CN113221779A - Display module and electronic equipment - Google Patents
Display module and electronic equipment Download PDFInfo
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- CN113221779A CN113221779A CN202110547217.4A CN202110547217A CN113221779A CN 113221779 A CN113221779 A CN 113221779A CN 202110547217 A CN202110547217 A CN 202110547217A CN 113221779 A CN113221779 A CN 113221779A
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- circuit board
- flexible circuit
- display module
- substrate layer
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- 230000006698 induction Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 59
- 238000005452 bending Methods 0.000 claims description 53
- 230000008093 supporting effect Effects 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 230000001976 improved effect Effects 0.000 abstract description 8
- 210000000438 stratum basale Anatomy 0.000 abstract description 8
- 230000002787 reinforcement Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000009194 climbing Effects 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to a display module and an electronic device, wherein the display module comprises a display panel, a fingerprint identification module and a flexible circuit board; the base layer in the fingerprint identification module is attached to the bearing surface, a bonding area and a bonding area are arranged on the surface of one side, away from the bearing surface, of the base layer, and the bonding area are located on two opposite sides of the induction device; one end of the flexible circuit board is bonded to the bonding area, and the other end of the flexible circuit board is bonded to the bonding area. The utility model provides a display module assembly has increased the regional area of connection between flexible circuit board and the stratum basale, has improved the firm degree of being connected between flexible circuit board and the stratum basale, has reduced the stress concentration of junction, has just also improved the holistic warpage degree of fingerprint identification module to reduced the pull stress of fingerprint identification module to the nation's of stratum basale surface district, can effectively avoid connection structure to drop. And, need not set up extra reinforcement structure among the display module assembly, further reduced the stress concentration on the fingerprint identification module assembly.
Description
Technical Field
The application relates to the technical field of fingerprint identification, in particular to a display module and electronic equipment.
Background
With the development of the technology, the under-screen fingerprint identification technology is widely applied due to the characteristics of no occupation of the surface space of the electronic equipment, high identification speed and high identification accuracy. The module is discerned at the fingerprint and the assembling process of display panel, adopts flexible circuit board to discern the fingerprint generally and is connected fixedly with display panel. Among the fingerprint structure under current screen, because the hookup location sets up unreasonablely, lead to connection structure easily to drop, influence the normal use of fingerprint identification module.
Disclosure of Invention
Therefore, it is necessary to provide a display module and an electronic device for solving the problem that a connection structure between the display module and the fingerprint identification module is easy to fall off.
The embodiment of the application provides a display module assembly, include: a display panel having a carrying surface; the fingerprint identification module comprises a substrate layer and an induction device arranged on the substrate layer, wherein the substrate layer is attached to the bearing surface, a bonding area and a bonding area are arranged on the surface of one side, away from the bearing surface, of the substrate layer, and the bonding area are located on two opposite sides of the induction device; and one end of the flexible circuit board is bonded to the bonding area, and the other end of the flexible circuit board is bonded to the bonding area.
In one embodiment, a receiving space for receiving the sensing device layer is formed between the substrate layer and the flexible circuit board at a spacing.
In one embodiment, the flexible circuit board comprises a connecting section and a bending section, the connecting section is bonded to the bonding area, the bending section is bent from the connecting section to a direction away from the substrate layer, the bending section is bonded to the bonding area, and the connecting section, the bending section and the substrate layer jointly define an accommodating space.
In one embodiment, the fixing device further comprises a supporting part, and two ends of the supporting part are respectively supported on the bending section and the bonding area.
In one embodiment, the flexible circuit board comprises a connecting section, a bending section and an extending section, the connecting section is bonded to the bonding area, the bending section is bent from the connecting section to the direction away from the base layer, the extending section extends from the bending section to the direction close to the bonding area, the extending section is bonded to the bonding area, and the connecting section, the bending section, the extending section and the base layer define an accommodating space together.
In one embodiment, the extending section is provided with an opening corresponding to the sensing device, and the orthographic projection of the opening on the surface of the substrate layer covers the sensing device.
In one embodiment, the adhesive tape further comprises a support part, and two ends of the support part are respectively supported on the extension section and the bonding area.
In one embodiment, the support is a fixing glue.
In one embodiment, the flexible circuit board is bonded to the bonding area through a conductive adhesive.
In one embodiment, the fingerprint identification module further comprises a support film disposed on the carrying surface and surrounding the periphery of the fingerprint identification module, the support film and the display panel together define a groove, and the fingerprint identification module is disposed in the groove.
An embodiment of the present application further provides an electronic device, including: a housing having an accommodating chamber; and as above-mentioned display module assembly, accept in holding the chamber, and the fingerprint identification module assembly is located the display module assembly and faces one side of casing.
Display module assembly and electronic equipment based on this application embodiment, through being equipped with bonding area and bonding area on the lateral surface that the stratum basale in the fingerprint identification module deviates from the loading end, and make the one end bonding of flexible circuit board in bonding area, the other end of flexible circuit board bonds in bonding area, thus, the connection area between flexible circuit board and the stratum basale has been increased, the firm degree of being connected between flexible circuit board and the stratum basale has been improved, the stress concentration of junction has been reduced, just also improve the holistic warpage degree of fingerprint identification module, thereby reduced the pull stress of fingerprint identification module to the bonding area on stratum basale surface, can effectively avoid connection structure to drop. And, need not set up extra reinforcement structure among the display module assembly, further reduced the stress concentration on the fingerprint identification module assembly.
Drawings
Fig. 1 is a schematic structural diagram of a display module in the prior art at a viewing angle;
FIG. 2 is a cross-sectional view of a display module of the prior art at another viewing angle;
fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 4 is a structural cross-sectional view of a display module according to an embodiment of the present disclosure at another viewing angle;
fig. 5 is a structural cross-sectional view of a flexible circuit board according to an embodiment of the present application.
Description of the main elements
Bonding region 211
Bonding region 212
Connecting segment 310
Bending section 320
Accommodating space 400
Support 500
Support film 600
Groove 610
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 is a schematic structural view of a display module in the prior art at one viewing angle, and fig. 2 is a cross-sectional structural view of the display module in the prior art at another viewing angle.
Referring to fig. 1 to 2, a display module 1 in the prior art includes a fingerprint identification module 10, a display panel 11, a flexible circuit board 12, and a support film 13 disposed on the display panel 11, wherein the fingerprint identification module 10 includes a substrate 14 and a sensing element 15 disposed on the substrate 14, a bonding area 16 is further disposed on one side of the substrate 14, one end of the flexible circuit board 12 is bonded to the bonding area 16, and the other end of the flexible circuit board 12 extends in a direction away from the fingerprint identification module 10 and is connected to the support film 13 disposed on the display panel 11. The supporting film 13 may be a multi-layer structure disposed in a stacked manner, for example, the supporting film 13 includes an impact-resistant layer, a heat dissipation layer and an anti-electromagnetic interference layer, so that the supporting film 13 has the properties of impact resistance, good heat dissipation performance and anti-electromagnetic interference. Wherein, the material of shock resistance layer can be the bubble cotton, and the material of heat dissipation layer can be the graphite flake, and the material of anti-electromagnetic interference layer can be the copper foil layer. Because flexible circuit board 12 only connects through 16 bonding in bonding district with fingerprint identification module 10, the regional area of connection is less, and the stress concentration degree of junction is higher, causes the fingerprint easily and distinguishes module 10 and produces warping problem, and the distance between actual measurement fingerprint identification module 10 warping highest position department and display panel 11 is between 350 microns to 500 microns. Moreover, the structure also has the problems that the connection stability of the flexible circuit board 12 and the fingerprint identification module 10 is poor and the flexible circuit board is easy to fall off, so that the reinforcing glue 17 is arranged at the connecting position in the prior art, and the stress concentration at the position is further enhanced by the arrangement of the reinforcing glue 17. On the other hand, the structure also has the problems that the distance between the connection point of the flexible circuit board 12 and the fingerprint identification module 10 and the connection point of the flexible circuit board 12 and the support film 13 on the display panel 11 is short, and the slope is large, so that the flexible circuit board 12 can pull the bonding area, and the connection stability of the flexible circuit board 12 and the fingerprint identification module 10 is further reduced.
Fig. 3 is a schematic structural diagram of the display module 10 according to an embodiment of the present disclosure at one viewing angle, and fig. 4 is a cross-sectional structural view of the display module 10 according to an embodiment of the present disclosure at another viewing angle.
In order to at least partially solve the above problems, please refer to fig. 3 to 4, an embodiment of the present application provides a display module 10, where the display module 10 includes a display panel 100, a fingerprint identification module 200, and a flexible circuit board 300.
The display panel 100 has a supporting surface 110. The Display panel 100 is used for displaying image information, and specifically, the Display panel 100 may be any panel having a Display function, such as a Liquid Crystal panel (LCD), a Light Emitting Diode (LED) panel, an Organic Light-Emitting Diode (OLED) panel, or an active matrix Quantum Dot Light Emitting Diode (QLED) panel. The display panel 100 has a light-emitting surface, and image information displayed on the display panel 100 can be observed facing the light-emitting surface. In order not to affect the normal use of the display module 10, a surface of the display panel 100 facing away from the light emitting surface may be used as the supporting surface 110, in one embodiment, the display module 10 further includes a supporting film 600, the supporting film 600 is attached to the supporting surface 110, the supporting film 600 is disposed around the periphery of the fingerprint identification module 200, the supporting film 600 and the display panel 100 together define a groove 610, and the fingerprint identification module 200 is disposed in the groove 610. The support film 600 may be a multi-layer structure, for example, the support film 600 includes an impact resistant layer, a heat dissipation layer and an anti-electromagnetic interference layer, so that the support film 600 has good impact resistance, heat dissipation performance and anti-electromagnetic interference performance. Wherein, the material of shock resistance layer can be the bubble cotton, and the material of heat dissipation layer can be the graphite flake, and the material of anti-electromagnetic interference layer can be the copper foil layer. The flexible circuit board 300 is fixedly connected with the support film 600, the distance from the connection point of the flexible circuit board 300 and the fingerprint identification module 200 to the connection point of the flexible circuit board 300 and the support film 600 is long, the climbing distance of the flexible circuit board 300 is prolonged, and the flexible circuit board 300 cannot pull the bonding area 211, so that the connection stability of the flexible circuit board 300 and the fingerprint identification module 200 is good. Simultaneously, because the climbing distance of flexible circuit board 300 has been prolonged in this application embodiment, consequently, need not to reserve extra climbing space for flexible circuit board 300 among the display module assembly 10, the open region of module 200 periphery is less is discerned to the fingerprint.
The fingerprint identification module 200 includes a substrate layer 210 and a sensing device 220 disposed on the substrate layer 210, wherein the substrate layer 210 is attached to the supporting surface 110. The base layer 210 is used for realizing that the fingerprint is discerned module 200 and is connected with fixed with other part or subassembly, and induction element 220 is used for discerning the fingerprint information of pressing at its surface, and fingerprint information includes the profile of fingerprint. The sensing device 220 may include a plurality of components stacked, for example, the sensing device 220 includes a Polymer layer (Polymer), a piezoelectric film layer (Pizeo film), an electrode layer, an Epoxy-based layer (Epoxy-based layer), and the like, which are sequentially stacked, and may be flexibly arranged according to an application scenario, which is not limited herein. The substrate layer 210 and the carrying surface 110 may be attached by glue, for example, in some embodiments, a double-sided tape is disposed between the substrate layer 210 and the carrying surface 110. A bonding area 211 and an adhesive area 212 are disposed on a surface of the substrate layer 210 facing away from the carrying surface 110, and the bonding area 211 and the adhesive area 212 are disposed on opposite sides of the sensing device 220. The bonding region 211 is an area on the surface of the substrate layer 210 for bonding the substrate layer 210 and the flexible circuit board 300, and the bonding can make the two closely contact with each other to form a firm mechanical connection. The bonding region 212 is a region on the surface of the substrate layer 210 for bonding the substrate to the flexible circuit board 300, and the bonding region can be firmly connected with the substrate by adhesion. Bonding areas 211 and 212 are located on opposite sides of sensing device 220. for example, sensing device 220 may be disposed at a middle position on the surface of base layer 210, bonding areas 211 and 212 may be located on opposite sides of sensing device 220, i.e., at two ends of the surface of base layer 210, respectively, and bonding areas 211 and 212 may be separated by sensing device 220.
Since the bonding area 211 and the bonding area 212 are disposed on the surface of the substrate layer 210 facing away from the carrying surface 110, one end of the flexible circuit board 300 is bonded to the bonding area 211, and the other end of the flexible circuit board 300 is bonded to the bonding area 212.
In the embodiment of the present application, the display module 10 is formed by disposing the bonding area 211 and the adhesion area 212 on the surface of the substrate layer 210 facing away from the carrying surface 110 in the fingerprint identification module 200, and one end of the flexible circuit board 300 is bonded to the bonding region 211, the other end of the flexible circuit board 300 is bonded to the bonding region 212, thus, the area of the connection region between the flexible circuit board 300 and the substrate layer 210 is increased, the stability of the connection between the flexible circuit board 300 and the substrate layer 210 is improved, the stress concentration at the connection position is reduced, the warping degree of the whole fingerprint identification module 200 is improved, the distance between the highest warping position of the fingerprint identification module 200 and the display panel 100 is actually measured to be improved to 230 microns, which is beneficial to the bonding of the display panel 10, thereby reduced fingerprint identification module 200 and to the bonding district 211's on stratum basale 210 surface pull stress, can effectively avoid connection structure to drop. In addition, no extra reinforcing structure is required to be arranged in the display module 10, so that the stress concentration on the fingerprint identification module 200 is further reduced. Simultaneously, because the climbing distance of flexible circuit board 300 has been prolonged in this application embodiment, consequently, need not to reserve extra climbing space for flexible circuit board 300 among the display module assembly 10, the open region of module 200 periphery is less is discerned to the fingerprint.
Since the bonding region 211 and the bonding region 212 are located on opposite sides of the sensing device 220, one end of the flexible circuit board 300 is bonded to the bonding region 211, and the other end of the flexible circuit board 300 is bonded to the bonding region 212, the flexible circuit board 300 spans over the sensing device 220, in order to allow the sensing device 220 to have a sufficient installation space in the fingerprint identification module 200 and not affect the normal use of the sensing device 220, in some embodiments, an accommodating space 400 for accommodating the sensing device 220 is formed between the substrate layer 210 and the flexible circuit board 300 at an interval. The size, shape, etc. of the accommodating space 400 are determined according to the size, shape, etc. of the space required by the sensing device 220, and are not limited herein. In order not to affect the normal use of the sensing device 220, the flexible circuit board 300 should not be in direct contact with the sensing device 220, and therefore, the size of the accommodating space 400 can be larger than the size of the space occupied by the sensing device 220, that is, the flexible circuit board 300 completely covers and covers the sensing device 220 in the accommodating space 400 on the substrate layer 210, so as to reserve an additional compensation space for the sensing device 220, and protect the sensing device 220.
Specifically, in some embodiments, the accommodating space 400 is formed between the substrate layer 210 and the flexible circuit board 300 by: the flexible circuit board 300 includes a connection segment 310 and a bending segment 320, the connection segment 310 is bonded to the bonding region 211, the bending segment 320 is bent from the connection segment 310 to a direction away from the substrate layer 210, the bending segment 320 is bonded to the bonding region 212, and the connection segment 310, the bending segment 320 and the substrate layer 210 together define an accommodating space 400. That is, the surface of the connecting section 310 is parallel to the surface of the substrate layer 210, and the surface of the bending section 320 is bent away from the substrate layer 210 relative to the surface of the substrate layer 210. The flexible circuit board 300 is bonded in the bonding area 211 through the connecting section 310, the connection with the fingerprint identification module 200 is not affected, and meanwhile, the bending section 320 is bent towards the direction away from the substrate layer 210 by the connecting section 310, so that a space is reserved for accommodating the sensing device 220, and the normal use of the sensing device 220 is not affected. Similarly, the starting point of the bending segment 320, the bending angle, etc. are determined according to the size, shape, etc. of the space occupied by the sensing device 220, and are not limited herein. It should be noted that the connection segment 310 and the bending segment 320 are divided according to different functions on the flexible circuit board 300, and there may not be a definite boundary for dividing the connection segment 310 and the bending segment 320 in the flexible circuit board 300.
Based on the above embodiments, since the bending portion 320 of the flexible circuit board 300 is adhered to the adhesion area 212 and the bending portion 320 is bent away from the substrate layer 210 by the connecting portion 310, in order to make the bending portion 320 more firmly adhered to the adhesion area 212, in some embodiments, the display module 10 further includes a supporting member 500, and two ends of the supporting member 500 are respectively supported by the bending portion 320 and the adhesion area 212. Under the supporting effect of the supporting member 500, the bending section 320 can maintain the distance between the bending section and the substrate layer 210, and the situation that the normal use of the display module 10 is affected due to the falling of the bending section 320 caused by gravity or other external factors is avoided.
As shown in fig. 3, in other embodiments, the accommodating space 400 may be formed between the substrate layer 210 and the flexible circuit board 300 by: the flexible circuit board 300 includes a connection section 310, a bending section 320, and an extension section 330, wherein the connection section 310 is bonded to the bonding region 211, the bending section 320 is bent from the connection section 310 in a direction away from the substrate layer 210, the extension section 330 is extended from the bending section 320 in a direction close to the bonding region 212, the extension section 330 is bonded to the bonding region 212, and the connection section 310, the bending section 320, the extension section 330 and the substrate layer 210 together define the accommodating space 400. That is, the surface of the connecting section 310 is parallel to the surface of the substrate layer 210, the surface of the bending section 320 is bent in a direction away from the substrate layer 210 relative to the surface of the substrate layer 210, and the surface of the extending section 330 is bent in a direction close to the substrate layer 210 relative to the bending section 320, so that the surface of the extending section 330 can be finally parallel to the surface of the substrate layer 210, or the surface of the extending section 330 is bent in a direction away from the substrate layer 210 relative to the bending section 320 by a smaller amount. The flexible circuit board 300 is bonded to the bonding area 211 through the connecting section 310, and does not affect the connection between the flexible circuit board and the fingerprint identification module 200, meanwhile, the bending section 320 is bent from the connecting section 310 to the direction away from the substrate layer 210, the extending section 330 is extended from the bending section 320 to the direction close to the bonding area 212, the bending section 320 and the extending section 330 leave a space for accommodating the sensing device 220, and the normal use of the sensing device 220 is not affected. The starting point and the bending angle of the bending section 320 are determined by the size and shape of the space occupied by the sensing device 220, and are not limited herein. It should be noted that the connection segment 310, the bending segment 320 and the extension segment 330 are divided according to different functions of the flexible circuit board 300, and there may not be a definite boundary for dividing the connection segment 310, the bending segment 320 and the extension segment 330 in the flexible circuit board 300.
Different from the previous embodiment, the flexible circuit board 300 in this embodiment further has an extension section 330, and by providing the extension section 330, the length of the bending section 320 can be reduced, so that the flexible circuit board 300 is bent to a certain extent, and after a sufficient accommodating space 400 is reserved for the sensing device 220, the flexible circuit board 300 is straightened through the extension section 330, the overall bending degree of the flexible circuit board 300 is reduced, the overall structure of the display module 10 is more compact, and the space occupation thereof is reduced. At this time, both ends of the supporting member 500 are supported by the extension 330 and the bonding region 212, respectively. Under the supporting effect of the supporting member 500, the extending section 330 can maintain the distance between the extending section and the substrate layer 210, and the situation that the bending section 320 falls off due to the influence of gravity or other external factors and influences the normal use of the display module 10 is avoided. Furthermore, the supporting member 500 is made of fixing glue, and the supporting member 500 is made of fixing glue without additionally arranging a fixing structure to fix the supporting member 500, so that the use is more convenient.
Meanwhile, in order to reduce the interference or blocking effect of the flexible circuit board 300 on the signal transmitted in the fingerprint identification module 200, in some embodiments, an opening 331 is provided on the extension 330 corresponding to the sensing device 220, and an orthogonal projection of the opening 331 on the surface of the substrate layer 210 covers the sensing device 220. The sensor device 220 is connected to the outside of the flexible circuit board 300 through the opening 331, so that the flexible circuit board 300 will not interfere with or block the signal transmitted in the fingerprint recognition module 200.
In some embodiments, the flexible circuit board 300 is bonded to the bonding region 211 by a Conductive adhesive, and specifically, an ACF (anisotropic Conductive film) anisotropic Conductive adhesive may be used, where the ACF anisotropic Conductive adhesive is a special adhesive and is characterized in that the electrical conduction direction of the Z axis has a significant difference from the resistance characteristics of the XY insulating plane. When the difference between the Z-axis conduction resistance value and the XY-plane insulation resistance value exceeds a certain ratio, it is called as good conduction anisotropy.
The embodiment of the application further provides an electronic device, which includes a housing and the display module 10 as described above, wherein the housing has a containing cavity, the display module 10 is contained in the containing cavity, and the fingerprint identification module 200 is located on one side of the display module 10 facing the housing. The electronic device can be any one of wearable devices such as a mobile phone, a tablet computer, a notebook computer, a personal digital assistant, an intelligent bracelet and an intelligent watch. The display module 10 can display, process or control information of the electronic device. Electronic equipment in the embodiment of the application, through be equipped with bonding area 211 and bonding area 212 on the side surface that basal layer 210 deviates from loading surface 110 in the fingerprint identification module 200, and make the one end bonding of flexible circuit board 300 in bonding area 211, the other end of flexible circuit board 300 bonds in bonding area 212, thus, the connection area between flexible circuit board 300 and basal layer 210 has been increased, the firm degree of being connected between flexible circuit board 300 and basal layer 210 has been improved, the stress concentration of junction has been reduced, just also improve the holistic warpage degree of fingerprint identification module 200, the distance between actual measurement fingerprint identification module 200 warpage highest position department and display panel 100 is improved to 230 microns, thereby reduced the pull stress of fingerprint identification module 200 to the bonding area 211 on basal layer 210 surface, can effectively avoid connection structure to drop. In addition, no extra reinforcing structure is required to be arranged in the display module 10, so that the stress concentration on the fingerprint identification module 200 is further reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A display module, comprising:
a display panel having a carrying surface;
the fingerprint identification module comprises a substrate layer and an induction device arranged on the substrate layer, wherein the substrate layer is attached to the bearing surface, a bonding area and a bonding area are arranged on the surface of one side, away from the bearing surface, of the substrate layer, and the bonding area are located on two opposite sides of the induction device; and
the flexible circuit board, the one end bonding of flexible circuit board in bonding district, the other end of flexible circuit board bond in bonding district.
2. The display module assembly according to claim 1, wherein a receiving space for receiving the sensing device is formed between the substrate layer and the flexible circuit board.
3. The display module assembly according to claim 2, wherein the flexible circuit board includes a connection section and a bending section, the connection section is bonded to the bonding region, the bending section is bent from the connection section to a direction away from the substrate layer, the bending section is bonded to the bonding region, and the connection section, the bending section and the substrate layer together define the accommodating space.
4. The display module assembly according to claim 3, further comprising a support member, wherein two ends of the support member are respectively supported by the bending section and the bonding region.
5. The display module assembly according to claim 2, wherein the flexible printed circuit board includes a connection section, a bending section and an extension section, the connection section is bonded to the bonding region, the bending section is bent away from the substrate layer by the connection section, the extension section is extended from the bending section to a direction close to the bonding region, and the extension section is bonded to the bonding region, and the connection section, the bending section, the extension section and the substrate layer define the receiving space together.
6. The display module according to claim 5, wherein the extension segment is provided with an opening corresponding to the sensor device, and an orthographic projection of the opening on the surface of the substrate layer covers the sensor device.
7. The display module of claim 5, further comprising a support member, wherein two ends of the support member are respectively supported by the extending section and the bonding region.
8. The display module according to claim 4 or 7, wherein the supporting member is a fixing glue.
9. The display module assembly according to claim 1, wherein the flexible circuit board is bonded to the bonding area by a conductive adhesive.
10. The display module of claim 1, further comprising a support film disposed on the carrying surface and surrounding the periphery of the fingerprint identification module, wherein the support film and the display panel define a groove, and the fingerprint identification module is disposed in the groove.
11. An electronic device, comprising:
a housing having an accommodating chamber; and
the display module according to any one of claims 1 to 10, received in the receiving cavity, wherein the fingerprint recognition module is located on a side of the display module facing the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110547217.4A CN113221779B (en) | 2021-05-19 | 2021-05-19 | Display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110547217.4A CN113221779B (en) | 2021-05-19 | 2021-05-19 | Display module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113221779A true CN113221779A (en) | 2021-08-06 |
| CN113221779B CN113221779B (en) | 2023-12-12 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113641047A (en) * | 2021-08-10 | 2021-11-12 | 豪威半导体（上海）有限责任公司 | Flexible board packaging structure and LCOS device |
| CN113743307A (en) * | 2021-09-06 | 2021-12-03 | 业泓科技(成都)有限公司 | Nation decides module, fingerprint identification subassembly and electronic equipment |
| CN114927071A (en) * | 2022-05-31 | 2022-08-19 | 武汉天马微电子有限公司 | Display module and display device |
| CN115504678A (en) * | 2022-11-03 | 2022-12-23 | 业泓科技(成都)有限公司 | Thinning method of touch identification module |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150162388A1 (en) * | 2013-12-11 | 2015-06-11 | Samsung Display Co., Ltd. | Display device including touch sensor |
| CN205264262U (en) * | 2015-12-28 | 2016-05-25 | 昆山国显光电有限公司 | Panel display device |
| WO2018072502A1 (en) * | 2016-10-20 | 2018-04-26 | 京东方科技集团股份有限公司 | Display panel and display device |
| US20180145278A1 (en) * | 2017-08-16 | 2018-05-24 | Wuhan Tianma Micro-Electronics Co., Ltd. | Flexible display panel and flexible display device |
| CN108153026A (en) * | 2018-01-25 | 2018-06-12 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
| CN208273349U (en) * | 2018-05-31 | 2018-12-21 | 云谷（固安）科技有限公司 | Flexible circuit board and its bonding structure and flexible display apparatus |
| CN109426018A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | Substrate and its manufacturing method, display panel, mosaic screen |
| CN109786426A (en) * | 2019-01-08 | 2019-05-21 | 昆山工研院新型平板显示技术中心有限公司 | The manufacturing method of display panel, display device and display panel |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110320689A (en) * | 2019-06-24 | 2019-10-11 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
| CN110598663A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Display screen assembly, electronic equipment and fingerprint processing method |
| WO2020103094A1 (en) * | 2018-11-22 | 2020-05-28 | 深圳市柔宇科技有限公司 | Oled display panel |
| US20200174526A1 (en) * | 2018-11-29 | 2020-06-04 | Lg Display Co., Ltd. | Flexible display apparatus |
| CN111338511A (en) * | 2020-02-28 | 2020-06-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN211319187U (en) * | 2019-11-21 | 2020-08-21 | 南昌欧菲光科技有限公司 | Touch screen and electronic equipment |
| CN112198981A (en) * | 2020-09-25 | 2021-01-08 | 合肥维信诺科技有限公司 | Display module, preparation method thereof and display device |
| CN112533367A (en) * | 2020-12-03 | 2021-03-19 | 昆山国显光电有限公司 | Flexible circuit board, display screen and electronic equipment |
| WO2021081952A1 (en) * | 2019-10-31 | 2021-05-06 | 京东方科技集团股份有限公司 | Display device |
| WO2021081988A1 (en) * | 2019-11-01 | 2021-05-06 | 京东方科技集团股份有限公司 | Display module and display device |
-
2021
- 2021-05-19 CN CN202110547217.4A patent/CN113221779B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150162388A1 (en) * | 2013-12-11 | 2015-06-11 | Samsung Display Co., Ltd. | Display device including touch sensor |
| CN205264262U (en) * | 2015-12-28 | 2016-05-25 | 昆山国显光电有限公司 | Panel display device |
| WO2018072502A1 (en) * | 2016-10-20 | 2018-04-26 | 京东方科技集团股份有限公司 | Display panel and display device |
| US20180145278A1 (en) * | 2017-08-16 | 2018-05-24 | Wuhan Tianma Micro-Electronics Co., Ltd. | Flexible display panel and flexible display device |
| CN109426018A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | Substrate and its manufacturing method, display panel, mosaic screen |
| CN108153026A (en) * | 2018-01-25 | 2018-06-12 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
| CN208273349U (en) * | 2018-05-31 | 2018-12-21 | 云谷（固安）科技有限公司 | Flexible circuit board and its bonding structure and flexible display apparatus |
| WO2020103094A1 (en) * | 2018-11-22 | 2020-05-28 | 深圳市柔宇科技有限公司 | Oled display panel |
| US20200174526A1 (en) * | 2018-11-29 | 2020-06-04 | Lg Display Co., Ltd. | Flexible display apparatus |
| CN109786426A (en) * | 2019-01-08 | 2019-05-21 | 昆山工研院新型平板显示技术中心有限公司 | The manufacturing method of display panel, display device and display panel |
| WO2020216301A1 (en) * | 2019-04-25 | 2020-10-29 | Oppo广东移动通信有限公司 | Input/output assembly and electronic device |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110320689A (en) * | 2019-06-24 | 2019-10-11 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
| CN110598663A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Display screen assembly, electronic equipment and fingerprint processing method |
| WO2021081952A1 (en) * | 2019-10-31 | 2021-05-06 | 京东方科技集团股份有限公司 | Display device |
| WO2021081988A1 (en) * | 2019-11-01 | 2021-05-06 | 京东方科技集团股份有限公司 | Display module and display device |
| CN211319187U (en) * | 2019-11-21 | 2020-08-21 | 南昌欧菲光科技有限公司 | Touch screen and electronic equipment |
| CN111338511A (en) * | 2020-02-28 | 2020-06-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN112198981A (en) * | 2020-09-25 | 2021-01-08 | 合肥维信诺科技有限公司 | Display module, preparation method thereof and display device |
| CN112533367A (en) * | 2020-12-03 | 2021-03-19 | 昆山国显光电有限公司 | Flexible circuit board, display screen and electronic equipment |
Non-Patent Citations (2)
| Title |
|---|
| PALAVESAM等: "Roll-to-roll processing of film substrates for hybrid integrated flexible electronics", 《FLEXIBLE AND PRINTED ELECTRONICS》, vol. 3, no. 1, pages 1 - 19, XP055640897, DOI: 10.1088/2058-8585/aaaa04 * |
| 陈康平: "触控LCD模组制造工艺中的智能检测技术研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》, no. 6, pages 136 - 17 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113641047A (en) * | 2021-08-10 | 2021-11-12 | 豪威半导体（上海）有限责任公司 | Flexible board packaging structure and LCOS device |
| CN113641047B (en) * | 2021-08-10 | 2023-08-25 | 豪威半导体（上海）有限责任公司 | Soft board packaging structure and LCOS device |
| CN113743307A (en) * | 2021-09-06 | 2021-12-03 | 业泓科技(成都)有限公司 | Nation decides module, fingerprint identification subassembly and electronic equipment |
| CN113743307B (en) * | 2021-09-06 | 2023-12-12 | 业泓科技(成都)有限公司 | Bonding module, fingerprint identification component and electronic equipment |
| CN114927071A (en) * | 2022-05-31 | 2022-08-19 | 武汉天马微电子有限公司 | Display module and display device |
| CN115504678A (en) * | 2022-11-03 | 2022-12-23 | 业泓科技(成都)有限公司 | Thinning method of touch identification module |
| CN115504678B (en) * | 2022-11-03 | 2023-09-29 | 业泓科技(成都)有限公司 | Thinning method of touch recognition module |
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