password is set to perform individual authentication. However, in the conventional personal authentication using the authentication number and password, the risk of plagiarism, spoofing, etc. is increasing, and personal authentication with higher confidentiality is being demanded.

On the basis of such a background, a personal authentication method utilizing biological characteristics such as fingerprints and iris that are invariant to everyone and are constant throughout life is spreading. Especially regarding fingerprint authentication,
Since the fingerprint sensor can be miniaturized and a highly accurate matching algorithm has been established through many years of research,
It is rapidly spreading, mainly for use as a login means for personal computers.

The principle of a fingerprint detection device used for fingerprint authentication is roughly classified into an optical system and a semiconductor system. The optical fingerprint detection device has a large number of parts such as lenses and prisms, and it is difficult to downsize the optical fingerprint detection device to a certain size or more due to optical size restrictions. On the other hand, the semiconductor type device can be easily downsized, and thus can be mounted on a mobile phone or a mobile information terminal.

The semiconductor type fingerprint detecting device is a mechanism for converting geometric fingerprint information peculiar to an individual into an electric signal from a change in capacitance or a change in pressure at a fingerprint detecting portion on the surface of the fingerprint detecting element. Therefore, it is inevitably required that the fingerprint detection unit be exposed to the outside of the device. However, in the case of a fingerprint detection element that partially converts a change in body temperature into an electric signal, it is possible to apply resin to the surface of the detection part for protection, but the coating on the detection part is not covered by other skins. It needs to be much thinner than.

As a fingerprint detecting device for exposing the detecting portion of the fingerprint detecting element to the outside as described above, Japanese Patent Laid-Open No. 9-2892
The configuration disclosed in Japanese Patent No. 68 is known. The structure of the conventional fingerprint detecting device will be described below with reference to FIGS. 8 and 9.

FIG. 8 shows a schematic structure of a conventional fingerprint detecting device 30. In FIG. 8, a fingerprint detection element 31 formed as a semiconductor element is provided on a lead frame 32 made of a metal such as 42 alloy which is a high nickel iron alloy containing 42% nickel (Ni) in iron (Fe). It is mounted via a die-bonding adhesive 33 such as silver (Ag) paste. The electrode pad 34 on the fingerprint detection element 31 is made of gold (A
It is connected to the lead portion 36 that is led out to the outside by the lead frame 32 via the thin metal wire 35 made of u) or the like. A fingerprint detecting section 37 is formed on the surface of the fingerprint detecting element 31. The surface of the fingerprint detection unit 37 is temporarily covered with a removable protective film (not shown). A lead frame 32 having a fingerprint detection element 31 covering the fingerprint detection portion 37 with a protective film is sandwiched in a molding die (not shown), and a sealing resin 38 made of epoxy resin or the like is press-fitted and hardened. A package 39 is obtained by Then, the above-mentioned protective film is removed with a predetermined solvent or the like, and the fingerprint detection unit 37 is exposed to the outside, whereby the fingerprint detection device 30 is obtained. When the fingerprint detection unit 37 exposed to the outside is brought into contact with the fingerprint 40 of the fingertip, an electric signal corresponding to the fingerprint 40 is obtained at the lead unit 36 connected to the fingerprint detection element 31.

FIG. 9 shows a schematic device configuration which is assumed when an electric signal of fingerprint information obtained from the fingerprint detection device 30 is stored in an external storage device 50. Figure 9
In, the fingerprint detecting device 30 is made of an organic material such as glass epoxy and is mounted on the wiring board 51 on which a predetermined conductive wiring pattern (not shown) is formed. A predetermined land pattern 52 is formed on the conductive wiring pattern. By connecting the lead portion 36 of the fingerprint detecting device 30 to the land pattern 52 with the solder material 53, the wiring board 51 and the fingerprint detecting device 30 can be electrically connected.

On the other hand, the memory element 54 made of a semiconductor integrated circuit chip has a lead frame 55 made of 42 alloy or the like.
It is mounted on top with an adhesive 56 such as Ag paste. The electrode pad 57 on the memory element 54 is connected to the lead portion 59 of the lead frame 55 via a thin metal wire 58 made of Au or the like. A lead frame 55 carrying the memory element 54 is sandwiched between molding dies (not shown), and a sealing resin 60 made of epoxy resin or the like is injected and solidified to obtain a package 61, which serves as the memory device 50. It can be manufactured. The storage device 50 includes a lead unit 59.
By being connected to the predetermined land pattern 62 by the solder material 63, the electrical connection with the wiring board 51 can be obtained.

After a predetermined electrical connection is made, if an arbitrary fingerprint 40 is pressed against the exposed fingerprint detecting portion 37 of the fingerprint detecting device 30, the surface of the fingerprint detecting portion 37 will have a geometrical shape peculiar to an individual. Fingerprint information is obtained by generating a distribution pattern such as a change in capacitance, a change in pressure, or a thermal change corresponding to a typical fingerprint, and converting the distribution pattern into a predetermined electric signal. This information is electrically stored in the storage device 50, and when personal authentication is required, the fingerprint information converted into an electric signal by the fingerprint detection element 31 is stored in advance in the storage device 50 via a predetermined algorithm. Individuals can be specified by comparing and collating with the fingerprint information registered in.

[0011]

However, in the case of the fingerprint detecting device 30 having the structure described in the above publication, the protective film is temporarily covered with the fingerprint detecting portion to form the package 39, and then the protective film is formed. A process such as removal is required, and the manufacturing method is very complicated. Therefore, cost increase is inevitable. Further, when identifying an individual by fingerprint authentication and accessing the information, a process of comparing and collating with the fingerprint information which is converted into an electric signal in advance by the fingerprint detecting element 31 and stored in the storage device 50 is required. The fingerprint detection device 30 described in the above publication does not provide a method of arranging the storage device 50 inside. Therefore, as assumed in FIG. 9, the storage device 50 must be necessarily arranged outside the fingerprint detection device 30, which leads to an increase in size and cost of the device. As in recent years, increasing the cost and increasing the size of a fingerprint detection device mounted on a mobile phone or a mobile information terminal has become a major obstacle to mounting the fingerprint detection device on the mobile phone and the mobile information terminal.

An object of the present invention is to provide a semiconductor device and a fingerprint detecting device which can be made small and thin and which is low in cost even if it has an opening to the outside and a storage device.

[0013]

According to the present invention, a first package member having one or more openings and in which a conductive wiring pattern is selectively formed, and a conductive wiring pattern are selectively formed. The formed second package member and the predetermined active portion are mounted so as to overlap the opening of the first package member and to be electrically connected to the conductive wiring pattern of the first package member. A first package including a first semiconductor element and a second semiconductor element mounted on the second package member so as to be electrically connected to the conductive wiring pattern of the second package member; The member and the second package member house the first semiconductor element and the second semiconductor element inside,
The semiconductor device is characterized in that the conductive wiring patterns are combined so as to be connected to each other to form a package in which the opening is opened to the outside.

According to the present invention, the first semiconductor element and the second semiconductor element
And manufacturing a semiconductor device including the semiconductor element, the first package member having the first semiconductor element mounted thereon, and the second package member having the second semiconductor element mounted thereon to form a package. be able to. The first package member has one or more openings, and conductive wiring patterns are selectively formed. The first semiconductor element is
The predetermined active portion is mounted on the first package member such that the active portion overlaps with the opening of the first package member and is electrically connected to the conductive wiring pattern of the first package member. The second semiconductor element is mounted on the second package member so as to be electrically connected to the conductive wiring pattern of the second package member. The first package member and the second package member are formed in advance, the first semiconductor element and the second semiconductor element are mounted respectively, and the first package member and the second package member are combined. For example, the conductive wiring patterns are electrically connected to each other, and the semiconductor device can be manufactured. A semiconductor device in which a first semiconductor element and a second semiconductor element are mounted in a package having an opening can be manufactured at a low cost by a simple manufacturing process. By using a sensor or the like that needs to be exposed to the outside as the first semiconductor element and using a memory element for storage or the like as the second semiconductor element, the semiconductor device can be downsized or thinned.

According to the present invention, the first semiconductor element is
It is a fingerprint detection element.

According to the present invention, a fingerprint detecting element is used as the first semiconductor element, and a semiconductor device having a fingerprint detecting function can be miniaturized and thinned and manufactured at low cost.

In the present invention, the second semiconductor element may be
It is a storage element. According to the present invention, the memory element is included as the second semiconductor element together with the first semiconductor element that is partially exposed in the opening. Therefore, information that is externally detected by the first semiconductor element is stored in the memory element. A storable semiconductor device can be manufactured at a low cost with downsizing and thinning.

Further, in the present invention, the conductive wiring pattern selectively formed on the second package member extends outward from a region where the second semiconductor element is mounted. .

According to the present invention, when the second semiconductor element is mounted on the second package member, the conductive wiring pattern selectively formed on the second package member mounts the second semiconductor element. Since it extends from the region to the outside, the second semiconductor element and the outside can be easily electrically connected.

Further, according to the present invention, at least one of the first package member and the second package member has a three-dimensional object obtained by injection-molding a hard-to-plate resin material and a three-dimensional object on the surface of the three-dimensional object. And an electroless plating layer selectively formed by injection molding, wherein the conductive wiring pattern is formed of an electroless plating layer formed on the surface of the easily plating resin material.

According to the invention, at least one of the first package member or the second package member is
It can be manufactured by injection molding and electroless plating. Selective injection molding of the easy-plating resin material on the surface of a three-dimensional object formed by injection-molding a hard-to-plate resin material can be performed quickly and with good mass productivity if there is a molding die. it can. When electroless plating is performed on the molded package member, a conductive electroless plating layer is attached to the easily-platable resin material, and a conductive wiring pattern can be easily obtained.

In the present invention, at least one of the first semiconductor element and the second semiconductor element is a conductive wiring pattern formed on the first package member or the second package member. It is characterized in that it is provided with a metal projection electrode which is formed in advance for electrically connecting with.

According to the present invention, the first package member or the second package member is formed by using the metal projection electrode previously formed on at least one of the first semiconductor element and the second semiconductor element. Electrical connection with the conductive wiring pattern formed on the substrate can be easily performed.

Further, the present invention further comprises a connection wiring member in which a conductive wiring pattern is selectively formed on a flexible organic base material, and the semiconductor element having the metal projection electrode is
The metal bump electrode is connected to a conductive wiring pattern of the connection wiring member, and is electrically connected to a conductive wiring pattern formed on the package member via the conductive pattern. .

According to the present invention, when electrically connecting the metal projection electrode provided in the semiconductor element and the conductive wiring pattern of the package member, the conductive wiring pattern is selectively formed on the flexible organic base material. Since the connection wiring member is formed, the semiconductor element can be prevented from being stressed.

In the present invention, the second semiconductor element may be
It is characterized in that it is electrically connected to the conductive wiring pattern formed on the second package member through the thin metal wire.

According to the present invention, the second semiconductor element and the conductive wiring pattern formed on the second package member are formed by wire bonding generally used in the assembly process of the semiconductor integrated circuit. It can be electrically connected via a thin metal wire.

Further, the present invention is characterized in that a protective resin is disposed on the active portion of the first semiconductor element facing the opening of the first package member.

According to the present invention, the active portion of the first semiconductor element facing the opening of the first package member can be protected by the protective resin to enhance reliability.

Further, in the invention, the first semiconductor element facing the opening of the first package member is characterized in that the periphery adjacent to the opening is covered with the protective resin.

According to the present invention, since the first semiconductor element has the periphery adjacent to the opening of the first package member covered with the protective resin, except for the portion exposed at the opening, It is possible to surely protect the periphery of the active portion and the inside of the package of the semiconductor device.

Further, the present invention relates to a fingerprint detection element having a fingerprint detection section for detecting a fingerprint by bringing one finger surface into contact with one surface of the semiconductor substrate, and a function related to processing of fingerprint information detected by the fingerprint detection element. A fingerprint detection device formed by mounting a fingerprint information device having a semiconductor substrate on a semiconductor substrate in a package, the package including an upper package member on which the fingerprint detection device is mounted and the fingerprint information device. And a lower package member in combination with the upper package member, the upper package member having one or more openings, and a conductive wiring pattern selectively formed, the fingerprint detecting element comprising: A fingerprint detection unit is disposed in the opening and is mounted so as to make an electrical connection to the conductive wiring pattern. A conductive wiring pattern interconnected with the conductive wiring pattern of the cage member is selectively formed, and the fingerprint information element is mounted so that the conductive wiring pattern is electrically connected to the upper wiring member. When the lower package member and the lower package member are combined with each other, the opening is opened to the outside, and the conductive wiring patterns are interconnected with each other.

According to the present invention, a fingerprint detecting element having a fingerprint detecting portion for detecting a fingerprint by touching one surface of a semiconductor substrate with a fingertip has a conductive wiring pattern and an upper package having an opening. Mounted on a member. A fingerprint information device having a function related to processing of fingerprint information detected by a fingerprint detection device on a semiconductor substrate is mounted on a lower package member having a conductive wiring pattern. Since the fingerprint detecting portion of the fingerprint detecting element is arranged at the opening of the upper package member that is opened to the outside when the package is assembled, the fingertip can be brought into contact with the fingerprint detecting portion.
Since the conductive wiring patterns of the upper package member and the lower package member are electrically connected to each other at the time of assembling as a package, for example, the geometrical shape of a fingerprint unique to an individual converted into an electric signal by a fingerprint detecting element. It is possible to easily manufacture a fingerprint detection device that can store biological information in a fingerprint information element and can read it out at the time of collation of personal identification. Since the fingerprint detection element and the fingerprint information element are mounted in the package to be combined, the fingerprint detection device can be easily miniaturized and thinned.

Further, in the present invention, the fingerprint detecting element mounted on the upper package member has the other surface of the semiconductor substrate facing the one surface having the fingerprint detecting portion covered with a sealing resin. It is characterized by being

According to the present invention, since the fingerprint detecting element has the periphery adjacent to the opening of the upper package member covered with the sealing resin, the inside of the package except the part exposed at the opening is covered. It can be surely sealed.

Further, in the present invention, the fingerprint information element mounted on the lower package member is covered with a sealing resin.

According to the present invention, since the fingerprint information element is covered with the sealing resin, the fingerprint information element is less susceptible to the surrounding environment and the reliability can be improved.

[0038]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. 1 to 7 in the case of applying the present invention to a fingerprint detection device. In each of the embodiments, corresponding parts are designated by the same reference numerals, and redundant description may be omitted. That is, the present invention provides the following means in order to solve the aforementioned problems of the fingerprint detection device.

FIG. 1 and FIG. 2 show a schematic sectional structure of a fingerprint detecting device 101 which is a first embodiment of the present invention. FIG. 1 shows a fingerprint detection device 101 in a sectional configuration perpendicular to the surface of the fingerprint detection element 1. FIG. 2 shows a sectional configuration taken along the section line II-II in FIG. Fingerprint detection device 10
A package 1 as a semiconductor device is formed by combining an upper resin member 102 which is a first package member and a lower resin member 103 which is a second package member.

On the fingerprint detecting element 1 which is the first semiconductor element, an active portion including a fingerprint detecting portion is formed on one surface of the semiconductor substrate. An electrode pad 2 is formed around the active part, and the electrode pad 2 is previously plated with Au by a plating method or the like.
A metal projection electrode 3 made of a solder material or the like is formed. The upper resin member 102 is composed of a three-dimensional object obtained by injection-molding the difficult-plating resin material 4, and an easily-plating resin material 5 selectively injection-molded on the surface thereof. The easily-platable resin material 5 has a conductive wiring pattern 6 made of electroless plating such as Au on the surface. Further, the upper resin member 102 has at least one opening 7. In the fingerprint detecting element 1, the fingerprint detecting section 9 is the upper resin member 1
It is arranged so as to be exposed to the outside from the opening 7 of No. 02.
The conductive wiring pattern 6 of the upper resin member 102 and the metal projection electrode 3 of the fingerprint detection element 1 are thermocompression bonded or connected by an anisotropic conductive resin 8. After the conductive wiring pattern 6 and the metal projection electrode 3 are brought into direct contact with each other to be electrically connected, the periphery can be sealed with a non-conductive resin. Depending on the type of the fingerprint detection element 1, the entire surface of the fingerprint detection unit 9 may be covered and protected by the protective resin 10. However, at least the periphery of the fingerprint detection unit 9 surrounded by the opening 7 is covered with the protective resin 10. Be seen. The back surface of the fingerprint detection element 1 mounted on the upper resin member 102 is covered with a sealing resin 11 or the like for the purpose of protecting the element.

On the other hand, the memory element 12 as the second semiconductor
Is the lower resin member 10 with an adhesive 13 such as Ag paste.
It is die-bonded so as to be mounted on the No. 3. The lower resin member 103 can be manufactured in the same manner as the upper resin member 102 described above. Electrode pad 14 on storage element 12
And the conductive wiring pattern 15 of the lower resin member 103,
It is electrically connected by wire bonding through the thin metal wire 16 made of Au or the like. The surface of the memory element 12 mounted on the lower resin member 103 is covered with a sealing resin 17 or the like for the purpose of protecting the element.

As described above, the upper resin member 102 on which the fingerprint detecting element 1 is mounted and the lower resin member 103 on which the memory element 12 is mounted are bonded to each other with the solder material 18 or the like, and the conductive wirings of the both are bonded together. Since the patterns 6 and 15 are electrically connected to each other, the fingerprint detection device 101
Is formed. A control signal from an external control circuit (not shown) is transmitted through the external terminal 19 to the fingerprint detection device 10
Introduced in 1.

Then, by pressing an arbitrary fingerprint 20 on the fingerprint detecting section 9 of the fingerprint detecting apparatus 101, the capacitance of the surface of the fingerprint detecting section 9 changes corresponding to the geometric fingerprint information peculiar to an individual. , Pressure change, or thermal change occurs. The fingerprint information is converted into a predetermined electric signal to be used for identifying an individual, etc.
Store in 2.

When personal authentication is required, the fingerprint information converted into an electric signal by the fingerprint detecting element 1 by pressing the fingerprint 20 against the fingerprint detecting section 9 is stored in advance in a storage element through a predetermined algorithm. The fingerprint information registered in 12 is compared and collated. If the comparison and matching results match, the individual to be authenticated can be specified.

FIG. 3 shows a second embodiment of the present invention,
The structure of a fingerprint detection device 201 according to the present invention is shown as a cross-sectional configuration perpendicular to the surface of the fingerprint detection element 1.
In the fingerprint detection device 201 of this embodiment, a package is assembled from the upper resin member 201 which is the first package member and the lower resin member 103 which is the second package member. In the upper resin member 202, as in the embodiment shown in FIGS. 1 and 2, the metal projection electrode 3 made of Au or a solder material is previously formed on the electrode pad 2 on the fingerprint detection element 1 made of a semiconductor by a plating method or the like. It is formed. The metal bump electrode 3 is thermocompression-bonded to one end of a flexible wiring substrate 21 made of a thin organic base material such as polyimide on which a low melting point metal such as tin (Sn) is plated in advance as a conductive wiring pattern. Further, the upper resin member 202 is made of the easy-plating resin material 5 selectively injection-molded on the surface of the three-dimensional object obtained by injection-molding the hard-plating resin material. It has a conductive wiring pattern 6 made of electroless plating such as Au. Further, the upper resin member 202 has at least one opening 7.
Flexible wiring board 21 connected to fingerprint detection element 1
The other end and the wiring pattern 6 are connected by thermocompression bonding so that the fingerprint detecting portion 9 of the fingerprint detecting element 1 is exposed to the outside from the opening 7 of the resin member 102. Depending on the type of the fingerprint detection element 1, the entire surface of the fingerprint detection unit 9 may be covered and protected with the protective resin 10, but at least the periphery of the fingerprint detection unit 9 surrounded by the opening is covered with the protective resin 10. . The back surface of the fingerprint detection element 1 mounted on the upper resin member 202 is covered with the sealing resin 11 or the like for the purpose of protecting the element.

The memory element 12 made of a semiconductor is mounted on the lower resin member 103, the upper resin member 202 and the lower resin member cane 103 are electrically connected to each other, and the fingerprint detecting device 20 is provided.
The method of converting the geometrical information of the fingerprint 20 into an electric signal by the fingerprint detecting element 1 and storing the information in the storage element 12 is the same as that of the first embodiment.

FIG. 4 shows a third embodiment of the present invention,
The structure of a fingerprint detecting device 301 according to the present invention is shown as a cross-sectional structure perpendicular to the surface of the fingerprint detecting element 1.
In the fingerprint detection device 301 of this embodiment, a package is assembled from the upper resin member 102 that is the first package member and the lower resin member 303 that is the second package member. The fingerprint detection element 1 made of a semiconductor has a metal projection electrode 3
The method of mounting on the upper resin member 102 using the electrical connection of is similar to that of the first embodiment. On the electrode pad 14 on the memory element 12 made of a semiconductor, a metal projection electrode 22 made of Au, a solder material or the like is previously formed by a plating method or the like. The metal protrusion electrode 22 is thermocompression-bonded to one end of a flexible wiring substrate 23 made of a thin organic base material such as polyimide on which a conductive wiring pattern is previously formed and which is plated with a low melting point metal such as Sn.

Upper resin member 102 and lower resin member 303
And are electrically connected to form the fingerprint detection device 301, the fingerprint detection element 1 converts the geometrical information of the fingerprint 20 into an electric signal, and the information is stored in the storage element 12.
This is similar to the case of the first and second forms of the embodiment.

FIG. 5 shows a fourth embodiment of the present invention,
The structure of a fingerprint detection device 401 according to the present invention is shown as a cross-sectional configuration perpendicular to the surface of the fingerprint detection element 1.
In the fingerprint detection device 401 of this embodiment, a package is assembled from an upper resin member 202 that is a first package member and a lower resin member 303 that is a second package member. The method of mounting the fingerprint detection element 1 made of a semiconductor on the upper resin member 202 via the flexible wiring board 21 is the same as in the case of the second embodiment. The method of mounting the memory element 12 made of a semiconductor on the lower resin member 303 via the flexible wiring board 22 is the same as in the case of the third embodiment. The upper resin member 202 and the lower resin member 303 are electrically connected to each other to form a fingerprint detection device 401, and the fingerprint detection element 1 converts the geometric information of the fingerprint 20 into an electric signal and stores it in the storage element 12. The method of storing the information is the same as in the first to third embodiments.

FIG. 6 shows a fifth embodiment of the present invention,
The structure of a fingerprint detection device 501 according to the present invention is shown as a cross-sectional configuration perpendicular to the surface of the fingerprint detection element 1.
In the fingerprint detection device 501 of this embodiment, a package is assembled from an upper resin member 102 that is a first package member and a lower resin member 503 that is a second package member. The fingerprint detection element 1 made of a semiconductor has a metal projection electrode 3
The method of mounting on the upper resin member 102 via the same is the same as in the case of the first embodiment.

In the lower resin member 503, the metal projection electrode 22 made of Au, a solder material or the like is previously formed on the electrode pad 14 on the memory element 12 made of semiconductor by a plating method or the like. The metal protrusion electrode 22 is formed of the lower resin member 50.
The second conductive wiring pattern 15 is thermocompression bonded or is connected by the anisotropic conductive resin 24. After the conductive wiring pattern 15 and the metal projection electrode 22 are brought into direct contact with each other to be electrically connected, the periphery can be sealed with a non-conductive resin. The back surface of the memory element 12 mounted on the lower resin member 503 is covered with a sealing resin 17 or the like for the purpose of protecting the element. The upper resin member 102 and the lower resin member 503 are electrically connected to each other to form a fingerprint detection device 501, and the fingerprint detection element 1 converts geometric information of the fingerprint 20 into an electric signal and stores it in the storage element 12. The method of storing the information is the same as in the first to fourth embodiments.

FIG. 7 shows a sixth embodiment of the present invention,
The structure of a fingerprint detection device 601 according to the present invention is shown as a cross-sectional configuration perpendicular to the surface of the fingerprint detection element 1.
In the fingerprint detection device 601 of this embodiment, a package is assembled from an upper resin member 202 that is a first package member and a lower resin member 503 that is a second package member. The method of mounting the fingerprint detection element 1 made of a semiconductor on the upper resin member 202 via the flexible wiring board 21 is the same as in the case of the second embodiment. The method of mounting the memory element 12 made of a semiconductor on the lower resin member 303 via the metal protruding electrode 22 is the same as in the fifth embodiment. Upper resin member 202 and lower resin member 50
3 is electrically connected to form a fingerprint detection device 601,
The method of converting the geometrical information of the fingerprint 20 into an electric signal by the fingerprint detecting element 1 and storing the information in the memory element 12 is the same as in the first to fifth embodiments.

By using one of the embodiments of the present invention as described above, the fingerprint detecting element 1 made of a semiconductor and the memory element 12 made of a semiconductor are made of the hard-to-plate resin material 4. Upper resin members 102, 202 and lower resin members 103, 3 made of the easily-platable resin material 5
It is possible to specify an individual who has been converted into an electric signal by the fingerprint detection element 1 by being electrically connected to each other through the conductive wiring patterns 6 and 15 formed on the easily plated resin material 03, 503. Fingerprint detection devices 101, 201, 30 capable of storing geometric information of fingerprints in the storage element 12.
1,401,501,601 can be obtained. Conventionally, a wiring board, which has been necessary when mounting a fingerprint detection device and a storage device, which are manufactured separately, is not required, so that the cost can be reduced. Furthermore, the fingerprint detection element 1
Since the storage element 12 and the storage element 12 are housed in an integrated package, the size and thickness can be significantly reduced as compared with the case where the conventional manufacturing method and the mounting method are individually mounted on the wiring board. .

The upper resin members 102, 202 and the lower resin members 103, 303, 503 are selectively plated easily on the surface of a three-dimensional object obtained by injection-molding the resin material 4 which is difficult to plate. Is injection-molded and electroconductive plating is applied to the surface of the conductive wiring pattern 6, 15
However, it is also possible to form the members for assembling the package with other electrically insulating materials such as ceramics. Further, the portion corresponding to the lower resin member is similar to the resin package of a general semiconductor integrated circuit in the memory element 1.
2 or the like may be mounted on a lead frame, the whole may be sealed by transfer molding, and the leads exposed to the outside may be connected to the conductive wiring patterns 6 of the upper resin members 102 and 202. Instead of the memory element 12, a semiconductor integrated circuit element having another function such as a microcomputer including a memory can be used. Instead of the fingerprint detection element 1, a sensor that detects temperature, humidity, atmospheric pressure, etc. can be used. Furthermore, since the image pickup surface can be exposed by mounting the image pickup element, it is possible to perform image formation by the optical system with high accuracy.

[0055]

As described above in detail, according to the present invention, a semiconductor device including a first semiconductor element and a second semiconductor element is mounted in a first package in which the first semiconductor element is mounted. A semiconductor device in which a member and a second package member on which the second semiconductor element is mounted are combined to form a package, and the active portion of the first semiconductor element is arranged in the opening;
It can be manufactured at low cost with a simple manufacturing process.
By mounting the first semiconductor element and the second semiconductor element in the same package, it is possible to reduce the size and thickness of the semiconductor device.

Further, according to the present invention, a semiconductor device having a fingerprint detecting function can be miniaturized and thinned and manufactured at low cost.

Further, according to the present invention, it is possible to reduce the size and the thickness of a semiconductor device which can store information detected from the outside by the first semiconductor element in the memory element as the second semiconductor element. It can be manufactured at low cost.

Further, according to the present invention, it is possible to easily electrically connect the second semiconductor element mounted on the second package member to the outside.

Further, according to the present invention, at least one of the first package member and the second package member can be manufactured quickly and with good mass productivity by injection molding and electroless plating.

Further, according to the present invention, it is possible to easily perform the electrical connection between the semiconductor element and the conductive wiring pattern formed on the package member by using the metal projection electrode formed in advance.

Further, according to the present invention, a connection wiring member in which a conductive wiring pattern is selectively formed on a flexible organic base material when electrically connecting the metal projection electrode and the conductive wiring pattern. Since it is carried out via the semiconductor device, it is possible to prevent stress from being applied to the semiconductor element.

Further, according to the present invention, it is possible to wire-bond the thin metal wires to electrically connect the second semiconductor element and the conductive wiring pattern formed on the second package member.

Further, according to the present invention, the reliability can be enhanced by protecting the first semiconductor element facing the opening of the first package member with the protective resin.

Further, according to the present invention, since the periphery of the first semiconductor element, which is adjacent to the opening of the first package member, is covered with the protective resin, except for the portion exposed at the opening. It can be surely protected with a protective resin.

Further, according to the present invention, a fingerprint detecting element having a fingerprint detecting section for contacting a fingertip to detect a fingerprint, and a fingerprint information element having a function related to processing of fingerprint information, have an opening. It can be mounted in a package to reduce size and weight. The package is assembled from the upper package member and the lower package member,
Since the fingerprint detecting portion of the fingerprint detecting element is arranged at the opening of the upper package member that is opened to the outside when the package is assembled, the fingertip can be brought into contact with the fingerprint detecting portion. For example, a fingerprint detection device that can store the geometrical information of a fingerprint unique to an individual converted into an electric signal by the fingerprint detection device in the fingerprint information device and read it out at the time of collation of personal authentication can be easily provided. It can be manufactured. Since the fingerprint detection element and the fingerprint information element are mounted in the package to be combined, the fingerprint detection device can be easily miniaturized and thinned.

Further, according to the present invention, since the periphery of the fingerprint detecting element adjacent to the opening of the package is covered with the sealing resin, the inside of the package can be surely sealed.

Further, according to the present invention, since the fingerprint information element is covered with the sealing resin, the fingerprint information element is less susceptible to the influence of the surrounding environment and the reliability can be improved.

[Brief description of drawings]

FIG. 1 is a fingerprint detection device 1 according to a first embodiment of the present invention.
It is sectional drawing which shows the schematic structure of 01.

FIG. 2 is a sectional view taken along the section line II-II in FIG.

FIG. 3 is a fingerprint detection device 2 according to a second embodiment of the present invention.
It is sectional drawing which shows the schematic structure of 01.

FIG. 4 is a fingerprint detection device 3 according to a third embodiment of the present invention.
It is sectional drawing which shows the schematic structure of 01.

FIG. 5 is a fingerprint detection device 4 according to a fourth embodiment of the present invention.
It is sectional drawing which shows the schematic structure of 01.

FIG. 6 is a fingerprint detection device 5 according to a fifth embodiment of the present invention.
It is sectional drawing which shows the schematic structure of 01.

FIG. 7 is a fingerprint detection device 6 according to a sixth embodiment of the present invention.
It is sectional drawing which shows the schematic structure of 01.

FIG. 8 is a cross-sectional view showing a schematic configuration of a fingerprint detection device according to a conventional technique.

9 is a cross-sectional view showing a state in which the fingerprint detection device and the storage device of FIG. 8 are combined.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Fingerprint detection element 3, 22 Metal projection electrode 4 Hard-plating resin material 5 Easy-plating resin material 6, 15 Conductive wiring pattern 7 Openings 8, 24 Anisotropic conductive resin 9 Fingerprint detection portion 10 Protective resin 11, 17 Sealing resin 12 Storage element 13 Adhesive 16 Metal thin wire 18 Solder material 20 Fingerprint 21,23 Flexible wiring board 101, 201, 301, 401, 501, 601 Fingerprint detection device 102, 202 Upper resin member 103, 303, 503 Lower resin Element

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01L 25/16 A61B 5/10 322 F term (reference) 2F063 AA41 BA29 BA30 BB01 BB02 CA35 HA04 HA10 MA07 ZA01 4C038 FF01 FF05 FG00 5B047 AA25

Claims (13)

[Claims]
1. A first package member having one or more openings and in which a conductive wiring pattern is selectively formed, and a second package in which a conductive wiring pattern is selectively formed. A member, a first semiconductor element mounted so that a predetermined active portion overlaps the opening of the first package member, and is electrically connected to the conductive wiring pattern of the first package member; A second semiconductor element mounted on the second package member so as to be electrically connected to the conductive wiring pattern of the second package member, and the first package member and the second package member are ,
A package in which the first semiconductor element and the second semiconductor element are housed inside, and the conductive wiring patterns are combined so as to be connected to each other to form a package in which the opening is opened to the outside. Semiconductor device.
2. The semiconductor device according to claim 1, wherein the first semiconductor element is a fingerprint detection element.
3. The semiconductor device according to claim 1, wherein the second semiconductor element is a memory element.
4. The conductive wiring pattern selectively formed on the second package member extends to the outside from a region where the second semiconductor element is mounted. 4. The semiconductor device according to any one of 3 to 3.
5. At least one of the first package member and the second package member is a three-dimensional object obtained by injection-molding a hard-to-plate resin material, and selectively on the surface of the three-dimensional object. 5. An easily-platable resin material that is injection-molded, wherein the conductive wiring pattern comprises an electroless plating layer formed on the surface of the easily-platable resin material. The semiconductor device according to 1.
6. At least one of the first semiconductor element and the second semiconductor element is electrically connected to a conductive wiring pattern formed on the first package member or the second package member. To connect to
The semiconductor device according to claim 1, further comprising a metal projection electrode that is formed in advance.
7. A semiconductor device having a metal protrusion electrode, wherein the metal protrusion electrode further comprises a connection wiring member in which a conductive wiring pattern is selectively formed on a flexible organic base material. Connected to the conductive wiring pattern of
7. The semiconductor device according to claim 6, wherein the semiconductor device is electrically connected to a conductive wiring pattern formed on the package member via the conductive pattern.
8. The second semiconductor element is electrically connected to a conductive wiring pattern formed on the second package member via a thin metal wire. 6. The semiconductor device according to any one of 5 above.
9. The protective resin is disposed on an active portion of the first semiconductor element which faces the opening of the first package member, and a protective resin is disposed on the active portion of the first semiconductor element. Semiconductor device.
10. The first semiconductor element facing the opening of the first package member has a periphery adjacent to the opening,
The semiconductor device according to claim 9, wherein the semiconductor device is covered with the protective resin.
11. A semiconductor substrate having a fingerprint detection element having a fingerprint detection part for detecting a fingerprint by touching one surface of the semiconductor substrate with a fingertip, and a function related to processing of fingerprint information detected by the fingerprint detection element. A fingerprint detecting device formed by mounting a fingerprint information element provided in a package in a package, the package including an upper package member on which the fingerprint detecting element is mounted, and the fingerprint information element mounted on the package. A lower package member in combination with an upper package member, wherein the upper package member has one or more openings, and a conductive wiring pattern is selectively formed. Is mounted in the opening so as to be electrically connected to the conductive wiring pattern, and the lower package member is an upper package member when assembled. Conductive wiring patterns that are mutually connected to the conductive wiring patterns are selectively formed, and the fingerprint information device is mounted so that the conductive wiring patterns are electrically connected to the conductive wiring patterns. A fingerprint detecting device, characterized in that, when combined with a lower package member, the opening is opened to the outside, and the conductive wiring patterns are interconnected.
12. The fingerprint detecting element mounted on the upper package member has the other surface side of the semiconductor substrate facing the one surface having the fingerprint detecting section covered with a sealing resin. The fingerprint detection device according to claim 11, which is characterized in that.
13. The fingerprint detecting device according to claim 11, wherein the fingerprint information element mounted on the lower package member is covered with a sealing resin.
JP2001272425A 2001-09-07 2001-09-07 Semiconductor device and fingerprint detector Pending JP2003086724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001272425A JP2003086724A (en) 2001-09-07 2001-09-07 Semiconductor device and fingerprint detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001272425A JP2003086724A (en) 2001-09-07 2001-09-07 Semiconductor device and fingerprint detector

Publications (1)

Publication Number Publication Date
JP2003086724A true JP2003086724A (en) 2003-03-20

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Country Link
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534008A (en) * 2010-06-18 2013-08-29 オーセンテック,インコーポレイテッド Finger sensor having sealing layer on sensing area and associated method
CN104183560A (en) * 2014-08-26 2014-12-03 南昌欧菲生物识别技术有限公司 Capacitance type fingerprint sensor packaging structure and packaging method
CN104484660A (en) * 2014-12-31 2015-04-01 华天科技(西安)有限公司 Chip-integrated fingerprint identification sensor and manufacturing method thereof
CN104681533A (en) * 2014-12-31 2015-06-03 华天科技(西安)有限公司 Substrate groove-based chip integrated fingerprint identification sensor and manufacturing method thereof
CN104779222A (en) * 2015-04-10 2015-07-15 华进半导体封装先导技术研发中心有限公司 Biometric identification module structure and manufacture method
JP2016076617A (en) * 2014-10-07 2016-05-12 新光電気工業株式会社 Semiconductor device for fingerprint recognition, manufacturing method of semiconductor device for fingerprint recognition, and semiconductor device
JP6055038B1 (en) * 2015-07-09 2016-12-27 コンクラフト ホールディング コーポレーション エルティーデーConcraft Holding Co., Ltd. Manufacturing method of frame used for fingerprint authentication panel, and manufacturing method of light guide structure using the frame
JP2018529158A (en) * 2015-05-08 2018-10-04 マイクロアレイ マイクロエレクトロニクス コーポレーション リミテッドMicroarray Microelectronics Corp., Ltd Fingerprint identification module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534008A (en) * 2010-06-18 2013-08-29 オーセンテック,インコーポレイテッド Finger sensor having sealing layer on sensing area and associated method
CN104183560A (en) * 2014-08-26 2014-12-03 南昌欧菲生物识别技术有限公司 Capacitance type fingerprint sensor packaging structure and packaging method
JP2016076617A (en) * 2014-10-07 2016-05-12 新光電気工業株式会社 Semiconductor device for fingerprint recognition, manufacturing method of semiconductor device for fingerprint recognition, and semiconductor device
CN104484660A (en) * 2014-12-31 2015-04-01 华天科技(西安)有限公司 Chip-integrated fingerprint identification sensor and manufacturing method thereof
CN104681533A (en) * 2014-12-31 2015-06-03 华天科技(西安)有限公司 Substrate groove-based chip integrated fingerprint identification sensor and manufacturing method thereof
CN104779222A (en) * 2015-04-10 2015-07-15 华进半导体封装先导技术研发中心有限公司 Biometric identification module structure and manufacture method
JP2018529158A (en) * 2015-05-08 2018-10-04 マイクロアレイ マイクロエレクトロニクス コーポレーション リミテッドMicroarray Microelectronics Corp., Ltd Fingerprint identification module
JP6055038B1 (en) * 2015-07-09 2016-12-27 コンクラフト ホールディング コーポレーション エルティーデーConcraft Holding Co., Ltd. Manufacturing method of frame used for fingerprint authentication panel, and manufacturing method of light guide structure using the frame

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