CN220983917U - Fingerprint module and electronic equipment - Google Patents

Abstract

A fingerprint module and electronic equipment relate to the technical field of biological information identification. The fingerprint module comprises a circuit board, a packaging chip electrically connected to one surface of the circuit board and a metal ring; the packaging chip comprises a fingerprint chip and a packaging body for packaging the fingerprint chip, and a step is arranged at the outer edge of one end, close to the circuit board, of the packaging body; the metal ring is sleeved on at least part of the packaging body, and one end of the metal ring, which is close to the circuit board, is matched with the step. The fingerprint module and the electronic equipment can improve the occupation of the metal ring to the space of the fingerprint module and reduce the volume of the fingerprint module.

Description

Fingerprint module and electronic equipment

Technical Field

The utility model relates to the technical field of biological information identification, in particular to a fingerprint module and electronic equipment.

Background

Fingerprint identification is increasingly applied to intelligent terminals in a convenient operation mode and with very strong security performance. However, due to the limited space structure of the intelligent terminal, the optical fingerprint sensor module cannot be used in some scenes, and a semiconductor fingerprint sensor module with smaller size is adopted. The capacitance type semiconductor sensor is characterized in that a plurality of thousands of semiconductor devices are integrated on a flat plate, fingers are attached to the flat plate to form the other surface of the capacitance, and the actual distances between the convex points and the concave points of the fingers contacting the flat plate are different due to the fact that the flat surfaces of the fingers are uneven, so that the capacitance values formed are different, and the electronic equipment can collect different collected values according to the principle, so that fingerprint collection is completed.

At present, a fingerprint chip and a power key of a common fingerprint module are combined into a whole, the on-off operation of the electronic equipment is realized through a dome transmission structure, meanwhile, the fingerprint chip is connected with a main board of the electronic equipment, and the operations of daily screen-extinguishing, unlocking, safe payment and the like of the electronic equipment can be realized by comparing with an input fingerprint. The existing mobile phone can put out higher requirements on the appearance of the fingerprint module according to the middle frame material, such as adding a metal ring to improve the overall texture of the electronic equipment. However, if the metal ring is to be added into the fingerprint module, the installation space of the metal ring needs to be reserved on the existing circuit board and the whole machine of the electronic device, which results in larger space occupation of the fingerprint module on the electronic device.

Disclosure of utility model

The utility model aims to provide a fingerprint module and electronic equipment, which can improve the occupation of a metal ring to the space of the fingerprint module and reduce the volume of the fingerprint module.

Embodiments of the present utility model are implemented as follows:

In one aspect of the present utility model, a fingerprint module is provided, the fingerprint module includes a circuit board, a package chip electrically connected to one side of the circuit board, and a metal ring; the packaging chip comprises a fingerprint chip and a packaging body for packaging the fingerprint chip, and a step is arranged at the outer edge of one end, close to the circuit board, of the packaging body; the metal ring is sleeved on at least part of the packaging body, and one end of the metal ring, which is close to the circuit board, is matched with the step. The fingerprint module can improve the occupation of the metal ring to the space of the fingerprint module and reduce the volume of the fingerprint module.

Optionally, the step is disposed opposite the circuit board.

Optionally, the package body includes a package body and a step disposed at a periphery of the package body; the metal ring is sleeved on the periphery of the packaging main body, and one end, close to the circuit board, of the metal ring is erected on the step.

Optionally, the fingerprint module further comprises a first adhesive layer, and the metal ring is adhered to the step through the first adhesive layer.

Optionally, the step is enclosed on an outer edge of the package body.

Optionally, the orthographic projection of the metal ring on the circuit board coincides with the orthographic projection of the step on the circuit board.

Optionally, the step is disposed toward the circuit board.

Optionally, the metal ring includes an annular first body and a limiting plate connected to the first body; the limiting plate is arranged at one end, close to the circuit board, in the accommodating space formed by the first body; the packaging chip is arranged in the accommodating space and is erected on the limiting plate through the step.

Optionally, the package body includes a package body and two steps disposed at opposite ends of the package body.

Optionally, the fingerprint module further includes a cover plate, the cover plate is attached to one side of the packaged chip, which is away from the circuit board, and at least part of the cover plate is located in the metal ring.

Optionally, the method further comprises: the support component is connected to the other side of the circuit board; the supporting component is used for limiting the middle frame of the electronic equipment, and a gap is formed between the supporting component and the middle frame along the arrangement direction of the circuit board and the packaged chip.

Optionally, the support assembly includes the second body and connects respectively in two fixed parts at the opposite both ends of second body, and fixed part is located the one side that the second body deviates from the circuit board, and fixed part is used for with middle frame fixed connection.

Optionally, the two fixing parts are respectively provided with grooves with opposite openings, the middle frame is provided with a limiting part, and the fixing parts can be fixed at the limiting part through the grooves; along the arrangement direction of the circuit board and the packaged chip and the arrangement direction of the two fixing parts, gaps are reserved between the fixing parts and the limiting parts.

Optionally, the support assembly further includes a pressing bracket connected to a surface of the second body facing away from the circuit board and located between the two fixing portions, and the pressing bracket is used for acting on a switch key of the electronic device.

In another aspect, the present utility model provides an electronic device, which includes the fingerprint module set described above.

The beneficial effects of the utility model include:

The fingerprint module provided by the application comprises a circuit board, a packaging chip electrically connected to one surface of the circuit board and a metal ring; the packaging chip comprises a fingerprint chip and a packaging body for packaging the fingerprint chip, and a step is arranged at the outer edge of one end, close to the circuit board, of the packaging body; the metal ring is sleeved on at least part of the packaging body, and one end of the metal ring, which is close to the circuit board, is matched with the step. The step is arranged at the outer edge of one surface of the packaging body of the fingerprint module, so that the step can reserve space for assembling the metal ring, the metal ring is convenient to install in the fingerprint module, the space of the packaging body can be effectively utilized, the occupation of the metal ring on the space of the fingerprint module can be improved, and the size of the fingerprint module is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a fingerprint module according to an embodiment of the present utility model;

FIG. 2 is an exploded view of the fingerprint module provided in FIG. 1;

FIG. 3 is a schematic diagram of the structure of the packaged chip in FIG. 1;

FIG. 4 is a second schematic diagram of a fingerprint module according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of the structure of the packaged chip in FIG. 4;

FIG. 6 is a schematic view of the metal ring of FIG. 4;

fig. 7 is a schematic view of the support assembly of fig. 4.

Icon: 10-a circuit board; 20-packaging the chip; 21-steps; 30-a support assembly; 31-a second body; 32-a fixing part; 321-grooves; 40-metal ring; 41-a first body; 42-limiting plates; 50-a first adhesive layer; 60-cover plate; 70-a second adhesive layer; 80-pressing the bracket; 90-a third adhesive layer; 200-middle frame; 210-limit part.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Biometric information recognition technology has been widely applied to various terminal devices or electronic apparatuses. Biometric techniques include, but are not limited to, fingerprint recognition, palm print recognition, vein recognition, iris recognition, face recognition, living body recognition, anti-counterfeit recognition, and the like. Among them, fingerprint recognition generally includes optical fingerprint recognition, capacitive fingerprint recognition, and ultrasonic fingerprint recognition.

At present, a common fingerprint module is combined with a power key into a whole, and the on-off operation of the electronic equipment is realized through a dome transmission structure, wherein a fingerprint chip of the fingerprint module is connected with a main board of the electronic equipment, and the operations of daily screen-extinguishing, unlocking, safe payment and the like of the electronic equipment can be realized by comparing with an input fingerprint. However, the existing fingerprint module of the electronic device needs to add a metal ring according to the middle frame material based on the requirement of improving the appearance texture, but if the metal ring is added, the installation space of the metal ring needs to be reserved on the existing circuit board and the whole machine of the electronic device, which results in larger space occupation of the fingerprint module to the electronic device. Therefore, the present application provides a new fingerprint module to solve the above-mentioned problems, and the specific structure of the fingerprint module will be described in detail below.

Referring to fig. 1 to 3, the fingerprint module provided in this embodiment includes a circuit board 10, a package chip 20 electrically connected to one side of the circuit board 10, and a metal ring 40; the packaging chip 20 comprises a fingerprint chip and a packaging body for packaging the fingerprint chip, and a step 21 is arranged at the outer edge of the packaging body, which is close to one end of the circuit board 10; the metal ring 40 is sleeved on at least part of the package body, and one end of the metal ring 40 close to the circuit board 10 is matched with the step 21. The fingerprint module improves the occupation of the metal ring 40 to the space of the fingerprint module, and reduces the volume of the fingerprint module.

The fingerprint module provided by the application comprises a circuit board 10, a packaging chip 20 and a metal ring 40. The circuit board 10 is provided with a corresponding circuit structure, and the circuit board 10 can be electrically connected with a motherboard of the electronic device, so as to realize communication between the fingerprint module and the motherboard of the electronic device.

It should be noted that, the circuit board 10 may be electrically connected to a motherboard of the electronic device through a wire; of course, the circuit board 10 may also be integrally provided with the motherboard of the electronic device, i.e., the circuit board 10 may be part of the motherboard of the electronic device. The specific setting mode is not limited by the application, and the person skilled in the art can select the specific setting mode according to actual requirements.

When the circuit board 10 is a part of a motherboard of an electronic device, the portion of the motherboard of the electronic device used to form the circuit board 10 may be cut, so that the corresponding portion of the circuit board 10 can be adapted to the shape of the fingerprint module.

Note that, the circuit board 10 may be a flexible circuit board.

The packaged chip 20 is electrically connected to the circuit board 10. The package chip 20 includes a fingerprint chip for electrical connection with the circuit board 10, and a package body for plastic packaging the fingerprint chip so that the fingerprint chip is protected from the outside.

The specific type of the fingerprint chip is not limited by the present application, and the fingerprint chip may be a capacitive sensor chip.

Specifically, the application does not limit the plastic packaging mode of the fingerprint chip by the packaging body, and a person skilled in the art can select a proper plastic packaging mode according to the needs.

In this embodiment, the outer edge of the package body near one end of the circuit board 10 is provided with a step 21, the metal ring 40 is sleeved on at least a portion of the package body, and one end of the metal ring 40 near the circuit board 10 is matched with the step 21, as shown in fig. 1 to 6.

The metal ring 40 of the fingerprint module is sleeved on at least part of the package body, and one end of the metal ring 40, which is close to the circuit board 10, is matched with the step 21. The present application is provided by mating the end of the metal ring 40 adjacent the circuit board 10 with the step 21. Like this, this step 21 can reserve certain space for the installation of metal ring 40 on the fingerprint module, so, the fingerprint module can save the installation space of reserving for metal ring 40, can effectively reduce the volume of fingerprint module.

Illustratively, the step 21 may be disposed opposite the circuit board 10, as shown in fig. 1-3; the above-mentioned step 21 may also be provided toward the circuit board 10 as shown in fig. 4 and 5.

It should be noted that, the size of the step 21 can be set by a person skilled in the art according to practical needs, but it should be noted that the step 21 should be capable of being in limit fit with the corresponding position of the metal ring 40. Illustratively, the step 21 may be formed by laser cutting or numerical control machining, and the present application is not limited thereto, and a person skilled in the art may select a suitable cutting method according to the need.

The size of the metal ring 40 may be set according to the size of the step 21, and the present application is not particularly limited.

When the fingerprint module provided by the application works, a user can acquire fingerprint information through the fingerprint chip by pressing or touching the packaging chip 20, the fingerprint information acquired by the fingerprint chip can be acquired through the circuit board 10, and the main board of the electronic equipment performs fingerprint information comparison according to the acquired fingerprint information; in addition, when the user presses the packaging chip 20, the circuit board 10 can deform to a certain extent, the bottom of the fingerprint module can act on the switch key of the electronic equipment, and then the operations of daily screen-extinguishing, unlocking and the like of the electronic equipment can be further realized. The fingerprint identification device can integrate fingerprint identification with the switch key through the arrangement, is convenient to operate, and saves the volume of electronic equipment.

In summary, the fingerprint module provided by the present application includes a circuit board 10, a package chip 20 electrically connected to one side of the circuit board 10, and a metal ring 40; the packaging chip 20 comprises a fingerprint chip and a packaging body for packaging the fingerprint chip, and a step 21 is arranged at the outer edge of the packaging body, which is close to one end of the circuit board 10; the metal ring 40 is sleeved on at least part of the package body, and one end of the metal ring 40 close to the circuit board 10 is matched with the step 21. The step 21 is further arranged at the outer edge of one surface of the package body of the fingerprint module, so that the step 21 can reserve a space for assembling the metal ring 40, and the metal ring 40 is convenient to install in the fingerprint module, so that the space of the package body can be effectively utilized, the occupation of the metal ring 40 on the space of the fingerprint module can be improved, and the size of the fingerprint module is reduced.

In addition, the fingerprint module provided by the application can be integrated with the switch key, so that the fingerprint information collection and the operation of the switch key can be realized by only pressing the fingerprint module once, and the operation is convenient.

Alternatively, in one possible embodiment, the step 21 may be disposed away from the circuit board 10, as shown in fig. 1 and 2.

Referring to fig. 1 to 3, alternatively, the package body includes a package body and the step 21 provided at the outer periphery of the package body; the metal ring 40 is sleeved on the outer periphery of the package body, and one end of the metal ring 40, which is close to the circuit board 10, is erected on the step 21. In this way, the metal ring 40 can be placed on the step 21, and a space can be reserved for the assembly of the metal ring 40 by the arrangement of the step 21.

In this embodiment, the fingerprint module further includes a first adhesive layer 50, and the metal ring 40 is adhered to the step 21 through the first adhesive layer 50, as shown in fig. 2. The first glue layer 50 may be an epoxy glue film or glue, for example.

It should be noted that the specific shape of the step 21 is not limited in the present application, and those skilled in the art can set the step according to the need, as long as the step 21 can directly cooperate with the metal ring 40.

For example, referring to fig. 3, alternatively, the step 21 may be surrounded on the outer edge of the package body. That is, as shown in fig. 3, the step 21 is provided on the outer periphery of the package body, and the step 21 is provided around the outer edge of the package body. Thus, the metal ring 40 can correspond to the annular step 21.

In the present embodiment, the front projection of the metal ring 40 on the circuit board 10 coincides with the front projection of the step 21 on the circuit board 10. In this way, as shown in fig. 1 and 2, the outer peripheral wall of the metal ring 40 will be aligned with the outer peripheral wall of the step 21, so that the volume of the fingerprint module can be effectively reduced.

In this way, the step 21 is arranged at the outer edge of one surface of the packaging main body, the metal ring 40 is sleeved on the periphery of the packaging main body, and the metal ring 40 can be erected on the step 21, so that the packaging body can be effectively utilized, the fixation of the metal ring 40 can be realized, the volume of the fingerprint module is not additionally increased, the size of the fingerprint chip is not required to be adjusted, and the fingerprint module has a better application prospect.

In another possible embodiment, the step 21 is disposed toward the circuit board 10 (i.e., the landing surface of the step 21 is disposed toward the circuit board 10), as shown in fig. 4 to 6.

In this embodiment, as shown in fig. 5 and 6, the metal ring 40 includes a ring-shaped first body 41 and a limiting plate 42 connected in the first body 41; the limiting plate 42 is disposed in the accommodating space formed by the first body 41 and is close to one end of the circuit board 10; the packaged chip 20 is disposed in the accommodating space and is erected on the limiting plate 42 through the step 21.

The first body 41 is disposed in an annular shape, the limiting plate 42 is located in the accommodating space formed by the annular first body 41, and the limiting plate 42 is connected to the first body 41, as shown in fig. 6. In this way, during assembly, the packaged chip 20 can be arranged in the accommodating space of the first body 41, and the step 21 of the packaged chip 20 is lapped on the limiting plate 42, so that the limiting fixation of the metal ring 40 and the packaged chip 20 is realized.

In this embodiment, the limiting plate 42 may be a steel plate, and the package body and the metal ring 40 may be adhered together by a first adhesive layer (not shown).

Referring to fig. 5 and 6, the package may include a package body and two steps 21 provided at opposite ends of the package body.

When the steps 21 include two, the limiting plates 42 may include two, and the two limiting plates 42 are disposed corresponding to the two steps 21, respectively.

Of course, the steps 21 and the limiting plates 42 are both included as two examples, and in other embodiments, the steps 21 may be included in plural, and correspondingly, the limiting plates 42 may be included in plural, and the steps 21 and the limiting plates 42 may be disposed correspondingly.

In order to effectively protect the packaged chip 20, in this embodiment, the fingerprint module may further include a cover plate 60, where the cover plate 60 is attached to a surface of the packaged chip 20 facing away from the circuit board 10, and at least a portion of the cover plate 60 is located in the metal ring 40.

The cover plate 60 is arranged in the metal ring 40, so that the fingerprint module is more compact in structure and beneficial to miniaturization of devices. The cover plate 60 may be adhered to the package chip 20 through a third adhesive layer 90, where the third adhesive layer 90 may be an epoxy adhesive film or an epoxy glue.

Illustratively, the cover plate 60 may be made of glass, sapphire, ceramic, or the like. The bottom of the cover plate 60 (i.e., the side of the cover plate 60 near the packaged chip 20) may be screen printed with ink and/or metal powder added, and the upper surface of the cover plate 60 (i.e., the side of the cover plate 60 facing away from the packaged chip 20) may be coated with a protective film.

Alternatively, the side of the cover plate 60 facing away from the packaged chip 20 may be flush with the side of the metal ring 40 facing away from the packaged chip 20. Therefore, the overall height of the fingerprint module can be reduced, and the miniaturization of the electronic equipment is facilitated.

Or the surface of the cover plate 60 facing away from the packaged chip 20 may also protrude from the surface of the metal ring 40 facing away from the packaged chip 20. In this way, the user can perform the pressing operation conveniently.

Optionally, the fingerprint module provided by the application further includes: and a support assembly 30 coupled to the other side of the circuit board 10. The support assembly 30 may be connected to the circuit board 10 by a second adhesive layer 70. The second glue layer 70 may be an epoxy glue film or an epoxy glue, for example.

Optionally, the supporting component 30 is used for limiting with the middle frame 200 of the electronic device, and a gap is formed between the supporting component 30 and the middle frame 200 along the arrangement direction of the circuit board 10 and the packaged chip 20.

It should be noted that, the supporting component 30 is connected to a side of the circuit board 10 facing away from the packaged chip 20, and the supporting component 30 is used for limiting and fixing with the middle frame 200, so that the fingerprint module is mounted on the middle frame 200. The specific structure of the support assembly 30 is not limited in the present application, as long as the support assembly 30 can be fixed to the middle frame 200, so as to fix the fingerprint module on the middle frame 200. Illustratively, the material of the support assembly 30 may be stainless steel.

In addition, it should be noted that the support assembly 30 of the fingerprint module of the present application is also located between the circuit board 10 and the switch key of the electronic device. In this way, the deformation of the supporting component 30 can also enable the supporting component 30 to act on the switch key, so that the daily screen-extinguishing and unlocking operations of the electronic equipment are realized.

In this embodiment, along the arrangement direction of the circuit board 10 and the package chip 20, a gap is formed between the support assembly 30 and the middle frame 200, so that when the fingerprint module is pressed to collect fingerprint information and operate on-off keys, the gap can form a space for avoiding the fingerprint module. The size of the gap can be determined by a person skilled in the art according to the initial distance between the switch key and the component of the fingerprint module for acting on the switch key, the telescopic distance when the fingerprint module is pressed, and other factors, and the application is not particularly limited.

Referring to fig. 1 and 7, the support assembly 30 provided by the present application includes a second body 31 and two fixing portions 32 connected to opposite ends of the second body 31, wherein the fixing portions 32 are located on a surface of the second body 31 facing away from the circuit board 10, the fixing portions 32 are fixedly connected with the middle frame 200, and the second body 31 is fixedly connected to a surface of the circuit board 10 facing away from the package chip 20.

Wherein, alternatively, the two fixing parts 32 are two symmetrically arranged L-shaped components, and the L-shaped components and the second body 31 form a groove 321; the middle frame has a limiting part 210 extending toward the fixing part 32, at least part of the limiting part 210 is accommodated in the groove 321 and fixedly connected with the L-shaped component, and the bottom end of the second body 31 and the top end of the limiting part 210 form the gap.

Note that, the two fixing portions 32 form grooves 321, respectively, and in this embodiment, openings of the two grooves 321 are disposed opposite to each other.

In the present embodiment, a gap is provided between the bottom end of the second body 31 and the top end of the limiting portion 210 along the arrangement direction of the circuit board 10 and the packaged chip 20.

In order to facilitate the pressing of the fingerprint module on the switch key, in this embodiment, the support assembly 30 further includes a pressing bracket 80, as shown in fig. 1 to 3, the pressing bracket 80 is connected to a surface of the second body 31 facing away from the circuit board 10 and located between the two fixing portions 32, and the pressing bracket 80 is used for acting on the switch key of the electronic device.

The setting of pressing the support 80 is equivalent to having set up protruding structure in the one side that second body 31 deviates from circuit board 10, so, the user adopts less pressing force alright realize pressing down of the on-off key of electronic equipment, and user experience is better, and can reduce the deformation degree of circuit board 10 and supporting component 30, improves the life of circuit board 10 and supporting component 30.

In addition, it should be noted that, in the present embodiment, the fingerprint module may be manufactured by firstly cutting the circuit board 10 to obtain the circuit board 10 with a predetermined shape, then mounting components (such as a capacitor, a resistor, a connector, etc.) on the circuit board 10 by solder paste, and mounting the support assembly 30 on the circuit board 10; then the packaging chip 20, the mounting metal ring 40 and the cover plate 60 are attached to the surface of the circuit board 10 away from the supporting component 30; and finally, carrying out functional test on the assembled fingerprint module by using a tooling fixture meeting the requirements so as to ensure that the circuit conduction of the fingerprint module and the fingerprint imaging of the module meet the software threshold requirements.

In another aspect, the present utility model provides an electronic device, which includes the fingerprint module set described above. The specific structure and the beneficial effects of the fingerprint module are described and illustrated in detail above, so that the detailed description is omitted.

The fingerprint identification method of the fingerprint module generally comprises the steps of fingerprint image acquisition, preprocessing, feature extraction, feature matching and the like. Some or all of the above steps may be implemented by conventional Computer Vision (CV) algorithms, or by artificial intelligence (ARTIFICIAL INTELLIGENCE, AI) based deep learning algorithms. The fingerprint identification technology can be applied to portable or mobile terminals such as smart phones, tablet computers and game devices, and other electronic devices such as intelligent door locks, automobiles and bank automatic teller machines, and is used for fingerprint unlocking, fingerprint payment, fingerprint attendance checking, identity authentication and the like.

The above description is only of alternative embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.

Claims (15)

1. The fingerprint module is characterized by comprising a circuit board, a packaging chip electrically connected to one side of the circuit board and a metal ring; the packaging chip comprises a fingerprint chip and a packaging body for packaging the fingerprint chip, and a step is arranged at the outer edge of the packaging body, which is close to one end of the circuit board; the metal ring is sleeved on at least part of the packaging body, and one end, close to the circuit board, of the metal ring is matched with the step.

2. The fingerprint module of claim 1, wherein the step is disposed opposite the circuit board.

3. The fingerprint module of claim 2, wherein the package body includes a package body and the step is provided at a periphery of the package body; the metal ring is sleeved on the periphery of the packaging main body, and one end, close to the circuit board, of the metal ring is erected on the step.

4. A fingerprint module according to claim 3, further comprising a first glue layer, wherein the metal ring is attached to the step by the first glue layer.

5. A fingerprint module according to claim 3, wherein the step is located around the outer edge of the package body.

6. The fingerprint module of claim 5, wherein an orthographic projection of the metal ring on the circuit board coincides with an orthographic projection of the step on the circuit board.

7. The fingerprint module of claim 1, wherein the step is disposed toward the circuit board.

8. The fingerprint module of claim 7, wherein the metal ring comprises a ring-shaped first body and a limiting plate connected to the first body; the limiting plate is arranged at one end, close to the circuit board, in the accommodating space formed by the first body; the packaging chip is arranged in the accommodating space and is arranged on the limiting plate through the step.

9. The fingerprint module of claim 8, wherein the package body includes a package body and two of the steps disposed at opposite ends of the package body.

10. The fingerprint module of any one of claims 1-9, further comprising a cover plate, wherein the cover plate is attached to a surface of the packaged chip facing away from the circuit board, and at least a portion of the cover plate is located in the metal ring.

11. The fingerprint module of any one of claims 1 to 9, further comprising: the support component is connected to the other side of the circuit board; the supporting component is used for limiting the middle frame of the electronic equipment, and a gap is reserved between the supporting component and the middle frame along the arrangement direction of the circuit board and the packaged chip.

12. The fingerprint module of claim 11, wherein the support assembly comprises a second body and two fixing portions respectively connected to two opposite ends of the second body, the fixing portions are located on one surface of the second body away from the circuit board, and the fixing portions are fixedly connected with the middle frame.

13. The fingerprint module of claim 12, wherein the two fixing parts are two L-shaped parts symmetrically arranged, and the L-shaped parts and the second body form a groove; the middle frame is provided with a limiting part extending towards the direction of the fixing part, at least part of the limiting part is accommodated in the groove and fixedly connected with the L-shaped component, and the bottom end of the second body and the top end of the limiting part form the gap.

14. The fingerprint module of claim 12, wherein the support assembly further comprises a pressing bracket, the pressing bracket is connected to a surface of the second body facing away from the circuit board and located between the two fixing portions, and the pressing bracket is used for acting on a switch key of the electronic device.

15. An electronic device comprising a fingerprint module as claimed in any one of claims 1 to 14.