CN111554583B - Fingerprint chip module preparation method, fingerprint chip module and electronic equipment - Google Patents
Fingerprint chip module preparation method, fingerprint chip module and electronic equipment Download PDFInfo
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- CN111554583B CN111554583B CN202010349394.7A CN202010349394A CN111554583B CN 111554583 B CN111554583 B CN 111554583B CN 202010349394 A CN202010349394 A CN 202010349394A CN 111554583 B CN111554583 B CN 111554583B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 51
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- 238000000576 coating method Methods 0.000 claims abstract description 17
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- 238000000034 method Methods 0.000 claims description 34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application provides a fingerprint chip module preparation method, which comprises the following steps: providing a substrate; arranging a fingerprint wafer and two conductive columns on a substrate, and connecting the two conductive columns with a first electrode and a second electrode of a touch module of the fingerprint wafer; plastic packaging is carried out on the surface of the fingerprint wafer and the surface of the substrate by using a plastic packaging material to obtain a plastic packaging layer; conductive ink is coated on the plastic packaging areas corresponding to the two conductive columns on the plastic packaging layer, and common ink is coated on the other plastic packaging areas, so that the fingerprint chip module is obtained, wherein no cross area exists in the plastic packaging areas corresponding to the two conductive columns. This application replaces traditional outside becket through leading electrical pillar and the regional coating of corresponding at the fingerprint chip promptly electrically conductive printing ink, utilizes electrically conductive printing ink to increase electrically conductive area, saves the becket of Touch key chip standby awakening usefulness, simple structure, and then promotes the yield of product. This application still provides a fingerprint chip module and electronic equipment simultaneously, all has above-mentioned beneficial effect.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a fingerprint chip module preparation method, a fingerprint chip module and electronic equipment.
Background
In the prior art, a Touch key is connected with a metal ring to realize standby awakening and reduce the standby power consumption of the fingerprint chip. After the fingerprint chip enters the sleep mode, the system automatically cuts off the power supplies of the fingerprint sensor and the MCU, and the Touch key is left for standby so that the MCU and the fingerprint sensor can be awakened after the fingerprint chip is touched by a finger. The standby power consumption of the scheme is 6-10 uA, a metal ring needs to be added around the fingerprint sensor, the cost and the production difficulty are greatly increased, the structural design of a finished product is complex, and meanwhile the yield of the product is reduced.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a fingerprint chip module preparation method, a fingerprint chip module preparation device and electronic equipment, which are simple in structural design and capable of improving the yield of products. The specific scheme is as follows:
the application provides a fingerprint chip module preparation method, which comprises the following steps:
providing a substrate;
arranging a fingerprint wafer and two conductive columns on the substrate, and connecting the two conductive columns with a first electrode and a second electrode of a touch module of the fingerprint wafer;
carrying out plastic package on the surface of the fingerprint wafer and the surface of the substrate by using a plastic package material to obtain a plastic package layer;
conductive ink is coated on the plastic packaging areas corresponding to the two conductive posts on the plastic packaging layer, and common ink is coated on the other plastic packaging areas, so that the fingerprint chip module is obtained, wherein no cross area exists in the plastic packaging areas corresponding to the two conductive posts.
Optionally, after the plastic package areas corresponding to the two conductive pillars on the plastic package layer are coated with conductive ink and other plastic package areas are coated with common ink, the method further includes:
and executing a surface treatment process to ensure that the surface display effect of the plastic packaging area coated with the conductive ink is consistent with that of other plastic packaging areas of the common ink.
Optionally, after the performing of the surface treatment process, the method further includes:
and spraying preset ink on the surface of the module after the surface treatment process is finished so as to enhance the hardness and the adhesive force.
Optionally, the plastic package area corresponding to the two conductive posts is a semicircular area.
Optionally, the fingerprint wafer surface and the surface of the substrate are plastically packaged by using a plastic package material to obtain a plastic package layer, including:
coating the plastic packaging material on the surface of the fingerprint wafer, the exposed surface of the substrate and the surfaces of the two conductive columns;
and removing the plastic packaging material on the surfaces of the two conductive posts.
The application provides a fingerprint chip module, include:
a substrate;
a fingerprint wafer disposed on the substrate;
the two conductive columns are arranged on the substrate and are respectively connected with a first electrode and a second electrode of the touch module of the fingerprint wafer;
the plastic packaging layer is coated on the fingerprint wafer and the area of the substrate except the fingerprint wafer and the conductive column;
the conductive ink is arranged in the plastic packaging area corresponding to the two conductive posts on the surface of the plastic packaging layer, and the common ink is arranged in other plastic packaging areas, wherein no cross area exists in the plastic packaging areas corresponding to the two conductive posts.
Optionally, the method further includes:
a predetermined ink disposed over the conductive ink and the common ink.
Optionally, the conductive pillar is a copper pillar.
Optionally, the fingerprint wafer further includes: a parameter detection module;
the parameter detection module is electrically connected with one end of the first electrode and one end of the second electrode respectively; when the other end of the first electrode and the other end of the second electrode are switched on by receiving touch of an object, the parameter detection module detects parameter change between the first electrode and the second electrode, wherein the parameter change is used for indicating change of a touch state between the first electrode and the second electrode.
The application provides an electronic equipment, includes as above fingerprint chip module.
The application provides a fingerprint chip module preparation method, which comprises the following steps: providing a substrate; arranging a fingerprint wafer and two conductive columns on a substrate, and connecting the two conductive columns with a first electrode and a second electrode of a touch module of the fingerprint wafer; plastic packaging is carried out on the surface of the fingerprint wafer and the surface of the substrate by using a plastic packaging material to obtain a plastic packaging layer; conductive ink is coated on the plastic packaging areas corresponding to the two conductive columns on the plastic packaging layer, and common ink is coated on the other plastic packaging areas, so that the fingerprint chip module is obtained, wherein no cross area exists in the plastic packaging areas corresponding to the two conductive columns.
It can be seen that this application replaces traditional outside becket through leading electrical pillar and the corresponding regional coating of coating at the fingerprint chip promptly electrically conductive printing ink, utilizes electrically conductive printing ink to increase electrically conductive area, saves the becket of waking up usefulness with Touch key chip standby, simple structure, and then promotes the yield of product.
This application still provides a fingerprint chip module and electronic equipment simultaneously, all has above-mentioned beneficial effect, no longer gives unnecessary details here.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a fingerprint chip module according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a fingerprint chip module according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating a connection between a first electrode and a second electrode of a touch module and a parameter detection module according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the prior art, a Touch key is connected with a metal ring to realize standby awakening and reduce the standby power consumption of the fingerprint chip. After the fingerprint chip enters the sleep mode, the system automatically cuts off the power supplies of the fingerprint sensor and the MCU, and the Touch key is left for standby so that the MCU and the fingerprint sensor can be awakened after the fingerprint chip is touched by a finger. The standby power consumption of the scheme is 6-10 uA, a metal ring needs to be added around the fingerprint sensor, the cost and the production difficulty are greatly increased, the structural design of a finished product is complex, and meanwhile the yield of the product is reduced. Based on the above technical problem, this embodiment provides a fingerprint chip module preparation method, through leading electrical pillar and at the corresponding regional coating of fingerprint chip promptly conductive ink replace traditional outside becket, utilize conductive ink to increase the conducting area, save the becket that Touch key chip standby awakens up usefulness, simple structure, and then promote the yield of product, please refer to fig. 1 specifically, fig. 1 is the flow chart of the fingerprint chip module preparation method that this application embodiment provided, specifically includes:
s110, providing a substrate;
specifically, the material of the substrate can be set by a user.
S120, arranging a fingerprint wafer and two conductive columns on the substrate, and connecting the two conductive columns with a first electrode and a second electrode of a touch module of the fingerprint wafer;
specifically, the present embodiment does not limit the conductive pillar as long as it can conduct electricity, for example, the conductive pillar includes, but is not limited to, a copper pillar, a silver pillar, a patch capacitor, a resistor, and the like. Set up the fingerprint wafer on the base plate, then set up two and lead electrical pillar in the fixed setting in other positions of base plate, do not prescribe a limit to the specific position of fingerprint wafer and electrical pillar in this embodiment, but the user-defined setting, preferred, the shape of the module that step S120 obtained is symmetrical structure. Specifically, a fingerprint wafer is arranged on a substrate, a touch module is arranged on the fingerprint wafer and provided with a first electrode and a second electrode, and then solder paste is coated on two preset positions of one surface of the substrate, which is provided with the fingerprint wafer; and respectively arranging the conductive columns at the positions coated with the solder paste so as to enable the conductive columns to be welded on the substrate through the solder paste.
S130, plastic packaging is carried out on the surface of the fingerprint wafer and the surface of the substrate by using a plastic packaging material to obtain a plastic packaging layer;
in the step, plastic package is performed by using a plastic package process, plastic package materials are coated on the surface of the fingerprint wafer and the surface of the substrate, the surface of the conductive post is not coated, or the plastic package materials on the surface of the conductive post are removed after the plastic package materials are coated for convenient operation.
Further, step S130 includes:
coating plastic packaging materials on the surface of the fingerprint wafer, the surface of the substrate and the surfaces of the two conductive columns;
and removing the plastic packaging material on the surfaces of the two conductive posts.
Specifically, after the plastic package process is completed, the two conductive posts can be exposed from the surface of the plastic package material through a polishing process.
And S140, coating conductive ink on the plastic packaging areas corresponding to the two conductive posts on the plastic packaging layer, and coating common ink on the other plastic packaging areas so as to obtain the fingerprint chip module, wherein no cross area exists in the plastic packaging areas corresponding to the two conductive posts.
Specifically, plastic packaging is performed by using a plastic packaging process, the surface of the whole module comprises a plastic packaging surface and surfaces of the conductive columns, the plastic packaging surface is divided into three areas, namely a plastic packaging area corresponding to the first conductive column, a plastic packaging area corresponding to the second conductive column and other plastic packaging areas. The other plastic packaging areas are used for separating the plastic packaging area corresponding to the first conductive column from the plastic packaging area corresponding to the second conductive column, so that no crossing area exists in the coating areas corresponding to the two conductive columns, and then the conductive ink and the common ink are correspondingly coated. Wherein, the conductive area is increased by coating the conductive ink, and the first electrode and the second electrode are not short-circuited by coating the common ink. In this embodiment, the shape and size of the plastic sealing region corresponding to the conductive post are not limited as long as the object of this embodiment can be achieved. For example, the plastic encapsulation area corresponding to the two conductive pillars is a semicircular area, specifically, the surface is divided into two areas, one area is a conductive area including the plastic encapsulation area corresponding to the two conductive pillars, and the other area is a non-conductive area, at this time, taking a circle as an example, when performing coating, special conductive ink is used for the two semicircular areas of the outer circle, and common ink is used for the circular area of the inner circle, please refer to fig. 2, and fig. 2 is a schematic structural diagram provided in the embodiment of the present application. For example, the plastic sealing area corresponding to the two conductive posts is square; of course, the shape and size may be other, and the user may customize the setting as long as the purpose of the present embodiment can be achieved.
Further, after S140, the method further includes: and performing a surface treatment process to enable the surface display effect of the plastic packaging area coated with the conductive ink to be consistent with that of other plastic packaging areas coated with the common ink. In this embodiment, the surface treatment process is not limited, and the user can set the surface treatment process in a user-defined manner, as long as the surface display effects of the plastic package region coated with the conductive ink and the other plastic package regions of the common ink are consistent. Through a surface treatment process, the two areas have no obvious chromatic aberration and no obvious boundary sense.
Further, after the surface treatment process is performed, the method further includes: and spraying preset ink on the surface of the module after the surface treatment process is performed so as to enhance the hardness and the adhesive force. In this embodiment, the preset ink is not limited, the user can set the fingerprint chip module by himself, and the physical performance of the fingerprint chip module can be improved by the preset ink.
Based on above-mentioned technical scheme, this embodiment replaces traditional outside becket through leading electrical pillar and the regional coating that coats that corresponds at the fingerprint chip promptly electrically conductive printing ink, utilizes electrically conductive printing ink to increase electrically conductive area, saves the becket of the usefulness of waking up in Touch key chip standby, simple structure, and then promotes the yield of product.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a fingerprint chip module provided in an embodiment of the present application, which includes:
a substrate 100;
a fingerprint wafer 200 disposed on the substrate;
two conductive pillars 300 disposed on the substrate, wherein the two conductive pillars 300 are respectively connected to the first electrode 210 and the second electrode 220 of the touch module of the fingerprint wafer 200;
the plastic sealing layer 400 is coated on the fingerprint wafer 200, the area of the substrate 100 except the fingerprint wafer 200 and the conductive pillars 300;
the conductive ink 510(510-1 and 510-2) disposed in the plastic encapsulation region of the plastic encapsulation layer corresponding to the two conductive posts 300, and the common ink 520 disposed in the other plastic encapsulation region, wherein the plastic encapsulation region corresponding to the two conductive posts 300 does not have a crossing region.
Preferably, the method further comprises the following steps:
a predetermined ink disposed over the conductive ink and the normal ink.
Preferably, the conductive post 300 is a copper post.
Preferably, the fingerprint wafer 200 further includes: a parameter detection module;
the parameter detection module is electrically connected with one end of the first electrode and one end of the second electrode respectively; when the other end of the first electrode and the other end of the second electrode receive the touch of an object and are switched on, the parameter detection module detects the parameter change between the first electrode and the second electrode, and the parameter change is used for indicating the change of the touch state between the first electrode and the second electrode.
Specifically, please refer to fig. 4, and fig. 4 is a schematic diagram illustrating a connection between a first electrode, a second electrode and a parameter detection module according to an embodiment of the present disclosure. Upon receiving a touch by a first object (e.g., a user's finger). Before, the first electrode 210 and the second electrode 220 are in an open circuit state, and standby power consumption can be reduced to a certain extent by using the embodiment in the touch technology, so that user experience is improved. In the existing touch scheme, clock participation is also required, and compared with consumption, the standby state of the detection device in the embodiment is close to zero power consumption, the transient working state is also at the uA level, and an application scene of ultra-long standby time can be realized when the detection device is applied to portable and consumer products such as a battery or a lithium battery. The parameter detecting module 230 detects a first parameter change between the first electrode 210 and the second electrode 220, that is, through a previous test and presetting a parameter change range, the first parameter change is used for only changing the touch state between the first electrode 210 and the second electrode 220, so as to determine whether the space detected by the first electrode 210 and the second electrode 220 is touched. The parameter detecting module 230 may include a voltage detecting module and/or a current detecting module, and may detect other circuit parameters besides these commonly used parameter detections, which is not limited herein. As a preferred solution, the parameter detecting module 230 is a voltage detecting module, for example, the voltage detecting module is used for detecting, it can be determined that the area where the first electrode 210 and the second electrode 220 are located is touched by an object in order to determine that the object exists within the range of 1-5V, and in the specific implementation process of the solution, the change range can be adjusted according to the actually used circuit elements.
It can be understood that, in the traditional mode, touch chip, fingerprint module and becket are three independent modules, pass through the wire at the PCB board and connect, that is to say, set up the fingerprint module on the PCB board, set up the becket around the fingerprint module, then set up touch chip in other positions of PCB board. However, in this embodiment, the metal ring is replaced by the conductive pillar 300 and the conductive ink coating, and is packaged in the fingerprint chip module together with the touch module on the fingerprint wafer 200, so that the structure is simple.
Therefore, before the touch of an object is received, the first electrode and the second electrode are in an open circuit state, standby power consumption can be reduced to a certain extent by using the detection device in the touch technology, and user experience is improved.
Since the embodiment of the fingerprint chip module portion corresponds to the embodiment of the method portion, please refer to the description of the embodiment of the method portion for the embodiment of the fingerprint chip module portion, which is not repeated herein.
In the following, an electronic device provided by an embodiment of the present application is introduced, and the electronic device described below and the method described above may be referred to correspondingly.
The embodiment provides an electronic device, which comprises the fingerprint chip module and the parameter detection module.
Wherein the electronic device includes, but is not limited to: cell-phone, flat panel, fingerprint switch etc.
Since the embodiment of the electronic device portion and the embodiment of the method portion correspond to each other, please refer to the description of the embodiment of the method portion for the embodiment of the electronic device portion, which is not repeated here.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The fingerprint chip module, the fingerprint chip module and the electronic device provided by the application are introduced in detail in the above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (7)
1. A preparation method of a fingerprint chip module is characterized by comprising the following steps:
providing a substrate;
arranging a fingerprint wafer and two conductive columns on the substrate, and connecting the two conductive columns with a first electrode and a second electrode of a touch module of the fingerprint wafer;
carrying out plastic package on the surface of the fingerprint wafer and the surface of the substrate by using a plastic package material to obtain a plastic package layer;
coating conductive ink on the plastic packaging areas corresponding to the two conductive posts on the plastic packaging layer, and coating common ink on the other plastic packaging areas to enable the fingerprint chip module to be obtained, wherein no cross area exists in the plastic packaging areas corresponding to the two conductive posts;
the two on the plastic envelope layer the plastic envelope region that corresponds of leading electrical pillar coats electrically conductive printing ink, after other plastic envelope regions coat ordinary printing ink, still include:
executing a surface treatment process to enable the surface display effect of the plastic packaging area coated with the conductive ink to be consistent with that of other plastic packaging areas of the common ink;
after the surface treatment process is executed, the method further comprises the following steps:
and spraying preset printing ink on the surface of the module after the surface treatment process is finished so as to enhance the hardness and the adhesive force.
2. The method for manufacturing the fingerprint chip module according to claim 1, wherein the plastic sealing area corresponding to the two conductive posts is a semicircular ring area.
3. The method for manufacturing a fingerprint chip module according to claim 1, wherein the step of performing plastic package on the surface of the fingerprint wafer and the surface of the substrate by using a plastic package material to obtain a plastic package layer comprises the steps of:
coating the plastic packaging material on the surface of the fingerprint wafer, the exposed surface of the substrate and the surfaces of the two conductive columns;
and removing the plastic packaging material on the surfaces of the two conductive posts.
4. The utility model provides a fingerprint chip module which characterized in that includes:
a substrate;
a fingerprint wafer disposed on the substrate;
the two conductive columns are arranged on the substrate and are respectively connected with a first electrode and a second electrode of the touch module of the fingerprint wafer;
the plastic packaging layer is coated on the fingerprint wafer and the area of the substrate except the fingerprint wafer and the conductive column;
the conductive ink is arranged in the plastic packaging area corresponding to the two conductive posts on the surface of the plastic packaging layer, and the common ink is arranged in other plastic packaging areas, wherein the plastic packaging areas corresponding to the two conductive posts do not have cross areas;
further comprising:
a predetermined ink disposed over the conductive ink and the common ink.
5. The fingerprint chip module of claim 4, wherein the conductive posts are copper posts.
6. The fingerprint chip module of any one of claims 4 or 5, wherein the fingerprint wafer further comprises: a parameter detection module;
the parameter detection module is electrically connected with one end of the first electrode and one end of the second electrode respectively; when the other end of the first electrode and the other end of the second electrode are switched on by receiving touch of an object, the parameter detection module detects parameter change between the first electrode and the second electrode, wherein the parameter change is used for indicating change of a touch state between the first electrode and the second electrode.
7. An electronic device, comprising the fingerprint chip module according to any one of claims 4 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010349394.7A CN111554583B (en) | 2020-04-28 | 2020-04-28 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010349394.7A CN111554583B (en) | 2020-04-28 | 2020-04-28 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111554583A CN111554583A (en) | 2020-08-18 |
| CN111554583B true CN111554583B (en) | 2022-05-31 |
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| CN202010349394.7A Active CN111554583B (en) | 2020-04-28 | 2020-04-28 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
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| CN103729617A (en) * | 2012-10-12 | 2014-04-16 | 周正三 | Fingerprint sensing device and manufacturing method thereof |
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| CN109189274A (en) * | 2018-11-20 | 2019-01-11 | 深圳芯邦科技股份有限公司 | A kind of detection device applied to touch technology, fingerprint recognition system |
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| CN103729617A (en) * | 2012-10-12 | 2014-04-16 | 周正三 | Fingerprint sensing device and manufacturing method thereof |
| CN103942530A (en) * | 2014-03-03 | 2014-07-23 | 孙立民 | Fingerprint induction device with anti-fake function |
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