CN114927071A

CN114927071A - Display module and display device

Info

Publication number: CN114927071A
Application number: CN202210610292.5A
Authority: CN
Inventors: 黄军; 陈杭
Original assignee: Wuhan Tianma Microelectronics Co Ltd
Current assignee: Wuhan Tianma Microelectronics Co Ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-08-19
Anticipated expiration: 2042-05-31
Also published as: CN114927071B

Abstract

The invention discloses a display module and a display device, belonging to the technical field of display, wherein the display module comprises: the display panel comprises a display panel, a composite foam layer and a flexible circuit board, wherein the flexible circuit board and the composite foam layer are positioned on one side away from a light-emitting surface of the display panel; the display panel at least includes: a substrate; the driving circuit layer is positioned on one side of the substrate, which is far away from the composite foam layer; the display functional layer is positioned on one side, away from the substrate, of the driving circuit layer; the flexible circuit board comprises a plurality of first pins, the driving circuit layer comprises a plurality of signal lines, and the first pins are electrically connected with the signal lines. The display device comprises the display module. The invention can not only further reduce the frame, but also effectively reduce the difficulty of the preparation process and improve the product yield and the processing efficiency.

Description

Display module and display device

Technical Field

The invention relates to the technical field of display, in particular to a display module and a display device.

Background

In the flat panel display technology, an Organic Light-Emitting Diode (OLED) display has many excellent characteristics such as being Light and thin, Emitting Light actively, having a fast response speed, a large viewing angle, a wide color gamut, high brightness, low power consumption, and being capable of manufacturing a flexible screen, and has attracted great interest in the scientific research and industrial fields, and has gradually become a new generation of display technology following a Liquid Crystal Display (LCD). With the development and maturity of flexible display technology, a full-screen has become the trend of electronic products, that is, a frameless OLED display becomes one of the currently important development trends.

In the manufacturing process of the frameless or ultra-narrow frame OLED display, a PAD bending (PAD bending) technology becomes one of the keys for determining the yield, and the PAD bending process is to bend a PAD binding region of a Flexible OLED panel by using a bent Flexible substrate and/or a Flexible Printed Circuit (FPC) and attach the PAD binding region to the back of the panel, so that a Circuit on the back is electrically connected with a Circuit on the front, thereby reducing the width of a frame region of the panel and improving the ratio of an effective display region. Although the frame can be reduced to a certain extent by the scheme, because the frame width of the display panel still needs to reserve an area for Bending (Bending), and the frame reduction range is limited by the Bending radius and the sealing adhesive thickness of the Bending area, the frame cannot be further reduced, if the frame is further reduced, the problem that the product yield cannot be guaranteed due to excessive Bending is caused, and the Bending process is added in the scheme, the manufacturing process is complex, and the improvement of the process efficiency is not facilitated.

Therefore, it is an urgent technical problem for those skilled in the art to provide a display module and a display device that can further reduce the frame, effectively reduce the difficulty of the manufacturing process, and improve the yield and the process efficiency.

Disclosure of Invention

In view of the above, the present invention provides a display module and a display device, so as to solve the problems that in the prior art, a product frame cannot be further reduced due to a bending radius and a sealant thickness of a bending area, a product yield cannot be guaranteed if the frame is excessively bent to reduce the frame, a manufacturing process is complicated, and the improvement of the manufacturing efficiency is not facilitated.

The invention discloses a display module, comprising: the display panel comprises a display panel, a composite foam layer and a flexible circuit board, wherein the flexible circuit board and the composite foam layer are positioned on one side away from a light-emitting surface of the display panel; the display panel at least includes: a substrate; the driving circuit layer is positioned on one side of the substrate, which is far away from the composite foam layer; the display functional layer is positioned on one side, away from the substrate, of the driving circuit layer; the flexible circuit board comprises a plurality of first pins, the driving circuit layer comprises a plurality of signal lines, and the first pins are electrically connected with the signal lines.

Based on the same inventive concept, the invention also discloses a display device which comprises the display module.

Compared with the prior art, the display module and the display device provided by the invention at least realize the following beneficial effects:

the display panel included in the display module can be an organic light-emitting diode display panel, the display module at least comprises a composite foam layer located on one side away from the light-emitting surface of the display panel, and the composite foam layer is arranged on one side of the display panel away from the light-emitting surface of the display panel, so that a buffering effect can be achieved, and the display panel can be effectively protected. The display module further comprises a flexible circuit board, wherein the flexible circuit board is arranged on one side of the display panel, which is far away from the light emergent surface of the display panel, namely, the surface of one side of the light emergent surface of the display panel is not provided with a structure of the flexible circuit board. The flexible circuit board comprises a plurality of first pins, the first pins are electrically connected with signal lines of a driving circuit layer of the display panel, so that signal transmission between the flexible circuit board located on one side of the light emitting surface of the display panel and the display panel is achieved, driving signals are provided for the display panel through the flexible circuit board, and normal display of the display module is achieved. The flexible circuit board is arranged at a position completely avoiding one side of the light-emitting surface of the display panel, so that the screen occupation ratio of the display area at the side of the light-emitting surface of the display panel is favorably improved, and the flexible circuit board is prevented from occupying any area at the side of the light-emitting surface of the display panel. Because the flexible circuit board is arranged on the side of the display panel, which is far away from the light-emitting surface of the display panel, compared with the pad part bending technology in the prior art, in the manufacturing process of the display module, the flexible circuit board is electrically connected with the display panel without a bending process, and only the side far away from the light-emitting surface of the display panel is required to be manufactured with the flexible circuit board, so that the flexible circuit board is electrically connected with the display panel to complete the transmission of signals, the manufacturing difficulty is reduced, and the manufacturing efficiency is improved. In addition, the frame position of the display module does not need to reserve a bending area of the flexible circuit board, so that the frame of the display module can be further reduced, and the display effect of an ultra-narrow frame or a display effect close to a full screen can be more effectively realized.

Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic plan view of a display module according to an embodiment of the present invention;

FIG. 2 is a schematic sectional view taken along line A-A' of FIG. 1;

FIG. 3 is a schematic view of another cross-sectional structure taken along line A-A' of FIG. 1;

FIG. 4 is a schematic view of another cross-sectional structure taken along line A-A' of FIG. 1;

FIG. 5 is a schematic cross-sectional view of the display panel provided in FIG. 4 during a manufacturing process;

FIG. 6 is a schematic cross-sectional view of the display panel of FIG. 4 during a manufacturing process;

FIG. 7 is a schematic cross-sectional view of the display panel of FIG. 4 during a manufacturing process;

FIG. 8 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;

FIG. 9 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;

FIG. 10 is an enlarged view of a portion of the structure of the region P in FIG. 9;

FIG. 11 is an enlarged view of another portion of the structure of the region P in FIG. 9;

FIG. 12 is an enlarged view of a portion of the structure of the region P in FIG. 9;

fig. 13 is a schematic view of the structure of the flexible circuit board in fig. 12;

fig. 14 is a schematic plan view illustrating another display module according to an embodiment of the invention;

FIG. 15 is a schematic sectional view taken along line B-B' of FIG. 14;

fig. 16 is a schematic plan view of a display device according to an embodiment of the present invention.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic plan structure diagram of a display module according to an embodiment of the present invention, and fig. 2 is a schematic sectional structure diagram along the direction of a-a' in fig. 1 (it can be understood that, in order to clearly illustrate the structure of the embodiment, fig. 1 is filled with transparency), a display module 000 according to the embodiment includes: the display panel 00, the composite foam layer 01 and the flexible circuit board 02 are arranged on one side, away from the light emitting surface 00E of the display panel 00, of the flexible circuit board 02 and the composite foam layer 01;

the display panel 00 includes at least:

a substrate 10;

the driving circuit layer 20 is positioned on one side, away from the composite foam layer 01, of the substrate 10;

a display function layer 30, wherein the display function layer 30 is positioned on one side of the driving circuit layer 20, which is far away from the substrate 10;

the flexible circuit board 02 includes a plurality of first pins 021, the driving circuit layer 20 includes a plurality of signal lines 201, and the first pins 021 are electrically connected with the signal lines 201.

Specifically, the display panel 00 included in the display module 000 provided in this embodiment may be an Organic Light Emitting Diode (OLED) display panel, and the display module 000 further includes at least a composite foam layer 01 located on a side away from the Light Emitting surface 00E of the display panel 00, it can be understood that the Light Emitting surface 00E of the display panel 00 in this embodiment refers to a side surface of the display panel 00 Emitting Light and displaying a required picture. Optionally, the composite Foam layer 01 in this embodiment may be of an SCF (Super Clean Foam) structure, and the composite Foam layer 01 is disposed on a side of the display panel 00 away from the light exit surface 00E of the display panel 00, so as to play a role in buffering and effectively protect the display panel 00. It can be understood that, this embodiment does not limit the specific structure of the composite foam layer 01, optionally, the composite foam layer 01 may be a multi-layer composite film structure (not shown in the figure) including at least a bonding layer, a foam layer, and a polyimide layer, which are stacked, the bonding layer may be bonded to a surface of a side of the display panel 00 away from the light exit surface 00E, the bonding layer may be made of a mesh adhesive, the mesh adhesive has an air exhaust function, and has a better flexibility, which may avoid affecting the flexible design of the display module 000, and in some other embodiments, the bonding layer may be made of other adhesive layers. The foam layer can be made of foam materials which can play a role in buffering and shading. The polyimide layer can play the reinforcement effect, increases the holistic steadiness and the reliability of compound bubble cotton layer 01, and in some other embodiments, compound bubble cotton layer 01 also can not include the polyimide layer, can adopt other materials to replace the preparation, can specifically refer to the structure on the compound bubble cotton layer among the correlation technique and understand, and this embodiment does not do not specifically limit.

The display module 000 of this embodiment further includes a Flexible Circuit board 02 (FPC), optionally, a driver Chip (IC) may be bound On the Flexible Circuit board 02, and the driver Chip may be electrically connected to the Flexible Circuit board 02 through binding to realize signal transmission therebetween, that is, the display module 000 of this embodiment may use a Chip On Film (COF) technology to bind the driver Chip. The flexible circuit board 02 in this embodiment is disposed on a side of the display panel 00 away from the light emitting surface 00E of the display panel 00 itself (since the flexible circuit board 02 is located on the side away from the light emitting surface 00E of the display panel 00, the flexible circuit board 02 in fig. 2 is filled with transparency to indicate that the flexible circuit board 02 cannot be seen on the light emitting surface 00E side of the display panel 00), that is, there is no structure of the flexible circuit board 02 on the surface of the light emitting surface 00E side of the display panel 00. In this embodiment, the position where the flexible circuit board 02 is disposed completely avoids the light exit surface 00E side of the display panel 00, which is beneficial to increasing the screen occupation ratio of the display area AA on the light exit surface 00E side of the display panel 00 (as shown in fig. 1 and fig. 2, at least a part of the flexible circuit board 02 located on the side away from the light exit surface 00E of the display panel 00 may be located within the range of the display area AA), and thus the flexible circuit board 02 is prevented from occupying any area on the light exit surface 00E side of the display panel 00. Because the flexible circuit board 02 is disposed on the side of the display panel 00 away from the light emitting surface 00E, compared with a PAD bending (PAD bending) technology in the prior art, in the process of manufacturing the display module 000 of this embodiment, the flexible circuit board 02 is electrically connected with the display panel 00 without a bending process, and only the flexible circuit board 02 is fabricated on the side away from the light emitting surface 00E of the display panel 00, so that the flexible circuit board 02 is electrically connected with the display panel 00 to complete signal transmission, which is beneficial to reducing the difficulty of the manufacturing process and improving the efficiency of the manufacturing process. And because the frame position of display module assembly 000 in this embodiment need not to reserve the bending region of flexible circuit board 02, consequently can further reduce display module assembly 000's frame, be favorable to more effectively obtaining super narrow frame or more be close to the display module assembly 000 of comprehensive screen effect.

The display panel 00 in this embodiment at least includes a substrate 10 (not filled in the drawing), and the substrate 10 can be used as a carrier substrate for disposing other film structures of the display panel 000. Alternatively, the substrate 10 may be any one of a transparent substrate and a translucent substrate made of a material such as Polyimide (PI) and Polycarbonate (PC), and the embodiment is not limited thereto. The substrate 10 may be adhesively secured to the composite foam layer 01. Moreover, since the flexible circuit board 02 of this embodiment is located on the side of the display panel 00 away from the light emitting surface 00E, a Back Plate structure (Back Plate, BP) can be removed between the substrate 10 of the display panel 00 and the composite foam layer 01, which is beneficial to reducing the thickness of the module and saving the cost. The display panel 00 of this embodiment further includes a driving circuit layer 20 located on a side of the substrate 10 away from the composite foam layer 01, optionally, the driving circuit layer 20 may include a plurality of metal layers and an insulating layer, the plurality of metal layers of the driving circuit layer 20 may be configured to provide a thin film transistor T (the thin film transistor is used to transmit a driving signal of the pixel circuit to a structure with a display function in the display panel 00 in a conducting state, such as an anode, etc.), a signal trace (which may be used to provide a driving voltage signal for the pixel circuit, etc.), a capacitor device, and so on, that is, the structure made by the plurality of metal layers of the driving circuit layer 20 may be used to form a driving circuit for providing a driving signal for the display panel 00, such as a pixel circuit, etc. When the display panel 00 is an organic light emitting diode display panel, the display functional layer 30 may include an anode layer 301, an organic light emitting material layer 302, a cathode layer 303, and a pixel definition layer 304 for defining an area of an organic light emitting layer, which is not described herein again, and this embodiment may be understood with reference to the structure of the organic light emitting diode display panel in the related art.

The flexible circuit board 02 in this embodiment includes a plurality of first pins 021, the driving circuit layer 20 of the display panel 00 can make a plurality of signal lines 201 through a metal layer or a transparent metal layer, in this embodiment, the first pins 021 on the flexible circuit board 02 are electrically connected with the signal lines 201 of the driving circuit layer 20 of the display panel 00, so that signal transmission between the flexible circuit board 02 located on the side away from the light exit surface 00E of the display panel 00 and the display panel 00 is realized, so that a driving signal is provided for the display panel 00 through the flexible circuit board 02, and normal display of the display module 000 is realized.

It should be noted that, in this embodiment, the first pin 021 on the flexible circuit board 02 located on the side away from the light exit surface 00E of the display panel 00 is electrically connected to the signal line 201 of the driving circuit layer 20 inside the display panel 00, for the specific connection manner between the first pin 021 and the signal line 201, this embodiment is not particularly limited, a through hole may be provided on a film layer between the driving circuit layer 20 and the flexible circuit board 02 (the film layer structure included between the specific driving circuit layer 20 and the flexible circuit board 02 may be set according to the actual design requirement), and a conductive material may be filled in the through hole to electrically connect the first pin 021 on the flexible circuit board 02 located on the side away from the light exit surface 00E of the display panel 00 and the signal line 201 of the driving circuit layer 20 inside the display panel 00, or may be electrically connected by another connection structure, and one first pin 021 may correspond to one signal line 201, or one first pin 021 may correspond to a plurality of signal lines 201, or other corresponding relationships may also be used, and it is only necessary to electrically connect the first pin 021 located on the flexible circuit board 02 on the side departing from the light emitting surface 00E of the display panel 00 and the signal line 201 of the driving circuit layer 20 inside the display panel 00.

It is understood that the display panel 00 of the display module 000 of the present embodiment includes, but is not limited to, the above-mentioned film layer structure, and may further include other film layer structures, as shown in fig. 3, fig. 3 is another schematic cross-sectional structure view along the direction a-a' in fig. 1, the display module 000 of the present embodiment may further include a film encapsulation layer 40 located on the side of the display functional layer 30 away from the substrate 10, a touch functional layer located on the side of the film encapsulation layer 40 away from the substrate 10, a circular polarizer (not shown in the drawings), and a protective cover 03, and the film encapsulation layer 40 may be used for isolating water and oxygen, and preventing water vapor and oxygen in the air from entering into the lower film layer, thereby damaging the components of the display panel 00, the touch layer is used for implementing the touch function of the display module 000, the circular polarizer is used for reducing reflection of external incident light, and the protective cover 03 is used for protecting the entire display module 000, the present embodiment is not described herein in detail, and can be understood with reference to the structure of the organic light emitting display panel in the related art. Optionally, the thin film encapsulation layer in this embodiment may include an inorganic, organic, and inorganic multilayer stacked structure, and details of the structure of the display panel are not repeated in this embodiment, and specifically, the structure of the organic light emitting display panel in the related art may be referred to for understanding, and details of this embodiment are not repeated here.

In some optional embodiments, please refer to fig. 1 and 4 in combination, fig. 4 is another schematic cross-sectional structure diagram along the direction of a-a' in fig. 1, in this embodiment, a display panel 00 includes a display area AA and a binding area BA, the display panel 00 of the binding area BA and the display panel 00 of the display area AA are separately disposed, and a forward projection of the binding area BA on a light-emitting surface 00E of the display panel 00 and a forward projection of the display area AA on the light-emitting surface 00E of the display panel 00 at least partially overlap; in the direction Z perpendicular to the light emitting surface 00E of the display panel 00, the display panel 00 of the binding area BA is located on one side of the composite foam layer 01 departing from the display panel 00 of the display area AA;

the bonding area BA comprises a plurality of conductive bonding pads BA1, and the conductive bonding pad BA1 is attached to and electrically connected with the first pin 021;

the composite foam cotton layer 01 comprises a plurality of first through holes 01K, the first through holes 01K penetrate through the composite foam cotton layer 01, and a first conductive part 501 is filled in the first through holes 01K; the substrate 10 comprises a plurality of second through holes 10K, the second through holes 10K penetrate through the substrate 10, and second conductive parts 502 are filled in the second through holes 10K;

the conductive pad BA1 is electrically connected to the signal line 201 through the first conductive portion 501 and the second conductive portion 502.

This embodiment explains that the display panel 00 in the display module 000 may include the display area AA and the bonding area BA, and the display panel 00 of the bonding area BA and the display panel 00 of the display area AA are separately disposed, alternatively, in the process of manufacturing the display panel 000, the display panel 00 of the bonding area BA and the display panel 00 of the display area AA may be manufactured at the same time, as shown in fig. 5, fig. 6 and fig. 7, fig. 5 is a schematic cross-sectional structure diagram of the display panel provided in fig. 4 in the manufacturing process, fig. 6 is a schematic cross-sectional structure diagram of the display panel provided in fig. 4 in the manufacturing process, fig. 7 is a schematic cross-sectional structure diagram of the display panel provided in fig. 4 in the manufacturing process, that is to sequentially manufacture the film structures of the display area AA of the display panel 00 and the bonding area BA on the same whole substrate structure, and then the display panel 00 including the bonding area BA and the display area AA illustrated in fig. 5 is cut along the cutting line M, the display panel 00 of the bonding area BA is separated from the display panel 00 of the display area AA, that is, the overall structure illustrated in fig. 5 is changed to the structure illustrated in fig. 6 in which the display panel 00 of the bonding area BA is separated from the display panel 00 of the display area AA. Then, as shown in fig. 7, the display panel 00 of the binding area BA is stacked on a side of the display panel 00 of the display area AA away from the light exit surface 00E thereof, so that the orthographic projection of the binding area BA on the light exit surface 00E of the display panel 00 and the orthographic projection of the display area AA on the light exit surface 00E of the display panel 00 are at least partially overlapped. The final structure formed in this embodiment is that, in the direction Z perpendicular to the light emitting surface 00E of the display panel 00, the display panel 00 of the binding area BA is located on the side of the composite foam layer 01 departing from the display panel 00 of the display area AA. The bonding area BA of the display panel 00 includes a plurality of conductive pads BA1, the conductive pads BA1 are electrically bonded to the first pins 021, that is, after the display panel 00 of the bonding area BA is stacked on the side of the display panel 00 of the display area AA away from the light exit surface 00E thereof, the plurality of conductive pads BA1 within the bonding area BA of the display panel 00 are electrically connected to the first pins 021, which are also disposed on the flexible circuit board 02 away from the light exit surface 00E of the display panel 00, by bonding contact, so as to bond the flexible circuit board 02 to the display panel 00 of the bonding area BA. In this embodiment, a plurality of first via holes 01K are formed in the composite foam layer 01 between the display panel 00 and the flexible circuit board 01, the first via holes 01K penetrate through the composite foam layer 01, first conductive portions 501 are filled in the first via holes 01K, a plurality of second via holes 10K are formed in the substrate 10 inside the display panel 00, the second via holes 10K penetrate through the substrate 10, and second conductive portions 502 are filled in the second via holes 10K, so that the conductive pads BA1 of the bonding area BA are electrically connected with the signal lines 201 in the driving circuit layer 20 by penetrating through the composite foam layer 01 and the first conductive portions 501 and the second conductive portions 502 of the substrate 10, and since the plurality of conductive pads BA1 in the bonding area BA range are electrically connected with the first pins 021 which are also arranged on the flexible circuit board 02 on the side away from the light exit surface 00E of the display panel 00 through bonding contact, the flexible circuit board 02 on the side away from the light exit surface 00E of the display panel 00 also achieves electrical connection with the signal lines 201 in the display panel 00 The signal lines 201 are electrically connected with each other, so that a driving signal is provided for the display panel 00 through the flexible circuit board 02, and normal display of the display module 000 is realized. In this embodiment, the display panel 00 of the binding area BA and the display panel 00 of the display area AA are separately disposed, so that the light exit surface 00E side of the display panel 00 finally presented to the user does not include the binding area BA, the display panel 00 of the binding area BA is located on the side away from the light exit surface 00E of the display panel 00, and the orthographic projection of the binding area BA on the light exit surface 00E of the display panel 00 and the orthographic projection of the binding area AA on the light exit surface 00E of the display panel 00 are at least partially overlapped, so that the frame space of the display panel 00 occupied by the binding area BA can be more effectively occupied inside, and therefore, while the signal transmission between the flexible circuit board 02 and the display panel 00 is realized, the whole frame of the display module 000 can be further reduced, and the effect of an ultra-narrow frame is further facilitated.

In addition, in the embodiment, in the process of manufacturing the display panel 00, the display panel 00 of the bonding area BA and the display panel 00 of the display area AA need to be cut along the cutting line M, so that the display panel 00 of the bonding area BA and the display panel 00 of the display area AA are separately arranged, and therefore, after the display panel 00 of the bonding area BA is stacked on one side of the display panel 00 away from the light emitting surface 00E of the display panel, the process of pressing and testing the bending area in the prior art is not needed (the pressing and testing refers to the process of testing the strength of the panel in the bending state after a part of the display panel for bonding the flexible circuit board is bent to the backlight surface of the display panel through the bending process in the prior art, and since the trace of the bending area is likely to be broken due to multiple pressing and testing, failure is likely to be caused in the pressing and testing), the embodiment cuts the display panel 00 of the display area AA and the display panel 00 of the bonding area BA, which are originally integrated, into two parts And realize drive signal line 201 and flexible circuit board 02's electricity connection effect through holing at the rete, can save the extrusion test process, not only be favorable to improving process efficiency, can also avoid the risk of walking the line disconnection inefficacy in the drive circuit layer 20, be favorable to guaranteeing the product yield.

Optionally, as shown in fig. 1 and 8, fig. 8 is another schematic cross-sectional structure diagram of the direction a-a' in fig. 1, when the conductive pad BA1 located on the side away from the light emitting surface 00E of the display panel 00 in this embodiment is electrically connected to the signal line 201 of the driving circuit layer 20 in the display panel 00, in order to avoid that the first via 01K penetrating through the composite foam layer 01 and the second via 10K penetrating through the substrate 10 are too deep and affect the process efficiency, some first metal portions J1 may be additionally arranged in the film layer between the conductive pad BA1 and the signal line 201 (the first metal portions J1 may be arranged in the same process and material as the metal film layer of the display panel), the first metal portions J1 and the first conductive portions 501 filled in the first via 01K may form a T-shaped structure, and the first metal portions J1 and the second conductive portions 502 filled in the second via 10K may also form a T-shaped structure, the first via hole 01K and the second via hole 10K may be divided into a plurality of sub-holes, and the depth of each sub-hole may be prevented from being too deep, which is beneficial to ensuring the stability of the electrical connection effect between the conductive pad BA1 located on the side departing from the light emitting surface 00E of the display panel 00 and the signal line 201 of the driving circuit layer 20 in the display panel 00.

It can be understood that, in the present embodiment, the process of electrically connecting the conductive pad BA1 located on the side away from the light exit surface 00E of the display panel 00 and the signal line 201 of the driving circuit layer 20 in the display panel 00 can be performed by, when the display panel 00 of the bonding area BA and the display panel 00 of the display area AA are not cut and separated, identifying in advance the positions where the first via hole 01K and the second via hole 10K need to be formed (not shown in the drawings), then manufacturing the first conductive portion 501 and the second conductive portion 502, and synchronously manufacturing the first metal portion J1 in advance at the position where the via hole is too deep during the manufacturing of the display film layer, so that the first via hole 01K is formed by a plurality of sub-holes, the second via hole 10K is formed by a plurality of sub-holes, and after the display panel 00 of the bonding area BA is stacked on the side of the display panel 00 away from the light exit surface 00E thereof, only the first via hole 01K filled with the first conductive portion 501 and the second via hole 10K filled with the second conductive portion 502 are required to be stacked after the display panel 00 of the bonding area BA is stacked on the side of the display panel 00 away from the light exit surface 00E thereof, and the display panel 00E The conductive pads BA1 on the side away from the light exit surface 00E of the display panel 00 and the signal lines 201 of the driving circuit layer 20 in the display panel 00 can be electrically connected by alignment contact and press-fitting. The manufacturing process is not particularly limited in this embodiment, and in the specific implementation, the electrical connection effect between the conductive pad BA1 and the signal line 201 may be achieved by other manufacturing processes, and it is only necessary to satisfy the requirement that the electrical connection performance between the conductive pad BA1 and the signal line 201 is stable.

In some optional embodiments, please refer to fig. 1 and 9 in combination, fig. 9 is another schematic cross-sectional structure diagram along a direction a-a' in fig. 1, in a display module 000 provided in this embodiment, a display panel 00 includes a display area AA and a binding area BA, and the binding area BA is located on one side of the display area AA in a direction X parallel to a light emitting surface 00E of the display panel 00; the bonding area BA includes a plurality of conductive pads BA 1; the orthographic projection of the composite foam layer 01 on the light-emitting surface 00E of the display panel 00 is not overlapped with the binding area BA;

the composite foam layer 01 comprises an inclined plane 01A, and an included angle alpha formed by the inclined plane 01A and the surface 01B of the composite foam layer 01 facing the display panel 00 is an acute angle;

the flexible circuit board 02 comprises a first area 02A, a second area 02B and a third area 02C, wherein a plurality of first pins 021 are positioned in the first area 02A; first pin 021 is connected with the laminating of the electrically conductive pad BA1 electricity of binding the district BA, and the flexible circuit board 02 and the inclined plane 01A laminating of second district 02B are fixed, and the flexible circuit board 02 of third district 02C and the laminating of the cotton layer 01 side surface 01C that deviates from display panel 00 of compound bubble are fixed.

The embodiment explains that the display panel 00 in the display module 000 may include a display area AA and a binding area BA, and in a direction X parallel to the light emitting surface 00E of the display panel 00, the binding area BA is located on one side of the display area AA, and the binding area BA includes a plurality of conductive pads BA1, and optionally, the binding area BA may be located within an area range near an edge position of a non-display area of the display panel 00. The orthographic projection of the composite foam layer 01 on the side away from the light emitting surface 00E of the display panel 00 is not overlapped with the binding area BA, namely, after the whole surface of the composite foam layer 01 is attached to the backlight surface of the display panel 00, the part in the range of the binding area BA needs to be hollowed out, so that the orthographic projection of the composite foam layer 01 on the light emitting surface 00E of the display panel 00 is not overlapped with the binding area BA, the hollowed-out position of the composite foam layer 01 can be used for binding the flexible circuit board 02, and the hollowed-out area of the composite foam layer 01 can be the area where the conductive pad BA1 is located.

This embodiment sets up compound cotton layer 01 of bubble including inclined plane 01A, inclined plane 01A and compound cotton layer 01 of bubble are the acute angle towards the contained angle alpha that surface 01B formed of display panel 00 one side, setting up through inclined plane 01A can make flexible circuit board 02 have a slope when binding, can make the better bending type of flexible circuit board 02 be fixed in on the inclined plane 01A of compound cotton layer 01 of bubble, when the side of the fretwork position of avoiding compound cotton layer 01 of bubble is the vertical plane, buckle too much when flexible circuit board 02 binds and arouse the fracture. The specific binding structure of the flexible circuit board 02 is that the flexible circuit board 02 includes a first area 02A, a second area 02B and a third area 02C, it can be understood that the first area 02A, the second area 02B and the third area 02C are only names of different areas of the flexible circuit board 02, the plurality of first pins 021 are located in the first area 02A, the first pins 021 are attached to and electrically connected with the conductive pads BA1 of the binding area BA, that is, the conductive pads BA1 of the binding area BA of the display panel 00 are exposed at the hollow positions of the composite foam layer 01, and the flexible circuit board 02 of the first area 02A is attached to and electrically connected with the conductive pads BA1 at the hollow positions in a one-to-one correspondence manner through the first pins 021. The flexible circuit board 02 of the second area 02B is fixed with the inclined plane 01A in an attaching mode, namely the flexible circuit board 02 of the second area 02B can be bent along the inclined plane 01A of the composite foam layer 01 in an inclined mode, an included angle alpha formed by the inclined plane 01A and the surface 01B, facing the display panel 00, of the composite foam layer 01 is an acute angle, the bent angle between the flexible circuit board 02 of the first area 02A and the flexible circuit board 02 of the second area 02B can be an obtuse angle, and the breakage of lines in the flexible circuit board 02 caused by excessive bending is avoided. Then the flexible circuit board 02 of third district 02C continues to deviate from one side surface 01C laminating of display panel 00 with compound bubble cotton layer 01 fixed to make flexible circuit board 02 and display panel 00 have the region of binding the connection, and flexible circuit board 02 also has the region of laminating fixed with compound bubble cotton layer 01, and then can effectively promote the binding fastness of flexible circuit board 02 on the side of deviating from display panel 00 play plain noodles 00E. Moreover, the flexible circuit board 02 does not need to be bent to the back of the display panel 00, so that the manufacturing process difficulty is reduced, the manufacturing process efficiency is improved, and the flexible circuit board 02 does not need to occupy the space on the light emergent surface 00E side of the display panel 00, so that the frame of the display module 000 can be further reduced, and the display effect of an ultra-narrow frame or a display effect close to a full-screen can be more effectively achieved.

Optionally, in this embodiment, an included angle formed by the inclined surface 01A of the composite foam layer 01 and the surface 01B of the composite foam layer 01 facing the display panel 00 is α, and α is greater than or equal to 40 ° and less than or equal to 50 °.

The embodiment explains that the angular range of the acute angle α formed by the inclined plane 01A of the composite foam layer 01 and the surface 01B of the composite foam layer 01 facing the display panel 00 can be between 40 ° and 50 °, and further optionally, the acute angle α formed by the inclined plane 01A of the composite foam layer 01 and the surface 01B of the composite foam layer 01 facing the display panel 00 is 45 °, so that when the angle of the angle α is too small, the distance of the inclined plane 01A in the direction X parallel to the light emitting surface 00E of the display panel 00 is too long, and further the obliquely cut part of the composite foam layer 01 is too much, which affects the protection effect of the composite foam layer 01 on the display panel 00, and when the angle of the angle α is too large, the flexible circuit board 02 is attached to the inclined plane 01A, which easily causes the flexible circuit board 02 to be excessively bent, so that the binding effect of the flexible circuit board 02 can be ensured, the risk of wire breakage caused by excessive bending is avoided.

In some alternative embodiments, please refer to fig. 1, 9 and 10 in combination, fig. 10 is an enlarged schematic view of a partial structure in a P region of fig. 9, in this embodiment, a plurality of conductive pads BA1 are located on a side of the substrate 10 facing away from the driving circuit layer 20, the driving circuit layer 20 of the bonding area BA includes a plurality of third vias 20K, and the signal line 201 is electrically connected to the conductive pad BA1 through the third vias 20K.

In the display module 000, since the flexible circuit board 02 is disposed on the side of the composite foam layer 01 away from the display panel 00, there is no need to dispose the conductive pad BA1 on the side of the light exit surface 00E of the display panel 00, and the plurality of conductive pads BA1 are disposed on the side of the substrate 10 away from the driving circuit layer 20, so as to reduce the distance between the conductive pad BA1 and the flexible circuit board 02 in the direction perpendicular to the light exit surface 00E of the display panel 00, the driving circuit layer 20 of the bonding area BA may be disposed with a plurality of third via holes 20K, the third via holes 20K may penetrate through the driving circuit layer 20 including a plurality of film layers, and the substrate 10 may also be disposed with the second via holes 10K penetrating through the substrate 10, so that the signal lines 201 (such as data lines, scanning lines, touch signal lines, etc.) of the driving circuit layer 20 may be electrically connected to the conductive pads BA1 on the side of the substrate 10 away from the display panel 00 through the third via holes 20K and the second via holes 10K. The plurality of conductive pads BA1 of this embodiment are located the one side that the substrate 10 deviates from the drive circuit layer 20, can reduce the degree of difficulty of binding of flexible circuit board 02, because the one side that the substrate 10 deviates from the display panel 00 directly exposes conductive pad BA1, consequently when flexible circuit board 01 binds to the backlight surface of display panel 00, can directly attach and make the conductive pad BA1 of binding district BA and the first pin 021 direct contact laminating electricity on the flexible circuit board 02 connect, be favorable to improving processing procedure efficiency.

It can be understood that, in this embodiment, the process of electrically connecting the conductive pad BA1 located on the side away from the light emitting surface 00E of the display panel 00 and the signal line 201 of the driving circuit layer 20 in the display panel 00 may be implemented by forming the third via hole 20K in the driving circuit layer 20, in particular, in order to avoid that a plurality of film layers through which the third via hole 20K penetrates are too deep, the second metal portion J2 may be synchronously formed in the process of manufacturing the display structure of each film layer, as shown in fig. 10, so that the third via hole 20K is formed by a plurality of sub-holes, or the electrical connection between the conductive pad BA1 and the signal line 201 may also be implemented by other process technologies, which is not specifically limited in this embodiment, and in particular, it only needs to satisfy that the electrical connection performance between the conductive pad BA1 and the signal line 201 is stable, and this embodiment is not specifically limited in this embodiment.

In some alternative embodiments, please refer to fig. 1, fig. 9 and fig. 11 in combination, fig. 11 is an enlarged schematic view of another partial structure of a region P in fig. 9, in this embodiment, a waterproof adhesive layer 60 is coated on an inclined surface 01A of the composite foam layer 01, and the flexible circuit board 02 of the second region 02B is fixed to the inclined surface 01A through the waterproof adhesive layer 60.

This embodiment explains when the flexible circuit board 02 is fixed with the inclined plane 01A of the compound foam layer 01, because the inclined plane 01A has a certain slope, so can coat the waterproof glue layer 60 on the inclined plane 01A of the compound foam layer 01, the waterproof glue layer 60 can be UV waterproof glue, not only can strengthen the protection effect to the display module 000, for example waterproof and corrosion resistance, can also avoid the glue that the mobility is good to flow on the inclined plane 01A of the compound foam layer 01 and cause local starvation when coating, and then influence the fixed effect of the flexible circuit board 02 of the second area 02B and the inclined plane 01A. Therefore this embodiment sets up the flexible circuit board 02 of second district 02B and fixes through waterproof glue layer 60 and inclined plane 01A, not only can utilize waterproof glue layer 60's viscidity to make the flexible circuit board 02 of second district 02B fixed with the inclined plane 01A of compound bubble cotton layer 01, can also keep waterproof glue layer 60's wholeness on inclined plane 01A, avoid glue to flow and lead to local scarce glue to influence fixed effect, and then be favorable to further promoting flexible circuit board 02 and compound bubble cotton layer 01's steadiness.

It can be understood that, in this embodiment, the flexible circuit board 02 in the third area 02C may also be fixedly attached to the surface 01C of the composite foam layer 01 away from the side of the display panel 00 through the waterproof adhesive layer, and the waterproof adhesive layer 60 in this embodiment may also be replaced by other waterproof adhesive materials with poor flowability, which is not described herein again.

In some alternative embodiments, please refer to fig. 1, fig. 9 and fig. 12 and fig. 13 in combination, fig. 12 is an enlarged schematic view of a partial structure of a region P in fig. 9, fig. 13 is a schematic view of a flexible circuit board in fig. 12, in this embodiment, the flexible circuit board 02 includes a first substrate 020 and a plurality of metal conductive layers 0201 located on the first substrate 020;

the flexible circuit board 02 at least comprises a first sub-portion 02D and a second sub-portion 02E, wherein the first sub-portion 02D is positioned at the joint position of the second area 02B and the first area 02A; and/or, the first sub-section 02D is located where the second region 02B meets the third region 02C;

the first sub-portion 02D includes a number of metal conductive layers 0201, the second sub-portion 02E includes a number of metal conductive layers 0201, a < B, and a and B are positive integers.

This embodiment explains a structure in which the flexible circuit board 02 generally includes a plurality of film layers stacked, wherein the first substrate 020 is used as a substrate for carrying the rest of the film layers of the flexible circuit board 02, the flexible circuit board 02 further includes at least a plurality of metal conductive layers 0201 located on the first substrate 020, and the plurality of metal conductive layers 0201 are used for making internal traces in the flexible circuit board 02, so that the pins of the flexible circuit board 02 have an electrical connection relationship with each other. Optionally, the plurality of metal conductive layers 0201 may also be provided with an insulating cover layer, the flexible circuit board 02 may further have an insulating glue layer used as a protective layer, and further optionally, the insulating glue layer and the first substrate 020 may be made of the same material, which is not specifically limited in this embodiment, and it is only required that the flexible circuit board 02 at least includes the first substrate 020 and the plurality of metal conductive layers 0201 located on the first substrate 020. Because the flexible circuit board 02 itself has a certain flexibility, and the overall thickness of the flexible circuit board 02 is relatively thin, the wire routing made in each metal conductive layer 0201 is also relatively thin, and the flexible circuit board 02 of this embodiment needs to be bent at a certain angle when being fixed on the composite foam layer 01 in a binding manner. Therefore, as shown in fig. 12 and fig. 13, in order to avoid a risk of wire breakage of the metal conductive layer 0201 when the flexible circuit board 02 is bent, in this embodiment, the flexible circuit board 02 at least includes a first sub-portion 02D and a second sub-portion 02E, where the first sub-portion 02D is located at a position where the second area 02B is connected to the first area 02A, or the first sub-portion 02D is located at a position where the second area 02B is connected to the third area 02C, or the first sub-portion 02D is located at a position where the second area 02B is connected to the first area 02A, or is located at a position where the second area 02B is connected to the third area 02C, that is, the first sub-portion 02D is a partial area of the flexible circuit board 02 that needs to be bent after being bound and fixed, and the remaining planar areas that do not need to be bent are all the second sub-portion 02E of the flexible circuit board 02. In this embodiment, the number a of the metal conductive layers 0201 included in the first sub-portion 02D is smaller than the number B of the metal conductive layers 0201 included in the second sub-portion 02E, for example, when the number of the metal conductive layers 0201 included in the first sub-portion 02D is three, the number of the metal conductive layers 0201 included in the second sub-portion 02E is two or one, so that by reducing the number of the metal conductive layers 0201 in the bending region of the flexible circuit board 02 after the flexible circuit board 02 is bound and fixed, not only can the thickness of the first sub-portion 02D of the flexible circuit board 02 be reduced, but also the problem that the bending is difficult to bend due to the thick thickness and the excessive hardness of the bending position can be avoided, the bending performance of the first sub-portion 02D of the flexible circuit board 02 can be improved, and the risk of internal routing breakage when the flexible circuit board 02 is bent can be reduced.

Optionally, the partial region of the flexible circuit board 02 that needs to be bent after being bound and fixed is the region where the first sub-portion 02D is located, and the first sub-portion 02D may only include one metal conductive layer 0201, so that the bent region of the flexible circuit board 02 may only use a single layer for routing, and the position of the flexible circuit board 02 that needs to be bent only includes a single metal conductive layer 0201 by setting, so that the thickness of the first sub-portion 02D of the flexible circuit board 02 may be further reduced, and the bending performance is further improved while the difficulty in attaching the flexible circuit board 02 is reduced.

It is understood that, when the first sub-portion 02D includes only one metal conductive layer 0201, the remaining second sub-portion 02E may be electrically connected to the single metal conductive layer 0201 in the first sub-portion 02D through a via exchange line at a position close to the first sub-portion 02D.

In some alternative embodiments, with continuing reference to fig. 1, 9, 12 and 13, the material of the first substrate 020 in at least the first sub-portion 02D of the flexible circuit board 02 includes a transparent flexible material.

The embodiment explains that the flexible circuit board 02 can adopt a sectional type structural design, specifically, the manufacturing material of the first substrate 020 corresponding to at least the first sub-portion 02D of the flexible circuit board 02 comprises a transparent flexible material, optionally, the other parts of the flexible circuit board 02 are made of other flexible materials like the manufacturing material of the first substrate 020 corresponding to the second sub-portion 02E, or the manufacturing material of the whole first substrate 020 of the flexible circuit board 02 is made of a transparent flexible material, such as flexible transparent materials like Polyimide (PI) and Polycarbonate (PC), so that the first sub-portion 02D can be bent more easily, and whether damage such as breakage exists in a circuit inside the flexible circuit board 02 after bending can be observed more clearly and intuitively, and the product yield can be further improved.

It can be understood that the flexible circuit board 02 in this embodiment may further include an insulating adhesive layer (not shown in the figure) on a side of the metal conductive layer 0201 away from the first substrate 020, the insulating adhesive layer may play a role of protecting the entire flexible circuit board 02, and optionally, the insulating adhesive layer and the first substrate 020 may be made of the same material, and may be both made of a flexible transparent material. Consequently when the preparation material of first basement 020 and insulating glue layer is flexible transparent material, flexible circuit board 02 binds to the cotton layer 01 of compound bubble on, both can set up first basement 020 and the cotton layer 01 laminating of compound bubble fixed, also can set up insulating glue layer and the cotton layer 01 laminating of compound bubble fixed, make things convenient for flexible circuit board 02 to bind and the equal can audio-visually observe whether the inside circuit of flexible circuit board 02 has damage such as fracture after buckling.

In some optional embodiments, please refer to fig. 14 and fig. 15 in combination, fig. 14 is another schematic plane structure diagram of the display module provided in the embodiment of the present invention, fig. 15 is a schematic cross-sectional structure diagram along the direction B-B' in fig. 14 (it can be understood that, for clearly illustrating the structure of the embodiment, the transparency filling is performed in fig. 14), the display module 000 in the embodiment further includes a driving chip 70, and the driving chip 70 is disposed on a side of the flexible circuit board 02 away from the display panel 00 in a binding manner.

The present embodiment explains that the flexible Circuit board 02 of the display module 000 may be bound with a driving Chip 70(Integrated Circuit, IC), and the driving Chip 70 may be electrically connected to the flexible Circuit board 02 by binding to realize signal transmission therebetween, that is, the display module 000 of the present embodiment may adopt a Chip On Film (COF) technology to bind the driving Chip 70. In this embodiment, the flexible circuit board 02 is disposed on a side of the display panel 00 away from the light exit surface 00E of the display panel 00 itself, the driving chip 70 is bound and disposed on a side of the flexible circuit board 02 away from the display panel 00, optionally, the driving chip 70 may be bound and electrically connected with the flexible circuit board 02 of the third area 02C, so as to transmit signals between the driving chip 70 and the flexible circuit board 02, and transmit driving signals provided by the driving chip 70 to the display panel 00 through the flexible circuit board 02, thereby implementing a normal display function of the display panel 00.

In some alternative embodiments, please refer to fig. 16, where fig. 16 is a schematic plane structure diagram of a display device according to an embodiment of the present invention, and the display device 111 according to this embodiment includes the display module 000 according to the above embodiment of the present invention. The embodiment in fig. 16 is only an example of a mobile phone, and the display device 111 is described, it should be understood that the display device 111 provided in the embodiment of the present invention may be other display devices 111 with a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited to this. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display module 000 provided in the embodiment of the present invention, and specific descriptions of the display module 000 in the above embodiments may be specifically referred to, and this embodiment is not described herein again.

According to the embodiment, the display module and the display device provided by the invention at least realize the following beneficial effects:

the display panel included in the display module can be an organic light-emitting diode display panel, the display module at least comprises a composite foam layer located on one side away from the light-emitting surface of the display panel, and the composite foam layer is arranged on one side of the display panel away from the light-emitting surface of the display panel, so that a buffering effect can be achieved, and the display panel can be effectively protected. The display module further comprises a flexible circuit board, and the flexible circuit board is arranged on one side of the display panel, which is far away from the light-emitting surface of the display panel, namely, the surface of one side of the light-emitting surface of the display panel is not provided with a structure of the flexible circuit board. The flexible circuit board comprises a plurality of first pins, the first pins are electrically connected with signal lines of a driving circuit layer of the display panel, so that signal transmission between the flexible circuit board located on one side of the light emitting surface of the display panel and the display panel is achieved, driving signals are provided for the display panel through the flexible circuit board, and normal display of the display module is achieved. The flexible circuit board is arranged at a position completely avoiding one side of the light-emitting surface of the display panel, so that the screen occupation ratio of the display area at the side of the light-emitting surface of the display panel is favorably improved, and the flexible circuit board is prevented from occupying any area at the side of the light-emitting surface of the display panel. Because the flexible circuit board is arranged on the side of the display panel, which is far away from the light-emitting surface of the display panel, compared with the pad part bending technology in the prior art, in the manufacturing process of the display module, the flexible circuit board is electrically connected with the display panel without a bending process, and only the side of the flexible circuit board, which is far away from the light-emitting surface of the display panel, is required to be manufactured, so that the flexible circuit board is electrically connected with the display panel to finish the transmission of signals, the manufacturing difficulty is favorably reduced, and the manufacturing efficiency is improved. And because the frame position of the display module in the invention does not need to reserve the bending region of the flexible circuit board, the frame of the display module can be further reduced, and the display effect of the ultra-narrow frame or the display effect close to the full-face screen can be more effectively realized.

Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A display module, comprising: the display panel comprises a display panel, a composite foam layer and a flexible circuit board, wherein the flexible circuit board and the composite foam layer are both positioned on one side away from a light-emitting surface of the display panel;

the display panel includes at least:

a substrate;

the driving circuit layer is positioned on one side of the substrate, which is far away from the composite foam layer;

the display functional layer is positioned on one side, away from the substrate, of the driving circuit layer;

the flexible circuit board comprises a plurality of first pins, the driving circuit layer comprises a plurality of signal lines, and the first pins are electrically connected with the signal lines.

2. The display module of claim 1, wherein the display panel comprises a display area and a binding area, the display panel of the binding area is separated from the display panel of the display area, and an orthographic projection of the binding area on a light-emitting surface of the display panel at least partially overlaps with an orthographic projection of the display area on a light-emitting surface of the display panel; in the direction perpendicular to the light-emitting surface of the display panel, the display panel of the binding region is positioned on one side, away from the display panel of the display region, of the composite foam layer;

the binding region comprises a plurality of conductive bonding pads, and the conductive bonding pads are attached to and electrically connected with the first pins;

the composite foam layer comprises a plurality of first through holes, the first through holes penetrate through the composite foam layer, and first conductive parts are filled in the first through holes; the substrate comprises a plurality of second through holes, the second through holes penetrate through the substrate, and second conductive parts are filled in the second through holes;

the conductive pad is electrically connected to the signal line through the first conductive part and the second conductive part.

3. The display module of claim 1,

the display panel comprises a display area and a binding area, and the binding area is positioned on one side of the display area in a direction parallel to a light-emitting surface of the display panel; the bonding region comprises a plurality of conductive pads; the orthographic projection of the composite foam layer on the light-emitting surface of the display panel is not overlapped with the binding area;

the composite foam layer comprises an inclined plane, and an included angle formed between the inclined plane and the surface of one side, facing the display panel, of the composite foam layer is an acute angle;

the flexible circuit board comprises a first area, a second area and a third area, and a plurality of first pins are positioned in the first area; first pin with bind the district the electrically conductive pad laminating electricity is connected, the second district the flexible circuit board with the inclined plane laminating is fixed, the third district the flexible circuit board with compound bubble cotton layer deviates from display panel's a side surface laminating is fixed.

4. The display module of claim 3,

the plurality of conductive bonding pads are positioned on one side of the substrate, which deviates from the driving circuit layer, the driving circuit layer of the binding region comprises a plurality of third through holes, and the signal line is electrically connected with the conductive bonding pads through the third through holes.

5. The display module of claim 3,

the included angle formed by the inclined plane and the surface of the composite foam layer facing one side of the display panel is alpha, and alpha is more than or equal to 40 degrees and less than or equal to 50 degrees.

6. The display module according to claim 3, wherein the inclined plane is coated with a waterproof glue layer, and the flexible circuit board of the second region is fixed to the inclined plane through the waterproof glue layer.

7. The display module according to claim 3, wherein the flexible circuit board comprises a first substrate and a plurality of metal conductive layers on the first substrate;

the flexible circuit board at least comprises a first sub-part and a second sub-part, and the first sub-part is positioned at the joint position of the second area and the first area; and/or the first sub-part is positioned at the position where the second area is connected with the third area;

the number of the metal conducting layers included in the first sub-portion is A, the number of the metal conducting layers included in the second sub-portion is B, A is less than B, and A and B are positive integers.

8. The display module of claim 7, wherein the first sub-portion comprises one of the metal conductive layers.

9. The display module of claim 7, wherein the first sub-portion of the first substrate is made of a transparent flexible material.

10. The display module assembly according to claim 1, further comprising a driving chip, wherein the driving chip is bonded to a side of the flexible circuit board away from the display panel.

11. A display device comprising the display module according to any one of claims 1 to 10.