CN207604033U - Multi net voting through-hole circuit board - Google Patents
Multi net voting through-hole circuit board Download PDFInfo
- Publication number
- CN207604033U CN207604033U CN201720245166.9U CN201720245166U CN207604033U CN 207604033 U CN207604033 U CN 207604033U CN 201720245166 U CN201720245166 U CN 201720245166U CN 207604033 U CN207604033 U CN 207604033U
- Authority
- CN
- China
- Prior art keywords
- layer
- hole
- plating resist
- circuit board
- resist layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model provides a kind of Multi net voting through-hole circuit board, including plating resist layer, conductive layer, copper electroplating layer, resin and the core material for completing internal layer circuit etching, plating resist layer is equipped on core material and is pressed into multilayer circuit board, through-hole passes through core material and plating resist layer；In addition to plating resist layer position does not cover conductive layer in through-hole, the other positions in through-hole cover conductive layer；In through-hole, two plating resist layers and the conductive layer between two plating resist layers form exposed portion, other than exposed portion is without copper electroplating layer, the other parts copper electroplating layer in through-hole；Resin is filled in through-hole.The beneficial effects of the utility model are：The Multi net voting through-hole board structure of circuit of the utility model is simple, improves production efficiency, while reduce manufacture cost, disclosure satisfy that the demand of user.
Description
Technical field
The utility model is related to circuit board technology field more particularly to Multi net voting through-hole circuit boards.
Background technology
Current Multi-layer circuit board structure is complicated, of high cost, can not meet the needs of users.
Utility model content
The utility model provides a kind of Multi net voting through-hole circuit board, including plating resist layer, conductive layer, copper electroplating layer, resin,
And the core material of internal layer circuit etching is completed, plating resist layer is equipped on core material and is pressed into multilayer circuit board, through-hole
Across core material and plating resist layer；In addition to plating resist layer position does not cover conductive layer in through-hole, the other positions in through-hole are covered
Lid conductive layer；In through-hole, two plating resist layers and the conductive layer between two plating resist layers form exposed portion, in addition to exposed portion
Outside without copper electroplating layer, the other parts copper electroplating layer in through-hole；Resin is filled in through-hole.
As further improvement of the utility model, the core material includes conductive copper layer and positioned at two conduction
Insulating layer between layers of copper, plating resist layer covering conductive copper layer.
As further improvement of the utility model, plating resist layer covers a part for conductive copper layer.
As further improvement of the utility model, plating resist layer size is more than through-hole diameter.
The beneficial effects of the utility model are：The Multi net voting through-hole board structure of circuit of the utility model is simple, improves production
Efficiency, while manufacture cost is reduced, it disclosure satisfy that the demand of user.
Description of the drawings
Fig. 1 is that the core material of the utility model makes plating resist layer side intention.
Fig. 2 is that plating resist layer schematic diagram is covered on the core material copper face of the utility model.
Fig. 3 is laminated construction side view before pressing of the invention.
Fig. 4 is laminated construction side view after pressing of the invention.
The through-hole that Fig. 5 is the present invention makes conductive layer side view.
Fig. 6 is the Multi net voting hole conductive layer side view of the present invention.
Fig. 7 is the Multi net voting the electroplates in hole copper side view of the present invention.
Fig. 8 is the Multi net voting through hole plug resin side view of the present invention.
Specific embodiment
As shown in figure 8, the invention also discloses a kind of Multi net voting through-hole circuit board, including plating resist layer 3, conductive layer 5,
Copper electroplating layer 6, resin 7 and the core material for completing internal layer circuit etching are equipped with plating resist layer 3 and are pressed on core material
Into multilayer circuit board, through-hole passes through conductive copper layer 1, insulating layer 2 and plating resist layer 3；In addition to 3 position of plating resist layer does not cover in through-hole
Conductive layer 5, the other positions in through-hole cover conductive layer 5；In through-hole, two plating resist layers 3 and positioned at two plating resist layers 3
Between conductive layer 5 form exposed portion, other than exposed portion is without copper electroplating layer 6, the other parts copper electroplating layer in through-hole
6；Resin 7 is filled in through-hole.
The core material includes conductive copper layer 1 and the insulating layer 2 between two conductive copper layers 1, plating resist layer 3
Cover conductive copper layer 1.
Plating resist layer 3 covers a part for conductive copper layer 1.3 size of plating resist layer is more than through-hole diameter.
As shown in Figure 1, the utility model discloses a kind of manufacturing method of Multi net voting through-hole circuit board, including walking as follows
Suddenly：
Step 1. makes plating resist layer 3 on the core material for completing internal layer circuit etching, as shown in Figure 1；
Core material and prepreg are pressed into multilayer circuit board by step 2., as shown in Figure 4；
Step 3. holes drilled through on multilayer circuit board, lead to the hole site pass through plating resist layer 3；
Step 4. covers one layer of conductive layer 5 in through-hole inner surface, is rear process as shown in figure 5, hole wall is made to have electric conductivity
Plating thickeies copper and prepares；
Step 5. removes the conductive layer 5 that 3 position of plating resist layer is corresponded in through-hole, so as to make two plating resist layers 3 and be located at
Conductive layer 5 between two plating resist layers 3 forms exposed portion in through-hole, and the conductive layer 5 that hole wall plating resist layer 3 adheres to is removed, is made
This part hole wall and perimeter conductors off-state, and the conductive layer on hole wall insulating layer can continue to be attached on hole wall, such as
Shown in Fig. 6；
Step 6. is other than exposed portion is without copper electroplating layer 6, the other parts copper electroplating layer 6 in through-hole, due to hole wall
Corresponding position conductive layer has removed, and the hole wall between original plating resist layer 3 and two layers of plating resist layer 3 is in peripheral conductor
Off-state can not realize electro-coppering, and other through-hole hole wall positions can thicken copper by plating, complete multilayer at this time
The design requirement of plate interlayer segmented conducting, as shown in Figure 7；
Step 7. potting resin 7 in through-hole, as shown in Figure 8；
The follow-up final manufacture for carrying out other old process making again and product can be completed.
The core material includes conductive copper layer 1 and the insulating layer 2 between two conductive copper layers 1, plating resist layer 3
Cover conductive copper layer 1.
In the step 5, the conductive layer 5 that 3 position of plating resist layer is corresponded in through-hole is removed by chemical method.
Plating resist layer 3 covers a part for conductive copper layer 1, and 3 size of plating resist layer is more than through-hole diameter.
The purpose of the utility model is to overcome the shortcomings that conventional manufacturing method, by adjusting technological process utility model
A kind of new Multi net voting through-hole method of manufacturing circuit board, after core plate completes internal layer circuit, it is only necessary to by one step press,
Drilling can complete increasing layer purpose, then complete the design requirement that product structure can be realized in follow-up old process.
The utility model has following technical advantage：
1. simplifying technological process, for multilayer circuit board, avoid core material and repeatedly press, drill, new side
Method only needs drilling after one step press.
2. due to simplifying technological process, manufacture cost is accordingly also reduced, improves product competition advantage.
The utility model is the multisection type conducting design that through-hole can be realized by one step press, drilling, avoids routine
Flow expends more time and processing cost using repeatedly pressing and drilling.The advantageous effect that i.e. the utility model can obtain
It is that can simplify manufacturing process flow, improves production efficiency, while reduce manufacture cost.The flow and method of the utility model is suitble to
Multilayer circuit board of the manufacture with the requirement of Multi net voting via design.
The above content is combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that the specific implementation of the utility model is confined to these explanations.For the ordinary skill of the utility model technical field
For personnel, without departing from the concept of the premise utility, several simple deduction or replace can also be made, should all be regarded
To belong to the scope of protection of the utility model.
Claims (4)
1. a kind of Multi net voting through-hole circuit board, which is characterized in that including plating resist layer（3）, conductive layer（5）, copper electroplating layer（6）, tree
Fat（7）And the core material of internal layer circuit etching is completed, plating resist layer is equipped on core material（3）And it is pressed into multilayer electricity
Road plate, through-hole pass through conductive copper layer（1）, insulating layer（2）And plating resist layer（3）；In addition to plating resist layer in through-hole（3）Position does not cover
Conductive layer（5）, the other positions in through-hole cover conductive layer（5）；In through-hole, two plating resist layers（3）It is and anti-positioned at two
Coating（3）Between conductive layer（5）Exposed portion is formed, in addition to exposed portion is without copper electroplating layer（6）Outside, other portions in through-hole
Divide copper electroplating layer（6）；Resin is filled in through-hole（7）.
2. Multi net voting through-hole circuit board according to claim 1, which is characterized in that the core material includes conductive copper layer
（1）And positioned at two conductive copper layers（1）Between insulating layer（2）, plating resist layer（3）Cover conductive copper layer（1）.
3. Multi net voting through-hole circuit board according to claim 1, which is characterized in that plating resist layer（3）Cover conductive copper layer（1）
A part.
4. Multi net voting through-hole circuit board according to claim 3, which is characterized in that plating resist layer（3）It is straight that size is more than through-hole
Diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720245166.9U CN207604033U (en) | 2017-03-14 | 2017-03-14 | Multi net voting through-hole circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720245166.9U CN207604033U (en) | 2017-03-14 | 2017-03-14 | Multi net voting through-hole circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207604033U true CN207604033U (en) | 2018-07-10 |
Family
ID=62751618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720245166.9U Expired - Fee Related CN207604033U (en) | 2017-03-14 | 2017-03-14 | Multi net voting through-hole circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207604033U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106982522A (en) * | 2017-03-14 | 2017-07-25 | 开平依利安达电子第三有限公司 | Multi net voting through hole circuit board and its manufacture method |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
| CN112888163A (en) * | 2019-11-29 | 2021-06-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114340232A (en) * | 2022-03-17 | 2022-04-12 | 梅州市志浩电子科技有限公司 | Manufacturing method of selective copper deposition and circuit board |
-
2017
- 2017-03-14 CN CN201720245166.9U patent/CN207604033U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106982522A (en) * | 2017-03-14 | 2017-07-25 | 开平依利安达电子第三有限公司 | Multi net voting through hole circuit board and its manufacture method |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
| CN112888163A (en) * | 2019-11-29 | 2021-06-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114340232A (en) * | 2022-03-17 | 2022-04-12 | 梅州市志浩电子科技有限公司 | Manufacturing method of selective copper deposition and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 |