CN214672572U

CN214672572U - Cambered surface electric capacity fingerprint packaging structure, module and electronic equipment

Info

Publication number: CN214672572U
Application number: CN202023351629.0U
Authority: CN
Inventors: 段晓锋; 刘相英
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-11-09
Anticipated expiration: 2030-12-31

Abstract

The application relates to the field of packaging, especially, relate to a cambered surface electric capacity fingerprint packaging structure, module and electronic equipment. A cambered surface capacitance fingerprint packaging structure comprises a packaging material layer, a capacitance fingerprint sensor, a ceramic wafer and a first wafer bonding film DAF adhesive layer; a first DAF adhesive layer is arranged between the capacitance fingerprint sensor and the ceramic chip to fix the ceramic chip above the capacitance fingerprint sensor; the first DAF glue layer is arranged on the upper surface of the capacitive fingerprint sensor; the ceramic plate is arranged on the upper surface of the first DAF adhesive layer; the upper surface of the packaging material layer is an arc surface; the packaging material layer coats the capacitive fingerprint sensor, the first DAF adhesive layer and the ceramic wafer. The ceramic wafer is arranged above the capacitive fingerprint sensor, so that the problem of poor fingerprint image quality caused by arrangement of the arc surface is solved.

Description

Cambered surface electric capacity fingerprint packaging structure, module and electronic equipment

Technical Field

The application relates to the field of biological identification, especially, relate to a cambered surface electric capacity fingerprint packaging structure, module and electronic equipment.

Background

At present, along with the development of the biometric sensor, especially the rapid development of the fingerprint sensor, the fingerprint sensor is widely applied to the fields of mobile terminal equipment, smart homes, automobile electronics and the like, the market demand for the biometric sensor is increasing day by day, the market demand is getting bigger and bigger, the requirement of a user on a product is not only the pursuit of high quality and high performance, the diversification of appearance requirements is expanded, and the aesthetic eye lights of different user groups are also diversified. At present, the capacitive fingerprints in the mainstream market are of a planar structure and are not enough to be matched with the curved surface part of the mobile terminal equipment. The surface of the side fingerprint (such as a capacitive fingerprint arranged near the start key) can be made into a cambered surface, but the quality of the acquired fingerprint image is poor, so that even if a target user is, the fingerprint identification success rate is low, and the user experience is poor.

SUMMERY OF THE UTILITY MODEL

To the relatively poor problem of fingerprint image quality of cambered surface fingerprint among the prior art, this application embodiment provides a cambered surface electric capacity fingerprint packaging structure, module and electronic equipment.

A first aspect of an embodiment of the present application provides an arc-surface capacitance fingerprint package structure, including a package material layer, a capacitance fingerprint sensor, a ceramic sheet, a first wafer bonding film DAF glue layer;

a first DAF adhesive layer is arranged between the capacitance fingerprint sensor and the ceramic chip to fix the ceramic chip above the capacitance fingerprint sensor;

the first DAF glue layer is arranged on the upper surface of the capacitive fingerprint sensor;

the ceramic plate is arranged on the upper surface of the first DAF adhesive layer;

the upper surface of the packaging material layer is an arc surface;

the packaging material layer coats the capacitive fingerprint sensor, the first DAF adhesive layer and the ceramic wafer.

According to the first aspect, in one possible implementation, the roughness of the ceramic wafer is 0.2um to 0.8 um.

According to the first aspect, in one possible implementation, the roughness of the upper surface of the ceramic plate is 0.2um to 0.8 um.

In a possible implementation form according to the first aspect, the ceramic sheet has a dielectric constant of 25 to 35.

In a possible implementation form according to the first aspect, the dielectric constant of the first DAF glue layer is 25 to 35.

According to the first aspect, in one possible implementation, the dielectric constant of the first DAF glue layer is less than or equal to the dielectric constant of the ceramic sheet;

the dielectric constant of the first DAF glue layer is greater than or equal to ninety percent of the dielectric constant of the ceramic sheet.

According to the first aspect, in one possible implementation, the ceramic sheet has a thickness of 50um to 200 um.

According to the first aspect, in one possible implementation, the ceramic sheet has a thickness of 100 um.

According to the first aspect, in one possible implementation, the area of the upper surface of the ceramic plate is equal to the area of the sensing area of the capacitive fingerprint sensor; the length of the ceramic wafer is smaller than that of the capacitance fingerprint sensor, and the width of the ceramic wafer is smaller than that of the capacitance fingerprint sensor.

According to the first aspect, in one possible implementation, the distance from the center of the upper surface of the capacitive fingerprint sensor to the center of the upper surface of the layer of encapsulation material is 150um to 480 um.

According to the first aspect, in a possible implementation manner, the fingerprint sensor further includes a second DAF glue layer and a substrate, and the second DAF glue layer is disposed between the capacitive fingerprint sensor and the substrate so that the capacitive fingerprint sensor is fixed above the substrate; the second DAF glue layer is arranged on the upper surface of the substrate;

the capacitive fingerprint sensor is arranged on the upper surface of the second DAF glue layer;

the soldering tin layer is arranged between the substrate and the FPC so that the substrate is electrically connected with the FPC;

still include the stiffening plate, the stiffening plate sets up in FPC's lower surface.

The second aspect of the embodiment of this application provides an cambered surface electric capacity fingerprint module, includes the cambered surface electric capacity fingerprint packaging structure as in any one of the first aspect, still includes the arc and coats, and the arc is coated and is set up in the upper surface on encapsulating material layer, and the upper surface on arc is the cambered surface.

According to the second aspect, in one possible implementation, the distance from the center of the upper surface of the capacitive fingerprint sensor to the center of the upper surface of the arc-shaped coating layer is 170um to 500 um.

According to the second aspect, in one possible implementation, a distance from a center of an upper surface of the capacitive fingerprint sensor to a center of an upper surface of the arc-shaped coating layer is 200um to 500 um.

According to the second aspect, in one possible implementation, the radius of the upper surface of the arc coating layer is 0.8mm to 8 mm.

A third aspect of embodiments of the present application provides an electronic device, comprising: the circuit mainboard with as in any one of the second aspect cambered surface electric capacity fingerprint module, cambered surface electric capacity fingerprint module passes through the connector with the circuit mainboard and is connected.

Compared with the prior art, the beneficial effects of the embodiment of the application lie in that: the embodiment of the application provides an cambered surface capacitance fingerprint packaging structure, module and electronic equipment, sets up the potsherd through the top at capacitance fingerprint sensor, has improved because the relatively poor problem of fingerprint image quality that the cambered surface setting leads to.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a cross-sectional view of a capacitive fingerprint module according to an embodiment of the present disclosure;

fig. 2 is a flowchart of a packaging method provided in an embodiment of the present application;

FIG. 3 is a schematic view of a package sheet according to an embodiment of the present application;

fig. 4 is a schematic view of another packaging sheet provided by an embodiment of the present application;

FIG. 5 is a schematic view of another cross-sectional angle of the encapsulating sheet provided by the embodiment of the present application;

fig. 6 is a schematic view of another packaging sheet provided in an embodiment of the present application;

fig. 7 is a flowchart of another packaging method provided in the embodiments of the present application;

fig. 8 is a flowchart of a method for manufacturing an arc-surface capacitance fingerprint module according to an embodiment of the present disclosure;

fig. 9 is a schematic view of another package sheet according to an embodiment of the present application;

fig. 10 is a flowchart of a method for manufacturing an arc-surface capacitance fingerprint module according to an embodiment of the present disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, some embodiments of the present application will be described in detail by way of example with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the examples, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

For a long time, capacitanc fingerprint module adopts traditional structure always, is a square or circular shape plane contact structure basically, and the user feels uncomfortable when using, the appearance is not pleasing to the eye, and under adverse circumstances such as many sand blown by the wind, many dust moreover, the dust can adsorb on plane contact structure very easily, leads to capacitanc fingerprint module fingerprint identification to appear erroneous judgement scheduling problem when using. The effective solution is to adopt a cambered surface capacitance fingerprint scheme, the new structural design scheme improves the fingerprint identification module, and after the fingerprint identification module is installed on the whole machine, the whole machine is more aesthetic in appearance, and the user feels comfortable, and has a stereoscopic impression in vision, and on the other hand, the cambered surface three-dimensional design can avoid the damage to the whole capacitance fingerprint identification module when the mobile phone falls down.

Fig. 1 is a cross-sectional view of an arc-shaped capacitive fingerprint module provided in an embodiment of the present application, where the arc-shaped fingerprint module 100 includes a capacitive fingerprint sensor 101 and a ceramic plate 111, a first Die Attach Film (DAF) adhesive layer 112 is disposed between the ceramic plate 111 and the capacitive fingerprint sensor 101, the first DAF adhesive layer 112 is used to fix the ceramic plate 111 above the capacitive fingerprint sensor 101, for convenience of description, the capacitive fingerprint sensor is denoted by Die, the module further includes a substrate 102, the Die101 is electrically connected to the substrate 102, the substrate 102 is located below the Die101, a second DAF adhesive layer 104 is disposed between the Die101 and the substrate 102, and the second DAF adhesive layer 104 is used to fix the Die101 above the substrate 102. Die101 may be directly attached to the upper surface of substrate 102 through second DAF adhesive layer 104, and then, electrical connection between Die101 and substrate 102 is achieved through Wire Bonding (WB). The module 100 further includes a Flexible Printed Circuit (FPC) 103, and the module further includes a solder layer 107 disposed between the substrate 102 and the FPC103, in this embodiment, the substrate 102 is connected to the FPC103 through solder and then underfill (under fill) colloid, the solder layer 107 includes solder and colloid, the solder is used for electrically connecting the substrate 102 to the FPC103, and the colloid is used for strengthening the physical connection between the substrate 102 and the FPC 103. The template further comprises a reinforcing steel plate (or called a reinforcing plate, a steel reinforcing plate and a reinforcing steel sheet) 108, wherein the reinforcing steel plate is arranged on the lower surface of the FPC103, and the reinforcing steel plate 108 is used for fixing the FPC 103. The module 100 may further include a packaging material layer 105, the packaging material layer 105 wraps the Die101, and since the upper surface of the Die101 is the first DAF adhesive layer 112 and the upper surface of the first DAF adhesive layer 112 is the ceramic sheet 111, the packaging material layer 105 wraps a packaging sheet formed by the Die101, the first DAF adhesive layer 112 and the ceramic sheet 111. For convenience of description, the encapsulating material layer is illustrated by taking an Epoxy Molding Compound (EMC) layer as an example, and an arc coating layer 106, such as an ink layer, is disposed on an upper surface of the EMC layer 105. In this embodiment, the encapsulating material layer may be obtained by performing a polishing process on the CNC curved surface, or by using a Molding die (Molding) process to obtain the encapsulating material layer with the arc surface as the upper surface.

In the embodiment, the ceramic sheet is arranged above the capacitance fingerprint sensor, and the ceramic belongs to a high dielectric material, and the dielectric constant of the ceramic sheet is higher than that of an EMC layer, so that under the same physical environment of a finger and the surface of the finger, when the ceramic sheet is arranged above Die, the signal quantity of the measured capacitance is larger, the penetration capacity of capacitance signals can be improved, and the significance is great for the cambered surface fingerprint. For the plane fingerprint module, the distance between the finger of the user and the upper surface of the Die is small, so that a fingerprint image with good quality can be acquired. And to the cambered surface fingerprint, when the user presses the finger on cambered surface fingerprint module, capacitance fingerprint sensor's upper surface is great to the distance between the finger, therefore, be difficult for acquireing high-quality fingerprint image, after setting up the potsherd in capacitance fingerprint sensor's top, can improve the relatively poor problem of fingerprint image quality, in addition, to cambered surface capacitance fingerprint encapsulation or module structure, capacitance fingerprint sensor's top has sufficient space can hold the potsherd, therefore, the thickness that the top of capacitance fingerprint sensor in encapsulation or module set up the potsherd and generally not increase cambered surface fingerprint encapsulation or module, user experience is better.

Based on the disclosure of the above embodiments, in the present embodiment, since the ceramic sheet is disposed above the capacitive fingerprint sensor, while the packaging material layer 105 covers the capacitive fingerprint sensor 101, the encapsulating material layer also covers the ceramic sheet 111 and the first DAF glue layer 112, if the upper surface of the ceramic sheet 111 is smooth, delamination tends to occur at the position where the EMC layer 105 contacts the ceramic sheet 111, i.e., an air gap is generated between the ceramic sheet and the EMC layer 105, which degrades the quality of the fingerprint image due to the low dielectric constant of air, and, in order to solve this problem, the roughness of the ceramic wafer can be set to be 0.2um to 0.8um, specifically, the roughness of the upper surface of the ceramic wafer can be set to be 0.2um to 0.8um, in addition, the bonding force between the packaging material layer and the ceramic wafer can be enhanced, and the reliability of the packaging structure or the module is improved. The evaluation parameters of the surface roughness specified by the national standards mainly include a basic parameter and an additional parameter, wherein the substrate parameter is also called an amplitude parameter, and the roughness in this embodiment can be understood as an amplitude parameter Ra (arithmetic mean deviation of the profile). In this embodiment, the overall roughness of the ceramic wafer may also be set to be 0.2um to 0.8um, that is, the roughness of the lower surface or the side surface of the ceramic wafer may also be 0.2um to 0.8um, which also helps to improve the bonding force between the first DAF adhesive layer and the ceramic wafer, and prevents an air gap from being generated between the first DAF adhesive layer and the ceramic wafer to degrade the quality of the fingerprint image, and in addition, may also improve the reliability.

Based on the disclosure of the above embodiments, in this embodiment, in order to further improve the quality of the fingerprint image, the dielectric constant of the ceramic sheet is set to be between 25 and 35, and when the dielectric constant of the ceramic sheet is set to be between 25 and 35, the signal amount of the detected capacitance is larger under the same physical environment of the finger and the surface of the finger, so that the quality of the acquired fingerprint image can be further improved. In this embodiment, the dielectric constant of the first DAF glue layer is not limited, and for example, the dielectric constant of the first DAF glue layer may be set to be 3.5.

Based on the disclosure of the above embodiments, in this embodiment, in order to further improve the quality of the fingerprint image, the dielectric constant of the first DAF adhesive layer is set to be between 25 and 35, and when the dielectric constant of the first DAF adhesive layer is set to be between 25 and 35, the signal amount of the detected capacitance is larger under the same physical environment of the finger and the surface of the finger, and therefore, the quality of the acquired fingerprint image can be further improved. Further, if the dielectric constant of the ceramic sheet is between 25 and 35, and the dielectric constant of the first DAF adhesive layer is between 25 and 35, when the dielectric constants of the ceramic sheet and the first DAF adhesive layer are similar, the quality of the acquired fingerprint image can be further improved.

Based on the disclosure of the above embodiments, in this embodiment, the dielectric constant of the first DAF glue layer is less than or equal to that of the ceramic sheet, and the dielectric constant of the first DAF glue layer is greater than or equal to ninety percent of that of the ceramic sheet. In this embodiment, the dielectric constants of the ceramic sheet and the first DAF adhesive layer are similar, specifically, the dielectric constant of the first DAF adhesive layer is less than or equal to the dielectric constant of the ceramic sheet and is greater than or equal to ninety percent of the dielectric constant of the ceramic sheet, so that the relationship between the dielectric constant of the first DAF adhesive layer and the dielectric constant of the ceramic sheet is set, the process is convenient to implement, and the cost is saved.

Based on the disclosure of the above embodiment, in this embodiment, the thickness of the ceramic wafer is 50um to 200um, if the ceramic wafer is too thin, the ceramic wafer is easy to be cracked in the process of attaching to the fingerprint identification sensor, which is not beneficial to process realization, if the ceramic wafer is too thick, the distance from the finger to the fingerprint identification sensor may be caused to be too far so that the quality of the acquired fingerprint image is poor and the fingerprint identification is affected, when the thickness of the ceramic wafer is set to be 50um to 200um, the quality of the fingerprint image can be ensured, and the yield of the package or the module can also be ensured.

Based on the disclosure of the above embodiment, in this embodiment, the thickness of the ceramic sheet can be set to 100um, when the thickness of the ceramic sheet is set to 100um, a fingerprint image with good quality can be obtained, so that the fingerprint image can be conveniently identified, and the ceramic sheet is also easily attached to the fingerprint identification sensor, so that the quality and the reliability of the fingerprint image can be well balanced.

Based on the disclosure of the above embodiments, in this embodiment, the area of the upper surface of the ceramic chip is equal to the area of the sensing area of the capacitance fingerprint sensor, generally, since the area of the upper surface of the ceramic chip is equal to the area of the lower surface, it can also be understood that the area of the lower surface of the ceramic chip is equal to the area of the sensing area of the capacitance fingerprint sensor, and since the sensing area of the capacitance fingerprint sensor is used for testing the signal quantity of the capacitance, when the ceramic chip is disposed right above the sensing area and can completely cover the sensing area of the capacitance sensor, a better fingerprint image can be obtained. Generally, the area of the sensing region of the capacitive fingerprint sensor is smaller than the area of the upper surface of the capacitive fingerprint sensor, in this embodiment, the area of the upper surface of the ceramic plate is equal to the area of the sensing region of the capacitive fingerprint sensor, the length of the ceramic plate is smaller than the length of the capacitive fingerprint sensor, and the width of the ceramic plate is smaller than the width of the capacitive fingerprint sensor.

Based on the disclosure of the above embodiments, in the present embodiment, the distance from the center of the upper surface of the capacitive fingerprint sensor to the center of the upper surface of the encapsulation material layer is 150um to 480 um. Packaging material layer cladding electric capacity fingerprint sensor, when the distance of the center of the upper surface of electric capacity fingerprint sensor to the center of packaging material layer is too far away, the fingerprint image quality of acquireing is relatively poor so that influence fingerprint identification, when the distance of the center of the upper surface of electric capacity fingerprint sensor to the center of packaging material layer is too close, then probably lead to the reliability problem, so that probably lead to the yield to reduce, when the distance that sets up electric capacity fingerprint sensor's the center of upper surface to the center of packaging material layer is 150um to 480um, can guarantee the quality of fingerprint image, also can guarantee the yield.

In this embodiment, the center of the plane figure may be understood as an intersection of diagonal lines of the plane figure, for example, if the upper surface of Die is rectangular, the center of the upper surface of Die is the intersection of the diagonal lines of the rectangle, and if the upper surface of Die is circular, the center of the upper surface of Die is the center of the circle.

Based on the disclosure of the above embodiments, in the present embodiment, referring to fig. 1, the capacitive fingerprint packaging structure further includes a second DAF adhesive layer 104 and a substrate 102, where the second DAF adhesive layer is disposed between the capacitive fingerprint sensor 101 and the substrate 102, so that the capacitive fingerprint sensor 101 is fixed on the upper surface of the substrate 102 through the second DAF adhesive layer. The capacitor fingerprint packaging structure can further comprise a soldering tin layer 107 and an FPC103, wherein the soldering tin layer 107 is arranged between the substrate 102 and the FPC103, and the soldering tin layer is used for electrically connecting the substrate 102 and the FPC 103.

Based on the disclosure of the above embodiments, in the embodiment, please refer to the arc capacitance fingerprint module shown in fig. 1, which is different from the arc capacitance fingerprint package structure, the arc capacitance fingerprint module further includes an arc coating layer 106, the arc coating layer 106 is disposed on the upper surface of the package material layer 105, and the upper surface of the arc coating layer 106 is an arc surface. In this embodiment, the arc coating layer may be formed by a coating process, and compared to a conventional cover plate process, the arc coating layer formed by the coating process has a higher degree of freedom in selecting characteristics such as material, thickness, and color.

Based on the disclosure of the above embodiments, in the present embodiment, the distance D1 from the center of the upper surface of the fingerprint sensor to the center of the upper surface of the arc coating layer is 170um to 500 um. When the distance from the center of the upper surface of the capacitor fingerprint sensor to the center of the upper surface of the arc coating layer is too far away, the quality of the acquired fingerprint image is poor so as to influence fingerprint identification, when the distance from the center of the upper surface of the capacitor fingerprint sensor to the center of the upper surface of the arc coating layer is too close, the reliability problem can be caused, so that the possible yield is reduced, when the distance from the center of the upper surface of the capacitor fingerprint sensor to the center of the upper surface of the arc coating layer is 170um to 500um, the quality of the fingerprint image can be ensured, and the yield can also be ensured. In addition, when the distance D1 from the center of the upper surface of the fingerprint sensor to the center of the upper surface of the arc-shaped coating layer is 200um to 500um, the ceramic sheet 111 is disposed above the fingerprint sensor 101, so that the quality of the fingerprint image can be greatly improved. Generally speaking, to plane electric capacity fingerprint module, electric capacity fingerprint sensor is the biggest generally 200um to the distance of plane coating, is greater than 200um to the distance of plane coating when electric capacity fingerprint sensor, then probably can not acquire high-quality fingerprint image and influence fingerprint identification, to cambered surface electric capacity fingerprint module, set up the ceramic wafer and can improve electric capacity fingerprint sensor to the distance of arc coating to 500um in electric capacity fingerprint sensor top, the requirement of the wide camber of fingerprint identification face (with the face that the consumer pointed the contact) in the whole machine of satisfying the consumer that can be better. In this embodiment, the ceramic wafer can be laminated on the surface of fingerprint identification sensor through the DAF glue film, then makes the encapsulation piece wholly, carries out coating technology at last and carries out surface treatment and form the arc coating to make cambered surface electric capacity fingerprint module. In this embodiment, the R angle of the upper surface of the arc coating layer 106 may be 0.8mm to 8mm, and the radius of the upper surface of the arc coating layer may be set to 0.8mm to 8mm, so as to satisfy the demand of the consumer for the wide curvature. For the thickness design of arc coating, if the arc coating is the matte layer, its thickness can set up to 25um, if the arc coating is the highlight layer, its thickness can be 30 um.

Based on the disclosure of the above embodiments, the present embodiment discloses an electronic device, which may be an electronic device including the fingerprint module disclosed in the foregoing embodiments, such as a mobile phone, a tablet, and a computer, and the capacitive fingerprint module is connected to a circuit main board in the electronic device through a connector.

Based on the disclosure of the foregoing embodiment, the present embodiment discloses a packaging method, which is applied to the capacitive fingerprint packaging structure disclosed in the foregoing embodiment, and specifically, as shown in fig. 2, the method includes the following steps:

s201: the capacitive fingerprint sensor is pasted above the substrate through the second DAF glue layer;

s202: the ceramic plate is pasted above the capacitive fingerprint sensor through the first DAF adhesive layer;

s203: electrically connecting pins of the capacitive fingerprint sensor and pins of the substrate through metal wires;

s204: and coating the second DAF adhesive layer, the capacitive fingerprint sensor, the first DAF adhesive layer and the ceramic wafer by using a plastic packaging material to form a packaging material layer above the substrate, wherein the upper surface of the packaging material layer is an arc surface.

In step S201, referring to fig. 3, a Die Bonding (DB) process is performed to adhere the capacitive fingerprint sensor 301 on the substrate 302 through the second DAF adhesive layer 304 to form the packaging sheet 300 shown in fig. 3. The capacitive fingerprint sensor 301, the second DAF adhesive layer 304, and the substrate 302 in this embodiment are the same as or similar to the capacitive fingerprint sensor 101, the second DAF adhesive layer 104, and the substrate 102 disclosed in the foregoing embodiments, and are not repeated herein.

Step S202 may be understood as pasting a ceramic sheet, please refer to fig. 4, that is, the ceramic sheet 411 is pasted above the capacitive fingerprint sensor 401 through the first DAF glue layer 412, for example, the ceramic sheet 411 is pasted above the sensing area of the capacitive fingerprint sensor 401 to form the packaging sheet shown in fig. 4. The ceramic sheet 411, the first DAF adhesive layer 412, the capacitive fingerprint sensor 401, the second DAF adhesive layer 404, and the substrate 402 in this embodiment are the same as or similar to the ceramic sheet 111, the first DAF adhesive layer 112, the capacitive fingerprint sensor 101, the second DAF adhesive layer 104, and the substrate 102 disclosed in the foregoing embodiments, and therefore, description thereof is omitted.

In step S203, referring to the cross-sectional view of the arc-surface capacitance fingerprint module shown in fig. 5 at another angle, using a WB process, the leads (IO or Pad) of the capacitance fingerprint sensor 501 and the leads of the substrate 502 can be electrically connected through the metal wires 509 to form the package sheet 500 shown in fig. 5, where the metal wires 509 are, for example, gold wires. The ceramic sheet 511, the first DAF adhesive layer 512, the capacitive fingerprint sensor 501, the second DAF adhesive layer 504, the substrate 502, the solder layer 507, the FPC503, the reinforcing steel plate 508, the arc coating layer 506, and the packaging material layer 505 in this embodiment are the same as or similar to the ceramic sheet 111, the first DAF adhesive layer 112, the capacitive fingerprint sensor 101, the second DAF adhesive layer 104, the substrate 102, the solder layer 107, the FPC103, the reinforcing steel plate 108, the arc coating layer 106, and the packaging material layer 105 disclosed in the foregoing embodiments, and are not described herein again. In this embodiment, the package structure may further include a stiffener 508, and the stiffener 508 is disposed on a lower surface of the FPC 503. The stiffened steel plate 508 may also be used to secure a connector 510, where the connector 510 is used to connect the capacitive fingerprint sensor to other circuits in the electronic device, such as a motherboard, to perform a fingerprint recognition function. It is understood that the cross section of the cross section shown in fig. 5 in this embodiment is perpendicular to the cross section shown in fig. 1, and the cross section shown in fig. 5 in this embodiment can conveniently show the gold wires 509 and the connectors 510.

In step S204, referring to the package sheet 600 shown in fig. 6, using a Molding process, an EMC layer 605 is manufactured by using a mold and a plastic Molding material to coat the capacitive fingerprint sensor 601, the first DAF glue layer 612 and the ceramic sheet 611, so as to protect the capacitive fingerprint sensor 601, the ceramic sheet 611 and the gold wires, that is, the package material layer may be molded according to a designed external dimension Molding to form the EMC layer 605 shown in fig. 6. As shown in fig. 6, the distance D2 from the center of the upper surface of the capacitive fingerprint sensor 601 to the center of the upper surface of the packaging material layer 605 is 150um to 480 um. The ceramic sheet 611, the first DAF adhesive layer 612, the capacitive fingerprint sensor 601, the second DAF adhesive layer 604, and the substrate 602 in this embodiment are the same as or similar to the ceramic sheet 111, the first DAF adhesive layer 112, the capacitive fingerprint sensor 101, the second DAF adhesive layer 104, and the substrate 102 disclosed in the foregoing embodiments, and therefore, the description thereof is omitted here. After Molding to make the upper Surface of the EMC be a cambered Surface, a solder layer 107 shown in fig. 1 may be formed on the lower Surface of the substrate by soldering using a Surface Mount Technology (SMT) process to electrically connect the substrate and the FPC, and then Coating is performed to form a cambered Coating layer on the upper Surface of the EMC layer.

Based on the disclosure of the above embodiments, an embodiment of the present application provides a packaging method, please refer to fig. 7, which is different from the packaging method shown in fig. 2, and may further include step S702 before the ceramic sheet is attached: processing the ceramic wafer to ensure that the roughness of the upper surface of the ceramic wafer is 0.2um to 0.8 um; after step S702, step S703 may be performed: the lower surface of the ceramic wafer is pasted on the upper surface of the capacitive fingerprint sensor through the first DAF glue layer. In step S702, in this embodiment, processing the ceramic wafer may be understood as manufacturing a ceramic wafer with a roughness of 0.2um to 0.8um on the upper surface, or manufacturing a ceramic wafer with a roughness of 0.2um to 0.8um on the outer surface. In order to meet the requirement of the roughness of the ceramic, whether the requirement of the roughness of 0.2um to 0.8um is met can be checked in Incoming Quality Control (IQA) of the Incoming material. In this embodiment, steps S701, S704, and S705 are the same as or similar to step S201, step S203, and step S204 in the foregoing embodiment, and are not repeated here.

Based on the disclosure of the above embodiments, the present embodiment discloses a method for manufacturing a capacitive fingerprint module, as shown in fig. 8, the method includes the following steps:

s801: the capacitive fingerprint sensor is pasted above the substrate through the second DAF glue layer;

s802: the ceramic plate is pasted above the capacitive fingerprint sensor through the first DAF adhesive layer;

s803: electrically connecting pins of the capacitive fingerprint sensor and pins of the substrate through metal wires;

s804: coating the second DAF adhesive layer, the capacitive fingerprint sensor, the first DAF adhesive layer and the ceramic wafer by using a plastic packaging material to form a packaging material layer above the substrate, wherein the upper surface of the packaging material layer is an arc surface;

s805: coating the upper surface of the packaging material layer to form an arc coating layer

In this embodiment, steps S801 to S804 are the same as or similar to steps S201 to S204 in the foregoing embodiment, and are not described herein again. In step S805, an arc coating layer 106 as shown in fig. 1 may be formed by performing a coating process on the upper surface of the packaging material layer as shown in fig. 6 to form the capacitive fingerprint module structure 100.

For step S804, the packaging sheet 900 shown in fig. 9 may also be formed by coating the capacitive fingerprint sensor with a packaging material, wherein the upper surface of the packaging material layer 905 is a plane, and performing CNC surface machining and polishing processes on the packaging material layer to form the packaging sheet 600 shown in fig. 6, where the upper surface of the packaging material layer is an arc surface, and then performing step S805 to form the arc surface coating layer disclosed in the foregoing embodiment on the upper surface of the packaging sheet 600. The ceramic sheet 911, the first DAF adhesive layer 912, the capacitive fingerprint sensor 901, the second DAF adhesive layer 904, and the substrate 902 in this embodiment are the same as or similar to the ceramic sheet 111, the first DAF adhesive layer 112, the capacitive fingerprint sensor 101, the second DAF adhesive layer 104, and the substrate 102 disclosed in the foregoing embodiments, and are not repeated herein. In this embodiment, between step S804 and step S805, the method may further include: the substrate is attached to the FPC through the soldering tin layer by the SMT process, namely the soldering tin layer is arranged between the FPC and the substrate to realize the electric connection of the FPC and the substrate.

In step S804, the encapsulation material layer 605 with the arc surface on the upper surface may also be directly manufactured by using an arc molding die, specifically, if the chamfer of the encapsulation material layer 605 manufactured by using the arc molding die does not conform to the preset angle, the chamfer with the preset angle may be formed by performing a CNC chamfering and blanking process, and then performing a coating surface treatment to form the arc coating layer.

Based on the disclosure of the above embodiments, an embodiment of the present application provides a method for manufacturing a capacitive fingerprint module, please refer to fig. 10, which is different from the method shown in fig. 8, and may further include step S1002 before attaching a ceramic sheet: processing the ceramic wafer to ensure that the roughness of the upper surface of the ceramic wafer is 0.2um to 0.8 um; after step S1002, step S1003 may be performed: the lower surface of the ceramic wafer is pasted on the upper surface of the capacitive fingerprint sensor through the first DAF glue layer. In step S1002, a ceramic wafer having an upper surface with a roughness of 0.2um to 0.8um may be manufactured. In this embodiment, steps S1001, S1004, S1005, and S1006 are the same as or similar to step S801, step S803, step S804, and step S805 in the foregoing embodiment, and are not repeated here.

It should be noted that, compared with the structure of the capacitive fingerprint module in the foregoing embodiment, the capacitive fingerprint package structure provided in this embodiment omits the arc-shaped coating layer, and the specific implementation thereof is described in the foregoing embodiment, and is not described herein again.

This embodiment still provides an electronic equipment, and this electronic equipment possesses circuit mainboard, and specific circuit mainboard can include memory and treater, and this electric capacity fingerprint module and circuit mainboard are connected, and is specific, and electric capacity fingerprint module passes through the connector with circuit mainboard and is connected to realize fingerprint identification and unblock, this electronic equipment can be cell-phone or electronic equipment such as panel, computer. The specific implementation of the method is described in the above embodiments, and details are not repeated here.

It should be understood that in the embodiment of the present application, "B corresponding to a" means that B is associated with a, from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.

In addition, the term "and/or" herein is only one kind of association relationship describing an associated object, and means that there may be three kinds of relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A cambered surface capacitance fingerprint packaging structure is characterized by comprising a packaging material layer, a capacitance fingerprint sensor, a ceramic chip and a first DAF adhesive layer;

the first DAF adhesive layer is arranged between the capacitive fingerprint sensor and the ceramic chip so as to fix the ceramic chip above the capacitive fingerprint sensor;

the upper surface of the packaging material layer is an arc surface;

the packaging material layer coats the capacitive fingerprint sensor, the first DAF adhesive layer and the ceramic sheet.

2. The cambered surface capacitance fingerprint packaging structure of claim 1, wherein the roughness of the ceramic wafer is 0.2um to 0.8 um.

3. The arc surface capacitance fingerprint packaging structure of claim 1, wherein the roughness of the upper surface of the ceramic wafer is 0.2um to 0.8 um.

4. The cambered surface capacitance fingerprint packaging structure of any one of claims 1-3, wherein the ceramic sheet has a dielectric constant of 25-35.

5. The cambered surface capacitor fingerprint package structure of claim 4, wherein the dielectric constant of the first DAF glue layer is 25 to 35.

6. The cambered surface capacitance fingerprint packaging structure of claim 4, wherein the dielectric constant of the first DAF glue layer is less than or equal to that of the ceramic sheet;

the dielectric constant of the first DAF glue layer is greater than or equal to ninety percent of the dielectric constant of the ceramic wafer.

7. The arc surface capacitance fingerprint packaging structure of any one of claims 1 to 3, wherein the ceramic sheet has a thickness of 50um to 200 um.

8. The cambered surface capacitance fingerprint packaging structure of claim 7, wherein the ceramic sheet is 100um thick.

9. The cambered surface capacitance fingerprint packaging structure of any one of claims 1-3, wherein the area of the upper surface of the ceramic plate is equal to the area of the sensing area of the capacitance fingerprint sensor; the length of the ceramic wafer is smaller than that of the capacitance fingerprint sensor, and the width of the ceramic wafer is smaller than that of the capacitance fingerprint sensor.

10. The cambered surface capacitive fingerprint package of any one of claims 1-3, wherein the distance from the center of the upper surface of the capacitive fingerprint sensor to the center of the upper surface of the encapsulation material layer is 150um to 480 um.

11. The cambered surface capacitance fingerprint packaging structure of any one of claims 1-3, further comprising a second DAF glue layer and a substrate, wherein the second DAF glue layer is arranged between the capacitance fingerprint sensor and the substrate so that the capacitance fingerprint sensor is fixed above the substrate; the second DAF glue layer is arranged on the upper surface of the substrate;

still include the stiffening plate, the stiffening plate set up in FPC's lower surface.

12. The arc surface capacitance fingerprint module is characterized by comprising the arc surface capacitance fingerprint packaging structure as claimed in any one of claims 1 to 11, and further comprising an arc coating layer, wherein the arc coating layer is arranged on the upper surface of the packaging material layer, and the upper surface of the arc coating layer is an arc surface.

13. The arc capacitance fingerprint module of claim 12, wherein the distance from the center of the top surface of the capacitive fingerprint sensor to the center of the top surface of the arc coating layer is 170um to 500 um.

14. The arc capacitance fingerprint module of claim 12, wherein the distance from the center of the top surface of the capacitive fingerprint sensor to the center of the top surface of the arc coating layer is 200um to 500 um.

15. The cambered surface capacitance fingerprint module of any one of claims 12-14, wherein the radius of the upper surface of the cambered coating layer is 0.8 mm-8 mm.

16. An electronic device, comprising: the cambered surface capacitance fingerprint module of any one of claims 12-15 with the circuit mainboard through the connector.