CN112866448B - Chip packaging structure, chip function module and electronic equipment - Google Patents

Abstract

The application is applicable to the technical fields of optics and electronics, and provides a chip packaging structure, which comprises: a substrate including a first surface and a second surface disposed opposite to each other in a thickness direction thereof; an integrated circuit die disposed on the first surface of the substrate and electrically connected to the outside through the substrate; and the packaging part is arranged on the substrate and covers the integrated circuit bare chip, and part of the outer surface of the packaging part, which is away from the first surface, is a curved surface. The application also provides a chip function module and electronic equipment comprising the chip packaging structure.

Description

Chip packaging structure, chip function module and electronic equipment

Technical Field

The present application relates to semiconductor packaging technology, and more particularly to a chip packaging structure, a chip function module, and an electronic device.

Background

The exposed sensing surface of the existing fingerprint recognition module for contacting with a finger is usually a plane, for example: the fingerprint identification module is arranged on the front face of the mobile phone. However, with the continuous change of the design style of the electronic device, the fingerprint recognition module may be disposed on a curved surface of the electronic device, for example: side frames of the electronic device. At this time, the flat exposed sensing surface of the existing fingerprint identification module cannot be well matched with the bending surface of the adjacent electronic equipment, so that the uniformity of the style of the whole appearance design of the electronic equipment is affected.

Disclosure of Invention

The application provides a chip packaging structure capable of solving the technical problems, and also provides a chip functional module and electronic equipment using the chip packaging structure.

The embodiment of the application provides a chip packaging structure, which comprises:

a substrate including a first surface and a second surface disposed opposite to each other in a thickness direction thereof;

an integrated circuit die disposed on the first surface of the substrate and electrically connected to the outside through the substrate;

and the packaging part is arranged on the substrate and covers the integrated circuit bare chip, and part of the outer surface of the packaging part, which is away from the first surface, is a curved surface.

In some embodiments, the packaging part is an integrally formed packaging body, and a part of the outer surface of the packaging body facing away from the first surface is a curved surface.

In some embodiments, the package portion includes an integrally formed package body and a cover body disposed on the package body, the package body encapsulates the integrated circuit die, a surface of the package body facing away from the first surface is defined as a third surface, the third surface is a plane, the cover body is disposed on the third surface, and a portion of an outer surface of the cover body facing away from the first surface is a curved surface.

In certain embodiments, the shape of the package is directly molded by a mold; or alternatively

The package body is formed into a preliminary shape through a die, and then is constructed into a specific shape through a surface processing technology.

In certain embodiments, the material of the cover is selected from any one or a combination of a plurality of glass, ceramic, plastic and metal.

In some embodiments, the chip package structure has an elongated shape, and the substrate has a length direction and a width direction perpendicular to a thickness direction thereof, respectively.

In some embodiments, the substrate further comprises a first side connecting the first surface and the second surface, wherein one end of the first side along the length direction of the substrate is hollowed out at a position close to the second surface to form a notch.

In some embodiments, the second surface is provided with a plurality of terminals for connecting to external electricity, and the terminals are sequentially arranged along the length direction of the substrate.

In some embodiments, the outer surface of the packaging part includes a second side surface, an upper surface and a lower surface, the upper surface and the lower surface are disposed opposite to each other along the thickness direction of the packaging part, the second side surface connects the upper surface and the lower surface, the lower surface is attached to the first surface of the substrate, and at least a portion of the upper surface is a curved surface.

In some embodiments, the radius of curvature of each point on the curved surface ranges from 2mm to 10mm.

In certain implementations, the integrated circuit die is a capacitive fingerprint recognition die.

The application also provides a chip functional module which comprises a circuit board and the chip packaging structure of any one of the embodiments. The circuit board is attached to the second surface of the substrate and is electrically connected with the chip packaging structure through terminals arranged on the second surface.

In some embodiments, the chip package structure is in an elongated strip shape, the substrate has a length direction and a width direction perpendicular to a thickness direction of the substrate, the substrate includes a first side surface respectively connected to the first surface and the second surface, one end of the first side surface along the length direction of the substrate is hollowed out at a position close to the second surface to form a notch, and the circuit board is led out from one side of the substrate where the notch is formed.

In some embodiments, the circuit board is coated with underfill around the area where it is electrically connected to the substrate, and the notch on the substrate is used to introduce the underfill.

The application also provides electronic equipment, which comprises the chip function module of any one of the embodiments.

In some embodiments, the electronic device includes a side frame having a curved shape, the chip function module is disposed on the side frame, and an outer surface of a portion of the package portion exposed by the chip function module is a curved surface, so that the curved surface and a surface shape of the adjacent side frame are matched with each other.

Additional aspects and advantages of embodiments of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the application.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of the functional module of the chip in fig. 1.

Fig. 3 is a cross-sectional view of the chip functional module of fig. 2 taken along line III-III.

Fig. 4 is a top view of the chip functional module of fig. 2.

Fig. 5 is a schematic structural diagram of the chip functional module according to another embodiment of the present application.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application. In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be interpreted as indicating or implying a relative importance or order of such features. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically connected, electrically connected or communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements or interaction relationship between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the application. In order to simplify the present disclosure, only the components and arrangements of specific examples will be described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat use of reference numerals and/or letters in the various examples, and is intended to be simplified and clear illustration of the present application, without itself being indicative of the particular relationships between the various embodiments and/or configurations discussed. In addition, the various specific processes and materials provided in the following description of the present application are merely examples of implementation of the technical solutions of the present application, but those of ordinary skill in the art should recognize that the technical solutions of the present application may also be implemented by other processes and/or other materials not described below.

Further, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the application. It will be appreciated, however, by one skilled in the art that the inventive aspects may be practiced without one or more of the specific details, or with other structures, components, etc. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring aspects of the application.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application, where the electronic device 100 includes a main body 10 and a chip function module 20 disposed on the main body 10. For convenience of description, a rectangular coordinate system of the electronic device 100 in fig. 1 is defined. The rectangular coordinate system in fig. 1 includes x, y, and z axes, wherein the x axis is a width direction of the electronic device 100, the y axis is a length direction of the electronic device 100, and the z axis is a thickness direction of the electronic device 100.

The body 10 includes a front 101, a back 103, and sides 102. The front surface 101 and the back surface 103 are disposed sequentially opposite to each other along the thickness direction z of the electronic device 100, and the side surfaces 102 are respectively connected to the front surface 101 and the back surface 103. Alternatively, in some embodiments, the front face 101 may be a side surface of the electronic device 100 that faces primarily toward a user when in use, for example: the electronic device 100 is configured to display a plane on which a display surface of a screen is located. The side 102 is, for example, an outer surface of a side frame of the electronic device 100. Opposite sides of the side 102 are respectively connected with the peripheral edge of the front 101 and the peripheral edge of the back 103. The side 102 extends along a length direction y and a width direction x of the electronic device 100.

Optionally, in some embodiments, the chip function module 20 is disposed on a side 102 of the electronic device 100. The side surface 102 is provided with a mounting hole 104, the chip functional module 20 is arranged on the main body 10 through the mounting hole 104, and a part of the outer surface of the chip functional module 20 is exposed from the mounting hole 104. It will be appreciated that the shape of the exposed portion of the outer surface of the chip functional module 20 may be matched with the shape of the adjacent portion of the side 102, so as to maintain the overall consistency of the appearance of the electronic device 100 and improve the grip of the user. The matching of the shapes herein means that the exposed portion of the outer surface of the chip functional module 20 and the adjacent portion of the side 102 have the same shape, for example: the exposed portion of the outer surface of the chip functional module 20 has the same curvature as the adjacent portion of the side 102. Alternatively, the shape of the exposed portion of the outer surface of the chip functional module 20 conforms to the shape change rule of the side 102 at this position, for example: the side 102 is a periodically varying wavy curved surface, and the shape of the exposed part of the outer surface of the chip functional module 20 is matched with the wavy shape of the side 102 at the position of the mounting hole 104.

It will be appreciated that, in other embodiments, the chip functional module 20 may be disposed on other surfaces of the electronic device 100, and the same technical effects as described above may be achieved by designing the shape of the exposed portion of the external surface of the chip functional module 20 to match the shape of the surface.

Optionally, in some embodiments, the electronic device 100 is, for example, but not limited to, a smart phone, a tablet computer, a notebook computer, a display, a television, a touch interactive screen, a smart door lock, a smart wearable device, a vehicle, a robot, an automated numerically controlled machine, and the like.

Optionally, in some embodiments, the chip function module 20 may be a biometric module for identifying biometric information of the user, where the biometric information includes, but is not limited to, fingerprint, palm print, ear print, palm print, etc., and other biometric information such as heart rate, vein, blood oxygen concentration, iris, voice print, etc. Specifically, the chip functional module 20 may be, for example, a fingerprint recognition module for recognizing a fingerprint, and the recognition principle of the fingerprint recognition module may be capacitive fingerprint recognition, optical fingerprint recognition or ultrasonic fingerprint recognition, which is not limited by the present application.

Alternatively, in some embodiments, the electronic device 100 may be a mobile phone. The chip function module 20, for example, a fingerprint identification module, is disposed on a side frame of the mobile phone, and the side frame has a curved surface as a side surface of the mobile phone. The outer surface of the exposed part of the packaging part 16 of the chip functional module 20 is a curved surface, and the curved surface has a curvature matched with the adjacent side frame surface, so that the shape of the exposed part of the chip functional module 20 and the shape of the side frame surface are matched with each other.

Optionally, the chip function module 20 may be integrated with a functional component disposed on the side frame of the mobile phone, for example, but not limited to, a power key, a volume key, a subscriber identity module (Subscriber Identification Module, SIM) card slot, and the like. Alternatively, the chip function module 20 may be separately disposed at a preset position on the side frame of the mobile phone, for example, a position where the user holds the side frame with his or her finger when operating the mobile phone.

It should be noted that, limited by the size of the chip functional module 20 shown in fig. 1, the chip module 20 in fig. 1 is only schematically shown in a cuboid shape in the installation position on the electronic device 100, and the actual structure of the chip module 20 is not shown.

Fig. 2 is a schematic structural diagram of the chip functional module 20 shown in fig. 1. Fig. 3 is a cross-sectional view of the chip functional module of fig. 2 taken along line III-III. Referring to fig. 1, 2 and 3, the chip functional module 20 includes a circuit board 30 and a chip package structure 10, the circuit board 30 is electrically connected to the chip package structure 10, and the chip package structure 10 is electrically connected to the outside through the circuit board 30.

The chip package structure 10 includes a substrate 12, an integrated circuit die 14, and a package 16. The substrate 12 includes a first surface 122 and a second surface 124 disposed opposite each other in a thickness direction thereof. The integrated circuit die 14 is disposed on the first surface 122 of the substrate 12 and is electrically connected to the outside through the substrate 12. The encapsulation 16 is disposed on the substrate 12 and covers the integrated circuit die 14 to protect the integrated circuit die 14.

For convenience of description, a rectangular coordinate system of the chip function module 20 is defined, wherein an l axis is a length direction of the chip function module 20, a w axis is a width direction of the chip function module 20, and t is a thickness direction of the chip function module 20. Referring to fig. 1, the correspondence between the rectangular coordinate system wlt of the chip functional module 20 and the rectangular coordinate system xyz of the electronic device 100 is as follows: the length direction l of the chip function module 20 is the same as the length direction y of the electronic device 100, the width direction w of the chip function module 20 is the same as the thickness direction z of the electronic device 100, and the thickness direction t of the chip function module 20 is the same as the width direction x of the electronic device 100.

Optionally, in some embodiments, the chip function module 20 is in an elongated strip shape, the chip function module 20 is mounted along the length direction y of the electronic device 100 according to the length direction l of the chip package structure 10, and the package portion 16 is mounted towards the placement angle of the outside of the electronic device 100. The portion of the outer surface 165 of the encapsulation portion 16 facing away from the first surface 122 is a portion of the outer surface of the entire chip functional module 20 exposed, and needs to be matched with the shape of the side 102 of the adjacent electronic device 100, for example: if the side 102 of the electronic device 100 adjacent thereto is curved, a portion of the outer surface 165 of the encapsulation portion 16 facing away from the first surface 122 is also curved.

Optionally, in some embodiments, the chip package structure 10 is in an elongated strip shape, and the corresponding components thereof, such as: the substrate 12, the integrated circuit die 14, the packaging portion 16, etc. are also correspondingly elongated, and can be described by using the rectangular coordinate system wlt of the chip function module 20 as a reference standard.

The substrate 12 has a length direction l and a width direction w, which are perpendicular to the own thickness direction t, respectively. The substrate 12 further includes a first side 126 connecting the first surface 122 and the second surface 124, and one end of the first side 126 along the length direction l of the substrate 12 is cut away near the second surface 124 to form a notch 125. The second surface 124 of the substrate 12 is provided with a plurality of terminals 127 for external connection, and the integrated circuit die 14 is disposed on the first surface 122 of the substrate 12 and is electrically connected to the terminals 127 through circuitry (not shown) disposed within the substrate 12.

Referring to fig. 4 together, fig. 4 is a top view of the chip functional module 20 shown in fig. 2. As shown in fig. 4, optionally, in some embodiments, the terminals 127 are arranged sequentially along the length direction i of the substrate 12 itself.

The circuit board 30 is mounted on the second surface 124 of the substrate 12 and is electrically connected to the chip package structure 10 through the terminals 127 on the second surface 124. Optionally, in some embodiments, the circuit board 30 is in an elongated strip shape. The length direction of the circuit board 30 is the same as the length direction of the substrate 12, and is the length direction l of the chip functional module 20. The width direction of the circuit board 30 is the same as the width direction of the substrate 12, and is the width direction w of the chip functional module 20. Optionally, the width of the circuit board 30 itself is smaller than the width of the substrate 12 itself. The circuit board 30 is led out from the side of the substrate 12 where the notch 125 is formed.

The circuit board 30 is electrically connected to the terminals 127 of the substrate 12 through the conductive adhesive 50, and the area where the terminals 127 on the second surface 124 are located is the area where the circuit board 30 is electrically connected to the substrate 12. In order to improve the reliability of the electrical connection between the circuit board 30 and the terminals 127 of the substrate 12, an underfill 60 (underfils) needs to be applied around the electrical connection area between the circuit board 30 and the substrate 12, the notch 125 on the substrate 12 is used for introducing the underfill 60, and the area where the circuit board 30 and the substrate 12 are electrically connected is filled by capillary flow after the underfill 60 is introduced from the notch 125.

Optionally, in some embodiments, the circuit board 30 is a flexible printed circuit board (Flexible Printed Circuit, FPC). The chip function module 20 further comprises a reinforcing plate 40, wherein one side surface of the FPC is electrically connected with the chip packaging structure 10, and the reinforcing plate 40 is arranged on the other side surface of the FPC, which is opposite to the chip packaging structure 10, so as to improve the strength of the FPC.

The outer surface of the packaging part 16 includes a second side surface 162, an upper surface 165 and a lower surface 166, the upper surface 165 and the lower surface 166 are disposed opposite to each other along the thickness direction t of the packaging part 16, and the second side surface 162 connects the upper surface 165 and the lower surface 166. The lower surface 166 conforms to the first surface 122 of the substrate 12. The upper surface 165 is a portion of the outer surface of the package portion 16 facing away from the first surface 122 of the substrate 12. At least a portion of the upper surface 165, which is the exposed portion of the outer surface of the entire chip functional module 20, is required to match the shape of the surface of the adjacent electronic device 100.

Optionally, in some embodiments, the second side 162 is perpendicular to the first surface 122 of the substrate 12, and at least a portion of the upper surface 165 is a curved surface, and a radius of curvature of each point on the curved surface ranges from 2mm to 10mm.

It is understood that in other embodiments, the second side 162 may be inclined to the first surface 122 of the substrate 12.

Optionally, in some embodiments, the package 16 is an integrally formed package 160, that is, the package 160 is the entire package 16, and has the same shape as the package 16, for example, the outer surface of the package 160 includes the second side 162, the upper surface 165, and the lower surface 166. The upper surface 165 of the package 160 is an outer surface of the package 16 facing away from the first surface 122 of the substrate 12, and at least a portion of the outer surface of the upper surface 165, which is exposed as the whole chip functional module 20, needs to be matched with the surface shape of the adjacent electronic device 100. Optionally, at least a portion of the upper surface 165 of the package 160 is curved.

Optionally, referring to fig. 3 and fig. 5 together, in some other embodiments, the packaging part 16 includes an integrally formed packaging body 160 and a cover 167 disposed on the packaging body 160. The package 160 is disposed on the substrate 12 and encapsulates the integrated circuit die 14. The package 160 includes a third surface 163 and a fourth surface 164 disposed opposite to each other in the thickness direction t thereof, and a third side 168 connecting the third surface 163 and the fourth surface 164. Wherein the third surface 163 is defined as a side surface of the package 160 facing away from the first surface 122 of the substrate 12. Optionally, the third surface 163 is a plane, and the cover 167 is disposed on the third surface 163. The fourth surface 164 is a surface of the package 160 that is bonded to the first surface 122 of the substrate 12, and corresponds to a lower surface 166 of the entire package 16. The third side 168 corresponds to at least a portion of the second side 162 of the entire package 16.

The cover 167 is attached to the third surface 163, and a portion of the outer surface 169 of the cover 167 facing away from the first surface 122 of the substrate 12 is required to be matched with the surface shape of the adjacent electronic device 100 as a portion of the outer surface exposed by the whole chip functional module 20. Optionally, the portion of the outer surface 169 of the cover 167 facing away from the first surface 122 of the substrate 12 is curved.

The material of the cover 167 is selected from any one or a combination of a plurality of glass, ceramic, plastic and metal. The cover 167 is disposed above the package 160 to serve as an exposed portion of the entire chip functional module 20, and the third surface 163 of the package 160 may be configured to be planar, thereby reducing the difficulty in manufacturing the chip package structure 10.

Alternatively, in some embodiments, the shape of the package 160 may be directly molded by a mold. Alternatively, in other embodiments, the package 160 is molded into a preliminary shape by a mold and then configured into a specific shape by a surface finishing process. For example: if a portion of the outer surface of the package 160 needs to be configured as a curved surface as an exposed portion of the whole chip functional module 20, the portion of the outer surface of the package 160 may be directly molded into a curved surface by a custom mold, or the portion of the outer surface of the package 160 may be molded into a flat surface by a mold and then processed into a curved surface by a surface processing technology. Such as, but not limited to, computer numerical control (Computer Numerical Control, CNC) machine machining, and the like.

The package 160 is used to encapsulate the integrated circuit die 14 on the substrate 12 to support and protect the entire chip package structure 10. The material of the package 160 is, for example, but not limited to, polyimide (PI), epoxy molding compound (Epoxy Molding Compound, EMC), silicone, etc.

Optionally, in some embodiments, the integrated circuit die 14 is a fingerprint recognition die, and correspondingly, the chip package structure 10 is a fingerprint recognition chip. The integrated circuit die 14 is, for example but not limited to, a capacitive fingerprint recognition die, an optical fingerprint recognition die, an ultrasonic fingerprint recognition die, according to the principle of the chip function module 20 implementing fingerprint recognition functions.

The chip function module 20 provided by the application matches the shape of the exposed surface of the package portion 16 of the chip package structure 10 with the shape of the surface of the adjacent electronic device 100, so that the electronic device 100 maintains the overall consistency of appearance.

In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing description of the preferred embodiments of the application is not intended to limit the application to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the application.

Claims (13)

1. The chip packaging structure is characterized by being in an elongated strip shape, and comprises:

the substrate is in an elongated strip shape and comprises a first surface and a second surface which are oppositely arranged along the thickness direction of the substrate, the substrate is provided with a length direction and a width direction which are respectively perpendicular to the thickness direction of the substrate, the substrate further comprises a first side surface which is used for connecting the first surface and the second surface, one end of the first side surface along the length direction of the substrate is dug away at a position close to the second surface to form a notch, and the notch is used for introducing underfill when the chip packaging structure and a circuit are mutually attached;

an integrated circuit die disposed on the first surface of the substrate and electrically connected to the outside through the substrate;

and the packaging part is arranged on the substrate and covers the integrated circuit bare chip, and part of the outer surface of the packaging part, which is away from the first surface, is a curved surface.

2. The chip package structure of claim 1, wherein the package portion is an integrally formed package, and a portion of an outer surface of the package facing away from the first surface is a curved surface.

3. The chip package structure of claim 1, wherein the package portion includes an integrally formed package body and a cover body disposed on the package body, the package body encapsulates the integrated circuit die, a surface of the package body facing away from the first surface is defined as a third surface, the third surface is a plane, the cover body is disposed on the third surface, and a portion of an outer surface of the cover body facing away from the first surface is a curved surface.

4. A chip package structure according to any one of claims 2 or 3, wherein the shape of the package body is directly molded by a mold; or alternatively

The package body is formed into a preliminary shape through a die, and then is constructed into a specific shape through a surface processing technology.

5. The chip package structure of claim 3, wherein the material of the cover is selected from any one or more of glass, ceramic, plastic and metal.

6. The chip package structure of claim 1, wherein a plurality of terminals for external connection are provided on the second surface, and the terminals are sequentially arranged along a length direction of the substrate itself.

7. The chip package structure of claim 1, wherein the outer surface of the package portion includes a second side surface, an upper surface and a lower surface, the upper surface and the lower surface are disposed opposite to each other in a thickness direction of the package portion, the second side surface connects the upper surface and the lower surface, the lower surface is attached to the first surface of the substrate, and at least a portion of the upper surface is curved.

8. The chip package structure of claim 1, wherein the radius of curvature of each point on the curved surface ranges from 2mm to 10mm.

9. The chip package structure of claim 1, wherein the integrated circuit die is a capacitive fingerprint recognition die.

10. The chip functional module comprises a circuit board and the chip packaging structure of any one of claims 1-9, wherein the circuit board is attached to the second surface of the substrate and is electrically connected with the chip packaging structure through terminals arranged on the second surface, the substrate is provided with a length direction and a width direction which are perpendicular to the thickness direction of the substrate, the substrate comprises a first side surface which is respectively connected with the first surface and the second surface, one end of the first side surface along the length direction of the substrate is dug away at a position close to the second surface to form a notch, the circuit board is led out from one side of the substrate where the notch is formed, underfill is required to be coated around the area where the circuit board is electrically connected with the substrate, and the notch on the substrate is used for guiding in the underfill.

11. The chip function module of claim 10, wherein the circuit board is in a strip shape, and the width of the circuit board is smaller than the width of the substrate.

12. An electronic device comprising the chip function module of any one of claims 10-11.

13. The electronic device of claim 12, wherein: the electronic equipment comprises a side frame with a bent shape, the chip functional module is arranged on the side frame, and the outer surface of a part of the packaging part exposed out of the chip functional module is a curved surface, so that the curved surface is matched with the surface shape of the adjacent side frame.