CN103917039B - A kind of flexible circuit board, method of attaching and liquid crystal display die set with backlight assembly - Google Patents
A kind of flexible circuit board, method of attaching and liquid crystal display die set with backlight assembly Download PDFInfo
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- CN103917039B CN103917039B CN201310248139.3A CN201310248139A CN103917039B CN 103917039 B CN103917039 B CN 103917039B CN 201310248139 A CN201310248139 A CN 201310248139A CN 103917039 B CN103917039 B CN 103917039B
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Abstract
Method of attaching and liquid crystal display die set the invention discloses a kind of flexible circuit board, with backlight assembly, including：Pass through the recessing in the not element area of the base material side of flexible circuit board, two-sided tape or gelatinous binding agent are contained in the groove of flexible circuit board, and be pasted together the flexible circuit board with backlight assembly by the two-sided tape or gelatinous binding agent, it is thinned the gross thickness of liquid crystal display die set.
Description
Technical field
The present invention relates to liquid crystal display die set field, more particularly to a kind of flexible circuit board, the stickup side with backlight assembly
Method and liquid crystal display die set.
Background technology
Liquid crystal display（Liquid Crystal Display, LCD）Be it is a kind of by liquid crystal display panel, driving chip,
Polaroid, flexible circuit board（Flexible Printed Circuit, FPC）With the dress together with the Standard such as backlight assembly
Put, wherein, flexible circuit board and backlight assembly are pasted together by two-sided tape.In the viscous of flexible circuit board and backlight assembly
During patch, two-sided tape can be adhered to the surface of flexible circuit board or be adhered to the surface of backlight assembly, and utilization is two-sided
Flexible circuit board and backlight assembly are pasted together by the stickiness of adhesive tape itself.
As shown in Figure 1, it is the side view of conventional flex wiring board, from figure 1 it appears that flexible circuit board includes base material
11st, it is compounded in the protection of the conductive layer 12 in the outside of base material 11, the adhesive phase 13 in the outside of conductive layer 12 and the outside of adhesive phase 13
Layer 14.Under normal conditions, two-sided tape can be adhered directly to the surface of flexible circuit board, be respectively double as shown in Fig. 2 a, 2b
Face adhesive tape 16 is adhered to the side view and front view of flexible circuitry plate surface.
Certainly, two-sided tape can also be adhered to the surface of backlight assembly according to the shape of flexible circuit board, such as Fig. 3 institutes
Show, be shape of the two-sided tape 16 according to flexible circuit board（L-type as shown in Figure 3）It is adhered to the main view on backlight assembly surface
Figure.
When flexible circuit board and backlight assembly are assembled, two-sided tape be located at flexible circuit board and backlight assembly it
Between, flexible circuit board and backlight assembly are pasted together using the stickiness of two-sided tape itself, as shown in figure 4, being backlight group
The side view of liquid crystal display die set when part 15 and flexible circuit board 17 are pasted together by two-sided tape 16.
In the structure shown in figure 4, the thickness of backlight assembly 15, the thickness of flexible circuit board 17 and two-sided tape 16
Thickness be overlapped mutually together, that is to say, that in the way of shown in Fig. 4, it is assumed that the thickness of backlight assembly 15 for A,
The thickness of flexible circuit board 17 is T, the thickness of two-sided tape 16 is X, then backlight assembly 15 passes through two-sided tape 16 and flexible wires
Gross thickness Y=A+T+X of liquid crystal display die set when road plate 17 is pasted together.
In the structure of flexible circuit board as shown in Figure 1, it is assumed that the thickness of base material 11 is T1, the thickness of conductive layer 12 is
T2, the thickness of adhesive phase 13 are T3, the thickness of protective layer 14 is T4, then thickness T=T4+T3+T2+T1+T2 of flexible circuit board
+T3+T4.Therefore, the thickness of thickness+flexible circuit board of liquid crystal display die set gross thickness Y=backlight assembly as shown in Figure 4+bis-
Thickness=A+T+X=A+ (T4+T3+T2+T1+T2+T3+T4)+X of face adhesive tape, the thickness of flexible circuit board and the thickness of two-sided tape
The sum of degree Z=T+X=T4+T3+T2+T1+T2+T3+T4+X.
As can be seen from the above description, the liquid crystal display die set thickness that current flexible circuit board is pasted together with backlight assembly
It is thicker, it is necessary to find a kind of mode of thinned liquid crystal display die set gross thickness.
The content of the invention
Method of attaching and liquid crystal display die set an embodiment of the present invention provides a kind of flexible circuit board, with backlight assembly,
To solve when flexible circuit board existing in the prior art and backlight assembly are pasted together liquid crystal display die set gross thickness compared with
The problem of thick.
A kind of flexible circuit board, including base material, the conductive layer and protective layer that are covered in substrate surface, wherein, the flexibility
Wiring board includes element region and not element area, is formed in the not element area fluted.
The flexible circuit board is additionally included in the first adhesive phase between the protective layer and the conductive layer, described recessed
Gross thickness of the depth of groove no more than the conductive layer of base material side, first adhesive phase and protective layer.
Specifically, the depth of the groove is the thickness of the protective layer of base material side；Or the depth of the groove is base
The protective layer of material side and the gross thickness of first adhesive phase；Or the depth of the groove for base material side protective layer, the
The gross thickness of one adhesive phase and conductive layer.
The flexible circuit board is additionally included in first adhesive phase between the protective layer and the conductive layer and in institute
The second adhesive phase between base material and the conductive layer is stated, the depth of the groove is not more than the second adhesive of base material side
Layer, conductive layer, the gross thickness of first adhesive phase and protective layer.
Specifically, the depth of the groove is the thickness of the protective layer of base material side；Or the depth of the groove is base
The protective layer of material side and the gross thickness of first adhesive phase；Or the depth of the groove for base material side protective layer, the
The gross thickness of one adhesive phase and conductive layer；Or the depth of the groove is the protective layer of base material side, first adhesive phase,
The gross thickness of conductive layer and second adhesive phase.
When the groove is used to house two-sided tape, the depth of the groove is less than the thickness of the two-sided tape.
The groove of the flexible circuit board is distributed or in continuous island in island in not element area border area
Distribution or the groove of the whole border area of covering；
Alternatively, the groove of the flexible circuit board is to be distributed in island in the non-border area in not element area or be in
The groove of the whole non-border area of continuous island distribution or covering；
Alternatively, the groove of the flexible circuit board is groove in not element area border area and in non-edge area
Groove in domain, the groove in not element area border area refer in not element area border area in island point
Cloth or the groove that whole border area is distributed or covered in continuous island；Groove in the non-border area in not element area is
Refer to and be distributed in island in the non-border area in not element area or be distributed in continuous island or cover whole non-border area
Groove；
Alternatively, the groove covers the whole not element area of flexible circuit board.
The base material is Kapton or polyester film；
The conductive layer is layers of copper；
The first adhesive phase and second adhesive phase are acrylate layer or epoxy resin layer or silica gel layer.
A kind of method of attaching of flexible circuit board and backlight assembly, the described method includes：
Two-sided tape or gelatinous binding agent are contained in the groove of flexible circuit board；
Backlight assembly is pasted together by the two-sided tape or gelatinous binding agent with the flexible circuit board.
A kind of liquid crystal display die set, including：
Flexible circuit board and backlight assembly, wherein housing two-sided tape or gelatinous in the groove of the flexible circuit board
Binding agent, the flexible circuit board and the backlight assembly are pasted together.
The present invention has the beneficial effect that：
The scheme of the embodiment of the present invention can be incited somebody to action double by the recessing in the not element area of the base material side of flexible circuit board
Face adhesive tape or gelatinous binding agent are contained in the groove of flexible circuit board, and the flexible circuit board are passed through described two-sided
Adhesive tape or gelatinous binding agent are pasted together with backlight assembly, are thinned flexible circuit board and are pasted together with backlight assembly
When liquid crystal display die set gross thickness.
Brief description of the drawings
Fig. 1 is the side view of flexible circuit board in background technology；
Fig. 2 a are the side view that two-sided tape is adhered to flexible circuitry plate surface in background technology；
Fig. 2 b are the front view that two-sided tape is adhered to flexible circuitry plate surface in background technology；
Fig. 3 is the front view that two-sided tape is adhered to backlight assembly surface in background technology；
Fig. 4 is liquid crystal display mode when flexible circuit board and backlight assembly are bonded together by two-sided tape in background technology
The side view of group；
Fig. 5 is the schematic diagram that the depth of one further groove of the embodiment of the present invention is the thickness of protective layer；
Fig. 6 is the side view being contained in two-sided tape in the embodiment of the present invention one in the groove shown in Fig. 5；
Fig. 7 is the signal that the depth of one further groove of the embodiment of the present invention is the gross thickness of protective layer and first adhesive phase
Figure；
Fig. 8 is that the depth of one further groove of the embodiment of the present invention is the gross thickness of protective layer, first adhesive phase and conductive layer
Schematic diagram；
Fig. 9 is liquid crystal when flexible circuit board is pasted together by two-sided tape and backlight assembly in the embodiment of the present invention one
The side view of display module；
Figure 10 a are the schematic diagram that the depth of two further groove of the embodiment of the present invention is the thickness of protective layer；
Figure 10 b are the signal that the depth of two further groove of the embodiment of the present invention is the gross thickness of protective layer and first adhesive phase
Figure；
Figure 10 c are that the depth of two further groove of the embodiment of the present invention is the total thickness of protective layer, first adhesive phase and conductive layer
The schematic diagram of degree；
Figure 10 d are that the depth of two further groove of the embodiment of the present invention is that protective layer, first adhesive phase, conductive layer and second are viscous
The schematic diagram of the gross thickness of mixture layer；
Figure 11 a are that flexible circuit board further groove is in island point in not element area border area in the embodiment of the present invention three
The front view of the groove of cloth；
Figure 11 b are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 11 a；
Figure 11 c are that flexible circuit board further groove 25 is in continuous in not element area border area in the embodiment of the present invention three
The front view of the groove of island distribution；
Figure 11 d are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 11 c；
Figure 11 e are that flexible circuit board further groove is covered entirely in not element area border area in the embodiment of the present invention three
The front view of the groove of border area；
Figure 11 f are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 11 e；
It is in island in the non-border area in not element area that Figure 12 a, which are that flexible circuit board further groove is in the embodiment of the present invention three,
The front view of the groove of distribution；
Figure 12 b are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 12 a；
Figure 12 c are that flexible circuit board further groove is in continuous in the non-border area in not element area in the embodiment of the present invention three
The front view of the groove of island distribution；
Figure 12 d are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 12 c；
Figure 12 e be the embodiment of the present invention three in flexible circuit board further groove be covered in the non-border area in not element area it is whole
The front view of the groove of a non-border area；
Figure 12 f are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 12 e；
Figure 13 a are that flexible circuit board further groove is covered entirely in not element area border area in the embodiment of the present invention three
The front view of the groove of border area and the groove being distributed in the non-border area in not element area in island；
Figure 13 b are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 13 a；
Figure 13 c are that flexible circuit board further groove is covered entirely in not element area border area in the embodiment of the present invention three
The front view of the groove of border area and the groove being distributed in the non-border area in not element area in continuous island；
Figure 13 d are the front view being contained in two-sided tape in the embodiment of the present invention three in the groove shown in Figure 13 c；
Figure 14 a are the front view that flexible circuit board further groove covers whole not element area in the embodiment of the present invention three；
Figure 14 b are the recessed of the whole not element area of covering that two-sided tape is contained in flexible circuit board in the embodiment of the present invention three
Front view in groove.
Embodiment
The scheme of embodiment of the present invention recessing in the not element area of the base material side of flexible circuit board, by two-sided tape
Or gelatinous binding agent is contained in the groove of flexible circuit board, and by the flexible circuit board by the two-sided tape or
Gelatinous binding agent is pasted together with backlight assembly, due to two-sided tape or gelatinous in obtained liquid crystal display die set
For at least a portion of binding agent in the groove of flexible circuit board, liquid crystal display die set relative to Fig. 4, utilizes the present invention
The scheme of embodiment is thinned the gross thickness of liquid crystal display die set.
Flexible circuit board in the embodiment of the present invention includes element region and not element area, and the element region refers to the flexibility
Electronic component is furnished with wiring board（Such as resistance, capacitance）And the region of the connection circuit between electronic component, the negation element
Part area refers to the region beyond element region in the flexible circuit board, for housing the recessed of two-sided tape or gelatinous binding agent
Groove is located in the not element area of the flexible circuit board.
Specifically, the flexible circuit board in the embodiment of the present invention includes base material, the conductive layer for being covered in base material both sides, bonding
Oxidant layer, protective layer and the groove in base material side.In the flexible circuit board of the embodiment of the present invention, the side of base material can have
A layer of adhesive layer, i.e., the first adhesive phase between protective layer and conductive layer；There can also be both adhesive layers, that is, protect
First adhesive phase between sheath and conductive layer and the second adhesive phase between base material and conductive layer.The base material can be with
For Kapton or polyester film, the conductive layer can be layers of copper, described adhesive layer（Including first adhesive phase and
Second adhesive phase）Can be acrylate layer or epoxy resin layer or silica gel layer.
When groove is used to house two-sided tape, since the one side of two-sided tape is contained in groove, another side and backlight
Component is pasted together, and to ensure that flexible circuit board and the firm of backlight assembly are pasted, the depth of groove is less than two-sided tape
Thickness.Assuming that the depth of groove is Tc, the thickness of two-sided tape is X, then Tc<X.More preferably, it is contemplated that flexible circuit board and the back of the body
Stitching operation can be also carried out after being pasted together between optical assembly by two-sided tape, therefore, the depth Tc of groove can be set
Much smaller than the thickness X of two-sided tape, for example, the depth Tc of groove is smaller than the half of the thickness X of two-sided tape, i.e. Tc<0.5X.
In the scheme of the embodiment of the present invention, groove is located at the side of base material, on the one hand, the depth of groove is less than double faced adhesive tape
The thickness of band, on the other hand, the depth of groove are not more than the gross thickness of the conductive layer of base material side, adhesive phase and protective layer：
Exemplified by there was only first adhesive phase by base material side, conductive layer of the depth no more than base material side of groove, first adhesive phase
With the gross thickness of protective layer, it is assumed that the thickness of base material is T1, the thickness of conductive layer is T2, the thickness of first adhesive phase be T3,
The thickness of protective layer is T4, then Tc≤T2+T3+T4；It is recessed exemplified by having first adhesive phase and second adhesive phase by base material side
The depth of groove is not more than second adhesive phase, conductive layer, first adhesive phase, the gross thickness of protective layer of base material side, it is assumed that
The thickness of second adhesive phase is T3, then Tc≤T3+T2+T3+T4.
In the scheme of the embodiment of the present invention, when the depth of flexible circuit board further groove meets：Less than the thickness of two-sided tape
During the gross thickness of degree and the conductive layer no more than base material side, adhesive phase and protective layer, double faced adhesive tape is housed in the groove
Band and after being pasted together with backlight assembly, can effectively be thinned the gross thickness of liquid crystal display die set.
The scheme of the embodiment of the present invention is described in detail with reference to Figure of description, but the present invention is not limited to down
The embodiment in face.
Embodiment one：
Exemplified by the present embodiment one only has the structure of first adhesive phase by the side of the base material of flexible circuit board, to flexible wires
The depth of road plate upper groove is described in detail.
The depth of the groove meets：It is thickness less than two-sided tape and the conductive layer no more than base material side, first viscous
The gross thickness of mixture layer and protective layer, specifically, the depth of groove include but not limited to following several situations：
Situation one：The depth of groove for base material side protective layer thickness, i.e. Tc=T4.
As shown in figure 5, for one further groove of the embodiment of the present invention depth be protective layer thickness schematic diagram, can from figure
To find out, the flexible circuit board in the embodiment of the present invention one includes base material 21, the conductive layer 22 for being compounded in the outside of base material 21, conduction
The first adhesive phase 23 in the outside of layer 22, the protective layer 24 and groove 25 in the outside of first adhesive phase 23.If by double faced adhesive tape
Band is contained in groove 25 as shown in Figure 5, then obtains the groove that two-sided tape 26 as shown in Figure 6 is contained in flexible circuit board
Schematic diagram in 25.At this time, it is assumed that the sum of the thickness of flexible circuit board and the thickness of two-sided tape are Z, then Z=T4+T3+T2+T1
+T2+T3+X。
Situation two：The depth of groove 25 for 21 side of base material protective layer 24 and first adhesive phase 23 gross thickness, i.e.,
Tc=T3+T4。
As shown in fig. 7, the depth for one further groove 25 of the embodiment of the present invention is protective layer 24 and first adhesive phase 23
The schematic diagram of gross thickness.If two-sided tape is contained in groove 25 as shown in Figure 7, the thickness of flexible circuit board with it is double
The sum of the thickness of face adhesive tape Z=T4+T3+T2+T1+T2+X.
Situation three：The depth of groove 25 is the protective layer 24 of 21 side of base material, first adhesive phase 23 and conductive layer 22
Gross thickness, i.e. Tc=T2+T3+T4.
As shown in figure 8, the depth for one further groove 25 of the embodiment of the present invention is protective layer 24, first adhesive phase 23 and leads
The schematic diagram of the gross thickness of electric layer 22.If two-sided tape is contained in groove 25 as shown in Figure 8, flexible circuit board
The sum of the thickness of thickness and two-sided tape Z=T4+T3+T2+T1+X.
Exemplified by the present embodiment one only has first adhesive phase by the side of the base material of flexible circuit board, in flexible circuit board
The depth of groove is described in detail.If by two-sided tape be contained in the present embodiment one it is any of the above-described in the case of it is soft
Property wiring board groove in after, the another side of two-sided tape can be pasted together with backlight assembly, realize flexible circuit board with
The stickup of backlight assembly, as shown in figure 9, for the flexible circuit board in the embodiment of the present invention one is passed through the flexible circuit board
The side view of liquid crystal display die set when the two-sided tape housed in groove is pasted together with backlight assembly.Can from figure
Go out, liquid crystal display die set includes：Flexible circuit board, by the groove of the flexible circuit board house two-sided tape with it is described
The backlight assembly that flexible circuit board is pasted together.
By liquid crystal display die set structure as shown in Figure 4 in liquid crystal display die set structure as shown in Figure 9 and background technology
Contrasted this it appears that：The liquid crystal display die set total thickness obtained using the flexible circuit board in the embodiment of the present invention
Degree is thinner than the liquid crystal display die set gross thickness in background technology.
By taking two-sided tape 26 as shown in Figure 6 is contained in the groove 25 of flexible circuit board as an example, by two-sided tape 26
Another side is pasted together with backlight assembly 27, liquid crystal display die set gross thickness Y=A+（T4+T3+T2+T1+T2+T3）+ X, relatively
In liquid crystal display die set gross thickness Y=A+ (T4+T3+T2+T1+T2+T3+T4)+X shown in Fig. 4, the thin T4 of thickness.
Embodiment two：
Exemplified by the present embodiment two has first adhesive phase and second adhesive phase by the base material side of flexible circuit board, to soft
The depth of property wiring board upper groove is described in detail.
The depth of the groove meets：Less than two-sided tape thickness and no more than base material side second adhesive phase,
The gross thickness of conductive layer, first adhesive phase and protective layer, specifically, the depth of two further groove of the present embodiment include but not limited to
Several situations below：
Situation one：The depth of groove for base material side protective layer thickness, i.e. Tc=T4.
As shown in Figure 10 a, the depth for being two further groove of the embodiment of the present invention is the schematic diagram of the thickness of protective layer 24, from figure
In as can be seen that the flexible circuit board in the embodiment of the present invention two includes base material 21, is compounded in second bonding in the outside of base material 21
Oxidant layer 29, the conductive layer 22 in the outside of second adhesive phase 29, first adhesive phase 23, the first adhesive phase in the outside of conductive layer 22
The protective layer 24 and groove 25 in 23 outsides.If two-sided tape is contained in groove 25 as shown in Figure 10 a, flexible wires
The sum of the thickness of road plate and the thickness of two-sided tape Z=T4+T3+T2+T3+T1+T3+T2+T3+X.
Situation two：The depth of groove 25 for 21 side of base material protective layer 24 and first adhesive phase 23 gross thickness, i.e.,
Tc=T3+T4。
As shown in fig. lob, the depth for being two further groove 25 of the embodiment of the present invention is protective layer 24 and first adhesive phase 23
Gross thickness schematic diagram, if two-sided tape is contained in groove 25 as shown in fig. lob, the thickness of flexible circuit board
With the sum of the thickness of two-sided tape Z=T4+T3+T2+T3+T1+T3+T2+X.
Situation three：The depth of groove 25 is the protective layer 24 of 21 side of base material, first adhesive phase 23 and conductive layer 22
Gross thickness, i.e. Tc=T2+T3+T4.
As shown in figure l0c, the depth for being two further groove 25 of the embodiment of the present invention is protective layer 24,23 and of first adhesive phase
The schematic diagram of the gross thickness of conductive layer 22, if two-sided tape is contained in groove 25 as shown in figure l0c, flexible circuitry
The sum of the thickness of plate and the thickness of two-sided tape Z=T4+T3+T2+T3+T1+T3+X.
Situation four：The depth of groove 25 is the protective layer 24 of 21 side of base material, first adhesive phase 23, conductive layer 22 and the
The gross thickness of two adhesive phases 29, i.e. Tc=T3+T2+T3+T4.
As shown in fig. 10d, the depth for being two further groove 25 of the embodiment of the present invention be protective layer 24, first adhesive phase 23,
The schematic diagram of the gross thickness of conductive layer 22 and second adhesive phase 29, if two-sided tape is contained in as shown in fig. 10d recessed
In groove 25, then the sum of thickness of the thickness of flexible circuit board and two-sided tape Z=T4+T3+T2+T3+T1+X.
It is similar with embodiment one, if in the groove for the flexible circuit board that two-sided tape is contained in the present embodiment two
Afterwards, the another side of two-sided tape can be pasted together with backlight assembly, realizes the stickup of flexible circuit board and backlight assembly, this
When liquid crystal display die set gross thickness ratio there is no flexible circuit board and backlight assembly during groove to be directly pasted onto one by two-sided tape
The liquid crystal display die set gross thickness risen is small.
The present invention apply example one to embodiment two not to shape of the groove in the not element area of flexible circuit board and
Position limits, as long as the shapes and sizes of groove suitably house two-sided tape, and accommodating two-sided tape can glue securely
Paste backlight assembly.
Embodiment three：
The fluting shape of the groove involved into embodiment two of the embodiment of the present invention one and position can be according to actual need
Ask and set, the present embodiment three is optionally slotted shape and position, certainly, this reality by following several examples to describe groove
The scheme for applying example is also not necessarily limited to following several examples, as long as can house two-sided tape and ensure all fluting shapes of firm pasting
Shape and position are all in the scheme of the present embodiment.
Example one：The groove be in not element area border area in island be distributed or in continuous island distribution,
Or the groove of the whole border area of covering.
As shown in fig. 11a, it is in the recessed of island distribution in not element area border area for flexible circuit board further groove 25
The front view of groove, wherein, refer in not element area border area in the groove of island distribution in the border area in not element area
Have the groove of at least one independent island distribution, be shown in Figure 11 a have in the border area in not element area two it is independent
The example of the groove of island distribution.After two-sided tape 26 being housed in the groove 25 of the flexible circuit board shown in Figure 11 a, its main view
Figure is as shown in figure 11b.
As shown in fig. 11c, it is to be distributed in not element area border area in continuous island for flexible circuit board further groove 25
Groove front view, wherein, refer in the groove of continuous island distribution in not element area border area multiple in border area
And the continuous groove in island distribution combines groove when linking together, the groove shown in Figure 11 c can be considered two companies
The continuous example to link together in the groove combination of island distribution.In 25 content of groove of the flexible circuit board shown in Figure 11 c
After putting two-sided tape 26, its front view is as illustrated in fig. 11d.
As illustrated in fig. 11e, it is that whole edge area is covered in not element area border area for flexible circuit board further groove 25
The front view of the groove in domain.After housing two-sided tape 26 in the groove 25 of the flexible circuit board shown in Figure 11 e, its front view is such as
Shown in Figure 11 f.
Example two：The groove is distributed or in continuous island point in island in the non-border area in not element area
The groove of cloth or the whole non-border area of covering.
As figure 12 a shows, it is to be distributed in the non-border area in not element area in island for flexible circuit board further groove 25
The front view of groove, wherein, refer in the non-border area in not element area in the groove of island distribution at the non-edge in not element area
There is the groove of at least one independent island distribution in region, be in the non-border area in not element area as figure 12 a shows
There is the example of the groove of two independent island distributions.Double faced adhesive tape is housed in the groove 25 of the flexible circuit board shown in Figure 12 a
After band 26, its front view is as shown in Figure 12b.
As shown in fig. 12 c, it is in continuous island point in the non-border area in not element area for flexible circuit board further groove 25
The front view of the groove of cloth, wherein, refer to non-border area in the groove of continuous island distribution in the non-border area in not element area
The interior multiple and continuous groove in island distribution combines groove when linking together, and Figure 12 c can be considered that two are in continuously
The example that the groove combination of island distribution links together.Housed in the groove 25 of the flexible circuit board shown in Figure 12 c two-sided
After adhesive tape 26, its front view is as shown in figure 12d.
It is that whole non-side is covered in the non-border area in not element area for flexible circuit board further groove 25 as shown in Figure 12 e
Along the front view of the groove in region, after housing two-sided tape 26 in the groove 25 of the flexible circuit board shown in Figure 12 e, its main view
Figure is as shown in Figure 12 f.
Example three：The groove is groove in not element area border area and recessed in non-border area
Groove.
Wherein, the groove in not element area border area refer in not element area border area in island distribution,
Or the groove of whole border area is distributed or covered in continuous island, such as each situation described in example one.
Groove in the non-border area in not element area refer in the non-border area in not element area in island distribution or
The groove of whole non-border area is distributed or covered in continuous island, such as each situation described in example two.
Groove described in this example three can be by the groove in example one in any border area and example two
Groove combination in any non-border area.
It is that the groove of whole border area is covered in not element area border area and is in non-border area with groove
Exemplified by the groove of island distribution, the front view of flexible circuit board further groove as depicted in fig. 13 a is obtained.Soft shown in Figure 13 a
Property wiring board groove 25 in house two-sided tape 26 after, its front view is as illustrated in fig. 13b.
It is that the groove of whole border area is covered in not element area border area and is in non-border area with groove
Exemplified by the groove of continuous island distribution, the front view of flexible circuit board further groove as shown in figure 13 c is obtained.Shown in Figure 13 c
Flexible circuit board groove 25 in house two-sided tape 26 after, its front view is as shown in figure 13d.
Example four：The groove covers the whole not element area of flexible circuit board.
As shown in figures 14a, the front view in the whole not element area of flexible circuit board is covered for flexible circuit board further groove 25,
After housing two-sided tape 26 in the groove 25 of flexible circuit board shown in Figure 14 a, its front view is as shown in fig. 14b.
It should be noted that the fluting shape of groove of the above example one into example four described in each attached drawing and position are only
It is the optional shape for illustrating the present embodiment and position, the present embodiment does not limit reeded to institute in Figure 11 a to Figure 14 b
Shape of slotting and the deformation of position.
Above-described embodiment one is described to embodiment three exemplified by housing two-sided tape in groove, is housed in groove
The situation of gelatinous binding agent is identical with the situation of accommodating two-sided tape.When groove is used to house gelatinous binding agent,
Gelatinous binding agent need to fill up groove, and more preferably, the gel-like adhesive agent of filling is higher by groove so that flexible circuit board and the back of the body
Optical assembly is pasted more firm.
By taking 25 depth of groove shown in Fig. 5 is the thickness of the protective layer 24 of 21 side of base material as an example, i.e. Tc=T4, then by soft
Property wiring board, by the groove of the flexible circuit board house gelatinous binding agent be pasted onto with the flexible circuit board
Liquid crystal display die set gross thickness Y=A+ of backlight assembly composition together（T4+T3+T2+T1+T2+T3）+ X ', wherein, X ' expressions
The thickness for the gelatinous binding agent being contained in groove（That is the depth of groove）With the gelatinous binding agent that is higher by groove
The sum of thickness.
Example IV：
The embodiment of the present invention four describes a kind of flexible circuit board by involved by embodiment one and is pasted onto with backlight assembly
Method together, concretely comprises the following steps：
First, two-sided tape or gelatinous binding agent are contained in the groove of flexible circuit board.
Then, backlight assembly is pasted onto by the two-sided tape or gelatinous binding agent with the flexible circuit board
Together.Specifically, what is be pasted together with two-sided tape can be iron frame, glue frame or the backboard in backlight assembly.
By taking accommodating two-sided tape as an example, since the depth of groove is less than the thickness of two-sided tape, housed in groove
After two-sided tape, the one side of two-sided tape is pasted onto in groove, and another side is protruded outside groove, is pasted with backlight assembly, is realized
Purpose that backlight assembly and the flexible circuit board are pasted together, meanwhile, by backlight assembly, two-sided tape and described soft
Property wiring board composition liquid crystal display die set gross thickness liquid crystal display die set gross thickness relative to Fig. 4 have it is thinning.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make these embodiments other change and modification.So appended claims be intended to be construed to include it is excellent
Select embodiment and fall into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and scope.In this way, if these modifications and changes of the present invention belongs to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these modification and variations.
Claims (10)
- A kind of 1. liquid crystal display die set, it is characterised in that including：Flexible circuit board and backlight assembly；The flexible circuit board includes：Base material, the conductive layer and protective layer for being covered in substrate surface, wherein, the flexible circuitry Plate includes element region and not element area, formed in the not element area it is fluted, when the groove be used for house double faced adhesive tape During band, the depth of the groove is less than the thickness of the two-sided tape；The backlight assembly, by the two-sided tape housed in the groove of the flexible circuit board, by the flexible circuit board It is pasted together with the backlight assembly.
- 2. liquid crystal display die set as claimed in claim 1, it is characterised in that be additionally included in the protective layer and the conductive layer Between first adhesive phase, the depth of the groove is not more than conductive layer, first adhesive phase and the protective layer of base material side Gross thickness.
- 3. liquid crystal display die set as claimed in claim 2, it is characterised in thatThe depth of the groove is the thickness of the protective layer of base material side；Alternatively,The depth of the groove is the protective layer of base material side and the gross thickness of first adhesive phase；Alternatively,The depth of the groove is the protective layer of base material side, the gross thickness of first adhesive phase and conductive layer.
- 4. liquid crystal display die set as claimed in claim 1, it is characterised in that be additionally included in the protective layer and the conductive layer Between first adhesive phase and the second adhesive phase between the base material and the conductive layer, the depth of the groove is not More than the gross thickness of the second adhesive phase of base material side, conductive layer, first adhesive phase and protective layer.
- 5. liquid crystal display die set as claimed in claim 4, it is characterised in thatThe depth of the groove is the thickness of the protective layer of base material side；Alternatively,The depth of the groove is the protective layer of base material side and the gross thickness of first adhesive phase；Alternatively,The depth of the groove is the protective layer of base material side, the gross thickness of first adhesive phase and conductive layer；Alternatively,The depth of the groove is the protective layer of base material side, the total thickness of first adhesive phase, conductive layer and second adhesive phase Degree.
- 6. the liquid crystal display die set as described in Claims 1 to 5 is any, it is characterised in that the groove is in the not element The groove of whole border area is distributed or covered in area's border area in island.
- 7. the liquid crystal display die set as described in Claims 1 to 5 is any, it is characterised in that the groove is in the not element The groove of whole non-border area is distributed or covered in the non-border area in area in island.
- 8. the liquid crystal display die set as described in Claims 1 to 5 is any, it is characterised in that the groove is in the not element Groove in area's border area and the groove in non-border area, wherein：Groove in not element area border area is Refer to the groove for being distributed or covering whole border area in island in not element area border area；The not element area is non- Groove in border area refers to be distributed or cover whole non-border area in island in the non-border area in not element area Groove.
- 9. liquid crystal display die set as claimed in claim 4, it is characterised in thatThe base material is Kapton or polyester film；The conductive layer is layers of copper；The first adhesive phase and second adhesive phase are acrylate layer or epoxy resin layer or silica gel layer.
- A kind of 10. method of attaching of flexible circuit board and backlight assembly, it is characterised in that the described method includes：Two-sided tape is contained in groove as claimed in claim 1；Backlight assembly is pasted together by the two-sided tape and the flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310248139.3A CN103917039B (en) | 2013-06-20 | 2013-06-20 | A kind of flexible circuit board, method of attaching and liquid crystal display die set with backlight assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310248139.3A CN103917039B (en) | 2013-06-20 | 2013-06-20 | A kind of flexible circuit board, method of attaching and liquid crystal display die set with backlight assembly |
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| Publication Number | Publication Date |
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| CN103917039A CN103917039A (en) | 2014-07-09 |
| CN103917039B true CN103917039B (en) | 2018-05-01 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106444152B (en) * | 2016-10-21 | 2020-07-17 | 友达光电（苏州）有限公司 | Backlight module and display device |
| CN110471203B (en) * | 2019-08-05 | 2022-06-07 | Oppo（重庆）智能科技有限公司 | Display device and electronic apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101778530A (en) * | 2009-01-09 | 2010-07-14 | 京东方科技集团股份有限公司 | Driving printed circuit board and liquid crystal display |
| CN102289109A (en) * | 2010-12-31 | 2011-12-21 | 友达光电股份有限公司 | Display panel |
| CN202353921U (en) * | 2011-09-30 | 2012-07-25 | 深圳市三德冠精密电路科技有限公司 | Improved flexible printed circuit board structure |
| CN102878482A (en) * | 2012-06-28 | 2013-01-16 | 友达光电股份有限公司 | Backlight module and display device using same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100972148B1 (en) * | 2002-12-31 | 2010-07-23 | 엘지디스플레이 주식회사 | a liquid crystal display device featuring a layered structure under a seal pattern |
-
2013
- 2013-06-20 CN CN201310248139.3A patent/CN103917039B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101778530A (en) * | 2009-01-09 | 2010-07-14 | 京东方科技集团股份有限公司 | Driving printed circuit board and liquid crystal display |
| CN102289109A (en) * | 2010-12-31 | 2011-12-21 | 友达光电股份有限公司 | Display panel |
| CN202353921U (en) * | 2011-09-30 | 2012-07-25 | 深圳市三德冠精密电路科技有限公司 | Improved flexible printed circuit board structure |
| CN102878482A (en) * | 2012-06-28 | 2013-01-16 | 友达光电股份有限公司 | Backlight module and display device using same |
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| CN103917039A (en) | 2014-07-09 |
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