CN111430406B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN111430406B CN111430406B CN202010366128.5A CN202010366128A CN111430406B CN 111430406 B CN111430406 B CN 111430406B CN 202010366128 A CN202010366128 A CN 202010366128A CN 111430406 B CN111430406 B CN 111430406B
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Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises the following components: the first substrate and the second substrate are laminated and attached, and the first edge of the first substrate is flush with the second edge of the second substrate; the first light-emitting element is positioned on one side of the first substrate far away from the second substrate; the first routing is positioned on one side of the first substrate, which is far away from the second substrate, and is used for transmitting signals; the second routing is positioned on one side of the second substrate far away from the first substrate; the connecting line is attached to the side surface of the first substrate on the first side and the side surface of the second substrate on the second side, and the second wire is connected with the first wire through the connecting line; the first substrate and the second substrate are made of glass. According to the invention, the second wiring is arranged on one side of the second substrate, so that the narrow frame of the display panel is realized, and the display quality of the display panel is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.
Background
With the continuous development of display technology, a full screen becomes a mainstream product in the display industry at present, and a larger display area needs to be used, so that a smaller non-display area is better. In order to realize the narrow frame under the normal condition among the prior art, omit the fan-out and walk the regional position of line in display panel to utilize the side to walk the line and set up electronic device such as driver chip and flexible circuit board in the one side that display panel kept away from the plain noodles, and then realize the narrow frame of display panel, but owing to having left out fan-out and walk the line district and can lead to flexible circuit board and walk the regional oversize of binding between the line, and then can lead to increasing flexible circuit board and bind the off normal risk, influence display panel's display quality.
Disclosure of Invention
In view of this, the invention provides a display panel, a manufacturing method thereof and a display device, where the second trace is disposed on a side of the second substrate away from the first substrate, so that a narrow frame of the display panel can be realized, and meanwhile, a problem of binding deviation of the flexible circuit board on the display panel can be prevented, and display quality of the display panel is improved.
In one aspect, the present invention provides a display panel comprising:
the first substrate and the second substrate are laminated and attached, and the first edge of the first substrate is flush with the second edge of the second substrate;
the first light-emitting element is positioned on one side of the first substrate far away from the second substrate;
the first routing is positioned on one side of the first substrate, which is far away from the second substrate, and is used for transmitting signals;
the second routing is positioned on one side of the second substrate far away from the first substrate;
the connecting line is attached to the side surface of the first substrate on the first side and the side surface of the second substrate on the second side, and the second wire is connected with the first wire through the connecting line; the first substrate and the second substrate are made of glass.
On the other hand, the invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a mother substrate, wherein the mother substrate is a glass substrate;
manufacturing a mother wire, wherein the mother wire is positioned on the mother substrate to form an intermediate substrate;
cutting the intermediate substrate to form a first intermediate substrate and a second intermediate substrate, wherein the mother substrate is cut into the first substrate and the second substrate, the edge of the first substrate formed by cutting is a first edge of the first substrate, the edge of the second substrate formed by cutting is a second edge of the second substrate, the mother wire is cut into a first wire and a second wire, the first intermediate substrate comprises the first substrate and a first wire positioned on the first substrate, and the second intermediate substrate comprises the second substrate and a second wire positioned on the second substrate;
the first middle substrate is attached to the second middle substrate, wherein the first wire is located on one side, far away from the second substrate, of the first substrate, the second wire is located on one side, far away from the first substrate, of the second substrate, and the first edge of the first substrate is flush with the second edge of the second substrate;
providing a connecting wire, attaching the connecting wire to the side surface of the first substrate positioned on the first side and the side surface of the second substrate positioned on the second side, wherein the second wire is connected with the first wire through the connecting wire;
and providing a first light-emitting element, and arranging the first light-emitting element on the first intermediate substrate, wherein the first light-emitting element is positioned on one side of the first substrate, which is far away from the second substrate.
In another aspect, the invention further provides a display device comprising the display panel.
Compared with the prior art, the display panel and the manufacturing method thereof provided by the invention at least realize the following beneficial effects:
the invention provides a display panel, which comprises a first substrate, a second substrate, a first wire, a second wire, a connecting wire and a second wire. Thirdly, the second wiring is arranged on one side, far away from the first substrate, of the second substrate, the first wiring and the second wiring are connected through the connecting line located on the side of the display panel, the narrow frame of the display panel can be achieved, meanwhile, due to the fact that the second wiring is located on one side of a non-light emitting area of the display panel, the wiring trend of the second wiring can be set as required, and display quality of the display panel is improved.
Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a display panel provided in the prior art;
FIG. 2 is a cross-sectional view taken along line N-N' of FIG. 1;
FIG. 3 is a schematic diagram of a display panel according to the present invention;
FIG. 4 is a cross-sectional view taken along line M-M' of FIG. 3;
FIG. 5 is a cross-sectional view taken along line M-M' of FIG. 3;
FIG. 6 is a cross-sectional view taken along line M-M' of FIG. 3;
FIG. 7 is a rear view of FIG. 3;
FIG. 8 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 9 is a rear view of FIG. 8;
FIG. 10 is a sectional view taken along line H-H' of FIG. 8;
FIG. 11 is a schematic structural diagram of another display panel provided in the present invention;
FIG. 12 is a rear view of FIG. 11;
FIG. 13 is a sectional view taken along line G-G' of FIG. 11;
FIG. 14 is a cross-sectional view of a display panel provided in accordance with the present invention;
FIG. 15 is a cross-sectional view taken along line M-M' of FIG. 3;
FIG. 16 is a schematic flow chart illustrating a method for fabricating a display panel according to the present invention;
FIG. 17 is a cross-sectional view of a process for fabricating the display panel of FIG. 16;
FIG. 18 is a schematic flow chart illustrating a method for fabricating a display panel according to yet another embodiment of the present invention;
FIG. 19 is a cross-sectional view of a process for fabricating the display panel of FIG. 18;
fig. 20 is a schematic structural diagram of a display device according to the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.
In the prior art, fig. 1 is a schematic structural diagram of a display panel in the prior art, and fig. 2 is a cross-sectional view taken along the direction N-N' in fig. 1; referring to fig. 1 and 2, a display panel 100 in the prior art includes a light emitting surface 01;
the display panel 100 further includes: the light-emitting device comprises a substrate 02, wherein the substrate 02 comprises a first side and a second side, the first side is the side of the substrate 02 close to the light-emitting surface 01, and the second side is the side of the substrate 02 far away from the light-emitting surface 01; a light emitting element 03 on a first side; the first routing line 04 is positioned on the first side and used for transmitting signals; a flexible circuit board 05 on the second side; the driving chip 06 is positioned on one side of the flexible circuit board 05 far away from the light emitting surface 01 and used for providing signals; the connecting line 07 is located on a side of the substrate 02 and is used for connecting the first trace 04 and the flexible circuit board 05.
Because the display panel 100 in the prior art is not provided with the fan-out routing area in order to implement the narrow bezel, the first routing 04 disposed on the first side 021 of the substrate 02 is only used for transmitting signals, the first routing 04 is not converged in the first direction X, and the routing width of the first routing 04 is matched with the width of the display panel 100; the connecting line 07 and the first line 04 one-to-one of walking of setting on base plate 02 side, and connecting line 07 is only used for connecting the first flexible circuit board 05 of walking on line 04 and the second side 022 on the first side 021, thereby, the width of binding between connecting line 07 and the flexible circuit board 05 and the wiring width phase-match of the first line of walking can lead to binding between flexible circuit board 05 and the connecting line 07 to distinguish too big, and then can cause the increase flexible circuit board 05 to bind the off normal risk, influence display panel 100's demonstration quality.
In order to solve the problem of binding deviation risk caused by overlarge binding area of the flexible circuit board of the display panel, the inventor carries out the following research on the display panel in the prior art: the present invention provides a display panel, and the following description will be made in detail with respect to the display panel provided by the present invention.
Fig. 3 is a schematic structural diagram of a display panel provided by the present invention, fig. 4 is a cross-sectional view taken along the direction M-M' in fig. 3, and in conjunction with fig. 3 and 4, a display panel 200 provided by the present invention includes: the substrate comprises a first substrate 1 and a second substrate 2, wherein the first substrate 1 and the second substrate 2 are laminated and attached, and a first edge 11 of the first substrate 1 is flush with a second edge 21 of the second substrate 2; a first light emitting element 3 located on one side of the first substrate 1 away from the second substrate 2; the first routing 4 is positioned on one side of the first substrate 1, which is far away from the second substrate 2, and is used for transmitting signals to the first light-emitting element 3; the second wire 5 is located on one side of the second substrate 2 away from the first substrate 1; the connecting line 6 is attached to the side surface of the first substrate 1 on the first side 11 and the side surface of the second substrate 2 on the second side 21, and the second trace 5 is connected with the first trace 4 through the connecting line 6; wherein, the materials of the first substrate 1 and the second substrate 2 are both glass.
The first substrate 1 and the second substrate 2 provided by the invention are divided into two parts by cutting the same mother substrate, the edge of the first substrate 1 formed by cutting is the first edge 11 of the first substrate 1, the edge of the second substrate 2 formed by cutting is the second edge 21 of the second substrate 2, and further, the first edge 11 of the first substrate 1 and the second edge 21 of the second substrate 2 are two connected side edges, so that the first edge 11 of the first substrate 1 and the second edge 21 of the second substrate 2 are in favor of being arranged to be flush with each other. Meanwhile, the mother traces formed on the mother substrate are cut off at the cut portion to form the first traces 4 on the first substrate 1 and the second traces 5 on the second substrate 2, and the arrangement manner of the end portions of the first traces 4 on the first side 11 of the first substrate 1 (for example, the distance between two adjacent first traces 4) is the same as the arrangement manner of the end portions of the second traces 5 on the second side 21 of the second substrate 2 (for example, the distance between two adjacent second traces 5), so that when the first side 11 of the first substrate 1 is flush with the second side 21 of the second substrate 2, the side of the first trace 4 close to the connecting line 6 and the side of the second trace 5 close to the connecting line 6 are oppositely disposed, that is, the portion of the first trace 4 connected to the connecting line 6 and the portion of the second trace 5 connected to the connecting line 6 are disposed in the same manner, the connection between the first wiring area and the connecting line 6 is convenient to implement, so that the process can be simplified, and with reference to fig. 3, the display panel 200 further includes a light emitting device setting area W, the light emitting device setting area W may include the first light emitting device 3 and a signal line (not shown in the figure) for transmitting a data signal for the first light emitting device 3, the first wiring 4 may be used to transmit a signal to the light emitting device setting area W, the first light emitting device 3 is arranged in an array in the light emitting device setting area W, the first wiring 4 may be arranged corresponding to the row of the first light emitting device 3, and since the fan-out wiring area is not provided in the first wiring area 20, the width of the first wiring area 20 in the first wiring extending direction is small, which is beneficial to implementing a narrow frame of the display panel.
It can be understood that, in the display panel 200 provided by the present invention, along the first direction X, the distance a between the two first traces 4 located at the edge matches with the distance b between the two sides of the display panel 200, and each first trace 4 is equidistantly disposed, and the first direction X intersects with the extending direction of the first trace 4; meanwhile, the second trace 5 is disposed on one side of the second substrate 2 away from the first substrate 1, that is, the second trace 5 is disposed on the backlight surface of the display panel 200, and the first trace 4 on one side of the first substrate 1 away from the second substrate 2 is guided to one side of the second substrate 2 away from the first substrate 1 by the connecting wire 6 to be connected with the second trace 5. Because the second trace 5 is disposed on the second substrate 2, the extending trend of the second trace 5 can be set on the second substrate 2 according to actual needs, that is, the binding width corresponding to the whole second trace can be adjusted by setting the arrangement mode of the second trace 5. The risk of deviation in binding of subsequent processes is reduced, and the display quality of the display panel is improved.
Fig. 4 only illustrates a case that the first substrate 1 and the second substrate 2 have the same size, and the present invention does not specifically require the size relationship between the first substrate 1 and the second substrate 2, and also refer to fig. 5, where fig. 5 is a cross-sectional view taken along the direction M-M' in fig. 3, the size of the second substrate 2 may be set smaller than that of the first substrate 1, and details are not repeated below.
With continued reference to fig. 3 and 4, optionally, the material of the first trace 4 is the same as the material of the second trace 5, for example, the material of the first trace 4 and the material of the second trace 5 are both metals. Since the first trace 4 and the second trace 5 are made of the same material, they can be formed in the same process, which is beneficial to further simplifying the process. In the present invention, the material of the first trace 4 and the second trace 5 is not specifically required, and the material that can be used for transmitting signals is within the protection scope of the present invention, and will not be described in detail below.
Optionally, the material of the connecting line 6 includes silver paste or organic material. It can be understood that, because the silver thick liquid has the curing temperature low, bonding strength is high, the electrical property is stable, be fit for characteristics such as screen printing, the material of connecting wire 6 can be the silver thick liquid, and when the material of connecting wire 6 was the silver thick liquid, because the resistivity of silver thick liquid is less, is favorable to reducing the diameter of connecting wire 6, is favorable to further realizing the narrow frame of display panel 200. Simultaneously when the material of connecting wire 6 is the silver thick liquid, can be with silver thick liquid silk screen printing on the PET substrate, make its cutting after the solidification shift to on first base plate 1 and the second base plate 2.
When the material of the connection line 6 is an organic material, the organic material may include one of polyacetylene, polypyrrole, polyaniline, and polythiophene, and the specific material selection is determined according to the actual use temperature range and the production cost, which is not limited in the present invention. When the material of the connection line 6 is an organic material, it can be manufactured by a coating process. In addition, compared with other film forming processes, such as an evaporation process and a vapor deposition process, which are often used for organic materials, the coating process has relatively low requirements on production equipment and is simple to manufacture.
Wherein, when the connecting wire 6 is connected with the first wire 4 and the second wire 5 respectively, the connecting wire 6 can be respectively at least partially overlapped with the first wire 4 and the second wire 5, and then it can be set that one end of the connecting wire 6 extends to the upper surface of the first substrate 1 and is partially overlapped with the first wire 4, and the other end extends to the lower surface of the second substrate 1 and is partially overlapped with the second wire 5, so as to ensure good electrical connection between the connecting wire 6 and the first wire 4, the second wire 5.
The material of the connecting lines 6 in the display panel of the present invention is not limited to silver paste and organic material, and it is within the scope of the present invention to connect the electronic component on the first substrate 1 and the electronic component on the second substrate 2, and the following description is omitted.
Fig. 6 is a cross-sectional view taken along the direction M-M' in fig. 3, and referring to fig. 6, the display panel 200 further includes a glue layer 7, the glue layer 7 is located between the first substrate 1 and the second substrate 2, and the first substrate 1 is attached to the second substrate 2 through the glue layer 7.
It can be understood that the material of the adhesive layer 7 may be OCA optical adhesive, and when the material of the adhesive layer 7 is OCA optical adhesive, since the OCA optical adhesive has high light transmittance, high adhesion, high weather resistance, water resistance, high temperature resistance, ultraviolet resistance, and controlled thickness, a uniform distance is provided, and the problems of yellowing, peeling and deterioration are not generated after long-term use, the light transmittance and the display quality of the display panel 200 can be improved. However, the material of the adhesive layer 7 is not limited to the OCA optical adhesive, and the materials for fully bonding the first substrate 1 and the second substrate 2 are within the protection scope of the present invention, and will not be described in detail below.
Fig. 7 is a rear view of fig. 3, fig. 8 is a schematic structural view of a further display panel according to the present invention, fig. 9 is a rear view of fig. 8, and fig. 10 is a sectional view taken along direction H-H' of fig. 8; as shown in fig. 3, 4, and 7 to 10, the display panel 200 further includes a pad 7 located on a side of the second substrate 2 away from the first substrate 1; the pad 7 is connected with the second trace 5; the second tracks 5 converge in a direction directed by the connection line 6 towards the pad 7.
Optionally, the display panel 200 further includes a flexible circuit board 8 and a driving chip 9, which are respectively bound and electrically connected to the second trace 5 and the flexible circuit board 8 through the pad 7, so as to provide various signals for the display panel 200, so that the display panel 200 can normally operate. The packaging method related to the driving chip 9 includes two types: the first method comprises the following steps: with continued reference to fig. 8 to 10, the packaging technology adopted by the driving Chip 9 is COG (Chip On Glass), in which the driving Chip 9 is directly disposed On the Glass substrate, that is, the driving Chip 9 is directly disposed On the side of the second substrate 2 away from the first substrate 1. The driver chip 9 adopting the packaging method can utilize the method provided in the prior art to perform the binding process of the driver chip 9 and the flexible circuit board 8, no additional process is needed, and the manufacturing cost of the display panel is reduced. And the second method comprises the following steps: with continued reference to fig. 3, 4 and 7, the packaging technology adopted by the driver Chip 9 is COF (Chip On Flex), and the driver Chip 9 is bound On the flexible circuit board 8. Since the driving chip 9 is bound on the flexible circuit board 8 and then bound on the second substrate 2 of the display panel, the number of the binding processes can be reduced, which is beneficial to improving the manufacturing efficiency of the display panel 200 and improving the quality of the display panel.
It can be understood that, along the direction in which the connection line 6 points to the pad 7, the second trace 5 is converged, that is, the binding area between the second trace 5 and the flexible circuit board 8 can be reduced, the binding offset risk of the flexible circuit board 8 can be reduced, and the display quality of the display panel 200 is improved; meanwhile, the second wire 5 is arranged on the second substrate 2, that is, the second wire 5 is arranged on the backlight surface of the display panel 200, so that the occupied area of the second wire on the frame area of the display panel 200 can be reduced, and the narrow frame of the display panel 200 can be realized.
Fig. 11 is a schematic structural view of another display panel provided by the present invention, fig. 12 is a rear view of fig. 11, and fig. 13 is a sectional view taken along direction G-G' in fig. 11. As shown in fig. 11 to 13, the display panel 200 further includes a second light emitting element 10 located on a side of the second substrate 2 away from the first substrate 1. The first Light Emitting element 3 and the second Light Emitting element 10 may be Micro LEDs (Micro Light Emitting diodes), which have the advantages of small size, high Light Emitting efficiency, low energy consumption, and the like, and thus the display quality of the display panel 200 can be improved and the power consumption can be reduced.
It can be understood that the display panel 200 provided by the present invention can be a double-sided display, the first light emitting element 3 is disposed on the side of the first substrate 1 away from the second substrate 2, and the second light emitting element 10 is disposed on the side of the second substrate 2 away from the first substrate 1, and the second light emitting element 10 can be electrically connected to the second trace 5 and the flexible circuit board 8, respectively, so as to implement a double-sided display. Referring to fig. 11, fig. 11 illustrates a form in which the driver chip 9 is bonded to the flexible circuit board 8. The driving chip 9 provides a display signal to the second light emitting element 10 to drive the second light emitting element to emit light, and the display panel displays the light; meanwhile, the display signal is sent to the first light emitting element 3 through the second wire 5, the connecting wire 6 and the first wire 4 to drive the first light emitting element to emit light, so that the display panel 200 can perform double-sided display.
Meanwhile, the present invention does not specifically require the positional relationship between the first light emitting element 3 and the second light emitting element 10, and the display panel 200 may realize double-sided display. The first method comprises the following steps: the orthographic projection of the first light-emitting element 3 on the plane of the first substrate 1 and the orthographic projection of the second light-emitting element 10 on the plane of the second substrate 2 are at least partially overlapped. The positions of the first light emitting element 3 and the second light emitting element 10 do not need to be aligned, so that the process can be simplified, and the manufacturing efficiency of the display panel 200 can be improved. Referring to fig. 13, fig. 13 only illustrates a case where the orthographic projection of the first light-emitting element 3 on the plane of the first substrate 1 and the orthographic projection of the second light-emitting element 10 on the plane of the second substrate 2 completely overlap. And the second method comprises the following steps: fig. 14 is a cross-sectional view of the display panel provided by the present invention, and as shown in fig. 14, an orthogonal projection of the first light-emitting element 3 on the plane of the first substrate 1 and an orthogonal projection of the second light-emitting element 10 on the plane of the second substrate 2 do not overlap. Due to the staggered arrangement of the first light emitting element 3 and the second light emitting element 10, the arrangement of the wires for driving the first light emitting element 3 and the second light emitting element 10 in the display panel 200 can be simplified, and the risk of short circuit between the driving wires is reduced.
Fig. 15 is a cross-sectional view of still another M-M' direction in fig. 3, and referring to fig. 3 and fig. 15, the display panel 200 further includes a first thin film transistor array layer 12 and a second thin film transistor array layer 22, the first thin film transistor array layer 12 is located on a side of the first substrate 1 away from the second substrate 2 and is used for driving the first light emitting device 3 to emit light, and the second thin film transistor array layer 22 is located on a side of the second substrate 2 away from the first substrate 1 and is used for driving the second light emitting device 10 to emit light. Different thin film transistor array layers are respectively arranged on different glass substrates, the first light-emitting element 3 can be controlled through the first thin film transistor array layer 12, the first light-emitting element 10 is controlled through the second thin film transistor array layer 22, the light-emitting elements can be controlled more effectively, and the display quality of the display panel 200 is improved.
With continued reference to fig. 13, in the display panel 200, the second substrate 2 includes a bonding area 23 and a display area AA, the bonding area BB is used for bonding the circuit board 8, and the second light emitting element 10 is located in the display area AA; wherein the binding area BB is located at a side of the display area AA away from the second edge 21. Meanwhile, the display panel 200 arranges the second wire 5 on one side of the second substrate 2 far away from the first substrate 1, that is, the second wire 5 is arranged on the backlight surface of the display panel 200, and the connecting wire positioned on the side edge of the display panel 200 is used for connecting the electronic element on one side of the first substrate 1 and the electronic element on one side of the second substrate 2, so that the occupied area of the second wire on the frame area of the display panel 200 can be reduced, and the narrow frame of the display panel 200 can be realized. Further, the display panel 200 can perform double-sided display while realizing a narrow bezel.
It is to be understood that, in the embodiment of the present invention, the first light emitting element and the second light emitting element may be respectively covered by the encapsulation structure.
Referring to fig. 16 and 17, fig. 16 is a schematic flow chart of a method for manufacturing a display panel according to the present invention, and fig. 17 is a cross-sectional view of a process for manufacturing the display panel shown in fig. 16.
The manufacturing method comprises the following steps:
step S101: providing a mother substrate 30, wherein the mother substrate 30 is a glass substrate;
step S102: manufacturing a mother wire 31, wherein the mother wire 31 is positioned on the mother substrate 30 to form an intermediate substrate 32;
step S103: cutting the intermediate substrate 32 to form a first intermediate substrate 33 and a second intermediate substrate 34, wherein the mother substrate 30 is cut into the first substrate 1 and the second substrate 2, the edge of the first substrate 1 formed by cutting is the first edge 11 of the first substrate 1, the edge of the second substrate 2 formed by cutting is the second edge 21 of the second substrate 2, the mother trace 31 is cut into the first trace 4 and the second trace 5, the first intermediate substrate 33 includes the first substrate 1 and the first trace 11 located on the first substrate 1, and the second intermediate substrate 34 includes the second substrate 2 and the second trace 21 located on the second substrate 2;
step S104: attaching the first intermediate substrate 33 to the second intermediate substrate 34, wherein the first trace 4 is located on one side of the first substrate 1 away from the second substrate 2, the second trace 5 is located on one side of the second substrate 2 away from the first substrate 1, and the first edge 11 of the first substrate 1 is flush with the second edge 21 of the second substrate 2;
step S105: providing a connecting wire 6, attaching the connecting wire 6 to the side surface of the first substrate 1 on the first side 11 and the side surface of the second substrate 2 on the second side 21, and connecting the second trace 5 with the first trace 4 through a connecting wire 7;
step S106: providing a first light emitting element 3, disposing the first light emitting element 3 on the first intermediate substrate 33, and the first light emitting element 3 is located on a side of the first substrate 1 away from the second substrate 2. It can be understood that, in the above manufacturing method, the mother trace is first manufactured on the mother substrate to form the intermediate substrate, and then the intermediate substrate is cut to form the first intermediate substrate and the second intermediate substrate, wherein the mother substrate is cut into the first substrate and the second substrate, the edge of the first substrate formed by cutting is the first edge of the first substrate, the edge of the second substrate formed by cutting is the second edge of the second substrate, and the mother trace is cut into the first trace and the second trace. The first wire and the second wire are originally the same wire and can be formed in the same process, so that the process is further simplified, the second wire and the first wire are in one-to-one correspondence, and the second wire close to one end of the second side edge of the second substrate is matched with the first wire, so that the route of the connecting wire can be simplified.
Meanwhile, due to the fact that the second routing is arranged on one side, away from the first substrate, of the second substrate in a cutting mode, the second routing is arranged on the backlight surface of the display panel, the electronic element on one side of the first substrate and the electronic element on one side of the second substrate are connected through the connecting line located on the side edge of the display panel 200, the occupied area of the second routing on the frame area of the display panel can be reduced, and then the narrow frame of the display panel can be achieved.
In step S106, the first light emitting device may be fabricated on the first intermediate substrate by bulk transfer, and the bulk transfer technology can achieve high uniformity and high repeatability, so that the brightness can be kept consistent no matter which angle the first light emitting device is viewed from, and the display effect of the display panel can be improved at the same time. Certainly, the first light emitting element can also be manufactured on the first intermediate substrate in a sheet-by-sheet manner, which can reduce the process difficulty, simplify the process procedure and is beneficial to improving the manufacturing efficiency of the display panel compared with a mass transfer manner.
Referring to fig. 18 and 19, fig. 18 is a schematic flow chart of a manufacturing method of another display panel provided by the present invention, and fig. 19 is a cross-sectional view of the manufacturing process of the display panel in fig. 18. The manufacturing method comprises the following steps:
step S201: providing a mother substrate 30, wherein the mother substrate 30 is a glass substrate;
step S202: manufacturing a mother wire 31, wherein the mother wire 31 is positioned on the mother substrate 30 to form an intermediate substrate 32;
step S203: cutting the intermediate substrate 32 to form a first intermediate substrate 33 and a second intermediate substrate 34, wherein the mother substrate 30 is cut into a first substrate 1 and a second substrate 2, the edge of the first substrate 1 formed by cutting is the first edge 11 of the first substrate 1, the edge of the second substrate formed by cutting is the second edge 21 of the second substrate 2, the mother wire 31 is cut into a first wire 4 and a second wire 5, the first intermediate substrate 33 includes the first substrate 1 and the first wire 11 located on the first substrate 1, and the second intermediate substrate 34 includes the second substrate 2 and the second wire 5 located on the second substrate 2;
step S204: attaching the first intermediate substrate 33 to the second intermediate substrate 34, wherein the first trace 4 is located on one side of the first substrate 1 away from the second substrate 2, the second trace 5 is located on one side of the second substrate 2 away from the first substrate 1, and the first edge 11 of the first substrate 1 is flush with the second edge 21 of the second substrate 2;
step S205: providing a connecting wire 6, attaching the connecting wire 6 to the side surface of the first substrate 1 on the first side 11 and the side surface of the second substrate 2 on the second side 21, and connecting the second wire 5 with the first wire 4 through the connecting wire 6;
step S206: providing a first light emitting element 3, disposing the first light emitting element 3 on the first intermediate substrate 33, and the first light emitting element 3 is located on a side of the first substrate 1 away from the second substrate 2. It can be understood that, in the above manufacturing method, the mother trace is first manufactured on the mother substrate to form the intermediate substrate, and then the intermediate substrate is cut to form the first intermediate substrate and the second intermediate substrate, wherein the mother substrate is cut into the first substrate and the second substrate, the edge of the first substrate formed by cutting is the first edge of the first substrate, the edge of the second substrate formed by cutting is the second edge of the second substrate, and the mother trace is cut into the first trace and the second trace. The first wire and the second wire are originally the same wire and can be formed in the same process, so that the process is further simplified, the second wire and the first wire are in one-to-one correspondence, and the second wire close to one end of the second side edge of the second substrate is matched with the first wire, so that the route of the connecting wire can be simplified.
Meanwhile, due to the fact that the second routing is arranged on one side, far away from the first substrate, of the second substrate in a cutting mode, namely the second routing is arranged on the backlight surface of the display panel, the electronic element on one side of the first substrate and the electronic element on one side of the second substrate are connected through the connecting line located on the side edge of the display panel, the occupied area of the second routing on a frame area of the display panel can be reduced, and then the narrow frame of the display panel can be achieved.
Step S207: providing a second light emitting element 10, disposing the second light emitting element 10 on the second intermediate substrate 34, and the second light emitting element 10 is located on a side of the second substrate 2 away from the first substrate 1. In step S6 and step S7, the light emitting elements are disposed on both the first intermediate substrate and the second intermediate substrate, so that the display panel can realize double-sided display. The first light-emitting element and the second light-emitting element can be manufactured on the intermediate substrate in a mass transfer mode, the mass transfer technology can achieve high consistency and high repeatability, the brightness can still be kept consistent no matter the display panel is viewed from any angle, and the display effect of the display panel can be improved at the same time. Certainly, the first light emitting element and the second light emitting element can also be manufactured on the first intermediate substrate in a sheet-by-sheet manner, so that the process difficulty can be reduced, the process procedure is simplified and the manufacturing efficiency of the display panel can be improved.
Referring to fig. 20, fig. 20 is a schematic structural diagram of a display device according to the present invention, and the display device 300 provided in the present embodiment includes the display panel 200 in the above embodiment. The embodiment of fig. 20 is only an example of a mobile phone, and the display device 300 is described, it should be understood that the display device 300 provided in the embodiment of the present invention may be other display devices 300 having a display function, such as a computer, a television, an electronic paper, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 300 provided in the embodiment of the present invention has the beneficial effects of the display panel 200 provided in the embodiment of the present invention, and specific reference may be made to the specific description of the display panel 200 in each embodiment described above, and this embodiment is not described herein again.
As can be seen from the above embodiments, the display panel, the manufacturing method thereof and the display device provided by the present invention at least achieve the following beneficial effects:
according to the display panel provided by the invention, the second wiring is arranged on one side of the second substrate far away from the first substrate, and the first wiring and the second wiring are connected by utilizing the connecting line positioned on the side edge of the display panel, so that the narrow frame of the display panel can be realized.
Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (8)
1. A method for manufacturing a display panel is characterized in that,
providing a mother substrate, wherein the mother substrate is a glass substrate;
manufacturing a mother wire, wherein the mother wire is positioned on the mother substrate to form an intermediate substrate;
cutting the intermediate substrate to form a first intermediate substrate and a second intermediate substrate, wherein the mother substrate is cut into a first substrate and a second substrate, an edge of the first substrate formed by the cutting is a first edge of the first substrate, an edge of the second substrate formed by the cutting is a second edge of the second substrate, the mother traces are cut into first traces and second traces, the first intermediate substrate includes the first substrate and the first traces located on the first substrate, and the second intermediate substrate includes the second substrate and the second traces located on the second substrate;
attaching the first intermediate substrate to the second intermediate substrate, wherein the first trace is located on one side of the first substrate far away from the second substrate, the second trace is located on one side of the second substrate far away from the first substrate, and the first edge of the first substrate is flush with the second edge of the second substrate;
providing a connecting wire, attaching the connecting wire to the side surface of the first substrate on the first side and the side surface of the second substrate on the second side, wherein the second wire is connected with the first wire through the connecting wire;
providing a first light-emitting element, and arranging the first light-emitting element on the first intermediate substrate, wherein the first light-emitting element is positioned on one side of the first substrate, which is far away from the second substrate.
2. The method of manufacturing according to claim 1,
and providing a second light-emitting element, and arranging the second light-emitting element on the second intermediate substrate, wherein the second light-emitting element is positioned on one side of the second substrate, which is far away from the first substrate.
3. The manufacturing method according to claim 2, wherein the second substrate includes a bonding area and a display area, the bonding area is used for bonding a circuit board, the second light-emitting element is located in the display area, the circuit board is located on a side of the second substrate away from the first substrate, and the second light-emitting element is electrically connected to the circuit board and the second trace respectively;
wherein the binding region is located on a side of the display region away from the second edge.
4. The manufacturing method according to claim 1, wherein a material of the first trace is the same as a material of the second trace.
5. The method according to claim 1, wherein the material of the connecting wire comprises silver paste or organic material.
6. The method of claim 1, wherein the first substrate is bonded to the second substrate by a glue layer.
7. The method of manufacturing according to claim 1, wherein the second substrate further comprises a pad on a side of the second substrate away from the first substrate;
the bonding pad is connected with the second routing;
the second trace converges in a direction from the connecting line to the pad.
8. The method according to claim 2, wherein the first substrate includes a first thin film transistor array layer located on a side of the first substrate away from the second substrate for driving the first light-emitting element to emit light, and the second substrate includes a second thin film transistor array layer located on a side of the second substrate away from the first substrate for driving the second light-emitting element to emit light.
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| CN111933666B (en) * | 2020-08-12 | 2024-02-23 | 合肥维信诺科技有限公司 | Display panel and display device |
| US20230043951A1 (en) * | 2020-09-07 | 2023-02-09 | Boe Technology Group Co., Ltd. | Array substrate and manufacturing method therefor, display panel, and backlight module |
| CN112309270A (en) * | 2020-10-23 | 2021-02-02 | Tcl华星光电技术有限公司 | Display module and preparation method thereof |
| CN113299704B (en) * | 2021-05-10 | 2022-11-08 | 武汉华星光电技术有限公司 | Display panel and preparation method thereof |
| CN113488577A (en) * | 2021-06-25 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN113629067A (en) * | 2021-07-16 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | Display panel and side binding method thereof |
| CN113555379B (en) * | 2021-07-26 | 2023-12-26 | 北京京东方光电科技有限公司 | Display panel, preparation method thereof and display device |
| CN115793303A (en) * | 2021-09-09 | 2023-03-14 | 深超光电（深圳）有限公司 | Display device and thin film transistor array substrate |
| CN116381996A (en) * | 2023-06-02 | 2023-07-04 | 惠科股份有限公司 | Display panel, manufacturing method thereof and display device |
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