CN103581814A - Mems microphone - Google Patents
Mems microphone Download PDFInfo
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- CN103581814A CN103581814A CN201310464930.8A CN201310464930A CN103581814A CN 103581814 A CN103581814 A CN 103581814A CN 201310464930 A CN201310464930 A CN 201310464930A CN 103581814 A CN103581814 A CN 103581814A
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- wiring board
- encapsulating structure
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Abstract
The invention discloses an MEMS microphone, and relates to the technical field of acoustoelectric converters. The MEMS microphone comprises a packaging structure composed of a main circuit board and a second circuit board, wherein the middle of the second circuit board is concave inwards to form a groove, due to the adopted double-layer circuit board structure, the installation and machining processes are easy to operate, the sealing connection between the layers of the circuit boards is removed, and the sealing effect is improved. An MEMS chip is arranged on the main circuit board inside the packaging structure, sound holes are formed in the position, opposite to the MEMS chip, of the main circuit board, a shielding layer is arranged on the inner wall of the groove in the second circuit board, the sealing connection between the layers of the circuit board is removed, and the whole shielding effect of the MEMS microphone is improved. A conducting circuit is arranged inside the second circuit board so as to be capable of achieving conversion from the Bottom structure into the Top structure, and on the basis that the good performance indexes of the Bottom structure are ensured, the aim that the Top structure is conveniently and electrically connected with a terminal product is achieved.
Description
Technical field
The present invention relates to acoustic-electric product technical field, particularly a kind of MEMS microphone.
Background technology
MEMS microphone is voice signal to be converted to the energy converter of the signal of telecommunication, and along with the develop rapidly of portable electric appts, MEMS microphone is widely used in portable electric appts in recent years.
MEMS microphone has two kinds of structures conventionally, and a kind of is that sound hole and the pad that receives voice signal is all arranged on same wiring board, and this kind of structure is called as " Bottom structure " in industry; Another is that sound hole and pad arrange respectively, not on same wiring board, this kind of structure is called as " Top structure " in industry, the MEMS microphone products superior performance of Bottom structure, the MEMS microphone of Top structure are convenient to be electrically connected to end product, the MEMS microphone of above two kinds of structures cuts both ways, but can only adopt separately a kind of mode wherein to realize and being electrically connected to of end product.
The MEMS microphone that while is conventional, in order to adopt same material, make outer enclosure structure, conventionally adopt the wiring board in upper and lower two sandwich circuit boards and an Intermediate Gray chamber to form a centre with the three sandwich circuit board outer enclosure structures in sound chamber, and on encapsulating structure, be provided with the sound hole that can receive voice signal, in the sound chamber of encapsulating structure inside, be provided with for voice signal being converted to the MEMS chip of the signal of telecommunication, this kind of structure is called " three sandwich circuit board structures " MEMS microphone, the MEMS microphone of this kind of structure is owing to adopting three sandwich circuit board structures, between every layer, need respectively sealing fixing, complex operation and sealing effectiveness are poor.Owing to fixing with fluid sealant between each layer, affected the effectiveness of whole encapsulating structure simultaneously.Need thus to design a kind of simple to operate, sealing effectiveness and effectiveness good, and can realize a kind of MEMS microphone to the conversion of Top structure by Bottom structure.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of simple to operate, sealing effectiveness and effectiveness is good, and can realize a kind of MEMS microphone to the conversion of Top structure by Bottom structure.
For solving the problems of the technologies described above, technical scheme of the present invention is:
As realizing the first technical scheme of the present invention: a kind of MEMS microphone, comprises an encapsulation
a sound chamber of the inner formation of described encapsulating structure, described encapsulating structure is provided with the sound hole that receives voice signal, and the inner described sound of described encapsulating structure is provided with MEMS chip in chamber, and wherein, described encapsulating structure is comprised of wiring board mainboard and the second wiring board; Described the second wiring board centre position caves inward and forms a groove; Described wiring board mainboard covers described groove and is combined with described the second wiring board and forms the described encapsulating structure with sound chamber; Described MEMS chip is arranged on the inner described wiring board mainboard of described encapsulating structure and is electrically connected to described wiring board mainboard, and described sound hole is arranged on the described wiring board mainboard position relative with described MEMS chip; Described in described the second wiring board, described the second PCB surface on groove inwall or encapsulating structure outside is provided with screen; Outside described the second PCB surface of described encapsulating structure is provided with the pad being electrically connected to outside; Described the second wiring board inside is provided with the conducting wire that is electrically connected to described wiring board mainboard and described pad, and described pad is electrically connected to described MEMS chip by the described conducting wire of described the second wiring board inside, the realization of described wiring board mainboard.
A technical scheme, is realized and being electrically connected to by abnormal sound conducting resinl or solder(ing) paste or silver slurry or copper cream between described wiring board mainboard and described the second wiring board.
A technical scheme, the described conducting wire of described the second wiring board inside is for being electrically connected to the electric conductor of described pad and described wiring board mainboard.
As realizing the second technical scheme of the present invention: a kind of MEMS microphone, comprise an encapsulating structure, a sound chamber of the inner formation of described encapsulating structure, described encapsulating structure is provided with the sound hole that receives voice signal, the inner described sound of described encapsulating structure is provided with MEMS chip in chamber, wherein, described encapsulating structure is comprised of wiring board mainboard and the second wiring board; Described the second wiring board centre position caves inward and forms a groove; Described wiring board mainboard covers described groove and is combined with described the second wiring board and forms with encapsulating structure described in sound chamber; Described MEMS chip is arranged on inner described the second wiring board bottom portion of groove of described encapsulating structure, and described sound hole is arranged on described the second wiring board relative with described MEMS chip and with described the second wiring board and is electrically connected to; Described in described the second wiring board, described the second PCB surface on groove inwall or encapsulating structure outside is provided with screen; The outside described wiring board mainboard of described encapsulating structure surface is provided with the pad being electrically connected to outside; Described the second wiring board inside is provided with the conducting wire that is electrically connected to described wiring board mainboard, and described pad is by the described conducting wire realization of described wiring board mainboard, the second wiring board inside and the electricity of described MEMS chip
A technical scheme, passes through between described wiring board mainboard and described the second wiring board
electricity glue or solder(ing) paste or silver slurry or copper cream are realized and being electrically connected to.
A technical scheme, the described conducting wire of described the second wiring board inside is for being electrically connected to the electric conductor of described MEMS chip and described wiring board mainboard.
Above structure, because adopting the double-layered circuit board structure being comprised of wiring board mainboard and the second wiring board, the encapsulating structure of MEMS microphone of the present invention replaces three sandwich circuit board structures, make in the installation course of processing simple to operate, and having reduced wiring board being tightly connected between layers improves its sealing effectiveness, and in the second wiring board centre position, cave inward and form a groove, and on groove inwall or outside described the second PCB surface of encapsulating structure be provided with screen, reduce wiring board being tightly connected between layers and improved the bulk shielding effect of MEMS microphone, simultaneously owing to being provided with conducting wire in the second wiring board inside respectively by wiring board mainboard---second wiring board---pad, the second wiring board---wiring board mainboard---pad, realized the conversion to Top structure by Bottom structure, guaranteeing on the good basis of each performance index of product, be convenient to realize and being electrically connected to end product.
Accompanying drawing explanation
Fig. 1 is that MEMS Mike sound of the wind of the present invention hole is arranged on wiring board mainboard, and pad is arranged on the second wiring board and screen is arranged on to the cross-sectional view of the MEMS microphone of the second wiring board inside grooves;
Fig. 2 is the structural representation of MEMS microphone the second wiring board of the present invention;
Fig. 3 is that MEMS Mike sound of the wind of the present invention hole is arranged on wiring board mainboard, and pad is arranged on the second wiring board and screen is arranged on to the cross-sectional view of the MEMS microphone of the second wiring board outside;
Fig. 4 is that MEMS Mike sound of the wind of the present invention hole is arranged on the second wiring board, and pad is arranged on wiring board mainboard and screen is arranged on to the cross-sectional view of the MEMS microphone of the second wiring board outside;
Fig. 5 is that MEMS Mike sound of the wind of the present invention hole is arranged on the second wiring board, and pad is arranged on wiring board mainboard and screen is arranged on to the cross-sectional view of the MEMS microphone of the second wiring board inside grooves.
Embodiment
Below in conjunction with drawings and Examples, further set forth the present invention, the present embodiment is and adopts simultaneously
circuit board structure product contrasts and describes.
Embodiment mono-:
As Fig. 1, shown in Fig. 2, MEMS microphone in the present invention, comprise that one is caved inward and formed the encapsulating structure with sound chamber 3 that the second wiring board 2 of a groove 21 forms by wiring board mainboard 1 and centre position, this kind of structure is owing to adopting double-layered circuit board structure, MEMS microphone package with respect to three sandwich circuit board structures is simple to operate in the installation course of processing, and having reduced wiring board being tightly connected between layers improves its sealing effectiveness, the described wiring board mainboard 1 in the inner sound of encapsulating structure chamber 3 is provided with MEMS chip 4, between MEMS chip 4 and wiring board mainboard 1, be electrically connected to, in described wiring board mainboard 1 position relative with described MEMS chip 4, be provided with the sound hole 6 that can receive voice signal, described in described the second wiring board 2, on groove 21 inwalls, be provided with screen 22, as shown in Figure 3, screen 22 also can be arranged on outside described the second wiring board 2 surfaces of encapsulating structure, with respect to the MEMS microphone of three sandwich circuit board structures, reduced wiring board being tightly connected between layers and improved the bulk shielding effect of MEMS microphone.
On above architecture basics, on outside described the second wiring board 2 surfaces of described encapsulating structure, be provided with the pad 5 being electrically connected to outside; Described the second wiring board 2 inside are provided with the conducting wire 23 that is electrically connected to described wiring board mainboard 1 and described pad 5, described pad 5 is electrically connected to described MEMS chip 4 by the described conducting wire 23 of described the second wiring board 2 inside, 1 realization of described wiring board mainboard, realized the conversion to Top structure by Bottom structure, on the good basis of each performance index of assurance Bottom infrastructure product, realized Top structure and be convenient to the effect being electrically connected to end product.
Can be by being electrically connected to effect better and the abnormal sound conducting resinl of easy to drawing materials or solder(ing) paste or silver slurry or copper cream are realized and being electrically connected between wiring board mainboard 1 and the second wiring board 2 in the present invention.
As realizing a kind of preferred technical scheme of the present invention, the described conducting wire 23 of described the second wiring board 2 inside is for being electrically connected to the electric conductor of described pad 5 and described wiring board mainboard 1, and processing is convenient, is convenient to and the second wiring board 2 one machine-shapings.
Embodiment bis-:
As shown in Figure 2, Figure 4 shows, the MEMS microphone in the present embodiment, comprises that one by wiring board
with centre position cave inward form that the second wiring board 2 of a groove 21 forms with sound chamber 3
structure, this kind of structure is owing to adopting double-layered circuit board structure, MEMS microphone package with respect to three sandwich circuit board structures is simple to operate in the installation course of processing, and having reduced wiring board being tightly connected between layers improves its sealing effectiveness, groove 21 bottoms of inner the second wiring board 2 of encapsulating structure are provided with MEMS chip 4, between MEMS chip 4 and the second wiring board 2, be electrically connected to, in described second wiring board 2 positions relative with described MEMS chip 4, be provided with the sound hole 6 that can receive voice signal, described in described the second wiring board 2, on groove 21 inwalls, be provided with screen 22, screen 22 also can be arranged on outside described the second wiring board 2 surfaces of encapsulating structure as shown in Figure 5, with respect to the MEMS microphone of three sandwich circuit board structures, reduced wiring board being tightly connected between layers and improved the bulk shielding effect of MEMS microphone.
On above architecture basics, on the outside described wiring board mainboard of described encapsulating structure 1 surface, be provided with the pad 5 being electrically connected to outside; Described the second wiring board 2 inside are provided with the conducting wire 23 that is electrically connected to described wiring board mainboard 1, described MEMS chip 4 is electrically connected to described pad 5 by the described conducting wire 23 of described the second wiring board 2 inside, 1 realization of described wiring board mainboard, realized the conversion to Top structure by Bottom structure, on the good basis of each performance index of assurance Bottom infrastructure product, realized Top structure and be convenient to the effect being electrically connected to end product.
Can be by being electrically connected to effect better and the abnormal sound conducting resinl of easy to drawing materials or solder(ing) paste or silver slurry or copper cream are realized and being electrically connected between wiring board mainboard 1 and the second wiring board 2 in the present invention.
As realizing a kind of preferred technical scheme of the present invention, the described conducting wire 23 of described the second wiring board 2 inside is for being electrically connected to the electric conductor of described pad 5 and described wiring board mainboard 1, and processing is convenient, is convenient to and the second wiring board 2 one machine-shapings.
In above-described embodiment; in view of MEMS chip is on not impact of purport of the present invention; pattern only adopts simple pattern to represent; above embodiment is only in order to explain the present invention; be not for limiting the present invention; described those skilled in the art should be understood that all any modifications of making within the spirit and principles in the present invention, are equal to replacement and improvement etc., all should be included in protection scope of the present invention.
Claims (6)
1. a MEMS microphone, comprises an encapsulating structure, a sound chamber of the inner formation of described encapsulating structure, and described encapsulating structure is provided with the sound hole that receives voice signal, and the inner described sound of described encapsulating structure is provided with MEMS chip in chamber, it is characterized in that:
Described encapsulating structure is comprised of wiring board mainboard and the second wiring board;
Described the second wiring board centre position caves inward and forms a groove;
Described wiring board mainboard covers described groove and is combined with described the second wiring board and forms the described encapsulating structure with sound chamber;
Described MEMS chip is arranged on the inner described wiring board mainboard of described encapsulating structure and is electrically connected to described wiring board mainboard, and described sound hole is arranged on the described wiring board mainboard position relative with described MEMS chip;
Described in described the second wiring board, described the second PCB surface on groove inwall or encapsulating structure outside is provided with screen;
Outside described the second PCB surface of described encapsulating structure is provided with the pad being electrically connected to outside;
Described the second wiring board inside is provided with the conducting wire that is electrically connected to described wiring board mainboard and described pad, and described pad is electrically connected to described MEMS chip by the described conducting wire of described the second wiring board inside, the realization of described wiring board mainboard.
2. MEMS microphone according to claim 1, is characterized in that:
Between described wiring board mainboard and described the second wiring board, by abnormal sound conducting resinl or solder(ing) paste or silver slurry or copper cream, realize and being electrically connected to.
3. MEMS microphone according to claim 1, is characterized in that: the described conducting wire of described the second wiring board inside is for being electrically connected to the electric conductor of described pad and described wiring board mainboard.
4. a MEMS microphone, comprises an encapsulating structure, a sound chamber of the inner formation of described encapsulating structure, and described encapsulating structure is provided with the sound hole that receives voice signal, and the inner described sound of described encapsulating structure is provided with MEMS chip in chamber, it is characterized in that:
Described encapsulating structure is comprised of wiring board mainboard and the second wiring board;
Described the second wiring board centre position caves inward and forms a groove;
Described wiring board mainboard covers described groove and is combined with described the second wiring board and forms with sound
encapsulating structure;
Described MEMS chip is arranged on inner described the second wiring board bottom portion of groove of described encapsulating structure, and described sound hole is arranged on described the second wiring board relative with described MEMS chip and with described the second wiring board and is electrically connected to;
Described in described the second wiring board, described the second PCB surface on groove inwall or encapsulating structure outside is provided with screen;
The outside described wiring board mainboard of described encapsulating structure surface is provided with the pad being electrically connected to outside;
Described the second wiring board inside is provided with the conducting wire that is electrically connected to described wiring board mainboard, and described pad is by the described conducting wire realization of described wiring board mainboard, the second wiring board inside and being electrically connected to of described MEMS chip.
5. MEMS microphone according to claim 4, is characterized in that:
Between described wiring board mainboard and described the second wiring board, by abnormal sound conducting resinl or solder(ing) paste or silver slurry or copper cream, realize and being electrically connected to.
6. MEMS microphone according to claim 4, is characterized in that:
The described conducting wire of described the second wiring board inside is for being electrically connected to the electric conductor of described MEMS chip and described wiring board mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464930.8A CN103581814A (en) | 2013-10-08 | 2013-10-08 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464930.8A CN103581814A (en) | 2013-10-08 | 2013-10-08 | Mems microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103581814A true CN103581814A (en) | 2014-02-12 |
Family
ID=50052557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310464930.8A Pending CN103581814A (en) | 2013-10-08 | 2013-10-08 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103581814A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106162394A (en) * | 2015-04-28 | 2016-11-23 | 钰太芯微电子科技（上海）有限公司 | A kind of waterproof microphone monomer |
| WO2018201471A1 (en) * | 2017-05-05 | 2018-11-08 | Goertek Inc. | Mems microphone |
| CN113132877A (en) * | 2021-06-17 | 2021-07-16 | 甬矽电子(宁波)股份有限公司 | Microphone packaging structure and preparation method thereof |
| CN113415781A (en) * | 2021-06-17 | 2021-09-21 | 甬矽电子(宁波)股份有限公司 | double-MEMS chip packaging structure and double-MEMS chip packaging method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100737726B1 (en) * | 2006-07-10 | 2007-07-10 | 주식회사 비에스이 | Packaging structure of mems microphone |
| CN201138866Y (en) * | 2007-12-24 | 2008-10-22 | 歌尔声学股份有限公司 | Silicon microphone with improved structure |
| CN101651918A (en) * | 2009-06-19 | 2010-02-17 | 瑞声声学科技(深圳)有限公司 | Capacitance type microphone |
| CN203406992U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Micro-electro-mechanic system (MEMS) microphone |
| CN203590457U (en) * | 2013-10-08 | 2014-05-07 | 歌尔声学股份有限公司 | Mems microphone |
-
2013
- 2013-10-08 CN CN201310464930.8A patent/CN103581814A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100737726B1 (en) * | 2006-07-10 | 2007-07-10 | 주식회사 비에스이 | Packaging structure of mems microphone |
| CN201138866Y (en) * | 2007-12-24 | 2008-10-22 | 歌尔声学股份有限公司 | Silicon microphone with improved structure |
| CN101651918A (en) * | 2009-06-19 | 2010-02-17 | 瑞声声学科技(深圳)有限公司 | Capacitance type microphone |
| CN203406992U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Micro-electro-mechanic system (MEMS) microphone |
| CN203590457U (en) * | 2013-10-08 | 2014-05-07 | 歌尔声学股份有限公司 | Mems microphone |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106162394A (en) * | 2015-04-28 | 2016-11-23 | 钰太芯微电子科技（上海）有限公司 | A kind of waterproof microphone monomer |
| WO2018201471A1 (en) * | 2017-05-05 | 2018-11-08 | Goertek Inc. | Mems microphone |
| US11109162B2 (en) | 2017-05-05 | 2021-08-31 | Goertek Inc. | MEMS microphone |
| CN113132877A (en) * | 2021-06-17 | 2021-07-16 | 甬矽电子(宁波)股份有限公司 | Microphone packaging structure and preparation method thereof |
| CN113132877B (en) * | 2021-06-17 | 2021-09-21 | 甬矽电子(宁波)股份有限公司 | Microphone packaging structure and preparation method thereof |
| CN113415781A (en) * | 2021-06-17 | 2021-09-21 | 甬矽电子(宁波)股份有限公司 | double-MEMS chip packaging structure and double-MEMS chip packaging method |
| CN113415781B (en) * | 2021-06-17 | 2023-05-23 | 甬矽电子(宁波)股份有限公司 | Double MEMS chip packaging structure and double MEMS chip packaging method |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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Application publication date: 20140212 |
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| RJ01 | Rejection of invention patent application after publication |