CN114596777A - Display module and mobile terminal - Google Patents
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- CN114596777A CN114596777A CN202210201408.XA CN202210201408A CN114596777A CN 114596777 A CN114596777 A CN 114596777A CN 202210201408 A CN202210201408 A CN 202210201408A CN 114596777 A CN114596777 A CN 114596777A
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The embodiment of the application provides a display module and a mobile terminal, wherein the display module comprises a display panel and a plurality of chip on films which are positioned on one side of the display panel and are bound and connected with the display panel, each chip on film comprises a flexible substrate, a plurality of input terminals which are positioned at the first end of the flexible substrate far away from the display panel and a plurality of output terminals which are positioned at the second end of the flexible substrate close to the display panel, wherein in the first direction, the size of the first end of the flexible substrate is smaller than that of the second end of the flexible substrate, and the first direction is vertical to the direction from the display panel to the chip on film; the display module increases the distance between the first ends of two adjacent flip chips by enabling the first end of the flexible substrate in the flip chip to be smaller than the second end of the flexible substrate, so that more flip chips can be bound on the printed circuit board electrically connected with the input terminal, and the space utilization rate of the flip chips is further improved.
Description
Technical Field
The application relates to the field of display, in particular to a display module and a mobile terminal.
Background
With the development of display technology, people increasingly strongly demand high contrast, high resolution, narrow frame and thinness of display screens, and the resolution of the display screens is gradually improved. Generally, a data signal of the driving Chip is transmitted to the display screen by a mode of binding and connecting a Chip On Film (COF) and the display screen, which is beneficial to the design of a narrow frame of the display screen. However, as the resolution of the display screen increases, more and more data signals are required to charge the thin film transistors. Compared with 55 inch 4K products, 55 inch 8K products have higher resolution, require more COF drivers, and need to bind more COFs with the same panel size, so that the problem of insufficient space for COF binding often occurs when the 55 inch 8K products are applied to 8K ultra-high definition products.
A driver chip is usually bonded to a COF, an output terminal of the COF is connected to a display panel, and an input terminal of the COF is connected to a PCB (printed circuit Board). However, in the 55 inch 8K display product, 24 COFs are required, each COF is 42mm wide, and according to the minimum clip size specified by production or customers, the required spacing between two adjacent COFs close to one side of the printed circuit board is greater than or equal to 10mm, so that the total size required for putting down the 24 COFs is 1248mm, which is much greater than 1209.8mm of the size of the glass substrate in the 55 inch 8K display product. 55 inch 8K display products cannot be produced according to the conventional COF design.
Therefore, a display module and a mobile terminal are needed to solve the above technical problems.
Disclosure of Invention
The embodiment of the application provides a display module and a mobile terminal, which can solve the technical problem that the binding space of a conventional flip chip film in a high-resolution product is insufficient.
The embodiment of the application provides a display module, which comprises a display panel and a plurality of chip on films positioned on one side of the display panel, wherein the chip on films are bound and connected with the display panel; the chip on film comprises a flexible substrate, a plurality of input terminals and a plurality of output terminals, wherein the input terminals are positioned at a first end of the flexible substrate, which is far away from the display panel, and the output terminals are positioned at a second end of the flexible substrate, which is close to the display panel;
in a first direction, the size of the first end of the flexible substrate is smaller than that of the second end of the flexible substrate, and the first direction is perpendicular to the direction from the display panel to the chip on film.
Optionally, in some embodiments of the present application, a pitch of two adjacent output terminals is smaller than a pitch of two adjacent input terminals.
Optionally, in some embodiments of the present application, the flip chip film includes a plurality of input terminal sets arranged along a first direction, and the input terminal set includes a plurality of input terminals arranged along a second direction;
the first direction is parallel to the direction from the display panel to the chip on film, and the second direction is perpendicular to the first direction.
Optionally, in some embodiments of the present application, the input terminals in two adjacent input terminal groups are arranged in a staggered manner.
Optionally, in some embodiments of the present application, the flexible substrate further includes a transition portion disposed between the first end and the second end;
wherein, the side edge of the transition part and the first end or/and the second end of the flexible substrate form an included angle of 125-145 degrees.
Optionally, in some embodiments of the present application, a distance between the first ends of two adjacent flip chips is a first distance, and a distance between the second ends of two adjacent flip chips is a second distance;
wherein the first pitch is greater than the second pitch.
Optionally, in some embodiments of the present application, the first pitch is greater than or equal to 10mm, and the second pitch is greater than or equal to 5 mm.
Optionally, in some embodiments of the present application, the display module further includes at least two first printed circuit boards, and the first printed circuit boards are electrically connected to the input terminals on the plurality of flip chips;
the number of the flip chip films bound on each first printed circuit board is the same.
Optionally, in some embodiments of the present application, the chip on film further includes at least one driving chip, a first end of the driving chip is electrically connected to the plurality of input terminals, and a second end of the driving chip is electrically connected to the plurality of output terminals.
Correspondingly, this application embodiment still provides a mobile terminal, including terminal subject and as above any one the display module assembly, terminal subject with the display module assembly makes up as an organic whole.
The embodiment of the application provides a display module and a mobile terminal, wherein the display module comprises a display panel and a plurality of chip on films positioned on one side of the display panel, the chip on films are bound and connected with the display panel, each chip on film comprises a flexible substrate, a plurality of input terminals positioned at a first end of the flexible substrate, which is far away from the display panel, and a plurality of output terminals positioned at a second end of the flexible substrate, which is close to the display panel, wherein in a first direction, the size of the first end of the flexible substrate is smaller than that of the second end of the flexible substrate, and the first direction is perpendicular to the direction from the display panel to the chip on films; according to the display module, the size of the first end of the flexible substrate in the chip on film is smaller than that of the second end of the flexible substrate, so that the distance between the first ends of two adjacent chip on films is increased, a printed circuit board electrically connected with the input terminal can be bound with a larger number of chip on films, the space utilization rate of the chip on films is improved, and the problem that the binding space of the chip on films in a high-resolution display product is insufficient is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a chip on film in a first display module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second flip chip on film in a display module according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application aims at the technical problem that the binding space of the conventional chip on film in a high-resolution product is insufficient, and the technical problem can be improved.
The technical solution of the present application will now be described with reference to specific embodiments.
Referring to fig. 1 to 3, an embodiment of the present invention provides a display module 100, including a display panel 10 and a plurality of flip chips 20 located on one side of the display panel 10, wherein the flip chips 20 are bound to the display panel 10; the flip-chip film 20 includes a flexible substrate 21, a plurality of input terminals 2111 located at a first end 211 of the flexible substrate 21 away from the display panel 10, and a plurality of output terminals 2121 located at a second end 212 of the flexible substrate 21 close to the display panel 10;
in a first direction D1, a dimension of the first end 211 of the flexible substrate 21 is smaller than a dimension of the second end 212 of the flexible substrate 21, and the first direction D1 is perpendicular to a direction from the display panel 10 to the flip-chip film 20.
The display module 100 provided in the embodiment of the present application increases the distance between the first ends 211 of the two adjacent flip chips 20 by making the size of the first ends 211 of the flexible substrates 21 smaller than the size of the second ends 212 of the flexible substrates 21 in the flip chips 20, so that more flip chips 20 can be bound on the first printed circuit board 30 electrically connected to the input terminals 2111, thereby improving the space utilization of the flip chips 20 and solving the problem of insufficient binding space of the flip chips 20 in a high resolution display product.
The technical solution of the present application will now be described with reference to specific embodiments.
Example one
As shown in fig. 1, a schematic structural diagram of a display module 100 provided in the embodiment of the present application is shown; the display module 100 includes a display panel 10 and a plurality of flip-chip films 20 located on one side of the display panel 10, wherein the flip-chip films 20 are bound to the display panel 10.
In this embodiment, the display panel 10 includes a display area 102 and a non-display area 101, the non-display area 101 is provided with a binding area 1011, the binding area 1011 includes a plurality of binding terminals, and the plurality of binding terminals are used for binding with a plurality of flip chips 20 in a one-to-one correspondence manner.
Wherein the plurality of binding terminals may be arranged in the same row along the edge of the non-display area 101.
Further, the display module 100 further includes at least two first printed circuit boards 30, one end of the flip-chip film 20 is bound to the display panel 10, and the other end of the flip-chip film 20 is bound to each of the first printed circuit boards 30. The plurality of flip-chip films 20 are electrically connected to the same second printed circuit board 50 through two first printed circuit boards 30 in a divisible manner.
Each of the first printed circuit boards 30 is electrically connected to the external second printed circuit board 50 through a Flexible Flat Cable (FFC) 40, and the number of the flip chips 20 bonded to each of the first printed circuit boards 30 is the same.
In the embodiment of the present application, the first printed circuit board 30 is a source driver circuit board, and the second printed circuit board 50 is a control driver circuit board; the second printed circuit board 50 is used for transmitting signals to signal lines in the display panel 10 through the first printed circuit board and the flip chip film 20.
In the embodiment of the present application, the display module 100 is applied to a 55 inch 8K resolution display, and according to actual production requirements, as shown in fig. 1, the edge distance between the first printed circuit board 30 and the side close to the display panel 10 must be greater than or equal to 5 mm; the distance between two adjacent first printed circuit boards 30 must be greater than or equal to 5 mm; the edge distance between the chip on film 20 at the outermost side and the first printed circuit board 30 must be greater than or equal to 5 mm; the length of the first printed circuit board 30 is less than or equal to 600 mm; the length dimension of the display panel 10 is 1209.8 mm.
Fig. 2 is a schematic structural diagram of a second flip-chip film 20 in a display module 100 according to an embodiment of the invention; the flip-chip film 20 includes a flexible substrate 21, a plurality of input terminals 2111 located at a first end 211 of the flexible substrate 21 away from the display panel 10, and a plurality of output terminals 2121 located at a second end 212 of the flexible substrate 21 close to the display panel 10;
in a first direction D1, a dimension of the first end 211 of the flexible substrate 21 is smaller than a dimension of the second end 212 of the flexible substrate 21, and the first direction D1 is perpendicular to a direction from the display panel 10 to the flip-chip film 20.
In the embodiment of the present application, the chip on film 20 further includes at least one driving chip 22, the first end 211 of the driving chip 22 is electrically connected to the plurality of input terminals 2111, and the second end 212 of the driving chip 22 is electrically connected to the plurality of output terminals 2121.
Furthermore, each of the flip-chip films 20 integrates at least two driving chips 22, which can reduce the number of the flip-chip films 20 bound on the first printed circuit board 30 to a limited extent, thereby improving the space utilization of the flip-chip films 20 to a certain extent and solving the problem of insufficient binding space of the flip-chip films 20.
Preferably, the arrangement direction of the two (or more) driver chips 22 is bound to the arrangement direction of the plurality of output terminals 2121, which is favorable for the wiring design of electrically connecting the driver chips 22 and the plurality of output terminals 2121, and avoids mutual interference between the respective wirings.
Preferably, the driving chip 22 may be a source driving chip 22 for inputting a driving signal to the display panel 10, and in other embodiments, the driving chip 22 may be a gate driving chip 22 for inputting a scanning signal to the display panel 10.
In the embodiment of the present application, the pitch between two adjacent output terminals 2121 is smaller than the pitch between two adjacent input terminals 2111. This is because the number of electrical signals (about 1100) connected to the second end 212 of the flip-chip film 20 is much larger than the number of electrical signals (about 100) connected to the first end 211 of the flip-chip film 20. Therefore, when the size of the first end 211 of the flexible substrate 21 is not different from the size of the second end 212 of the flexible substrate 21, the pitch between two adjacent output terminals 2121 is smaller than the pitch between two adjacent input terminals 2111.
Since the number of the input terminals 2111 is much smaller than the number of the output terminals 2121, the width of the input terminals 2111 may be larger than the width of the output terminals 2121.
In the embodiment of the present application, the flexible substrate 21 further includes a transition portion 213 disposed between the first end 211 and the second end 212; an included angle θ between the side of the transition portion 213 and the first end 211 or/and the second end 212 of the flexible substrate 21 is 125 ° to 145 °. Preferably, an angle θ between the side of the transition portion 213 and the first end 211 or/and the second end 212 of the flexible substrate 21 is 135 °. By such an arrangement, the actual use toughness of the corresponding width reduction region is not lost when the flexible substrate 21 is bent, and the risk of tearing the flexible substrate 21 when the flexible substrate is bent is further prevented.
In the embodiment of the present application, the distance between the first ends 211 of two adjacent flip chips 20 is a first distance, and the distance between the second ends 212 of two adjacent flip chips 20 is a second distance;
wherein the first pitch is greater than the second pitch.
Further, the first pitch is greater than or equal to 10 mm; the second pitch is greater than or equal to 5 mm. The design is that the first distance between the first printed circuit board 30 and the chip on film 20 is greater than or equal to 10mm according to the design requirement of production; when the first pitch is too small, a first flexible flat cable row connecting the input terminals 2111 on the chip on film 20 and a second flexible flat cable row connecting the input terminals 2111 on the chip on film 20 adjacent to the first flexible flat cable row interfere with each other in terms of wiring.
For a display product with 55 inches and 8K resolution, 24 flip chips 20 are required, and each flip chip 20 has a size of 42mm in the first direction D1. According to the minimum buckle size required by production, the distance between the first ends 211 of two adjacent flexible substrates 21 is required to be at least 10 mm. When the size of the first end 211 of the flexible substrate 21 is equal to the size of the second end 212 of the flexible substrate 21, the size of 24 flip-chip films 20 to be laid down on the side of the display module 100 away from the display panel 10 is at least greater than (42+10) × 24 ═ 1248mm, which is greater than the size (1209.8mm) of the display panel 10.
In the embodiment of the present application, since the size of the first end 211 of the flexible substrate 21 is smaller than the size of the second end 212 of the flexible substrate 21, the first direction D1 is perpendicular to the direction from the display panel 10 to the flip-chip film 20. The size of the second end 212 is 42mm, so that the size of the first end 211 is smaller than 42mm, and on the premise that the display module 100 binds 24 flip chips 20, the distance between the first ends 211 of two adjacent flexible substrates 21 is at least greater than or equal to 10mm, thereby improving the technical problem that the binding space of the flip chips 20 in a high-resolution product is insufficient.
Meanwhile, according to the minimum snap size required by production, the distance between the second ends 212 of two adjacent flexible substrates 21 is required to be at least 5 mm. The size of 24 flip-chip films 20 that are laid down on the side of the display module 100 close to the display panel 10 is at least greater than (42+5) × 24 ═ 1128mm, which is smaller than the size (1209.8mm) of the display panel 10. At this time, the bonding space of the chip on film 20 is sufficient.
In the embodiment of the present application, the material of the flexible substrate 21 may be one of colorless Polyimide (PI), Polycarbonate (PC), Polynorbornene (PNB), and polyethylene terephthalate (PET). The flexible substrate 21 is a film stack structure, the thickness range of the flexible substrate 21 is 0.02-0.2mm, further, the thickness range of the flexible substrate 21 is 0.05-0.18mm, and may also be specifically 0.11mm, 0.15mm, and the like, which is not further limited herein.
In the embodiment of the present application, the output terminals 2121 of the chip on film 20 are arranged in a same row along the second end 212 of the flexible substrate 21, and the input terminals 2111 of the chip on film 20 are arranged in a same row along the first end 211 of the flexible substrate 21.
To solve the technical problem of insufficient binding space of the conventional flip-chip 20 in a high-resolution product, an embodiment of the present invention provides a display module 100, where the display module 100 includes a display panel 10 and a plurality of flip-chip 20 located on one side of the display panel 10, the flip-chip 20 is bound to the display panel 10, the flip-chip 20 includes a flexible substrate 21, a plurality of input terminals 2111 located at a first end 211 of the flexible substrate 21 away from the display panel 10, and a plurality of output terminals 2121 located at a second end 212 of the flexible substrate 21 close to the display panel 10, where in a first direction D1, a size of the first end 211 of the flexible substrate 21 is smaller than a size of the second end 212 of the flexible substrate 21, and the first direction D1 is perpendicular to a direction from the display panel 10 to the flip-chip 20, the output terminals 2121 of the chip on film 20 are arranged in the same row along the second end 212 of the flexible substrate 21, and the input terminals 2111 of the chip on film 20 are arranged in the same row along the first end 211 of the flexible substrate 21; in the display module 100, the size of the first end 211 of the flexible substrate 21 in the flip chip film 20 is smaller than the size of the second end 212 of the flexible substrate 21, so that the distance between the first ends 211 of two adjacent flip chip films 20 is increased, and a larger number of flip chip films 20 can be bound on the printed circuit board electrically connected with the input terminal 2111, thereby improving the space utilization rate of the flip chip films 20 and solving the problem of insufficient binding space of the flip chip films 20 in a high-resolution display product.
Example two
Fig. 3 is a schematic structural diagram of a second flip-chip film 20 in a display module 100 according to an embodiment of the invention; the structure of the flip-chip on film 20 in the display module 100 in the second embodiment of the present application is the same as or similar to the structure of the flip-chip on film 20 in the display module 100 in the first embodiment of the present application, except that the flip-chip on film 20 includes a plurality of input terminal sets arranged along the first direction D1, and one of the input terminal sets includes a plurality of input terminals 2111 arranged along the second direction;
the first direction D1 is parallel to the direction from the display panel 10 to the flip-chip film 20, and the second direction is perpendicular to the first direction D1.
Further, the input terminals 2111 in two adjacent input terminal groups are arranged in a staggered manner.
Compared with the first embodiment of the present application, in the first embodiment of the present application, by arranging the plurality of input terminals 2111 in multiple rows, on one hand, the width required when the chip on film 20 is bound with the first printed circuit board 30 can be reduced, the problem of insufficient binding space of the chip on film 20 of a high-resolution product is solved, and on the other hand, the manufacturing cost of the chip on film 20 can be saved.
Meanwhile, since the input terminals 2111 in two adjacent input terminal groups are arranged in a staggered manner, and a trace needs to be arranged between the input terminal 2111 in each row and the driving chip 22 electrically connected thereto, a wiring space needs to be provided for the input terminal 2111 connected to each row. In order to avoid the wirings connected to the input terminals 2111 of each row from interfering with each other, the input terminals 2111 of each row may be arranged with a shift.
In order to solve the technical problem that the bonding space of the flip chip 20 in the high resolution product is insufficient by using the conventional design, the embodiment of the present application provides a display module 100, where the display module 100 includes a display panel 10 and a plurality of flip chips 20 located on one side of the display panel 10, the flip chips 20 are bonded to the display panel 10, the flip chips 20 include a flexible substrate 21, a plurality of input terminals 2111 located at a first end 211 of the flexible substrate 21 far away from the display panel 10, and a plurality of output terminals 2121 located at a second end 212 of the flexible substrate 21 close to the display panel 10, where in a first direction D1, a size of the first end 211 of the flexible substrate 21 is smaller than a size of the second end 212 of the flexible substrate 21, and the first direction D1 is perpendicular to a direction from the display panel 10 to the flip chip 20, the flip-chip film 20 includes a plurality of input terminal sets arranged along a first direction D1, one of the input terminal sets includes a plurality of input terminals 2111 arranged along a second direction, the first direction D1 is parallel to the direction from the display panel 10 to the flip-chip film 20, and the second direction is perpendicular to the first direction D1; in the display module 100, the size of the first end 211 of the flexible substrate 21 in the chip on film 20 is smaller than the size of the second end 212 of the flexible substrate 21, so that the distance between the first ends 211 of two adjacent chip on films 20 is increased, and thus a greater number of chip on films 20 can be bound on the printed circuit board electrically connected to the input terminal 2111, thereby improving the space utilization rate of the chip on film 20 and solving the problem of insufficient binding space of the chip on film 20 in a high-resolution display product.
In the above embodiment of the present application, under the condition that the bonding width between the chip on film 20 and the display panel 10 is not changed, the bonding width between the chip on film 20 and the first printed circuit board 30 is reduced to satisfy various fastening sizes (the distance between the first ends 211 of the two adjacent flexible substrates 21 is at least 10mm) that the first printed circuit board 30 needs to satisfy in actual production, so that the space utilization rate of the chip on film 20 is improved, and the problem of insufficient bonding space of the chip on film 20 in a high-resolution display product is solved.
In the above embodiments of the present application, the width of the flip chip 20 is not completely reduced, and from the design point of view, the number of signals transmitted by the input terminals 2111 bound to the first printed circuit board 30 by the flip chip 20 is less than 100, and the line width of each input signal line occupies sufficient space, so that the bound width of the flip chip 20 and the first printed circuit board 30 can be reduced without affecting the performance; the number of signals transmitted by the output terminals 2121 bound between the chip on film 20 and the display panel 10 is about 1100, and the space occupied by the line width of each output signal line is insufficient, which may not reduce the binding width between the chip on film 20 and the display panel 10.
The display panel 10 mentioned in the above embodiments of the present application includes, but is not limited to, one of a liquid crystal display panel 10 and an organic light emitting diode display panel 10.
Correspondingly, the embodiment of the application further provides a mobile terminal, the mobile terminal comprises a terminal main body and the spliced display panel 10 as described in any one of the above, and the terminal main body and the display panel 10 are combined into a whole. The mobile terminal may be a mobile phone, a computer, an intelligent wearable display device, and the like, which is not particularly limited in this embodiment.
The embodiment of the present application provides a display module 100, the display module 100 includes a display panel 10 and a plurality of flip-chip films 20 located on one side of the display panel 10, the flip-chip films 20 are bound to the display panel 10, the flip-chip films 20 include a flexible substrate 21, a plurality of input terminals 2111 located at a first end 211 of the flexible substrate 21 away from the display panel 10, and a plurality of output terminals 2121 located at a second end 212 of the flexible substrate 21 close to the display panel 10, wherein, in a first direction D1, a size of the first end 211 of the flexible substrate 21 is smaller than a size of the second end 212 of the flexible substrate 21, and the first direction D1 is perpendicular to a direction from the display panel 10 to the flip-chip films 20; in the display module 100, the size of the first end 211 of the flexible substrate 21 in the flip chip film 20 is smaller than the size of the second end 212 of the flexible substrate 21, so that the distance between the first ends 211 of two adjacent flip chip films 20 is increased, and a larger number of flip chip films 20 can be bound on the printed circuit board electrically connected with the input terminal 2111, thereby improving the space utilization rate of the flip chip films 20 and solving the problem of insufficient binding space of the flip chip films 20 in a high-resolution display product.
The display module 100 and the mobile terminal provided in the embodiments of the present application are described in detail above, and specific examples are applied in this document to explain the principles and embodiments of the present application, and the description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display module is characterized by comprising a display panel and a plurality of chip on films positioned on one side of the display panel, wherein the chip on films are bound and connected with the display panel; wherein, the chip on film includes:
a flexible substrate;
a plurality of input terminals located at a first end of the flexible substrate away from the display panel;
a plurality of output terminals located at the second end of the flexible substrate close to the display panel;
in a first direction, the size of the first end of the flexible substrate is smaller than that of the second end of the flexible substrate, and the first direction is perpendicular to the direction from the display panel to the chip on film.
2. The display module according to claim 1, wherein the distance between two adjacent output terminals is smaller than the distance between two adjacent input terminals.
3. The display module of claim 1, wherein the COF comprises a plurality of input terminal sets arranged along a first direction, and the input terminal set comprises a plurality of input terminals arranged along a second direction;
the first direction is parallel to the direction from the display panel to the chip on film, and the second direction is perpendicular to the first direction.
4. The display module of claim 3, wherein the input terminals of two adjacent input terminal sets are arranged in a staggered manner.
5. The display module of claim 1, wherein the flexible substrate further comprises a transition portion disposed between the first end and the second end;
wherein, the side edge of the transition part and the first end or/and the second end of the flexible substrate form an included angle of 125-145 degrees.
6. The display module according to claim 1, wherein the first ends of two adjacent flip-chip films are spaced at a first distance, and the second ends of two adjacent flip-chip films are spaced at a second distance;
wherein the first pitch is greater than the second pitch.
7. The display module of claim 6, wherein the first pitch is greater than or equal to 10mm and the second pitch is greater than or equal to 5 mm.
8. The display module according to claim 1, wherein the display module further comprises at least two first printed circuit boards electrically connected to the input terminals on the plurality of flip-chip films;
the number of the flip chip films bound on each first printed circuit board is the same.
9. The display module as claimed in claim 1, wherein the COF further comprises at least one driving chip, a first end of the driving chip is electrically connected to the plurality of input terminals, and a second end of the driving chip is electrically connected to the plurality of output terminals.
10. A mobile terminal, comprising a terminal body and the display module according to any one of claims 1 to 9, wherein the terminal body and the display module are integrated.
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| CN202210201408.XA CN114596777A (en) | 2022-03-03 | 2022-03-03 | Display module and mobile terminal |
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| CN115206187A (en) * | 2022-07-04 | 2022-10-18 | Tcl华星光电技术有限公司 | Chip on film set |
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| CN111176037A (en) * | 2020-02-26 | 2020-05-19 | 深圳市华星光电半导体显示技术有限公司 | Flip chip film set, flip chip film set binding method and display device |
| CN111179755A (en) * | 2020-01-03 | 2020-05-19 | 京东方科技集团股份有限公司 | Chip packaging structure and display device |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
| CN113260142A (en) * | 2021-05-18 | 2021-08-13 | 武汉天马微电子有限公司 | Chip on film, display module and display device |
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| CN111179755A (en) * | 2020-01-03 | 2020-05-19 | 京东方科技集团股份有限公司 | Chip packaging structure and display device |
| CN111176037A (en) * | 2020-02-26 | 2020-05-19 | 深圳市华星光电半导体显示技术有限公司 | Flip chip film set, flip chip film set binding method and display device |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
| CN113260142A (en) * | 2021-05-18 | 2021-08-13 | 武汉天马微电子有限公司 | Chip on film, display module and display device |
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| CN115206187A (en) * | 2022-07-04 | 2022-10-18 | Tcl华星光电技术有限公司 | Chip on film set |
| CN115206187B (en) * | 2022-07-04 | 2024-02-06 | Tcl华星光电技术有限公司 | Flip chip film set |
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