CN106973499A

CN106973499A - A kind of module and its manufacture method including printed circuit board (PCB) and flexible PCB

Info

Publication number: CN106973499A
Application number: CN201710382721.7A
Authority: CN
Inventors: 汤仁波; 朱志峰; 樊树全; 李文静; 王徐鹏; 吴茂棒
Original assignee: Shanghai AVIC Optoelectronics Co Ltd
Current assignee: Shanghai AVIC Optoelectronics Co Ltd
Priority date: 2017-05-26
Filing date: 2017-05-26
Publication date: 2017-07-21
Anticipated expiration: 2037-05-26
Also published as: CN106973499B

Abstract

The invention discloses a kind of module including printed circuit board (PCB) and flexible PCB and its manufacture method, it is related to circuit board module group structure technical field, the printed circuit board (PCB) of the module includes being provided with one layer of insulated base material layer between at least one layer of insulated base material layer and at least two conductive layers, adjacent two layers conductive layer；At least two conductive layers at least include the first conductive layer and the second conductive layer, and the side close to the first conductive layer on the second conductive layer is formed with the first golden finger；The boundary of first surface positioned at printed circuit board (PCB) is provided with first " U-shaped " opening of the first golden finger of exposure, first surface is located at the first conductive layer away from the second conductive layer side；The second golden finger on flexible PCB is electrically connected with the first golden finger in first " U-shaped " opening.The thickness compensation of flexible PCB to first " U-shaped " can be open interior by the present invention by the way that the first golden finger is arranged at into inner layer of printed-circuit board, and overall module thickness, space-saving purpose are reduced to reach.

Description

A kind of module and its manufacture method including printed circuit board (PCB) and flexible PCB

Technical field

The present invention relates to circuit board module group structure technical field, include printed circuit board (PCB) and soft more particularly, to one kind The module and its manufacture method of property circuit board.

Background technology

Printed circuit board (PCB) (Printed Circuit Board, PCB), using rigid insulation substrate layer as base material, is cut into certain Size, thereon at least with conductive pattern, and is furnished with hole (such as component hole, fastener hole, plated through-hole), for replace with Toward the chassis of device electronic component, and realize the interconnection between electronic component.

Flexible PCB (Flexible Printed Circuit Board, FPC), is made of flexible insulating substrate A kind of circuit board, it can with free bend, winding, fold.The volume of electronic product can be substantially reduced using FPC, electricity is applicable The need for sub- product develops to high density, miniaturization, highly reliable direction.

PCB is typically employed in the occasion that some need not bend, and the place of harder intensity, such as computer main board, mobile phone Mainboard etc.；FPC is generally used for needing repeated deflection and the link of some widgets, such as clamshell phone renovate bending part, Position of printer connection printhead etc..Also have some modular structures, such as display module and the attachment structure of mainboard, it is necessary to PCB and FPC are used simultaneously, at this time, it may be necessary to realize PCB and FPC electric connection using some structures.

In the prior art, including PCB and FPC module generally by FPC golden fingers and being arranged on the outermost golden hand of pcb board Refer to contraposition crimping, realize electrical conducting.Fig. 1 cuts for the module in the prior art including printed circuit board (PCB) and flexible PCB Face figure, as shown in figure 1, when PCB and FPC crimping position and the component on PCB are arranged at two relative surfaces of PCB, When i.e. the crimping position is set with component antarafacial, module thickness includes FPC thickness, bonded adhesives thickness, PCB thickness, component Thickness sum, causes the overall thickness of module thicker, is unfavorable for current product and pursues light, thin, small trend requirement.

Therefore it provides the module including PCB and FPC and its manufacture method of a kind of thickness thinning, are that this area is urgently solved Certainly the problem of.

The content of the invention

In view of this, the invention provides a kind of module including printed circuit board (PCB) and flexible PCB and its manufacturer Method.

The present invention provides a kind of module including printed circuit board (PCB) and flexible PCB,

The printed circuit board (PCB) includes at least one layer of insulated base material layer and at least two conductive layers, conduction described in adjacent two layers One layer of insulated base material layer is provided between layer；

At least two conductive layers at least include the first conductive layer and the second conductive layer, are leaned on second conductive layer The side of nearly first conductive layer is formed with the first golden finger；

The boundary of first surface positioned at the printed circuit board (PCB) is provided with the of an exposure first golden finger One " U-shaped " is open, and the first surface is located at side of first conductive layer away from second conductive layer；

The flexible PCB includes the second golden finger, and second golden finger is with first golden finger described first Electrically connected in " U-shaped " opening.

Alternatively, the printed circuit board (PCB) has second surface, and the second surface is relative with the first surface, is hanging down On the direction of the straight plane where the printed circuit board (PCB), the part of second golden finger is provided with the flexible PCB Side away from first golden finger is less than or equal to the print to the distance of the second surface of the printed circuit board (PCB) Distance of the first surface of printed circuit board to the second surface.

Alternatively, the first surface by the printed circuit board (PCB) to the printed circuit board (PCB) second surface side Upwards, first conductive layer is the first layer conductive layer of the printed circuit board (PCB), and second conductive layer is the printing electricity The second layer conductive layer of road plate, the first surface is relative with the second surface.

Alternatively, first " U-shaped " opening has the first width, institute along the border of the printed circuit board (PCB) where it State the development length on border of first width less than or equal to the printed circuit board (PCB) where described first " U-shaped " opening.

Alternatively, the flexible PCB is located in described first " U-shaped " opening.

Alternatively, the printed circuit board (PCB) also includes component, and the component is located at the second of the printed circuit board (PCB) Surface, the component is at least electrically connected with one layer of conductive layer, and the first surface is relative with the second surface.

Alternatively, the printed circuit board (PCB) also includes the first separation layer, and it is conductive that first separation layer is located at described first Side of the layer away from second conductive layer.

Alternatively, first golden finger is electrically connected with second golden finger by anisotropic conductive film.

Alternatively, where the printed circuit board (PCB) on the direction of plane, the flexible PCB includes described 70 μm≤d1≤100 μm of thickness of the part of second golden finger.

Alternatively, where the vertical printed circuit board (PCB) on the direction of plane, the thickness of the anisotropic conductive film For 30 μm≤d2≤50 μm.

Alternatively, where the vertical printed circuit board (PCB) on the direction of plane, the first surface to first gold medal The distance of finger is more than or equal to 150 μm.

Alternatively, the printed circuit board (PCB) also includes the second separation layer, and it is conductive that second separation layer is located at described second Side of the layer away from first conductive layer；

First " U-shaped " opening orthographic projection of plane where the printed circuit board (PCB) exists positioned at second separation layer Where the printed circuit board (PCB) in the orthographic projection of plane；

First step is provided with described first " U-shaped " opening, the step surface of the first step is first gold medal Plane where finger.

Based on same inventive concept, present invention also offers a kind of module including printed circuit board (PCB) and flexible PCB Manufacture method, including：

With laminar manner formation layer printed circuit board group, the layer printed circuit board group includes at least one layer of insulated base material layer One layer of insulated base material layer is provided between at least two conductive layers, conductive layer described in every two layers, is led for described at least two layers Electric layer includes the first conductive layer and the second conductive layer；

On the direction for pointing to second conductive layer by first conductive layer, to the of the layer printed circuit board group The boundary on one surface is punched out, and forms first " U-shaped " opening of exposure second conductive layer, the first surface position In side of first conductive layer away from second conductive layer；

Part in second conductive layer by described first " U-shaped " opening exposure is handled to form the first gold medal hand Refer to, form printed circuit board (PCB)；

By the second golden finger set on ready-made flexible PCB and first golden finger in the first " U Electrically connected in shape " opening, include the module of the printed circuit board (PCB) and the flexible PCB to be formed.

Alternatively, formed after the module for including the printed circuit board (PCB) and the flexible PCB, perpendicular to the print On the direction of plane where printed circuit board, be provided with the flexible PCB second golden finger partially away from described the The side of one golden finger is less than or equal to the layer printed circuit board to the distance of the second surface of the layer printed circuit board group The first surface of group is to the distance of the second surface, and the first surface is relative with the second surface.

Alternatively, the part in second conductive layer by described first " U-shaped " opening exposure is handled to be formed After first golden finger, methods described also includes：

Component is set in the second surface of the layer printed circuit board group, by the component with being led described at least one layer Electric layer is electrically connected, and the component is located at side of second conductive layer away from first conductive layer, the second surface It is relative with the first surface.

Alternatively, after the step of forming the layer printed circuit board group with the laminar manner, methods described is also wrapped Include：The first separation layer is covered in the first surface of the layer printed circuit board group, first separation layer is located at described the Side of one conductive layer away from second conductive layer.

Alternatively, second golden finger and first golden finger set on the flexible PCB will be made in advance The step of being electrically connected in described first " U-shaped " opening includes：

First golden finger is electrically connected with second golden finger by anisotropic conductive film.

Alternatively, after the step of forming the layer printed circuit board group with the laminar manner, methods described is also wrapped Include：

The second separation layer is covered in the second surface of the layer printed circuit board group, second separation layer is located at described the Side of two conductive layers away from first conductive layer, the second surface is relative with the first surface；

In described first " U-shaped " opening, the boundary of second conductive layer is punched out, first step is formed, The step surface of the first step is plane where first golden finger.

Compared with prior art, the present invention at least has the advantages that to protrude as follows：

A kind of module including printed circuit board (PCB) and flexible PCB that the present invention is provided, will form in printed circuit board (PCB) The conductive layer of one golden finger is arranged at the internal layer of printed circuit board (PCB), and in the boundary of the first surface positioned at printed circuit board (PCB) First " U-shaped " opening of first golden finger of exposure is provided with, when the second golden finger and printed circuit board (PCB) of flexible PCB After first golden finger bonding, the thickness compensation of flexible PCB is interior to first " U-shaped " opening, to reach that the overall module of reduction is thick Degree, space-saving purpose.

By referring to the drawings to the detailed description of the exemplary embodiment of the present invention, further feature of the invention and its Advantage will be made apparent from.

Brief description of the drawings

The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even It is used for the principle for explaining the present invention together with its explanation.

Fig. 1 is the sectional view for the module for including printed circuit board (PCB) and flexible PCB in the prior art；

Fig. 2 is a kind of top view of module including printed circuit board (PCB) and flexible PCB of the present invention；

Fig. 3 is a kind of explosive view of module including printed circuit board (PCB) and flexible PCB of the present invention；

Fig. 4 is a kind of sectional view of module including printed circuit board (PCB) and flexible PCB of the present invention；

Fig. 5 bows for a kind of a kind of printed circuit board (PCB) of module including printed circuit board (PCB) and flexible PCB of the present invention View；

Fig. 6 is a kind of another printed circuit board (PCB) of module including printed circuit board (PCB) and flexible PCB of the present invention Top view；

Fig. 7 is the top view of another module including printed circuit board (PCB) and flexible PCB of the present invention；

Fig. 8 is the explosive view of another module including printed circuit board (PCB) and flexible PCB of the present invention；

Fig. 9 is the sectional view of another module including printed circuit board (PCB) and flexible PCB of the present invention；

Figure 10 is the partial enlarged drawing at the first golden finger of printed circuit board (PCB) in Fig. 8；

Figure 11 is a kind of printed circuit board (PCB) of another module including printed circuit board (PCB) and flexible PCB of the present invention Top view；

Figure 12 is another printed circuit of another module including printed circuit board (PCB) and flexible PCB of the present invention The top view of plate；

Figure 13 is a kind of flow chart of the manufacture method of module including printed circuit board (PCB) and flexible PCB of the present invention；

Figure 14 to Figure 21 for a kind of Figure 13 modules including printed circuit board (PCB) and flexible PCB provided manufacture method Corresponding structural representation；

Figure 22 is the flow of the manufacture method of another module including printed circuit board (PCB) and flexible PCB of the present invention Figure；

Figure 23 to Figure 32 for Figure 22 another modules including printed circuit board (PCB) and flexible PCB provided manufacturer The corresponding structural representation of method.

Embodiment

The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.

The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention And its any limitation applied or used.

It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable In the case of, the technology, method and apparatus should be considered as a part for specification.

In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without It is as limitation.Therefore, other examples of exemplary embodiment can have different values.

It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.

Fig. 2 is a kind of top view of module including printed circuit board (PCB) and flexible PCB of the present invention；Fig. 3 is the present invention A kind of module including printed circuit board (PCB) and flexible PCB explosive view；Fig. 4 includes printed circuit for one kind of the present invention The sectional view of the module of plate and flexible PCB.Wherein, the include printed circuit board (PCB) and the module of flexible PCB in Fig. 4 are figures Sectional view of the module for including printed circuit board (PCB) and flexible PCB along A-A directions in 2, Fig. 3 illustrate only including printing electricity The part-structure of the printed circuit board (PCB) of the module of road plate and flexible PCB.

Fig. 2 to Fig. 4 is referred to, a kind of module including printed circuit board (PCB) and flexible PCB is present embodiments provided.Should The printed circuit board (PCB) 1 of module is included between at least one layer of insulated base material layer 103 and at least two conductive layers, adjacent two layers conductive layer It is provided with one layer of insulated base material layer 103.At least two conductive layers at least include the first conductive layer 101 and the second conductive layer 102, Side on second conductive layer 102 close to the first conductive layer 101 is formed with the first golden finger 11.As shown in Figure 2 and Figure 4, print Circuit board 1 has first surface a.Wherein, if side of first conductive layer 101 away from the second conductive layer 102 is additionally provided with other Film layer structure (in Fig. 4 withRepresent), then first surface a be side of first conductive layer 101 away from the second conductive layer 102 away from The surface of the film layer farthest from the first conductive layer 101, for example, the farthest film layer is upper separation layer, then printed circuit board (PCB) 1 herein First surface a be also upper separation layer surface.

As shown in Fig. 2 the boundary in the first surface a positioned at printed circuit board (PCB) 1 is provided with first golden finger of exposure 11 first " U-shaped " opening 10, first surface is located at side of first conductive layer 101 away from the second conductive layer 102.

As shown in Figure 3 and Figure 4, the flexible PCB 2 of the module includes the second golden finger 21, the second golden finger 21 and first Golden finger 11 is electrically connected in first " U-shaped " opening 10.

The present embodiment is applied at least include connection of the printed circuit board (PCB) 1 with FPC 2 of two conductive layers.Printing One layer of insulated base material layer 103 is provided between the adjacent two layers conductive layer of circuit board 1, the insulated base material layer 103 is used for two The insulation of conductive layer, prevents short circuit between two conductive layers.It should be appreciated that through hole can be set in insulated base material layer 103, with reality Functional connection between existing different conductive layers, but this insulating effect that simultaneously without prejudice to insulated base material layer 103 is played.Second Side on conductive layer 102 close to the first conductive layer 101 is formed with the first golden finger 11, and positioned at printed circuit board (PCB) 1 First surface a boundary be provided with first golden finger of exposure 11 first " U-shaped " opening 10, this causes the first golden finger 11 are located at the internal layer of printed circuit board (PCB) 1.Flexible PCB 2 includes the second golden finger 21, the second golden finger 21 and the first golden finger 11 electrically connect in first " U-shaped " opening 10 so that after printed circuit board (PCB) 1 and FPC 2 are assembled, flexible PCB 2 All or part of thickness can be compensated into first " U-shaped " opening 10, be conducive to reducing the thickness of overall module, save module institute The space accounted for.

" first " and " second " in the embodiment of the present invention is only as differentiation, without order qualifier.

Alternatively, as shown in figure 4, printed circuit board (PCB) 1 has second surface b, second surface b is relative with first surface a.If Side of second conductive layer 102 away from the first conductive layer 101 be additionally provided with other film layer structures (in Fig. 4 withRepresent), then the Two surface b are the table of the farthest film layer of lateral extent second conductive layer 102 of second conductive layer 102 away from the first conductive layer 101 Face, for example, the farthest film layer is lower separation layer, then the second surface b of printed circuit board (PCB) 1 is also the table of lower separation layer herein Face.

Meanwhile, as shown in figure 4, on the direction perpendicular to the place plane of printed circuit board (PCB) 1, being set on flexible PCB 2 There is the side partially away from the first golden finger 11 of the second golden finger 21 to the small apart from d4 of the second surface b of printed circuit board (PCB) 1 In or equal to printed circuit board (PCB) 1 first surface a to second surface b apart from d5 (provided in Fig. 4 situation about being less than), i.e. it is soft Property circuit board 2 thickness can be fully compensated to first " U-shaped " opening 10 in.And by the way that the thickness of flexible PCB is mended completely Repay in first " U-shaped " opening, the overall module thickness of reduction, space-saving purpose can be reached to greatest extent.

Alternatively, as shown in Figure 5, Figure 6, Fig. 5 is a kind of mould including printed circuit board (PCB) and flexible PCB of the invention A kind of top view of printed circuit board (PCB) of group, Fig. 6 is a kind of module including printed circuit board (PCB) and flexible PCB of the invention Another printed circuit board (PCB) top view, first " U-shaped " opening 10 along the border of the printed circuit board (PCB) 1 where it have first Width d.

Wherein, as shown in figure 5, the first width d is less than the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10 Development length.Specifically, the width of the first width d and flexible PCB is adapted.When the width of FPC is less than first During the length on the border of the printed circuit board (PCB) 1 where " U-shaped " opening 10, the first width d can be less than first " U-shaped " opening, 10 institutes Printed circuit board (PCB) 1 border development length.Width less first " U-shaped " opening 10 is set, the first " U can be reduced The fluting area of shape " opening 10, so as to reduce to needing the influence for each layer for carrying out slot treatment.

Wherein, as shown in fig. 6, the first width d is equal to the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10 Development length.Specifically, the first width d and flexible PCB 2 width are adapted.Be more than when the width of FPC 2 or Equal to first " U-shaped " be open 10 where printed circuit board (PCB) 1 border length when, the first width d be equal to first " U-shaped " opening The development length on the border of the printed circuit board (PCB) 1 where 10, now, the width regardless of FPC 2 can ensure Flexible PCB 2 is in flattened state.

Alternatively, as shown in Fig. 2 flexible PCB 2 is located in first " U-shaped " opening 10.Property circuit board 2 is arranged at In one " U-shaped " opening 10, it is ensured that flexible PCB can be located in first " U-shaped " opening, the overall module of reduction can either be played The effect of thickness, ensure that the connection effect of printed circuit board (PCB) and flexible PCB again.

Alternatively, as shown in Figure 3 and Figure 4, the module in the present embodiment also includes：Anisotropic conductive film 3, the first gold medal hand The golden finger 21 of finger 11 and second is electrically connected by the anisotropic conductive film 3.

Specifically, it can be easy to implement between the first golden finger 11 and the second golden finger 21 using anisotropic conductive film 3 Electrical connection, and current limit flows up in 21 sides of the vertical golden finger of first golden finger 11 and second；While anisotropy The thickness of conductive adhesive film 3 is relatively low, is conducive to reducing the thickness of overall module.

Alternatively, as shown in figure 3, on the direction perpendicular to the place plane of printed circuit board (PCB) 1, flexible PCB 2 includes 70 μm≤d1≤100 μm of thickness of the part of second golden finger.

Alternatively, as shown in figure 3, on the direction of the place plane of vertical printed circuit plate 1, anisotropic conductive film 3 Thickness is 30 μm≤d2≤50 μm.

Alternatively, as shown in figure 4, on the direction of the place plane of vertical printed circuit plate 1, first surface a to the first gold medal The distance of finger 11 is d3 >=150 μm.

Specifically, where vertical printed circuit plate on the direction of plane, when by first surface to the first golden finger 11 Distance, i.e., the depth of first " U-shaped " opening is set greater than or during equal to 150 μm, can be ensured as far as possible after installation Module in flexible PCB including the second golden finger the thickness of part and the thickness sum of anisotropic conductive film be less than or Person is equal to the depth that first " U-shaped " is open, it ensure that the thickness of flexible PCB and anisotropic conductive film can be as far as possible Full remuneration in first " U-shaped " opening, and when the thickness of flexible PCB and anisotropic conductive film is fully compensated to the When in one " U-shaped " opening, the thickness of printed circuit board (PCB) is exactly the thickness of overall module, and the thickness of overall module reaches minimum.

The present embodiment provide a kind of module including printed circuit board (PCB) and flexible PCB, by printed circuit board (PCB) by shape Conductive layer into the first golden finger is arranged at the internal layer of printed circuit board (PCB), and on the side of the first surface positioned at printed circuit board (PCB) First " U-shaped " opening of first golden finger of exposure is provided with boundary, when the second golden finger and printed circuit of flexible PCB After the first golden finger bonding of plate, the thickness compensation of anisotropic conductive film and flexible PCB is interior to first " U-shaped " opening, Reduce overall module thickness, space-saving purpose to reach.

The top view for another module including printed circuit board (PCB) and flexible PCB that Fig. 7 provides for the present invention；Fig. 8 is The explosive view of another module including printed circuit board (PCB) and flexible PCB of the present invention；Fig. 9 is another bag of the invention Include the sectional view of the module of printed circuit board (PCB) and flexible PCB；Figure 10 is at the first golden finger of printed circuit board (PCB) in Fig. 8 Partial enlarged drawing.Wherein, the module including printed circuit board (PCB) and flexible PCB in Fig. 9 is another including printing in Fig. 7 Sectional view of the module of circuit board and flexible PCB along B-B directions.

Fig. 7 to Figure 10 is referred to, another module including printed circuit board (PCB) and flexible PCB is present embodiments provided.

The printed circuit board (PCB) 1 of the module includes at least one layer of insulated base material layer 103 and at least two conductive layers, adjacent two layers One layer of insulated base material layer 103 is provided between conductive layer.

The conductive layer of printed circuit board (PCB) 1 at least includes the first conductive layer 101 and the second conductive layer 102, in the second conductive layer Side on 102 close to the first conductive layer 101 is formed with the first golden finger 11.

The boundary of first surface a positioned at printed circuit board (PCB) 1 is provided with the first " U of first golden finger of exposure 11 Shape " opening 10, first surface a is located at side of first conductive layer 101 away from the second conductive layer 102.

The flexible PCB 2 of the module includes the second golden finger 21, and the second golden finger 21 and the first golden finger 11 are first Electrically connected in " U-shaped " opening 10.

The present embodiment is applied to include connection of the printed circuit board (PCB) 1 with FPC 2 of multiple conductive layers.Printed circuit One layer of insulated base material layer 103 is provided between the adjacent two layers conductive layer of plate 1, the insulated base material layer 103 is used for two conductions The insulation of layer, prevents short circuit between two conductive layers.It should be appreciated that through hole can be set in insulated base material layer 103, to realize not With functional connection between conductive layer, but this insulating effect that simultaneously without prejudice to insulated base material layer 103 is played.It is conductive second Side on layer 102 close to the first conductive layer 101 is formed with the first golden finger 11, and positioned at the of printed circuit board (PCB) 1 The boundary on one surface is provided with first " U-shaped " opening 10 of first golden finger of exposure 11, and this causes the first golden finger 11 In the internal layer of printed circuit board (PCB) 1.Flexible PCB 2 includes the second golden finger 21, and the second golden finger 21 and the first golden finger 11 exist Electrically connected in first " U-shaped " opening 10 so that after printed circuit board (PCB) 1 and FPC 2 are assembled, the thickness of flexible PCB 2 Compensate into first " U-shaped " opening 10, be conducive to reducing the thickness of overall module, save the space shared by module.

Alternatively, as shown in figure 9, printed circuit board (PCB) 1 has second surface b, second surface b is relative with first surface a, On the direction of the place plane of printed circuit board (PCB) 1, be provided with flexible PCB 2 second golden finger 21 partially away from First table that apart from d4 is less than or equal to printed circuit board (PCB) 1 of the side of one golden finger 11 to the second surface of printed circuit board (PCB) 1 Face is to second surface apart from d5 (provided in Fig. 9 situation about being equal to).I.e.：The thickness of flexible PCB 2 can be fully compensated In first " U-shaped " opening 10.

By the way that the thickness of flexible PCB is fully compensated into first " U-shaped " opening, the overall mould of reduction can be reached Group thickness, space-saving purpose.

Alternatively, as is illustrated by figs. 11 and 12, Figure 11 is the another including printed circuit board (PCB) and flexible circuit of the present invention A kind of top view of printed circuit board (PCB) of the module of plate, Figure 12 is another including printed circuit board (PCB) and flexible circuit for the present invention's The top view of another printed circuit board (PCB) of the module of plate, first " U-shaped " opening 10 is along the border of the printed circuit board (PCB) 1 where it With the first width d.Point-like diagram represents insulating barrier in " U-shaped " opening 10 first in Figure 11 and Figure 12.

Wherein, as shown in figure 11, the first width d is less than the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10 Development length.Specifically, the width of the first width d and flexible PCB is adapted.When the width of FPC is less than first During the length on the border of the printed circuit board (PCB) 1 where " U-shaped " opening 10, the first width d can be less than first " U-shaped " opening, 10 institutes Printed circuit board (PCB) 1 border development length.Width less first " U-shaped " opening 10 is set, the first " U can be reduced The fluting area of shape " opening 10, so as to reduce to needing the influence for each layer for carrying out slot treatment.

Wherein, as shown in figure 12, the first width d is equal to the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10 Development length.Specifically, the first width d and flexible PCB 2 width are adapted.Be more than when the width of FPC 2 or Equal to first " U-shaped " be open 10 where printed circuit board (PCB) 1 border length when, the first width d be equal to first " U-shaped " opening The development length on the border of the printed circuit board (PCB) 1 where 10, now, the width regardless of FPC 2 can ensure Flexible PCB 2 is in flattened state.

Alternatively, as shown in fig. 7, flexible PCB 2 is located in first " U-shaped " opening 10.Flexible PCB 2 is arranged at In first " U-shaped " opening 10, it is ensured that flexible PCB can be located in first " U-shaped " opening, the overall mould of reduction can either be played The effect of group thickness, ensure that the connection effect of printed circuit board (PCB) and flexible PCB again.

Alternatively, as shown in Figure 8 and Figure 9, in the first surface a by printed circuit board (PCB) 1 to printed circuit board (PCB) 1 the second table On face b direction, the first conductive layer 101 is the first layer conductive layer of printed circuit board (PCB) 1, and the second conductive layer 102 is printed circuit The second layer conductive layer of plate 1, first surface a is relative with second surface b.

Specifically, preferably, by the first surface a by printed circuit board (PCB) to printed circuit board (PCB) second surface On b direction, the second conductive layer 102 is the second layer conductive layer of printed circuit board (PCB) 1, and this is due to that flexible PCB generally compares Thin, the first golden finger is made on second layer conductive layer can just realize the purpose of thinned module, and such first " U-shaped " opening is not Need too deeply, and influence is not resulted on other following layers yet.

Alternatively, as shown in Figure 8 and Figure 9, the module in the present embodiment also includes：Anisotropic conductive film 3, the first gold medal hand The golden finger 21 of finger 11 and second is electrically connected by the anisotropic conductive film 3.

Specifically, being electrically connected between the first golden finger and the second golden finger can be easy to implement using anisotropic conductive film Connect, and current limit is flowed up in the side of vertical first golden finger and the second golden finger；Anisotropic conductive film is thick simultaneously Degree is relatively low, is conducive to reducing the thickness of overall module.

Alternatively, as shown in figure 8, on the direction perpendicular to the place plane of printed circuit board (PCB) 1, flexible PCB 2 includes 70 μm≤d1≤100 μm of thickness of the part of second golden finger.

Alternatively, as shown in figure 8, on the direction of the place plane of vertical printed circuit plate 1, anisotropic conductive film 3 Thickness is 30 μm≤d2≤50 μm.

Alternatively, as shown in figure 9, on the direction of the place plane of vertical printed circuit plate 1, first surface a to the first gold medal The distance of finger 11 is d3 >=150 μm.

Specifically, it is set to when by the depth of first surface a to the first golden finger 11 distance, i.e., first " U-shaped " opening During more than or equal to 150 μm, it can ensure that flexible PCB includes the second golden finger in the module after installation as far as possible Part thickness and anisotropic conductive film thickness sum be less than or equal to first " U-shaped " be open depth, this guarantee The thickness of flexible PCB and anisotropic conductive film can be fully compensated into first " U-shaped " opening as far as possible, and work as When the thickness of flexible PCB and anisotropic conductive film is fully compensated into first " U-shaped " opening, the thickness of printed circuit board (PCB) It is exactly the thickness of overall module, the thickness of overall module reaches minimum.

Alternatively, as shown in Figure 8 and Figure 9, printed circuit board (PCB) 1 also includes component 104, and component 104 is located at printing electricity The second surface b of road plate 1, component 104 is at least electrically connected with one layer of conductive layer, and first surface is relative with second surface.

Specifically, component 104 includes but is not limited to resistance, electric capacity, inductance, potentiometer, transformer, diode and three poles Pipe.One layer of conductive layer connection of one component 104 and printed circuit board (PCB) 1, different component is according to the function of circuit and sets Meter is connected to identical or different conductive layer.

The height of component can be with the thickness more than flexible PCB, so setting similar on the surface where component In first " U-shaped " be open other opening have little significance, therefore the present embodiment be applied to component where surface and first Surface where " U-shaped " opening is the situation of antarafacial.

Alternatively, as shown in Figure 8 and Figure 9, printed circuit board (PCB) 1 also includes the first separation layer 105, the first separation layer 105 In side of first conductive layer 101 away from the second conductive layer 102.Wherein, the first separation layer 105 can play the conduction of protection first The effect of layer 101, can effectively prevent the corrosion of the first conductive layer 101, while can also play a part of preventing electric leakage.

Alternatively, as shown in Figure 8 and Figure 9, printed circuit board (PCB) 1 also includes the second separation layer 106, the second separation layer 106 In side of second conductive layer 102 away from the first conductive layer 101.Wherein, the second separation layer 106, which is played, protects what is be in contact with it to lead The effect of electric layer, can effectively prevent the corrosion of conductive layer being in contact with it, while can also play a part of preventing electric leakage.And And, because the second separation layer has the effect for preventing electric leakage, therefore allow component that there is smaller spacing with printed circuit board (PCB), So as to be conducive to reducing the thickness of overall module.

As shown in Figure 9 and Figure 10, first " U-shaped " opening 10 is located at second in the orthographic projection of the place plane of printed circuit board (PCB) 1 Separation layer 106 is in the orthographic projection of the place plane of printed circuit board (PCB) 1.First step 12 is provided with first " U-shaped " opening 10, The step surface of first step 12 is the place plane of the first golden finger 11.

Specifically, the height of first step 12 and the thickness sum of anisotropic conductive film 3 are more than or equal to flexible electrical Road plate 2 is on the direction that the second golden finger 21 points to the first golden finger 11, beyond the part of the place plane of the second golden finger 21 Highly.By setting first step 12, and the first golden finger 11 is arranged on to the step surface of first step 12 so that flexible circuit Plate 2 is on the direction that the second golden finger 21 points to the first golden finger 11, and the part beyond the place plane of the second golden finger 21 can Compensate into first " U-shaped " opening, it is ensured that the thinned effect of module integral thickness.

What the present embodiment was provided includes the module of printed circuit board (PCB) and flexible PCB, and the will will be formed in printed circuit board (PCB) The conductive layer of one golden finger is arranged at the internal layer of printed circuit board (PCB), and in the boundary of the first surface positioned at printed circuit board (PCB) First " U-shaped " opening of first golden finger of exposure is provided with, when the second golden finger and printed circuit board (PCB) of flexible PCB After first golden finger bonding, in the thickness compensation of anisotropic conductive film and flexible PCB to first " U-shaped " opening, with up to To the overall module thickness of reduction, space-saving purpose；By the of the first surface by printed circuit board (PCB) to printed circuit board (PCB) On the direction on two surfaces, the second conductive layer is the second layer conductive layer of printed circuit board (PCB), and first is made on second layer conductive layer Golden finger can not only realize the purpose of thinned module, and on other layers do not result in influence yet；By in printed circuit The first surface and second surface of plate increase the first separation layer and the second separation layer, are effectively protected conductive layer.

Include the module of printed circuit board (PCB) and flexible PCB for what each embodiment of the invention was provided, can use Following manufacture method is manufactured.

Figure 13 is a kind of flow chart of the manufacture method of printed circuit board (PCB) and flexible PCB module of the invention, Tu14Zhi Figure 21 is each step structural representation in the manufacture method.Figure 13 is referred to, is present embodiments provided a kind of including printed circuit The preparation method of the module of plate and flexible PCB, comprises the following steps：

Step S101：With laminar manner formation layer printed circuit board group, layer printed circuit board group includes at least one layer of insulate One layer of insulated base material layer, at least two conductive layers bag are provided between substrate layer and at least two conductive layers, every two conductive layers Include the first conductive layer and the second conductive layer.

As shown in figure 14, at least one layer of insulated base material layer is included by the layer printed circuit board group of step S101 formation 103 and at least two conductive layers, per two conductive layers between be provided with one layer of insulated base material layer 103, at least two conductive layers bag Include the first conductive layer 101 and the second conductive layer 102.

It should be noted that in the structural representation provided in Figure 14, Figure 15, Figure 18 and Figure 21, only showing that first leads Insulated base material layer 103 between electric layer 101, the second conductive layer 102 and the first conductive layer 101 and the second conductive layer 102.

Step S102：On the direction for pointing to the second conductive layer by the first conductive layer, to the first of layer printed circuit board group The boundary on surface is punched out, and forms first " U-shaped " opening for exposing the second conductive layer, it is conductive that first surface is located at first Side of the layer away from the second conductive layer.

As shown in figure 15, on the direction for pointing to the second conductive layer 102 by the first conductive layer 101, to layer printed circuit board The boundary of the first surface of group is punched out, until forming first " U-shaped " opening 10 for exposing the second conductive layer 102.

If it should be noted that side of first conductive layer 101 away from the second conductive layer 102 is provided with other film layer knots Structure, then first surface is the farthest film of lateral extent first conductive layer 101 of first conductive layer 101 away from the second conductive layer 102 The surface of layer.

Wherein, first " U-shaped " opening has the first width d along the border of the printed circuit board (PCB) where it.

As shown in figure 16, the extension on the border of the printed circuit board (PCB) where the first width d is open less than first " U-shaped " is long Degree.Specifically, the width of the first width d and flexible PCB is adapted.When the width of FPC is opened less than first " U-shaped " During the length on the border of the printed circuit board (PCB) 1 where mouth 10, the first width d can be less than the print where first " U-shaped " opening 10 The development length on the border of printed circuit board 1.Width less first " U-shaped " opening 10 is set, first " U-shaped " opening can be reduced 10 fluting area, so as to reduce to needing the influence for each layer for carrying out slot treatment.

As shown in figure 17, the extension on the border of the printed circuit board (PCB) where the first width d is open equal to first " U-shaped " is long Degree.The first width d is set to be equal to the development length on the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10, it is no matter flexible How is the width of wiring board, can ensure that flexible PCB is in flattened state.

Step S103：Part in second conductive layer by first " U-shaped " opening exposure is handled to form the first gold medal Finger, forms printed circuit board (PCB).

As shown in figure 18, the parts in the second conductive layer 102 by the exposure of first " U-shaped " opening 10 are handled to be formed First golden finger 11, forms printed circuit board (PCB).

Step S104：By the second golden finger set on ready-made flexible PCB and the first golden finger described Electrically connected in one " U-shaped " opening, include the module of printed circuit board (PCB) and the flexible PCB to be formed.

As shown in figure 19, by the second golden finger 21 set on ready-made flexible PCB 2 and the first golden finger 11 Electrically connected in described first " U-shaped " opening, include the module of printed circuit board (PCB) and the flexible PCB to be formed.

By lamination and die cutting techniques, one layer is provided between the adjacent two layers conductive layer of printed circuit board (PCB) 1 absolutely Edge substrate layer 103, the insulated base material layer 103 is used for the insulation to two conductive layers, prevents short circuit between two conductive layers.Should Understand, through hole can be set in insulated base material layer 103, to realize functional connection between different conductive layers, but this is not The insulating effect for hindering insulated base material layer 103 to play.Side close to the first conductive layer 101 on the second conductive layer 102 is formed There is the first golden finger 11, and the boundary of the first surface positioned at printed circuit board (PCB) 1 is provided with first golden finger of exposure 11 first " U-shaped " opening 10, this causes the first golden finger 11 to be located at the internal layer of printed circuit board (PCB) 1.Flexible PCB 2, including Second golden finger 21, the second golden finger 21 is electrically connected with the first golden finger 11 in first " U-shaped " opening 10 so that printed circuit After plate 1 and FPC 2 are assembled, the thickness compensation of flexible PCB 2 is open in 10 to first " U-shaped ", is conducive to reduction whole The thickness of body module, saves the space shared by module.

Alternatively, formed after the module for including printed circuit board (PCB) and flexible PCB, as shown in figure 20, perpendicular to printing On the direction of the place plane of circuit board 1, be provided with flexible PCB 2 second golden finger 21 partially away from the first golden finger 11 Side be less than or equal to the first surface a to second of printed circuit board (PCB) 1 apart from d4 to the second surface b of printed circuit board (PCB) 1 Surface b apart from d5 (provided in Figure 20 situation about being less than), the thickness of flexible PCB 2 can be fully compensated to the first " U In shape " opening.And by the way that the thickness of flexible PCB is fully compensated into first " U-shaped " opening, can be to greatest extent Reach the overall module thickness of reduction, space-saving purpose.

Alternatively, the second golden finger set on flexible PCB and the first golden finger will be made in advance in first " U-shaped " The step of being electrically connected in opening includes：First golden finger is electrically connected with the second golden finger by anisotropic conductive film.As schemed Shown in 19, the first golden finger 11 is electrically connected with the second golden finger 21 by anisotropic conductive film 3.

Electrical connection between first golden finger and the second golden finger can be easy to implement using anisotropic conductive film, and Current limit is flowed up in the side of vertical first golden finger and the second golden finger；Anisotropic conductive film thickness is relatively low simultaneously, Be conducive to reducing the thickness of overall module.

Alternatively, as shown in figure 21, on the direction perpendicular to the place plane of printed circuit board (PCB) 1, flexible PCB 2 is wrapped The thickness control for including the part of the second golden finger 21 is 70 μm≤d1≤100 μm.

Alternatively, as shown in figure 21, on the direction of the place plane of vertical printed circuit plate 1, by anisotropic conductive film 3 Thickness control be 30 μm≤d2≤50 μm.

Alternatively, as shown in figure 20, on the direction of the place plane of vertical printed circuit plate 1, by first surface a to first Being controlled apart from d3 for golden finger is d3 >=150 μm.

Specifically, on the direction of the place plane of vertical printed circuit plate 1, when by first surface a to the first golden finger 11 Distance, i.e., the depth of first " U-shaped " opening 10 is set greater than or during equal to 150 μm, can ensure to install as far as possible Flexible PCB 2 includes the thickness of the part of the second golden finger and the thickness sum of anisotropic conductive film 3 in module after The depth being open less than or equal to first " U-shaped ", it ensure that the thickness energy of flexible PCB 2 and anisotropic conductive film 3 It is enough to be fully compensated as far as possible into first " U-shaped " opening, and when the thickness of flexible PCB 2 and anisotropic conductive film 3 is complete When compensating entirely into first " U-shaped " opening, the thickness of printed circuit board (PCB) 1 is exactly the thickness of overall module, the thickness of overall module Reach minimum.

A kind of manufacture method for module including printed circuit board (PCB) and flexible PCB that the present embodiment is provided, passes through lamination The conductive layer for forming the first golden finger, will be arranged at the internal layer of printed circuit board (PCB) by technology and die cutting techniques in printed circuit board (PCB), And the boundary of the first surface positioned at printed circuit board (PCB) is provided with first " U-shaped " opening of first golden finger of exposure, After the second golden finger of flexible PCB and Nian Jie the first golden finger of printed circuit board (PCB), anisotropic conductive film and flexibility The thickness compensation of circuit board is interior to first " U-shaped " opening, and overall module thickness, space-saving purpose are reduced to reach.

Figure 22 for the present invention another printed circuit board (PCB) and flexible PCB module manufacture method flow chart.Figure 23 Each step structural representation in being the manufacture method to Figure 31.Figure 22 is referred to, is present embodiments provided another including printing The preparation method of the module of circuit board and flexible PCB, comprises the following steps：

Step S201：With laminar manner formation layer printed circuit board group, layer printed circuit board group includes at least one layer of insulate One layer of insulated base material layer, at least two conductive layers bag are provided between substrate layer and at least two conductive layers, every two conductive layers Include the first conductive layer and the second conductive layer.

As shown in figure 23, by step S201, included with laminar manner formation layer printed circuit board group at least one layer of exhausted One layer of insulated base material layer 103, at least two layers are provided between edge substrate layer 103 and at least two conductive layers, every two conductive layers Conductive layer includes the first conductive layer 101 and the second conductive layer 102.

Step S202：On the direction for pointing to the second conductive layer by the first conductive layer, to the first of layer printed circuit board group The boundary on surface is punched out, and forms first " U-shaped " opening for exposing the second conductive layer, it is conductive that first surface is located at first Side of the layer away from the second conductive layer.

As shown in figure 24, by step S202, on the direction for pointing to the second conductive layer 102 by the first conductive layer 101, After being punched out to the first surface a of layer printed circuit board group boundary, a first " U for exposing the second conductive layer 102 is formed Shape " opening 10, first surface a is located at side of first conductive layer 101 away from the second conductive layer 102.

Wherein, first " U-shaped " opening has the first width d along the border of the printed circuit board (PCB) where it, and the first width is small The development length on the border of the printed circuit board (PCB) where first " U-shaped " is open.

As shown in figure 25, the first width d is less than the extension on the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10 Length.Specifically, the width of the first width d and flexible PCB is adapted.When the width of FPC is less than first " U-shaped " During the length on the border of the printed circuit board (PCB) 1 where opening 10, the first width d can be less than the place of first " U-shaped " opening 10 The development length on the border of printed circuit board (PCB) 1.Width less first " U-shaped " opening 10 is set, first " U-shaped " can be reduced and opened The fluting area of mouth 10, so as to reduce to needing the influence for each layer for carrying out slot treatment.

Wherein, as shown in figure 26, the first width d is equal to the border of the printed circuit board (PCB) 1 at the place of first " U-shaped " opening 10 Development length.Specifically, the width of the first width d and flexible PCB is adapted.When the width of FPC is more than or waits When first " U-shaped " is open the length on the border of the printed circuit board (PCB) 1 at 10 places, the first width d is equal to first " U-shaped " opening 10 The development length on the border of the printed circuit board (PCB) 1 at place, now, the width regardless of FPC can ensure soft Property circuit board be in flattened state.

Step S203：Part in second conductive layer by first " U-shaped " opening exposure is handled to form the first gold medal Finger, forms printed circuit board (PCB).

As shown in figure 27, by the step, the parts in the second conductive layer 102 by the exposure of first " U-shaped " opening 10 are entered The first golden finger 11 is formed after row processing, printed circuit board (PCB) is formed.

Step S204：In the second surface of layer printed circuit board group, component is set, component and at least one layer is conductive Layer electrical connection, component is located at side of second conductive layer away from the first conductive layer, and second surface is relative with first surface.

As shown in figure 28, by the step, component 104 is set in the second surface b of layer printed circuit board group, by first device Part 104 is electrically connected with least one layer of conductive layer, and component 104 is located at one of the second conductive layer 102 away from the first conductive layer 101 Side, second surface b is relative with first surface a.

Step S205：By the second golden finger set on ready-made flexible PCB and the first golden finger described Electrically connected in one " U-shaped " opening, include the module of printed circuit board (PCB) and the flexible PCB to be formed.

As shown in figure 29, by the step, by the second golden finger 21 set on ready-made flexible PCB 2 and One golden finger 11 is electrically connected in described first " U-shaped " opening, is formd including printed circuit board (PCB) and the flexible PCB Module.

By lamination and die cutting techniques, one layer is provided between the adjacent two layers conductive layer of printed circuit board (PCB) 1 absolutely Edge substrate layer 103, the insulated base material layer 103 is used for the insulation to two conductive layers, prevents short circuit between two conductive layers.Should Understand, through hole can be set in insulated base material layer 103, to realize functional connection between different conductive layers, but this is not The insulating effect for hindering insulated base material layer 103 to play.Side close to the first conductive layer 101 on the second conductive layer 102 is formed There is the first golden finger 11, and the boundary of the first surface positioned at printed circuit board (PCB) 1 is provided with first golden finger of exposure 11 first " U-shaped " opening 10, this causes the first golden finger 11 to be located at the internal layer of printed circuit board (PCB) 1.Flexible PCB 2, including Second golden finger 21, the second golden finger 21 is electrically connected with the first golden finger 11 in first " U-shaped " opening 10 so that printed circuit After plate 1 and FPC 2 are assembled, the thickness compensation of flexible PCB 2 is open in 10 to first " U-shaped ", is conducive to reduction whole The thickness of body module, saves the space shared by module.Component 104 is added, is conducive to strengthening module prepared by this method Function.

Alternatively, formed after the module for including printed circuit board (PCB) and flexible PCB, as shown in figure 30, perpendicular to described On the direction of the place plane of printed circuit board (PCB) 1, be provided with flexible PCB 2 second golden finger 21 partially away from first The side of golden finger 11 is less than or equal to the of layer printed circuit board group to the second surface b of layer printed circuit board group apart from d4 One surface a to second surface b apart from d5 (provided in Figure 30 situation about being equal to), first surface a is relative with second surface b, will The thickness of flexible PCB can be fully compensated into first " U-shaped " opening.And by the way that the thickness of flexible PCB is mended completely Repay in first " U-shaped " opening, the overall module thickness of reduction, space-saving purpose can be reached to greatest extent.

Alternatively, the second golden finger set on flexible PCB and the first golden finger will be made in advance in first " U-shaped " The step of being electrically connected in opening includes：First golden finger is electrically connected with the second golden finger by anisotropic conductive film.As schemed Shown in 30 and Figure 31, the first golden finger 11 is electrically connected with the second golden finger 21 by anisotropic conductive film 3.

Alternatively, after the step of with laminar manner formation layer printed circuit board group, this method also includes：In printing electricity The first surface of road flaggy group covers the first separation layer, and the first separation layer is located at one of the first conductive layer away from the second conductive layer Side.As shown in figures 30 and 31, the first separation layer 105, the first separation layer are covered in the first surface a of layer printed circuit board group 105 are located at side of first conductive layer 101 away from the second conductive layer 102.

Specifically, the first separation layer plays a part of protecting the first conductive layer, can effectively prevent the corruption of the first conductive layer Erosion, while playing a part of preventing electric leakage.

Alternatively, after the step of with laminar manner formation layer printed circuit board group, this method also includes：In printing electricity The second surface of road flaggy group covers the second separation layer, and the second separation layer is located at one of the second conductive layer away from the first conductive layer Side, second surface is relative with first surface.As shown in figures 30 and 31, in the second surface b coverings the of layer printed circuit board group Two separation layers 106.

Specifically, the second separation layer plays a part of the conductive layer that protection is in contact with the second separation layer 106, can be effective The corrosion of the conductive layer is prevented, while playing a part of preventing electric leakage.

As shown in Figure 27 and Figure 28, such as Figure 27 is printed circuit board (PCB) when not forming step, and Figure 28 is to be formed after step Printed circuit board (PCB), first " U-shaped " opening is located at the second separation layer 106 described in the orthographic projection of the place plane of printed circuit board (PCB) 1 Where printed circuit board (PCB) in the orthographic projection of plane；

As shown in figure 32, Figure 32 shows the enlarged drawing of the structure of first step 12, in first " U-shaped " opening, to second The boundary of conductive layer 102 is punched out, and forms first step 12, the step surface of first step 12 is where the first golden finger 11 Plane.

Specifically, as shown in Figure 30, Figure 31 and Figure 32, the height of first step 12 and the thickness of anisotropic conductive film 3 Sum is more than or equal to flexible PCB 2 on the direction that the second golden finger 21 points to the first golden finger 22, beyond the second gold medal The height of the part of the place plane of finger 21.

Second separation layer plays a part of protection conductive layer in contact, can effectively prevent the corruption of the conductive layer Erosion, while playing a part of preventing electric leakage.Being additionally, since the second separation layer has the effect for preventing electric leakage, therefore allows first device Part has smaller spacing with printed circuit board (PCB), so as to be conducive to reducing the thickness of overall module.By setting first step, and First golden finger is arranged on to the step surface of first step so that flexible PCB points to the first golden finger in the second golden finger On direction, it be can compensate for beyond the part of plane where the second golden finger into first " U-shaped " opening, it is ensured that module integral thickness Thinned effect.

Alternatively, as shown in figure 31, on the direction of plane, flexible PCB is included where printed circuit board (PCB) The thickness control of the part of second golden finger is 70 μm≤d1≤100 μm.

Alternatively, as shown in figure 31, where vertical printed circuit plate on the direction of plane, by anisotropic conductive film 3 Thickness control be 30 μm≤d2≤50 μm.

Alternatively, as shown in figure 30, where vertical printed circuit plate on the direction of plane, by first surface to the first gold medal The distance controlling of finger is d3 >=150 μm.

Specifically, where vertical printed circuit plate on the direction of plane, when by first surface to the first golden finger away from Depth from, i.e., first " U-shaped " opening is set greater than or during equal to 150 μm, can be ensured as far as possible after installation In module the thickness of part and the thickness sum of anisotropic conductive film of flexible PCB including the second golden finger be less than or The depth being open equal to first " U-shaped ", it ensure that the thickness of flexible PCB and anisotropic conductive film can be as far as possible It is fully compensated into first " U-shaped " opening, and when the thickness of flexible PCB and anisotropic conductive film is fully compensated to first When in " U-shaped " opening, the thickness of printed circuit board (PCB) is exactly the thickness of overall module, and the thickness of overall module reaches minimum.

The manufacture method for the module for including printed circuit board (PCB) and flexible PCB that the present embodiment is provided, by being laminated and rushing The conductive layer for forming the first golden finger, will be arranged at the internal layer of printed circuit board (PCB) by incision technology in printed circuit board (PCB), and in place The boundary of the first surface of printed circuit board (PCB) is provided with first " U-shaped " opening of first golden finger of exposure, works as flexible electrical After second golden finger of road plate is Nian Jie with the first golden finger of printed circuit board (PCB), anisotropic conductive film and flexible PCB Thickness compensation is interior to first " U-shaped " opening, and overall module thickness, space-saving purpose are reduced to reach；Will be by printing electricity On the first surface of road plate to the direction of the second surface of printed circuit board (PCB), the second conductive layer is led for the second layer of printed circuit board (PCB) Electric layer, the first golden finger is made on second layer conductive layer can not only realize the purpose of thinned module, and to other layers Influence is not resulted in yet；First separation layer and the second isolation are increased by the first surface in printed circuit board (PCB) and second surface Layer, is effectively protected conductive layer.

By above-described embodiment, of the invention includes module and its manufacturer of printed circuit board (PCB) and flexible PCB Method, has reached following beneficial effect：

(1) a kind of module including printed circuit board (PCB) and flexible PCB that the present invention is provided, will be incited somebody to action in printed circuit board (PCB) The conductive layer for forming the first golden finger is arranged at the internal layer of printed circuit board (PCB), and in the first surface positioned at printed circuit board (PCB) Boundary is provided with first " U-shaped " opening of first golden finger of exposure, when the second golden finger and the printing electricity of flexible PCB After the first golden finger bonding of road plate, the thickness compensation of anisotropic conductive film and flexible PCB is open to first " U-shaped " It is interior, reduce overall module thickness, space-saving purpose to reach.

(2) by the direction by the second surface of the first surface of printed circuit board (PCB) to printed circuit board (PCB), second is conductive Layer is the second layer conductive layer of printed circuit board (PCB), and the first golden finger is made on second layer conductive layer can not only realize thinned mould Group purpose, and on other layers do not result in influence yet；

(3) the first separation layer and the second separation layer are increased by the first surface in printed circuit board (PCB) and second surface, had Protect conductive layer to effect.

(4) manufacture method of a kind of module including printed circuit board (PCB) and flexible PCB of the invention, by lamination with Die cutting techniques, by the conductive layer that form the first golden finger will be arranged at the internal layer of printed circuit board (PCB) in printed circuit board (PCB), and First " U-shaped " opening of first golden finger of exposure is provided with positioned at the boundary of the first surface of printed circuit board (PCB), works as flexibility After second golden finger of circuit board is Nian Jie with the first golden finger of printed circuit board (PCB), anisotropic conductive film and flexible PCB Thickness compensation in first " U-shaped " opening, reduce overall module thickness, space-saving purpose to reach.

Although some specific embodiments of the present invention are described in detail by example, the skill of this area Art personnel are it should be understood that example above is merely to illustrate, the scope being not intended to be limiting of the invention.The skill of this area Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair Bright scope is defined by the following claims.

Claims

1. a kind of module including printed circuit board (PCB) and flexible PCB, it is characterised in that the printed circuit board (PCB) is included at least One layer of insulating substrate is provided between one layer of insulated base material layer and at least two conductive layers, conductive layer described in adjacent two layers Layer；

At least two conductive layers at least include the first conductive layer and the second conductive layer, close to institute on second conductive layer The side for stating the first conductive layer is formed with the first golden finger；

The boundary of first surface positioned at the printed circuit board (PCB) is provided with the first " U of an exposure first golden finger Shape " is open, and the first surface is located at side of first conductive layer away from second conductive layer；

The flexible PCB includes the second golden finger, and second golden finger is with first golden finger in the first " U Electrically connected in shape " opening.

2. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that the printing Circuit board has second surface, and the second surface is relative with the first surface, where the printed circuit board (PCB) On the direction of plane, be provided with the flexible PCB second golden finger partially away from the one of first golden finger Side is less than or equal to the first surface of the printed circuit board (PCB) to the distance of the second surface of the printed circuit board (PCB) To the distance of the second surface.

3. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that by described On the first surface of printed circuit board (PCB) to the direction of the second surface of the printed circuit board (PCB), first conductive layer is institute The first layer conductive layer of printed circuit board (PCB) is stated, second conductive layer is the second layer conductive layer of the printed circuit board (PCB), described First surface is relative with the second surface.

4. the module according to claim 1 or 2 including printed circuit board (PCB) and flexible PCB, it is characterised in that described First " U-shaped " opening has the first width along the border of the printed circuit board (PCB) where it, and first width is less than or waited Development length in the border of the printed circuit board (PCB) where described first " U-shaped " opening.

5. the module according to claim 4 including printed circuit board (PCB) and flexible PCB, it is characterised in that the flexibility Circuit board is located in described first " U-shaped " opening.

6. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that the printing Circuit board also includes component, and the component is located at the second surface of the printed circuit board (PCB), and the component is at least with one The layer conductive layer electrical connection, the first surface is relative with the second surface.

7. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that the printing Circuit board also includes the first separation layer, and first separation layer is located at one of first conductive layer away from second conductive layer Side.

8. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that described first Golden finger is electrically connected with second golden finger by anisotropic conductive film.

9. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that perpendicular to Where the printed circuit board (PCB) on the direction of plane, the flexible PCB includes the thickness 70 of the part of second golden finger μm≤d1≤100μm。

10. the module according to claim 8 including printed circuit board (PCB) and flexible PCB, it is characterised in that vertical Where the printed circuit board (PCB) on the direction of plane, the thickness of the anisotropic conductive film is 30 μm≤d2≤50 μm.

11. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that vertical Where the printed circuit board (PCB) on the direction of plane, the distance of the first surface to first golden finger is more than or equal to 150μm。

12. the module according to claim 1 including printed circuit board (PCB) and flexible PCB, it is characterised in that the print Printed circuit board also includes the second separation layer, and second separation layer is located at second conductive layer away from first conductive layer Side；

The orthographic projection of first " U-shaped " opening plane where the printed circuit board (PCB) is located at second separation layer described Where printed circuit board (PCB) in the orthographic projection of plane；

First step is provided with described first " U-shaped " opening, the step surface of the first step is first golden finger Place plane.

13. a kind of manufacture method of the module including printed circuit board (PCB) and flexible PCB, it is characterised in that including：

With laminar manner formation layer printed circuit board group, the layer printed circuit board group is including at least one layer of insulated base material layer and extremely One layer of insulated base material layer, at least two conductive layers are provided between few two conductive layers, conductive layer described in every two layers Including the first conductive layer and the second conductive layer；

On the direction for pointing to second conductive layer by first conductive layer, to the first table of the layer printed circuit board group The boundary in face is punched out, and forms first " U-shaped " opening of exposure second conductive layer, and the first surface is located at institute State side of first conductive layer away from second conductive layer；

Part in second conductive layer by described first " U-shaped " opening exposure is handled to form the first golden finger, Form printed circuit board (PCB)；

The second golden finger set on ready-made flexible PCB is opened with first golden finger in described first " U-shaped " Intraoral electrical connection, includes the module of the printed circuit board (PCB) and the flexible PCB to be formed.

14. the manufacture method of the module according to claim 13 including printed circuit board (PCB) and flexible PCB, its feature It is, is formed after the module for including the printed circuit board (PCB) and the flexible PCB, perpendicular to the printed circuit board (PCB) institute On the direction of plane, be provided with the flexible PCB second golden finger partially away from first golden finger Side is less than or equal to described the of the layer printed circuit board group to the distance of the second surface of the layer printed circuit board group One surface is to the distance of the second surface, and the first surface is relative with the second surface.

15. the module according to claim 13 including printed circuit board (PCB) and flexible PCB makes method, its feature exists In, the part in second conductive layer by described first " U-shaped " opening exposure is handled to be formed after the first golden finger, Methods described also includes：

Component is set in the second surface of the layer printed circuit board group, by the component and at least one layer of conductive layer Electrical connection, the component is located at side of second conductive layer away from first conductive layer, the second surface and institute State first surface relative.

16. the manufacture method of the module according to claim 13 including printed circuit board (PCB) and flexible PCB, its feature It is, after the step of forming the layer printed circuit board group with the laminar manner, methods described also includes：In the print The first surface of printed circuit board layer group covers the first separation layer, and it is remote that first separation layer is located at first conductive layer The side of second conductive layer.

17. the manufacture method of the module according to claim 13 including printed circuit board (PCB) and flexible PCB, its feature It is, second golden finger set on the flexible PCB will be made in advance with first golden finger described first The step of being electrically connected in " U-shaped " opening includes：

18. the manufacture method of the module according to claim 13 including printed circuit board (PCB) and flexible PCB, its feature It is, after the step of forming the layer printed circuit board group with the laminar manner, methods described also includes：

The second separation layer is covered in the second surface of the layer printed circuit board group, second separation layer is led positioned at described second Side of the electric layer away from first conductive layer, the second surface is relative with the first surface；

In described first " U-shaped " opening, the boundary of second conductive layer is punched out, first step is formed, it is described The step surface of first step is plane where first golden finger.