CN113743307B - Bonding module, fingerprint identification component and electronic equipment - Google Patents
Bonding module, fingerprint identification component and electronic equipment Download PDFInfo
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- CN113743307B CN113743307B CN202111038021.9A CN202111038021A CN113743307B CN 113743307 B CN113743307 B CN 113743307B CN 202111038021 A CN202111038021 A CN 202111038021A CN 113743307 B CN113743307 B CN 113743307B
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- circuit board
- flexible circuit
- bonding
- board body
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 52
- 230000007704 transition Effects 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 5
- 229920006267 polyester film Polymers 0.000 claims description 4
- 208000013201 Stress fracture Diseases 0.000 abstract description 5
- 208000010392 Bone Fractures Diseases 0.000 abstract description 2
- 206010017076 Fracture Diseases 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 29
- 238000010586 diagram Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
Abstract
The application relates to the technical field of display, and provides a bonding module, a fingerprint identification component with the bonding module and electronic equipment with the fingerprint identification component, wherein the bonding module at least comprises a flexible circuit board and a substrate; the functional film layer of the flexible circuit board is provided with the opening capable of exposing the first golden finger group, so that the hardness of the bonding part is reduced, the substrate is convenient to attach to the flexible circuit board, the height of the substrate relative to the flexible circuit board is reduced, the substrate is prevented from being scratched or damaged due to external force, and the risk of stress fracture of the bonding area circuit is further reduced; by arranging the curve at the edge of the opening, the stress applied to the opening can be reduced, so that the condition of line stress fracture near the opening is improved, and the risk of line fracture near the bonding area of the flexible circuit board is reduced.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a bonding module, a fingerprint identification component with the bonding module, and an electronic device with the fingerprint identification component.
Background
The flexible printed circuit board (Flexible Printed Circuit, abbreviated as FPC) is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has the characteristics of high reliability, light weight, thin thickness and good flexibility. Accordingly, in the touch display device, a flexible circuit board is generally used to increase a screen ratio by bending the flexible circuit board.
However, in the above-described process, after the flexible circuit board is bonded to another substrate, the vicinity of the bonding region of the flexible circuit board is likely to be broken by an external force.
Disclosure of Invention
Based on the above, it is necessary to provide a bonding module, a fingerprint identification component having the bonding module and an electronic device having the fingerprint identification component, so as to reduce the risk of circuit breakage near the bonding region of the flexible circuit board.
According to a first aspect of the present application, an embodiment of the present application provides a bonding module, including:
the flexible circuit board comprises a flexible circuit board body and a functional film layer which is covered on one side surface of the flexible circuit board body; the flexible circuit board body comprises a first bonding region, a first golden finger group is arranged in the first bonding region, an opening capable of exposing the first golden finger group is arranged on the functional film layer, and the inner side edge of the projection of the opening towards the flexible circuit board body is a curve; and
the substrate comprises a second bonding region, and a second golden finger group aligned with the first golden finger group is arranged in the second bonding region;
wherein the first golden finger group and the second golden finger group are aligned with each other; and the orthographic projection of the functional film layer on the flexible circuit board body and the orthographic projection of the substrate on the flexible circuit board body do not have an overlapping area.
In one embodiment, the inner side edge of the projection of the opening towards the flexible circuit board body is a wavy curve.
In one embodiment, the projected inner edge of the opening toward the flexible circuit board body includes alternately arranged peaks and valleys;
the wave crest and the wave trough are arc-shaped.
In one embodiment, the peaks and valleys are equal in magnitude.
In one embodiment, adjacent peaks and valleys are joined by a cambered surface transition.
In one embodiment, the radius of the arc of the peak and the radius of the arc of the trough are both 0.2 millimeters.
In one embodiment, the inner side edge of the projection of the opening towards the flexible circuit board body is sinusoidal.
In one embodiment, the functional film layer comprises a polyimide film or a polyester film.
In one embodiment, the flexible circuit board and the substrate are bonded by using an anisotropic conductive adhesive.
According to a second aspect of the present application, an embodiment of the present application further provides a fingerprint identification component, including a bonding module as described above.
According to a third aspect of the present application, an embodiment of the present application further provides an electronic device, including a fingerprint identification component as described above.
In the bonding module, the fingerprint identification component with the bonding module and the electronic equipment with the fingerprint identification component provided by the application, the bonding module at least comprises a flexible circuit board and a substrate; the flexible circuit board comprises a flexible circuit board body and a functional film layer which is covered on one side surface of the flexible circuit board body, wherein the flexible circuit board body comprises a first bonding area, a first golden finger group is arranged in the first bonding area, an opening capable of exposing the first golden finger group is arranged on the functional film layer, and the inner side edge of the projection of the opening towards the flexible circuit board body is a curve; the substrate comprises a second bonding region, and a second golden finger group aligned with the first golden finger group is arranged in the second bonding region; the first golden finger group and the second golden finger group are aligned with each other, and the orthographic projection of the functional film layer on the flexible circuit board body and the orthographic projection of the substrate on the flexible circuit board body do not have an overlapping area; the first golden finger is exposed through the opening, so that the hardness of the bonding part is reduced, the substrate is conveniently attached to the flexible circuit board, the height of the substrate relative to the flexible circuit board is reduced, the substrate is prevented from being scratched or damaged due to external force, and the risk of stress fracture of the bonding area circuit is further reduced; by arranging the curve at the edge of the opening, the stress applied to the opening can be reduced, so that the condition of line stress fracture near the opening is improved, and the risk of line fracture near the bonding area of the flexible circuit board is reduced.
Drawings
FIG. 1 is a schematic diagram of a structure before bonding a bonding module according to an embodiment of the related art;
FIG. 2 is a schematic diagram of a structure of a bonded module according to an embodiment of the related art;
FIG. 3 is a schematic view of the bottom structure of FIG. 2;
FIG. 4 is a schematic diagram illustrating a bonding module according to an embodiment of the present application;
FIG. 5 is a broken view of an X-ray scan line at an opening of a bonding module according to one embodiment of the present application;
FIG. 6 is a force-bearing schematic diagram of a linear structure according to an embodiment of the present application;
FIG. 7 is a schematic diagram illustrating stress of an arc structure according to an embodiment of the present application;
FIG. 8 is a schematic diagram illustrating a bonding module according to an embodiment of the present application;
FIG. 9 is a schematic diagram of the flexible circuit board of FIG. 8;
fig. 10 is an enlarged schematic view of a partial structure at G in fig. 8.
Reference numerals simply denote:
100: flexible circuit board 110: flexible circuit board body
120: functional film layer 121: open mouth
122: inboard edge 1221: wave crest
1222: trough 1223: arc surface transition
101: first bonding region 130: first golden finger group
140: copper foil
200: substrate 201: second bonding region
210: second golden finger group
10: first region 20: second region
30: third region 40: fourth region
Fp: external force Fpy: force in vertical direction
Fpx: force in horizontal direction
R1: arc radius R2 of peak and arc radius of trough
A1: amplitude A2 of the peak: amplitude of trough
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, a detailed description of embodiments accompanied with figures is provided below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the application. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application. The embodiments of the present application may be implemented in many other ways than those herein described, and those skilled in the art may make similar modifications without departing from the spirit of the application, so that the embodiments of the application are not limited to the specific embodiments disclosed below.
It will be appreciated that the terms "first," "second," "third," "fourth," and the like, as used herein, may be used to describe various terms, and are not to be construed as indicating or implying any particular importance or order of magnitude of the technical features indicated. However, unless specifically stated otherwise, these terms are not limited by these terms. These terms are only used to distinguish one term from another. For example, the first bonding region and the second bonding region are different bonding regions, the first golden finger set and the second golden finger set are different golden finger sets, and the first region, the second region, the third region and the fourth region are different regions without departing from the scope of the present application. In the description of the embodiments of the present application, the meaning of "a plurality", "a number" or "a plurality" is at least two, for example, two, three, etc., unless explicitly defined otherwise.
In describing embodiments of the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.
In the description of embodiments of the application, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature level is higher than the second feature level. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature level is less than the second feature level.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In order to facilitate understanding of the technical solutions of the embodiments of the present application, before explaining specific implementation manners of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are first explained briefly.
COF (Chip On Flex, or Chip On Film), commonly called flip Chip Film, is a die-attach Film packaging technology for fixing an Integrated Circuit (IC) On a flexible circuit board, and uses a flexible additional circuit board as a package Chip carrier to combine a Chip with a flexible substrate circuit, or a flexible additional circuit board of a single-finger unpackaged Chip, including tape-reel packaging production (TAB substrate, its manufacturing process is called TCP), a flexible board connection Chip assembly, and a flexible IC carrier package.
TFT (Thin Film Transistor), namely a thin film transistor. TFT type display screens are the mainstream display devices on various notebook computers and desktops, and each liquid crystal pixel on the display screen is driven by a thin film transistor integrated behind the pixel.
FIG. 1 is a schematic diagram showing a structure before binding a binding module according to an embodiment of the related art; FIG. 2 is a schematic diagram of a structure of a binding module after binding according to an embodiment of the related art; FIG. 3 shows a schematic bottom view of FIG. 2; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
As described in the background, in the touch display device, the flexible circuit board 100 is generally used to increase the screen ratio by bending the flexible circuit board 100. As shown in fig. 1 and fig. 2, the flexible circuit board 100 includes a first bonding area 101, the substrate 200 includes a second bonding area 201, the first bonding area 101 is located in the second bonding area, after the flexible circuit board 100 is bonded to the substrate 200, as shown in fig. 3, the height of the substrate 200 can be obviously higher than that of the flexible circuit board 100, and the edge of the side of the substrate 200 facing the flexible circuit board 100 is easily scratched or damaged by external force (such as vibration, drop, etc.), so that the circuit is broken near the bonding area of the flexible circuit board 100 under the driving of the bonding force after bonding.
FIG. 4 is a schematic diagram illustrating a bonding module according to an embodiment of the present application; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
As shown in fig. 4, an embodiment of the present application provides a bonding module, which includes a flexible circuit board 100 and a substrate 200; the flexible circuit board 100 comprises a flexible circuit board body 110 and a functional film layer 120 which is covered on one side surface of the flexible circuit board body 110, wherein the flexible circuit board body 110 comprises a first bonding area 101, a first golden finger group 130 is arranged in the first bonding area 101, and an opening 121 capable of exposing the first golden finger group 130 is arranged on the functional film layer 120; the substrate 200 includes a second bonding region 201, and a second golden finger group 210 aligned with the first golden finger group 130 is disposed in the second bonding region 201; the first golden finger set 130 and the second golden finger set 210 are aligned with each other; the orthographic projection of the functional film 120 on the flexible circuit board body 110 does not have an overlapping area with the orthographic projection of the substrate 200 on the flexible circuit board body 110. That is, the opening 121 is formed on the functional film layer 120, and the first golden finger is exposed, so that the hardness of the bonding portion of the flexible circuit board 100 is reduced, the substrate 200 is conveniently attached to the flexible circuit board 100, the height of the substrate 200 relative to the flexible circuit board 100 is reduced, the substrate 200 is prevented from being scratched or damaged due to external force, and the risk of stress fracture of the bonding region circuit is reduced.
It should be noted that, the opening 121 is an opening communicating with the outside of the flexible circuit board 100, and the area of the opening 121 may at least accommodate the second bonding region 201 of the substrate 200. That is, the front projection of the functional film 120 on the flexible circuit board body 110 does not have an overlapping area with the front projection of the substrate 200 on the flexible circuit board body 110.
FIG. 5 illustrates an X-ray scan line break at an opening 121 of a bonding module in accordance with one embodiment of the present application; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
Further studies by the present inventors have found that, due to manufacturing tolerances of the functional film 120 and the substrate 200, there is a distance between the functional film 120 and the substrate 200 when the flexible circuit board 100 and the substrate 200 are bonded. For convenience of description, the area of the flexible circuit board body 110 corresponding to the functional film layer 120 is divided into the first area 10, and the area of the flexible circuit board 100 corresponding to the opening 121 is at least divided into: 1. the area of the flexible circuit board 100 corresponding to the distance between the functional film 120 and the substrate 200 is the second area 20; 2. the area of the flexible circuit board 100 corresponding to the distance between the edge of the substrate 200 facing the functional film 120 and the second golden finger group 210 is a third area 30; 3. the area of the flexible circuit board 100 corresponding to the second golden finger group 210 corresponding to the first golden finger group 130 is the fourth area 40. With continued reference to fig. 4, since the functional film 120 is present in the first area 10, the functional film 120 is absent in the second area 20 and is exposed outside, the functional film 120 is absent in the third area 30 and a distance is present between the substrate 200 and the third area 30, and the first gold finger group 130 and the second gold finger group 210 are bonded together in the fourth area 40, the structural strength of the flexible circuit board 100 in the first area 10 and the structural strength of the flexible circuit board 100 in the fourth area 40 are greater than the structural strength of the flexible circuit board 100 in the second area 20 and the structural strength of the flexible circuit board 100 in the third area 30. As a result, when an external force is applied, as shown in fig. 5, the second region 20 and the third region 30 of the flexible circuit board 100 are prone to problems such as line breakage, and the broken portions are indicated by arrows.
FIG. 6 is a force diagram of a linear structure according to an embodiment of the present application; FIG. 7 is a force diagram of an arcuate structure in accordance with an embodiment of the present application; FIG. 8 is a schematic diagram illustrating a bonding module according to an embodiment of the present application; fig. 9 is a schematic diagram showing the structure of the flexible circuit board 100 in fig. 8; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
As a result of further studies by the present inventors, it was found that, as shown in fig. 6, when an external force Fp is applied to a linear structure, the external force Fp is applied to the linear structure, and as shown in fig. 7, the external force Fp applied to an arc-shaped structure is decomposed into a vertical force Fpy and a horizontal force Fpx. Therefore, in order to prevent the above-mentioned problems such as line breakage when the second area 20 and the third area 30 of the flexible circuit board 100 are subjected to external forces, as shown in fig. 8 and 9, it should be noted that, fig. 8 and 9 are schematic structural diagrams of fig. 4 in a top view, and the inner edge 122 of the projection of the opening 121 towards the flexible circuit board body 110 is curved, so that the stress applied to the inner edge 122 of the opening 121 can be effectively reduced, and the line stress breakage situation near the opening 121 is improved. Thereby, the risk of line breaks near the bonding region of the flexible circuit board 100 is reduced.
FIG. 10 shows an enlarged schematic view of a partial structure at G in FIG. 8; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
As shown in fig. 9, in some embodiments, the projected inner edge 122 of the opening 121 toward the flexible circuit board body 110 is a wavy curve. As shown in fig. 10, in particular to some embodiments, the projected inner edge 122 of the opening 121 toward the flexible circuit board body 110 includes alternately arranged peaks 1221 and valleys 1222, and the peaks 1221 and valleys 1222 are each circular arc-shaped. Thus, the stresses experienced by the inner rim 122 are further resolved by the rounded shape as the stresses are transferred to the peaks 1221 and/or valleys 1222. The magnitude and the direction of the external force applied to the bonding module are random, so that the waveform of the wavy curve can be uniformly designed.
It should be noted that the waveform of the wavy curve is designed uniformly, which means that the variation of the curve is uniform, that is, it shows a regular, periodic variation. For example, in some embodiments, please continue to refer to fig. 10, the amplitude A1 of the peak is equal to the amplitude A2 of the trough to improve the uniformity of the wavy curve. Of course, in other embodiments, the amplitude A1 of the peak and the amplitude A2 of the trough may be different values, so long as a period is formed by a fixed variation, so that the states of the decomposed stresses in all directions can be kept consistent, and in addition, better combination effects can be achieved by using the matching of the peaks 1221 and the troughs 1222 of various amplitudes. For another example, and in other specific embodiments, referring still to fig. 10, adjacent peaks 1221 and valleys 1222 are joined by a cambered transition 1223, such that when stresses are conducted from the peaks 1221 (or valleys 1222) to the valleys 1222 (or peaks 1221), a smooth transition is achieved by the cambered transition 1223, such that stresses are uniformly distributed without stress concentrations, thereby preventing tearing during the process. Of course, in other specific embodiments, the radius of the arc of the peak 1221 and the radius of the arc of the trough 1222 may each be set to 0.2 mm for better stress resolution. More specifically, the inner side edge 122 of the projection of the opening 121 toward the flexible circuit board body 110 is sinusoidal, so as to further improve the uniformity of the wavy curve. Thus, the embodiment of the present application is not particularly limited as long as it is possible to achieve a uniform variation in the waveform of the wavy curve.
The substrate 200 is a basic material for manufacturing a circuit board, typically, the substrate 200 is a copper clad laminate, and in manufacturing, single-sided and double-sided printed boards are formed by selectively performing hole processing, electroless copper plating, electrolytic copper plating, etching and the like on a substrate material, i.e., a copper clad laminate (Copper Clad Laminate, CCL), to obtain a desired circuit pattern. In the manufacture of the other type of multilayer printed board, an inner core thin copper-clad foil board is used as a substrate, and conductive pattern layers and prepregs are alternately laminated and bonded together at one time to form more than 3 layers of conductive pattern interlayer interconnection. It has the functions of conducting, insulating and supporting. The performance, quality, workability in manufacturing, manufacturing cost, manufacturing level, etc. of the printed board depend to a large extent on the substrate material. Substrate materials for general printed boards can be divided into two main categories: rigid substrate materials and flexible substrate materials. In some embodiments, please continue with reference to fig. 4, the flexible circuit board 100 includes a flexible circuit board body 110, and copper foils 140 disposed on opposite sides of the flexible circuit board body 110, and a functional film layer 120 is disposed on one side of the copper foil 140 of the flexible circuit board body 110. In order to improve the mechanical properties of the functional film 120, particularly, in some embodiments, the functional film 120 includes a polyimide film or a polyester film, more particularly, the functional film 120 may be made of a PI (polyimide) film, which has excellent thermal stability, chemical resistance and mechanical properties, and the embodiments of the present application are not limited thereto.
In some embodiments, in order to improve the static electricity protection capability of the binding place of the bonding module, a conductive adhesive is disposed between the flexible circuit board 100 and the substrate 200, so that the flexible circuit board 100 and the substrate 200 can be bound by the conductive adhesive. In particular, in some embodiments, the conductive adhesive is an anisotropic conductive adhesive, that is, bonding is performed by ACF adhesive (Anisotropic Conductive Film, anisotropic conductive adhesive layer), so that conductive particles in the ACF are broken during the lamination process, thereby realizing a structure of vertical conduction and lateral insulation.
In display devices such as mobile phones, the screen occupation ratio of the display screen is more and more required, so that good visual experience is obtained. In this process, the frame size of the display device is also smaller and smaller, so that the fingerprint identification element module for biometric identification is also widely used in the display device.
Therefore, based on the same inventive concept, the embodiment of the application provides a fingerprint identification component, which comprises the bonding module according to the above embodiment, so as to improve the reliability of the fingerprint identification component. In particular, in some embodiments, the substrate 200 may be formed by an array (array) process to include a plurality of fingerprint sensors, each configured with a fingerprint chip. In other words, the substrate 200 may be any suitable structure configured with a fingerprint chip, and the embodiment of the present application is not particularly limited. As one embodiment, the substrate 200 may be a TFT (Thin FilmTransistor ) substrate.
Of course, in other embodiments, the bonding module provided in the embodiments of the present application may be used in other modules, which is not limited in particular.
Based on the same inventive concept, the embodiment of the application also provides electronic equipment, which comprises the fingerprint identification component described in the embodiment.
The electronic equipment can be applied to the fields of mobile phone terminals, bionic electrons, electronic skins, wearable equipment, vehicle-mounted equipment, internet of things equipment, artificial intelligent equipment and the like. For example, the electronic device may be a mobile phone terminal, a tablet, a palm top computer, an ipod, a smart watch, a laptop computer, a television, a monitor, or the like.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (11)
1. A bonding module, comprising:
the flexible circuit board comprises a flexible circuit board body and a functional film layer which is covered on one side surface of the flexible circuit board body; the flexible circuit board body comprises a first bonding region, a first golden finger group is arranged in the first bonding region, an opening capable of completely exposing the first golden finger group is arranged on the functional film layer, and the inner side edge of the projection of the opening towards the flexible circuit board body is a curve; and
the substrate comprises a second bonding region, and a second golden finger group aligned with the first golden finger group is arranged in the second bonding region;
the first golden finger group and the second golden finger group are aligned with each other and bonded together; orthographic projection of the functional film layer on the flexible circuit board body does not have an overlapping area with orthographic projection of the substrate on the flexible circuit board body;
and a space is reserved between the first golden finger group and the inner side edge of the projection of the opening towards the flexible circuit board body.
2. The bonding module of claim 1, wherein an inner edge of the projection of the opening toward the flexible circuit board body is a wavy curve.
3. The bonding module of claim 2, wherein an inner edge of the projection of the opening toward the flexible circuit board body includes alternating peaks and valleys;
the wave crest and the wave trough are arc-shaped.
4. The bonding module of claim 3, wherein the peaks and valleys are equal in magnitude.
5. The bonding module of claim 3, wherein adjacent peaks and valleys are joined by a cambered transition.
6. The bonding module of claim 3, wherein the arc radius of the peaks and the arc radius of the valleys are each 0.2 millimeters.
7. The bonding module according to any one of claims 1-6, wherein an inner edge of the projection of the opening toward the flexible circuit board body is sinusoidal.
8. The bonding module according to any one of claims 1-6, wherein the functional film layer comprises a polyimide film or a polyester film.
9. The bonding module according to any one of claims 1-6, wherein the flexible circuit board and the substrate are bonded by an iso-square conductive paste.
10. A fingerprint identification assembly comprising a bonding module according to any one of claims 1 to 9.
11. An electronic device comprising the fingerprint recognition component of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111038021.9A CN113743307B (en) | 2021-09-06 | 2021-09-06 | Bonding module, fingerprint identification component and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111038021.9A CN113743307B (en) | 2021-09-06 | 2021-09-06 | Bonding module, fingerprint identification component and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113743307A CN113743307A (en) | 2021-12-03 |
| CN113743307B true CN113743307B (en) | 2023-12-12 |
Family
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Family Applications (1)
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| CN202111038021.9A Active CN113743307B (en) | 2021-09-06 | 2021-09-06 | Bonding module, fingerprint identification component and electronic equipment |
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