CN209859953U

CN209859953U - Display screen and display device

Info

Publication number: CN209859953U
Application number: CN201920496533.1U
Authority: CN
Inventors: 王洋
Original assignee: Kunshan Guoxian Photoelectric Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd; Kunshan Guoxian Photoelectric Co Ltd
Priority date: 2019-04-12
Filing date: 2019-04-12
Publication date: 2019-12-27
Anticipated expiration: 2029-04-12

Abstract

The application discloses a display screen and a display device, wherein the display screen comprises a display substrate, a bonding layer and a module assembly, wherein the display substrate is divided into a display area and a wiring area; the bonding layer is arranged on one side far away from the light-emitting direction of the display substrate, the module assembly is arranged in the bonding layer, the conductive element is arranged on the wiring area of the display substrate, and the module assembly is electrically connected with the conductive element. Through setting up at the module subassembly in bonding layer, and then replace the flexible product of the comprehensive screen of present mainstream to buckle to walking the line district, buckle the module to the base plate back, avoided the stress difference between each rete to lead to the fracture risk that the circuit walked the line easily to promote display screen display effect's purpose.

Description

Display screen and display device

Technical Field

The application relates to the technical field of display, in particular to a display screen and a display device.

Background

An organic light-emitting diode (OLED) has the advantages of self-luminescence, wide working temperature range, fast response speed, wide viewing angle, high luminous efficiency, capability of being manufactured on a flexible substrate, low driving voltage and energy consumption, and the like, and is known as a next generation display technology.

With the continuous development of mobile terminal technology, the application of the mobile terminal is more and more extensive, and especially, the mobile terminal with a large screen ratio brings better use experience to users, and is also more and more popular with the users.

The current mainstream comprehensive display mode is that a flexible product bends the wiring of a non-display area, a module is bent to the back of a substrate, and the circuit wiring is easily broken due to different stresses among film layers.

The analysis found that the main causes of fracture were: the bending area is large during bending, and the circuit wiring in the bending area is easy to break due to process fluctuation, so that the defects are caused; the circuit wiring area bears certain stress after bending, and the risk of circuit wiring breakage is large.

SUMMERY OF THE UTILITY MODEL

For solving above-mentioned technical problem, this application provides a display screen and display device to walk the cracked problem of line when realizing buckling, thereby promote the purpose of display screen display effect.

The application provides a display screen, including display substrate, bonding layer and module subassembly, display substrate divide into the display area and walks the line district, the bonding layer sets up and is keeping away from one side of display substrate light-emitting direction, the module subassembly sets up in the bonding layer, display substrate's the line district of walking is provided with conductive element, the module subassembly with the conductive element electricity is connected.

Optionally, the conductive element includes a circuit trace, and the circuit trace is electrically connected to the module assembly through a anisotropic conductive adhesive.

Optionally, the length of the circuit trace is 0.5-3 mm.

Optionally, the bonding layer comprises a flexible substrate.

Optionally, the module assembly includes a driving chip and a flexible circuit board, and the driving chip and the flexible circuit board are fixed on the flexible substrate through a anisotropic conductive adhesive.

Optionally, the bonding layer has a thickness of 2-5 mm.

Optionally, the module assembly is matched in shape, size and position to the routing area.

Optionally, the display screen further comprises an adhesive layer, a buffer structure and a heat dissipation structure, wherein the adhesive layer, the buffer structure and the heat dissipation structure are arranged in a manner that the bonding layer is sequentially stacked in the direction away from the display substrate.

The adhesive layer comprises pressure-sensitive adhesive, the buffer structure comprises foam, and the heat dissipation structure comprises copper foil and graphite sheets.

The embodiment of the application also provides a display device, which comprises the display screen.

According to the technical scheme, the display screen and the display device are provided, the display screen comprises a display substrate, a bonding layer and a module assembly, and the display substrate is divided into a display area and a wiring area; the bonding layer sets up and is keeping away from one side of display substrates light-emitting direction, the module subassembly sets up in the bonding layer, including conductive element in the region of walking the line, conductive element sets up walk on the line region the module subassembly with the conductive element electricity in the region of walking the line of display substrates is connected. The bonding layer is directly arranged below the display substrate, so that the area of the bonding layer is increased, the process is simple, and the abnormal rate is reduced; in addition, the module assembly is arranged in the bonding layer and is directly connected with the conductive element in the wiring area, so that the bending of wiring is avoided, the risk of breakage of wiring due to different stress between the film layers is avoided, and the display effect of the display screen is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only schematic drawings of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic diagram of a display panel in the prior art;

fig. 2 is a schematic structural diagram of a display screen according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a display screen according to another embodiment of the present application.

1-a display screen; 2-a display area; 3-a wiring area; 4-adhesive glue; 5-bonding layer; 6-module assembly; 7-circuit routing; 8-an adhesive layer; 9-a buffer structure; 10-a heat dissipation structure; 11-display substrate.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Where the terms "comprising," "having," and "including" are used herein, another element may be added unless an explicit limitation is used, such as "only," "consisting of … …," etc. Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.

As described in the background art, referring to fig. 1 in the prior art, a display panel 1 includes a display substrate 11, the display substrate 11 is divided into a display area 2 and a routing area 3, a circuit trace 7 is disposed on the routing area 3 of the display substrate, and is connected to the display panel 1 through an adhesive 4 as the routing area 3 is bent to the back of the display panel 1, but this way may cause the circuit trace 7 to break, resulting in display failure of the display panel 1.

In the embodiment of the present application, please refer to fig. 2-3, the display screen 1 includes a display substrate 11, the display substrate 11 is divided into a display area 2 and a wiring area 3, a bonding layer 5 is disposed on one side away from the light-emitting direction of the display substrate 11, a module assembly 6 is disposed in the bonding layer 5, the wiring area of the display substrate is provided with a conductive element, and the module assembly 6 is electrically connected to the conductive element (not shown in the figure). The bonding layer 5 is arranged on one side far away from the light emergent direction of the display substrate 11, so that the area of the bonding layer 5 is increased, the process is simple, and the abnormal rate is reduced; set up module assembly 6 in bonding layer 5 in addition, directly link to each other with the conductive element who walks line district 3, avoided walking the buckling of line, avoided because the different fracture risk that leads to walking the line easily of stress between each rete to promote display screen display effect.

Specifically, the specific type of the display screen 1 is not particularly limited, and those skilled in the art can flexibly select the display screen according to the requirement as long as the flexibility and the display requirement can be met, for example, the display screen includes but is not limited to an OLED (Organic Light-emitting diode) screen and an LCD screen. The display screen 1 may be disposed in the electronic device, and the electronic device may be a smart phone, a tablet computer, or the like. The display panel 1 is a multi-layer structure according to an embodiment of the present invention, for example, the display panel 1 includes a cathode plate, an organic light emitting layer, an anode plate, a polarizing plate (not shown in the figure), and the like, and the present invention will not be described in detail based on the recognition of those skilled in the art.

In the embodiment of this application, display screen 1 includes display substrate 11, and display substrate 11 is divided into display area 2 and wiring area 3, and display area 2 can be used to the demonstration of picture, and wiring area 3 includes conductive element, and specific conductive element walks the line for the circuit, for example: the SCAN circuit, the EM and other signal integrated circuits combine the traditional SCAN circuit part and the EM circuit part into a unified circuit structure, the number of thin film transistors and capacitors required by the circuit is saved, the frame narrowing design is facilitated, and output signals are stable and not prone to dislocation.

In the embodiment of this application, module subassembly 6 sets up in bonding layer 5, and is concrete can set up in the position corresponding with the zone of walking 3, and the zone of walking 3 is walked 7 through the circuit and is connected with module subassembly 6, preferably, can adopt the incorgruous conducting resin to connect. This process needs to adopt bonding equipment, carries out high accuracy optics counterpoint for circuit wiring 7 aims at module subassembly 6, presses back coating ACF colloid, thereby the colloid solidification makes circuit wiring 7 and module subassembly 6 connect, and this technology convenient operation, module subassembly 6 and circuit wiring are connected 7 firmly, and the position is accurate.

The distance between the module assembly 6 and the wiring area 3 of the display substrate can be freely selected, and the module assembly 6 can be arranged close to the wiring area 3 of the display substrate, so that the length of the connected circuit wiring 7 can be shortened, and the probability of breakage of the circuit wiring 7 is reduced. The vertical distance of the circuit wiring between the module assembly 6 and the display substrate 1 is 0.5-3mm, and the specific vertical distance of the circuit wiring is 1 mm. The length is selected in consideration of the complexity of the process implementation, and the circuit trace 7 is ensured not to be broken due to too long. In addition, the anisotropic conductive adhesive can be fully filled when being bonded, on one hand, the anisotropic conductive adhesive can wrap the circuit wiring 7 to play a role in buffering, so that the circuit wiring 7 cannot be broken, and on the other hand, the circuit wiring and the module assembly 6 can be connected more firmly.

In the embodiment of this application, module component 6's shape, size and position need and the district 3 phase-matchs of walking the line, and is concrete, and when the size of walking the line district 3 is great, module component 6's size also needs corresponding setting big to satisfy the connection of circuit wiring 7. The thickness of nation decides layer 5 is 2-5mm, preferred 3mm, and nation decides layer 5's thickness influence display screen's thickness, thereby makes the display screen whole thinner through reducing nation decides layer 5's thickness, uses and feels good, and is whole pleasing to the eye, has optimized user experience, simple structure, and is with low costs, and the practicality is strong.

In the embodiment of the application, the bonding layer 5 is disposed on one side of the display substrate 11 away from the light emitting direction, the material for forming the bonding layer 5 is not limited by any particular value, and those in the art can flexibly select the bonding layer according to actual conditions. In some embodiments of the present application, the material forming bonding layer 5 includes, but is not limited to, a PET (polythene terephthalate) substrate. The PET base material has smooth and glossy surface, good creep resistance, fatigue resistance, abrasion resistance and dimensional stability, small abrasion and high hardness, can strengthen the strength of the display substrate 1, and supports the screen after the display substrate 1 is peeled off.

In the embodiment of the present application, the module assembly 6 includes a driver chip and a flexible circuit board, where the flexible circuit board may be a motherboard of the electronic device, and one, two or more of functional components such as a motor, a microphone, a speaker, an earphone interface, a universal serial bus interface, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on the flexible circuit board. The driving chip and the flexible circuit board are fixed on the flexible base material through anisotropic conductive adhesive ACF. The anisotropic conductive adhesive has the functions of single vertical conduction, parallel non-conduction and gluing fixation, and is suitable for the adhesion of flat cables with fixed volume and large production.

According to the embodiment of this application, display screen 1 can also include gluing layer 8, and gluing layer 8 sets up and keeps away from at bonding layer 5 in the direction of display substrate 11, and gluing layer 8's material does not receive special restriction, and the skilled person can select according to actual conditions is nimble. In some embodiments of the present application, the material forming the adhesive layer 8 includes, but is not limited to, Pressure Sensitive Adhesive (PSA). Pressure-sensitive adhesives are pressure-sensitive adhesives that change from a liquid state to a solid state within a short period of time after being pressed across the surface of an adherend to bond the adherend, and are commonly used for the production of pressure-sensitive adhesive tapes. The pressure-sensitive adhesive must have an adhesion force, which is a peeling force exhibited after the adhesive tape is pressure-adhered to an adherend surface, greater than an adhesive force, which is a so-called handle adhesion force exhibited when the adhesive tape is lightly touched with a finger.

According to the embodiment of the application, the display screen 1 may further include a buffer structure 9, the buffer structure 9 is disposed in a direction in which the adhesive layer 8 is far away from the bonding layer 5, a material forming the buffer structure 9 is not particularly limited, and a person in the art may flexibly select the buffer structure according to actual conditions. In some embodiments of the present application, the material forming the cushioning structure 9 includes, but is not limited to, cushioning foam. By adding foam, the device structure in the display screen 1 can be protected, and the damage of the display screen 1 is prevented. The method for forming the buffer structure 9 is not particularly limited, and the method for forming the buffer structure 9 includes, but is not limited to, methods such as attaching and gluing, and the buffer structure 9 can be glued by using OCA (optical Clear adhesive) optical glue, and OCA has the advantages of being colorless and transparent, having light transmittance of more than 90%, having good gluing strength, being curable at room temperature or intermediate temperature, and having small curing shrinkage.

According to the embodiment of the present application, the display screen 1 may further include a heat dissipation structure 10, the heat dissipation structure 10 is disposed in a direction away from the adhesive layer 8 of the buffer structure 9, and the heat dissipation structure 10 may further include: the heat dissipation layer is arranged on the back of the buffer structure 9; the bonding layer is arranged on the back of the heat dissipation layer. Therefore, the heat dissipation layer can also have a heat dissipation effect, and the adhesive layer can be used for bonding the flexible screen with other components.

According to the embodiment of the application, the material for forming the heat dissipation layer is not particularly limited, and the heat dissipation layer may be a one-layer structure or a multi-layer structure as long as the heat dissipation function is achieved, and a person in the art can flexibly select the heat dissipation layer according to actual conditions. In some embodiments of the present application, the material forming the heat sink layer includes, but is not limited to, graphite fins. The formation method of the heat dissipation layer is also not particularly required, but the formation method of the heat dissipation layer includes, but is not limited to, coating, deposition, and the like.

The specific type of the adhesive layer is not limited to a particular condition according to an embodiment of the present application, and can be flexibly selected by a person skilled in the art as needed. In some embodiments of the present application, specific types of adhesive layers include, but are not limited to, textured tape, double-sided tape, copper foil tape. The formation method of the adhesive layer is also not particularly limited, and includes, but is not limited to, coating, deposition, and the like.

The embodiment of the present application further provides a display device, which includes the above-mentioned display screen. The display device has good display quality, and the frame width of the non-display area is narrow. It will be understood by those skilled in the art that the display device has all the features and advantages of the display screen described above, and thus, the description thereof is omitted. The specific type of the display device is not particularly limited, and may be any device or equipment having a display screen in the field, for example, but not limited to, a mobile phone, a tablet computer, a computer monitor, a game machine, a television, a wearable device, and other living or household appliances having a display screen.

Of course, it can be understood by those skilled in the art that the display device described in the present application may include necessary structures and components of a conventional display device, and the display device described in the present application is described by taking a mobile phone as an example, and may include structures and components of a conventional mobile phone, such as a touch screen, a housing, a CPU, a camera module, a fingerprint identification module, a sound processing system, and the like, in addition to the display screen of the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the combination and combination of features of different embodiments or examples and different embodiments or examples described in this specification can be performed by those skilled in the art without contradiction, and the combination of these features should be considered as the scope of the description in this specification as long as there is no contradiction between the features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application.

Claims

1. A display screen, comprising:

the display substrate is divided into a display area and a wiring area;

the bonding layer is arranged on one side far away from the light emergent direction of the display substrate;

the module assembly is arranged in the bonding layer;

the wiring area of the display substrate is provided with a conductive element, and the module assembly is electrically connected with the conductive element.

2. The display screen of claim 1, wherein the conductive elements comprise circuit traces that are electrically connected to the module assembly by anisotropic conductive adhesive.

3. The display screen of claim 2, wherein a vertical distance of circuit traces between the module assembly and the display substrate is 0.5-3 mm.

4. A display screen in accordance with any one of claims 1-3, wherein the bonding layer comprises a flexible substrate.

5. The display screen of claim 4, wherein the module assembly comprises a driving chip and a flexible circuit board, and the driving chip and the flexible circuit board are fixed on the flexible substrate through anisotropic conductive adhesive.

6. A display screen in accordance with any one of claims 1-3, wherein the bonding layer has a thickness of 2-5 mm.

7. A display screen in accordance with any one of claims 1 to 3, wherein the module assembly is shaped, sized and positioned to match the routing area.

8. The display screen of claim 7, further comprising an adhesive layer, a buffer structure, and a heat dissipation structure, wherein the adhesive layer, the buffer structure, and the heat dissipation structure are sequentially stacked in a direction away from the display substrate at the bonding layer.

9. The display screen of claim 8, wherein the adhesive layer comprises a pressure sensitive adhesive, the buffer structure comprises foam, and the heat dissipating structure comprises a copper foil and a graphite sheet.

10. A display device, comprising: a display screen according to any one of claims 1 to 9.