CN113221779B - Display module and electronic equipment - Google Patents
Display module and electronic equipment Download PDFInfo
- Publication number
- CN113221779B CN113221779B CN202110547217.4A CN202110547217A CN113221779B CN 113221779 B CN113221779 B CN 113221779B CN 202110547217 A CN202110547217 A CN 202110547217A CN 113221779 B CN113221779 B CN 113221779B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- substrate layer
- flexible circuit
- display module
- segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 230000006698 induction Effects 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims description 55
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 21
- 230000008093 supporting effect Effects 0.000 description 16
- 230000001976 improved effect Effects 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000009194 climbing Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to a display module and electronic equipment, wherein the display module comprises a display panel, a fingerprint identification module and a flexible circuit board; the substrate layer in the fingerprint identification module is attached to the bearing surface, a bonding area and a bonding area are arranged on the surface of one side of the substrate layer, which is away from the bearing surface, and the bonding area are positioned on two opposite sides of the induction device; one end of the flexible circuit board is bonded to the bonding area, and the other end of the flexible circuit board is bonded to the bonding area. The display module increases the area of the connection area between the flexible circuit board and the substrate layer, improves the connection stability between the flexible circuit board and the substrate layer, reduces the stress concentration at the connection part, and improves the integral warping degree of the fingerprint identification module, thereby reducing the pulling stress of the fingerprint identification module on the bonding area on the surface of the substrate layer and effectively avoiding the falling of the connection structure. And in addition, an additional reinforcing structure is not required to be arranged in the display module, so that the stress concentration on the fingerprint identification module is further reduced.
Description
Technical Field
The present application relates to the field of fingerprint identification technologies, and in particular, to a display module and an electronic device.
Background
With the development of technology, the under-screen fingerprint identification technology is widely applied due to the characteristics of no occupation of surface space of electronic equipment, high identification speed and high identification accuracy. In the process of assembling the fingerprint identification module with the display panel, a flexible circuit board is generally used to connect and fix the fingerprint identification module with the display panel. In the existing fingerprint structure under the screen, the connection position is unreasonable, so that the connection structure is easy to fall off, and the normal use of the fingerprint identification module is affected.
Disclosure of Invention
Based on this, it is necessary to provide a display module and an electronic device, aiming at the problem that the connection structure between the display module and the fingerprint identification module is easy to fall off.
The embodiment of the application provides a display module, which comprises: a display panel having a bearing surface; the fingerprint identification module comprises a substrate layer and an induction device arranged on the substrate layer, wherein the substrate layer is attached to the bearing surface, a bonding area and a bonding area are arranged on the surface of one side of the substrate layer, which is away from the bearing surface, and the bonding area are positioned on two opposite sides of the induction device; and one end of the flexible circuit board is bonded to the bonding area, and the other end of the flexible circuit board is bonded to the bonding area.
In one embodiment, a receiving space for receiving the sensing device layer is formed between the base layer and the flexible circuit board at intervals.
In one embodiment, the flexible circuit board comprises a connecting section and a bending section, the connecting section is bound in the binding area, the bending section is bent in the direction away from the substrate layer by the connecting section, the bending section is bonded in the bonding area, and the connecting section, the bending section and the substrate layer jointly define an accommodating space.
In one embodiment, the device further comprises a supporting piece, and two ends of the supporting piece are respectively supported on the bending section and the bonding area.
In one embodiment, the flexible circuit board comprises a connecting section, a bending section and an extending section, wherein the connecting section is bound in the binding area, the bending section is bent in the direction away from the substrate layer by the connecting section, the extending section extends in the direction close to the bonding area by the bending section, and the extending section is bonded in the bonding area, and the connecting section, the bending section, the extending section and the substrate layer jointly define an accommodating space.
In one embodiment, the extending section is provided with an opening corresponding to the sensing device, and the orthographic projection of the opening on the surface of the substrate layer covers the sensing device.
In one embodiment, the device further comprises a supporting piece, and two ends of the supporting piece are respectively supported on the extension section and the bonding area.
In one embodiment, the support is a fixing glue.
In one embodiment, the flexible circuit board is bonded to the bonding region by a conductive adhesive.
In one embodiment, the fingerprint recognition device further comprises a support film, wherein the support film is arranged on the bearing surface, the support film is arranged around the periphery of the fingerprint recognition module, the support film and the display panel jointly define a groove, and the fingerprint recognition module is arranged in the groove.
The embodiment of the application also provides electronic equipment, which comprises: a housing having a receiving cavity; and the display module is accommodated in the accommodating cavity, and the fingerprint identification module is positioned on one side of the display module facing the shell.
According to the display module and the electronic equipment provided by the embodiment of the application, the bonding area and the bonding area are arranged on the surface of one side, which is far away from the bearing surface, of the substrate layer in the fingerprint identification module, one end of the flexible circuit board is bonded to the bonding area, and the other end of the flexible circuit board is bonded to the bonding area, so that the area of a connecting area between the flexible circuit board and the substrate layer is increased, the connection stability between the flexible circuit board and the substrate layer is improved, the stress concentration at the connecting part is reduced, the integral warping degree of the fingerprint identification module is also improved, the pulling stress of the fingerprint identification module to the bonding area on the surface of the substrate layer is reduced, and the falling of a connecting structure can be effectively avoided. And in addition, an additional reinforcing structure is not required to be arranged in the display module, so that the stress concentration on the fingerprint identification module is further reduced.
Drawings
FIG. 1 is a schematic diagram of a display module according to the prior art under a single viewing angle;
fig. 2 is a structural cross-sectional view of a display module according to the prior art at another viewing angle;
fig. 3 is a schematic structural diagram of a display module according to an embodiment of the application under a viewing angle;
fig. 4 is a structural cross-sectional view of a display module according to an embodiment of the present application at another view angle;
fig. 5 is a structural cross-sectional view of a flexible circuit board according to an embodiment of the present application.
Description of the main reference signs
Display module 10
Display panel 100
Bearing surface 110
Fingerprint identification module 200
Base layer 210
Bonding region 211
Bonding area 212
Sensing device 220
Flexible circuit board 300
Connection section 310
Bending section 320
Extension 330
Opening 331
Accommodation space 400
Support 500
Support membrane 600
Groove 610
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Fig. 1 is a schematic structural view of a display module in the prior art at one viewing angle, and fig. 2 is a structural cross-sectional view of the display module in the prior art at another viewing angle.
Referring to fig. 1 to 2, a display module 1 in the prior art includes a fingerprint identification module 10, a display panel 11, a flexible circuit board 12 and a supporting film 13 disposed on the display panel 11, wherein the fingerprint identification module 10 includes a substrate 14 and a sensing element 15 disposed on the substrate 14, a bonding region 16 is disposed on one side of the substrate 14, one end of the flexible circuit board 12 is bonded to the bonding region 16, and the other end of the flexible circuit board 12 extends in a direction away from the fingerprint identification module 10 and is connected to the supporting film 13 on the display panel 11. The support film 13 may be a laminated multi-layer structure, for example, the support film 13 includes an impact-resistant layer, a heat dissipation layer, and an electromagnetic interference resistant layer, so that the support film 13 has impact resistance, good heat dissipation, and electromagnetic interference resistance. Wherein, the material of impact resistance layer can be the bubble cotton, and the material of heat dissipation layer can be the graphite flake, and the material of anti-electromagnetic interference layer can be the copper foil layer. Because the flexible circuit board 12 and the fingerprint identification module 10 are bonded and connected only through the bonding area 16, the area of the connected area is small, the stress concentration degree of the connecting part is high, the problem that the fingerprint identification module 10 is easy to warp is easily caused, and the distance between the highest warp position of the actually measured fingerprint identification module 10 and the display panel 11 is between 350 micrometers and 500 micrometers. In addition, the structure has the problems of poor connection stability and easy falling of the flexible circuit board 12 and the fingerprint identification module 10, and for this reason, the reinforcing glue 17 is also arranged at the connection position in the prior art, and the arrangement of the reinforcing glue 17 further enhances the problem of stress concentration at the position. On the other hand, the structure also has the problems that the distance between the connecting point of the flexible circuit board 12 and the fingerprint identification module 10 and the connecting point of the flexible circuit board 12 and the supporting film 13 on the display panel 11 is short and the gradient is large, and the flexible circuit board 12 can cause pulling to the bonding area, so that the connection stability of the flexible circuit board 12 and the fingerprint identification module 10 is further reduced.
Fig. 3 is a schematic structural diagram of a display module 10 according to an embodiment of the present application under one viewing angle, and fig. 4 is a structural cross-sectional view of the display module 10 according to an embodiment of the present application under another viewing angle.
In order to at least partially solve the above problems, referring to fig. 3 to 4, a display module 10 is provided in an embodiment of the application, and the display module 10 includes a display panel 100, a fingerprint identification module 200 and a flexible circuit board 300.
The display panel 100 has a carrying surface 110. The display panel 100 is used for displaying image information, and specifically, the display panel 100 may be any panel having a display function, such as a liquid crystal panel (LCD, liquid Crystal Display), a Light Emitting Diode (LED, light Emitting Diodes) panel, an Organic Light-Emitting Diode (OLED) panel, or an active matrix quantum dot Light Emitting Diode (QLED, quantum Dot Light Emitting Diodes) panel. The display panel 100 has a light emitting surface, and the image information displayed on the display panel 100 can be observed by facing the light emitting surface. In order not to affect the normal use of the display module 10, the surface of the display panel 100 facing away from the light emitting surface may be used as the bearing surface 110, in one embodiment, the display module 10 further includes a support film 600, the support film 600 is attached to the bearing surface 110, the support film 600 is disposed around the periphery of the fingerprint identification module 200, the support film 600 and the display panel 100 together define a groove 610, and the fingerprint identification module 200 is disposed in the groove 610. The support film 600 may have a laminated multi-layer structure, for example, the support film 600 includes an impact-resistant layer, a heat dissipation layer, and an electromagnetic interference resistant layer, so that the support film 600 has impact resistance, good heat dissipation, and electromagnetic interference resistance. Wherein, the material of impact resistance layer can be the bubble cotton, and the material of heat dissipation layer can be the graphite flake, and the material of anti-electromagnetic interference layer can be the copper foil layer. The flexible circuit board 300 is fixedly connected with the support film 600, the distance between the connecting point of the flexible circuit board 300 and the fingerprint identification module 200 and the connecting point of the flexible circuit board 300 and the support film 600 is long, the climbing distance of the flexible circuit board 300 is prolonged, and the flexible circuit board 300 cannot cause pulling to the bonding area 211, so that the connection stability of the flexible circuit board 300 and the fingerprint identification module 200 is good. Meanwhile, since the climbing distance of the flexible circuit board 300 is prolonged in the embodiment of the application, no additional climbing space is required to be reserved for the flexible circuit board 300 in the display module 10, and the opening area of the periphery of the fingerprint identification module 200 is smaller.
The fingerprint identification module 200 includes a substrate layer 210 and a sensing device 220 disposed on the substrate layer 210, and the substrate layer 210 is attached to the carrying surface 110. The base layer 210 is used to connect and fix the fingerprint recognition module 200 with other parts or components, and the sensing device 220 is used to identify fingerprint information pressed against its outer surface, the fingerprint information including the profile of the fingerprint. The sensing device 220 may include a plurality of components stacked, for example, the sensing device 220 includes a Polymer layer (Polymer), a piezoelectric thin film layer (Pizeo film), an electrode layer, an Epoxy-based layer (Epoxy-based layer), etc. stacked in order, and may be flexibly configured according to an application scenario, which is not limited herein. Glue may be used between the base layer 210 and the bearing surface 110 to achieve attachment, for example, in some embodiments, double sided glue is provided between the base layer 210 and the bearing surface 110. Bonding region 211 and bonding region 212 are disposed on a surface of substrate layer 210 facing away from bearing surface 110, bonding region 211 and bonding region 212 being located on opposite sides of inductive device 220. Bonding region 211 is the area on the surface of base layer 210 for bonding base layer 210 to flexible circuit board 300, and bonding can bring the two into close contact to form a firm mechanical connection. The bonding area 212 is the area of the surface of the substrate layer 210 for bonding the substrate to the flexible circuit board 300, and the bonding may be firmly connected by adhesion. Bonding region 211 and bonding region 212 are located on opposite sides of sensing device 220, for example, sensing device 220 may be disposed at a central location on the surface of base layer 210, such that bonding region 211 and bonding region 212 are located on opposite sides of sensing device 220, i.e., at opposite ends of the surface of base layer 210, respectively, and bonding region 211 and bonding region 212 are separated by sensing device 220.
Because the bonding region 211 and the bonding region 212 are disposed on the surface of the substrate layer 210 facing away from the bearing surface 110, one end of the flexible circuit board 300 can be bonded to the bonding region 211, and the other end of the flexible circuit board 300 is bonded to the bonding region 212.
According to the display module 10 in the embodiment of the application, the bonding region 211 and the bonding region 212 are arranged on the surface of one side, away from the bearing surface 110, of the substrate layer 210 in the fingerprint identification module 200, one end of the flexible circuit board 300 is bonded to the bonding region 211, and the other end of the flexible circuit board 300 is bonded to the bonding region 212, so that the area of a connecting region between the flexible circuit board 300 and the substrate layer 210 is increased, the connection stability between the flexible circuit board 300 and the substrate layer 210 is improved, the stress concentration at the connecting position is reduced, the integral warping degree of the fingerprint identification module 200 is improved, the distance between the position where the fingerprint identification module 200 warps the highest and the display panel 100 is improved to 230 micrometers, the bonding of the display panel 10 is facilitated, and the pulling stress of the fingerprint identification module 200 to the bonding region 211 on the surface of the substrate layer 210 is reduced, and the connection structure can be effectively prevented from falling. In addition, no additional reinforcing structure is needed to be arranged in the display module 10, so that the stress concentration on the fingerprint identification module 200 is further reduced. Meanwhile, since the climbing distance of the flexible circuit board 300 is prolonged in the embodiment of the application, no additional climbing space is required to be reserved for the flexible circuit board 300 in the display module 10, and the opening area of the periphery of the fingerprint identification module 200 is smaller.
Since the bonding region 211 and the bonding region 212 are located at opposite sides of the sensing device 220, and one end of the flexible circuit board 300 is bonded to the bonding region 211, and the other end of the flexible circuit board 300 is bonded to the bonding region 212, the flexible circuit board 300 spans over the sensing device 220, so that the sensing device 220 has a sufficient mounting space on the fingerprint identification module 200, normal use of the sensing device 220 is not affected, and in some embodiments, an accommodating space 400 for accommodating the sensing device 220 is formed between the base layer 210 and the flexible circuit board 300. The size, shape, etc. of the accommodation space 400 are determined according to the size, shape, etc. of the space required to be occupied by the sensing device 220, and are not limited herein. In order not to affect the normal use of the sensing device 220, the flexible circuit board 300 should not be in direct contact with the sensing device 220, so that the size of the accommodating space 400 is larger than the size of the space occupied by the sensing device 220, that is, the flexible circuit board 300 completely covers the sensing device 220 inside the accommodating space 400 on the substrate layer 210, so that an additional compensation space is reserved for the sensing device 220, and meanwhile, the sensing device 220 is protected.
Specifically, in some embodiments, the receiving space 400 is formed by spacing the base layer 210 from the flexible circuit board 300 by: the flexible circuit board 300 includes a connection section 310 and a bending section 320, the connection section 310 is bonded to the bonding region 211, the bending section 320 is bent from the connection section 310 towards a direction away from the substrate layer 210, the bending section 320 is bonded to the bonding region 212, and the connection section 310, the bending section 320 and the substrate layer 210 together define an accommodating space 400. I.e., the surface of connecting segment 310 remains parallel to the surface of base layer 210, while the surface of bending segment 320 bends relative to the surface of base layer 210 in a direction away from base layer 210. The flexible circuit board 300 is bonded to the bonding region 211 through the connecting section 310, so that connection with the fingerprint identification module 200 is not affected, and meanwhile, the bending section 320 bends from the connecting section 310 to the direction away from the substrate layer 210, so that a space is reserved for accommodating the sensing device 220, and normal use of the sensing device 220 is not affected. Similarly, the starting point of bending the bending section 320, the bending angle, etc. are determined according to the size, shape, etc. of the space required for the sensing device 220, and are not limited herein. It should be noted that the connection section 310 and the bending section 320 are separated according to different functions on the flexible circuit board 300, and the flexible circuit board 300 may not have a clear limitation for separating the connection section 310 and the bending section 320.
On the basis of the above embodiments, since the bending section 320 of the flexible circuit board 300 is adhered to the adhesion area 212, and the bending section 320 is bent from the connecting section 310 in a direction away from the substrate layer 210, in order to make the bending section 320 more firmly adhered to the adhesion area 212, in some embodiments, the display module 10 further includes a supporting member 500, and two ends of the supporting member 500 are respectively supported on the bending section 320 and the adhesion area 212. Under the supporting action of the supporting member 500, the bending section 320 can maintain the distance between the bending section and the substrate layer 210, so as to avoid the situation that the bending section 320 falls down due to the influence of gravity or other external factors, and the normal use of the display module 10 is affected.
In other embodiments, as shown in fig. 3, the accommodating space 400 may be formed between the base layer 210 and the flexible circuit board 300 by: the flexible circuit board 300 includes a connection section 310, a bending section 320 and an extension section 330, the connection section 310 is bonded to the bonding region 211, the bending section 320 is bent from the connection section 310 towards a direction away from the substrate layer 210, the extension section 330 extends from the bending section 320 towards a direction close to the bonding region 212, the extension section 330 is bonded to the bonding region 212, and the connection section 310, the bending section 320, the extension section 330 and the substrate layer 210 together define an accommodating space 400. That is, the surface of the connecting section 310 is parallel to the surface of the substrate layer 210, while the surface of the bending section 320 bends relative to the surface of the substrate layer 210 in a direction away from the substrate layer 210, while the surface of the extending section 330 bends relative to the bending section 320 in a direction close to the substrate layer 210, so that the surface of the extending section 330 can be finally parallel to the surface of the substrate layer 210, or the surface of the extending section 330 bends relative to the bending section 320 in a direction away from the substrate layer 210 by a smaller extent. The flexible circuit board 300 is bound in the bonding region 211 through the connecting section 310, connection with the fingerprint identification module 200 is not affected, meanwhile, the bending section 320 is bent in the direction away from the substrate layer 210 through the connecting section 310, the extending section 330 extends in the direction close to the bonding region 212 through the bending section 320, and the bending section 320 and the extending section 330 together provide a space for accommodating the sensing device 220, so that normal use of the sensing device 220 is not affected. The starting point of bending the bending section 320, the bending angle, etc. are determined according to the size, shape, etc. of the space required for the sensing device 220, and are not limited herein. It should be noted that the connection section 310, the bending section 320 and the extending section 330 are divided according to different functions on the flexible circuit board 300, and the flexible circuit board 300 may not have a clear limitation for dividing the connection section 310, the bending section 320 and the extending section 330.
Unlike the above embodiment, the flexible circuit board 300 in this embodiment further has an extension section 330, and by setting the extension section 330, the length of the bending section 320 can be reduced, so that after the flexible circuit board 300 is bent to a certain extent, and a sufficient accommodating space 400 is reserved for the sensing device 220, the whole bending degree of the flexible circuit board 300 is reduced by the extension section 330, so that the whole structure of the display module 10 is more compact, and the space occupation of the display module is reduced. At this time, both ends of the supporting member 500 are respectively supported on the extension section 330 and the bonding area 212. Under the supporting action of the supporting member 500, the extending section 330 can maintain the distance between the extending section and the substrate layer 210, so as to avoid the situation that the bending section 320 falls down due to the influence of gravity or other external factors, which affects the normal use of the display module 10. Further, the supporting member 500 is made of a fixing adhesive, and the supporting member 500 is fixed by the fixing adhesive without additionally arranging a fixing structure, so that the use is more convenient.
Meanwhile, in order to reduce interference or blocking effect of the flexible circuit board 300 on the signal transmitted in the fingerprint recognition module 200, in some embodiments, the extending section 330 is provided with an opening 331 corresponding to the sensing device 220, and an orthographic projection of the opening 331 on the surface of the substrate layer 210 covers the sensing device 220. The sensing device 220 is communicated with the outside of the flexible circuit board 300 through the opening 331, and the flexible circuit board 300 will not interfere or block the signal transmitted in the fingerprint identification module 200.
In some embodiments, the flexible circuit board 300 is bonded to the bonding region 211 by a conductive adhesive, specifically, ACF (Anisotropic Conductive Film) anisotropic conductive adhesive may be used, and ACF anisotropic conductive adhesive is a special adhesive, which is characterized by a significant difference between the electrical conduction direction of the Z-axis and the resistance characteristics of the XY-insulation plane. When the difference between the Z-axis on-resistance value and the XY plane insulation resistance value exceeds a certain ratio, the Z-axis on-resistance value and the XY plane insulation resistance value can be called as good conduction anisotropy.
The embodiment of the application also provides an electronic device, which comprises a shell and the display module 10, wherein the shell is provided with a containing cavity, the display module 10 is contained in the containing cavity, and the fingerprint identification module 200 is positioned on one side of the display module 10 facing the shell. The electronic device may be any one of wearable devices such as a mobile phone, a tablet computer, a notebook computer, a personal digital assistant, a smart bracelet, a smart watch, and the like. The display module 10 can realize the related operations such as information display, processing or control of the electronic equipment. According to the electronic device in the embodiment of the application, the bonding region 211 and the bonding region 212 are arranged on the surface of one side, which is away from the bearing surface 110, of the substrate layer 210 in the fingerprint identification module 200, and one end of the flexible circuit board 300 is bonded to the bonding region 211, and the other end of the flexible circuit board 300 is bonded to the bonding region 212, so that the area of a connecting region between the flexible circuit board 300 and the substrate layer 210 is increased, the connection stability between the flexible circuit board 300 and the substrate layer 210 is improved, the stress concentration at the connecting position is reduced, the integral warping degree of the fingerprint identification module 200 is improved, the distance between the highest warping position of the actually measured fingerprint identification module 200 and the display panel 100 is improved to 230 micrometers, and the pulling stress of the fingerprint identification module 200 to the bonding region 211 on the surface of the substrate layer 210 is reduced, and the falling of a connecting structure can be effectively avoided. In addition, no additional reinforcing structure is needed to be arranged in the display module 10, so that the stress concentration on the fingerprint identification module 200 is further reduced.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
1. A display module, comprising:
a display panel having a bearing surface;
the fingerprint identification module comprises a substrate layer and an induction device arranged on the substrate layer, wherein the substrate layer is attached to the bearing surface, a bonding area and a bonding area are arranged on the surface of one side of the substrate layer, which is away from the bearing surface, and the bonding area are positioned on two opposite sides of the induction device; and
and one end of the flexible circuit board is bonded to the bonding area, the other end of the flexible circuit board is bonded to the bonding area, and an accommodating space for accommodating the induction device is formed between the substrate layer and the flexible circuit board at intervals.
2. The display module assembly of claim 1, wherein the flexible circuit board includes a connection segment and a bending segment, the connection Duan Bang is defined in the bonding region, the bending segment is bent away from the substrate layer by the connection segment, the bending segment is bonded to the bonding region, and the connection segment, the bending segment and the substrate layer together define the accommodating space.
3. The display module assembly of claim 2, further comprising a support member having two ends respectively supported by the bending section and the bonding region.
4. The display module assembly of claim 1, wherein the flexible circuit board includes a connection segment, a bending segment, and an extension segment, the connection Duan Bang is positioned at the bonding region, the bending segment is bent from the connection segment in a direction away from the substrate layer, the extension segment extends from the bending segment in a direction close to the bonding region, and the extension segment is bonded to the bonding region, and the connection segment, the bending segment, the extension segment, and the substrate layer together define the accommodation space.
5. The display module assembly of claim 4, wherein the extension is provided with an opening corresponding to the sensing device, and an orthographic projection of the opening on the surface of the substrate layer covers the sensing device.
6. The display module assembly of claim 4, further comprising a support member having two ends supported by the extension and the bonding region, respectively.
7. A display module according to claim 3 or 6, wherein the support member is a fixing glue.
8. The display module of claim 1, wherein the flexible circuit board is bonded to the bonding region by a conductive adhesive.
9. The display module of claim 1, further comprising a support film disposed on the bearing surface and surrounding the periphery of the fingerprint identification module, the support film and the display panel together defining a recess, the fingerprint identification module being disposed within the recess.
10. An electronic device, comprising:
a housing having a receiving cavity; and
the display module of any one of claims 1 to 9, being accommodated in the accommodating cavity, and the fingerprint recognition module being located at a side of the display module facing the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110547217.4A CN113221779B (en) | 2021-05-19 | 2021-05-19 | Display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110547217.4A CN113221779B (en) | 2021-05-19 | 2021-05-19 | Display module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113221779A CN113221779A (en) | 2021-08-06 |
| CN113221779B true CN113221779B (en) | 2023-12-12 |
Family
ID=77093175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110547217.4A Active CN113221779B (en) | 2021-05-19 | 2021-05-19 | Display module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113221779B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113641047B (en) * | 2021-08-10 | 2023-08-25 | 豪威半导体（上海）有限责任公司 | Soft board packaging structure and LCOS device |
| CN113743307B (en) * | 2021-09-06 | 2023-12-12 | 业泓科技(成都)有限公司 | Bonding module, fingerprint identification component and electronic equipment |
| CN114927071B (en) * | 2022-05-31 | 2023-06-27 | 武汉天马微电子有限公司 | Display module and display device |
| CN115504678B (en) * | 2022-11-03 | 2023-09-29 | 业泓科技(成都)有限公司 | Thinning method of touch recognition module |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205264262U (en) * | 2015-12-28 | 2016-05-25 | 昆山国显光电有限公司 | Panel display device |
| WO2018072502A1 (en) * | 2016-10-20 | 2018-04-26 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN108153026A (en) * | 2018-01-25 | 2018-06-12 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
| CN208273349U (en) * | 2018-05-31 | 2018-12-21 | 云谷（固安）科技有限公司 | Flexible circuit board and its bonding structure and flexible display apparatus |
| CN109426018A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | Substrate and its manufacturing method, display panel, mosaic screen |
| CN109786426A (en) * | 2019-01-08 | 2019-05-21 | 昆山工研院新型平板显示技术中心有限公司 | The manufacturing method of display panel, display device and display panel |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110320689A (en) * | 2019-06-24 | 2019-10-11 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
| CN110598663A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Display screen assembly, electronic equipment and fingerprint processing method |
| WO2020103094A1 (en) * | 2018-11-22 | 2020-05-28 | 深圳市柔宇科技有限公司 | Oled display panel |
| CN111338511A (en) * | 2020-02-28 | 2020-06-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN211319187U (en) * | 2019-11-21 | 2020-08-21 | 南昌欧菲光科技有限公司 | Touch screen and electronic equipment |
| CN112198981A (en) * | 2020-09-25 | 2021-01-08 | 合肥维信诺科技有限公司 | Display module, preparation method thereof and display device |
| CN112533367A (en) * | 2020-12-03 | 2021-03-19 | 昆山国显光电有限公司 | Flexible circuit board, display screen and electronic equipment |
| WO2021081988A1 (en) * | 2019-11-01 | 2021-05-06 | 京东方科技集团股份有限公司 | Display module and display device |
| WO2021081952A1 (en) * | 2019-10-31 | 2021-05-06 | 京东方科技集团股份有限公司 | Display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102133452B1 (en) * | 2013-12-11 | 2020-07-14 | 삼성디스플레이 주식회사 | Display device |
| CN107482041B (en) * | 2017-08-16 | 2020-04-24 | 武汉天马微电子有限公司 | Flexible display panel and flexible display device |
| KR102672834B1 (en) * | 2018-11-29 | 2024-06-05 | 엘지디스플레이 주식회사 | Flexible display apparatus |
-
2021
- 2021-05-19 CN CN202110547217.4A patent/CN113221779B/en active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205264262U (en) * | 2015-12-28 | 2016-05-25 | 昆山国显光电有限公司 | Panel display device |
| WO2018072502A1 (en) * | 2016-10-20 | 2018-04-26 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN109426018A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | Substrate and its manufacturing method, display panel, mosaic screen |
| CN108153026A (en) * | 2018-01-25 | 2018-06-12 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
| CN208273349U (en) * | 2018-05-31 | 2018-12-21 | 云谷（固安）科技有限公司 | Flexible circuit board and its bonding structure and flexible display apparatus |
| WO2020103094A1 (en) * | 2018-11-22 | 2020-05-28 | 深圳市柔宇科技有限公司 | Oled display panel |
| CN109786426A (en) * | 2019-01-08 | 2019-05-21 | 昆山工研院新型平板显示技术中心有限公司 | The manufacturing method of display panel, display device and display panel |
| WO2020216301A1 (en) * | 2019-04-25 | 2020-10-29 | Oppo广东移动通信有限公司 | Input/output assembly and electronic device |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110320689A (en) * | 2019-06-24 | 2019-10-11 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
| CN110598663A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Display screen assembly, electronic equipment and fingerprint processing method |
| WO2021081952A1 (en) * | 2019-10-31 | 2021-05-06 | 京东方科技集团股份有限公司 | Display device |
| WO2021081988A1 (en) * | 2019-11-01 | 2021-05-06 | 京东方科技集团股份有限公司 | Display module and display device |
| CN211319187U (en) * | 2019-11-21 | 2020-08-21 | 南昌欧菲光科技有限公司 | Touch screen and electronic equipment |
| CN111338511A (en) * | 2020-02-28 | 2020-06-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN112198981A (en) * | 2020-09-25 | 2021-01-08 | 合肥维信诺科技有限公司 | Display module, preparation method thereof and display device |
| CN112533367A (en) * | 2020-12-03 | 2021-03-19 | 昆山国显光电有限公司 | Flexible circuit board, display screen and electronic equipment |
Non-Patent Citations (2)
| Title |
|---|
| Roll-to-roll processing of film substrates for hybrid integrated flexible electronics;Palavesam等;《Flexible and Printed Electronics》;第3卷(第1期);1-19 * |
| 触控LCD模组制造工艺中的智能检测技术研究;陈康平;《中国优秀硕士学位论文全文数据库 信息科技辑》(第6期);I136-17 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113221779A (en) | 2021-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113221779B (en) | Display module and electronic equipment | |
| CN107102762B (en) | Touch screen panel and mobile terminal including the same | |
| CN110277435B (en) | Display device and preparation method thereof | |
| US11233208B2 (en) | Flexible display screen with groove to accommodate a chip | |
| KR102561819B1 (en) | Flexible display module and electronic device comprising the same | |
| US11129281B2 (en) | Flexible circuit film and electronic device comprising the same | |
| EP2547180B1 (en) | Touch screen panel active matrix organic light emitting diode display device having a flexible printed circuit board | |
| CN111725265B (en) | Display module and display device | |
| US11342539B2 (en) | Display panel aligned with window and display device having the same | |
| US20140306942A1 (en) | Display apparatus | |
| CN113555412A (en) | Display module and display device | |
| CN110225159A (en) | Display device, electronic equipment and display device preparation method | |
| CN114093274B (en) | Display device and display terminal | |
| CN209859953U (en) | Display screen and display device | |
| CN108966485B (en) | Circuit board assembly, electronic equipment, display screen device and assembling method thereof | |
| CN114822285A (en) | Display device | |
| CN112201158B (en) | Display module and display device | |
| JP4743979B2 (en) | Display device and display device | |
| JP2002148653A (en) | Display device | |
| CN114982387A (en) | Flexible circuit board and display device | |
| KR101023128B1 (en) | Flat Panel Dispaly device | |
| TWI637676B (en) | Wearable device with a chip on film package structure | |
| US20230209754A1 (en) | Display Module and Display Device | |
| CN210925292U (en) | Electronic device | |
| US20220141957A1 (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |