CN205093037U - Flexible high density circuit board - Google Patents
Flexible high density circuit board Download PDFInfo
- Publication number
- CN205093037U CN205093037U CN201520893215.0U CN201520893215U CN205093037U CN 205093037 U CN205093037 U CN 205093037U CN 201520893215 U CN201520893215 U CN 201520893215U CN 205093037 U CN205093037 U CN 205093037U
- Authority
- CN
- China
- Prior art keywords
- density circuit
- layer
- high density
- coating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model relates to a flexible high density circuit board, warp the coating including base plate, elastic layer and the chinese people's anti -Japanese military and political college, the upper end of base plate is equipped with the insulating layer, the upside of insulating layer bonds and has the honeycomb sheet layer, the upside of honeycomb sheet layer bonds and has the high density circuit to spread the layer, the upside that the layer was spread to the high density circuit is equipped with insulating coating, the elastic layer and the chinese people's anti -Japanese military and political college warp the coating and bond in proper order at the lower extreme of base plate. The utility model discloses a set up base plate, elastic layer and the chinese people's anti -Japanese military and political college and be out of shape the deformation function that bends that the coating helps realizing the holistic low -angle of device, help realizing the holistic heat dissipation of device and increase the holistic insulating effect of device through setting up insulating layer, honeycomb sheet layer, high density circuit shop layer and insulating coating, and simple structure, convenient operation, economical and practical.
Description
Technical field
The utility model relates to circuit board design techniques field, particularly relates to a kind of flexible high density circuit board.
Background technology
Circuit board makes circuit miniaturization, visualize, for permanent circuit batch production and optimize electrical appliance layout and play an important role.Circuit board can be described as FPC wiring board, and FPC wiring board is that the one made for base material with polyimides or polyester film has height reliability, excellent flexible printed circuit also known as flexible circuit board flexible PCB.It has the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.The birth of FPC and PCB and development, expedited the emergence of this new product of Rigid Flex.Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, through operations such as pressings, combines by related process requirement, the wiring board with FPC characteristic and PCB characteristic of formation.But, existing flexible high density circuit board lacks the device of the low-angle bending distortion function contributing to implement device entirety, some flexible high density circuit board lacks the device of the insulation effect of the heat radiation contributing to implement device entirety and increase device entirety, the demand of actual conditions can not be met.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of flexible high density circuit board.
The utility model is achieved through the following technical solutions:
A kind of flexible high density circuit board, comprise substrate, elastic layer and Chinese People's Anti-Japanese Military and Political College's distortion coating, the upper end of described substrate is provided with insulating barrier, the upside of described insulating barrier is bonded with honeycomb flaggy, the upside of described honeycomb flaggy is bonded with high-density circuit laying, and the upside of described high-density circuit laying is provided with insulating coating.
As optimal technical scheme of the present utility model, described elastic layer and Chinese People's Anti-Japanese Military and Political College's distortion coating are bonded in the lower end of substrate successively.
As optimal technical scheme of the present utility model, the shape of described substrate is cuboid.
As optimal technical scheme of the present utility model, the material of described insulating coating is high molecular polymer.
During onsite application, device entirety is placed into correct position by operating personnel, then by fixing for device entirety, can carry out electric component and install steady job.
Compared with prior art, the beneficial effects of the utility model are: the utility model contributes to the low-angle bending distortion function of implement device entirety by arranging substrate, elastic layer and Chinese People's Anti-Japanese Military and Political College's distortion coating, contribute to the heat radiation of implement device entirety by arranging insulating barrier, honeycomb flaggy, high-density circuit laying and insulating coating and increase the insulation effect of device entirety, and structure is simple, easy to operate, economical and practical.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, substrate; 2, elastic layer; 3, Chinese People's Anti-Japanese Military and Political College's distortion coating; 4, insulating barrier; 5, honeycomb flaggy; 51, high-density circuit laying; 6, insulating coating.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is structural representation of the present utility model.
The flexible high density circuit board of described one, comprise substrate 1, elastic layer 2 and Chinese People's Anti-Japanese Military and Political College's distortion coating 3, the shape of described substrate 1 is cuboid, substrate 1, elastic layer 2 and Chinese People's Anti-Japanese Military and Political College's distortion coating 3 contribute to the low-angle bending distortion function of implement device entirety, described elastic layer 2 and Chinese People's Anti-Japanese Military and Political College's distortion coating 3 are bonded in the lower end of substrate 1 successively, and the upper end of described substrate 1 is provided with insulating barrier 4.
The upside of described insulating barrier 4 is bonded with honeycomb flaggy 5, insulating barrier 4, honeycomb flaggy 5, high-density circuit laying 51 and insulating coating 6 contribute to the heat radiation of implement device entirety and increase the insulation effect of device entirety, the upside of described honeycomb flaggy 5 is bonded with high-density circuit laying 51, the upside of described high-density circuit laying 51 is provided with insulating coating 6, and the material of described insulating coating 6 is high molecular polymer.
During onsite application, device entirety is placed into correct position by operating personnel, then by fixing for device entirety, can carry out electric component and install steady job.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. a flexible high density circuit board, it is characterized in that: comprise substrate (1), elastic layer (2) and Chinese People's Anti-Japanese Military and Political College's distortion coating (3), the upper end of described substrate (1) is provided with insulating barrier (4), the upside of described insulating barrier (4) is bonded with honeycomb flaggy (5), the upside of described honeycomb flaggy (5) is bonded with high-density circuit laying (51), and the upside of described high-density circuit laying (51) is provided with insulating coating (6).
2. the flexible high density circuit board of one according to claim 1, is characterized in that: described elastic layer (2) and Chinese People's Anti-Japanese Military and Political College's distortion coating (3) are bonded in the lower end of substrate (1) successively.
3. the flexible high density circuit board of one according to claim 1, is characterized in that: the shape of described substrate (1) is cuboid.
4. the flexible high density circuit board of one according to claim 1, is characterized in that: the material of described insulating coating (6) is high molecular polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520893215.0U CN205093037U (en) | 2015-11-10 | 2015-11-10 | Flexible high density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520893215.0U CN205093037U (en) | 2015-11-10 | 2015-11-10 | Flexible high density circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205093037U true CN205093037U (en) | 2016-03-16 |
Family
ID=55483683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520893215.0U Expired - Fee Related CN205093037U (en) | 2015-11-10 | 2015-11-10 | Flexible high density circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205093037U (en) |
-
2015
- 2015-11-10 CN CN201520893215.0U patent/CN205093037U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203746444U (en) | Anisotropic conductive film and display panel | |
| CN205255668U (en) | Low dielectricity glued membrane | |
| CN205093037U (en) | Flexible high density circuit board | |
| CN205071456U (en) | Multilayer circuit plate structure with embedded connector | |
| CN202121866U (en) | Copper foil substrate of flexible circuit board | |
| CN208490034U (en) | A kind of soft or hard combination core plate of projector | |
| CN203788548U (en) | Flexible circuit board | |
| CN210351765U (en) | Multilayer rigid-flex printed circuit board | |
| CN203352937U (en) | Flexible circuit board | |
| CN205093036U (en) | Take circuit plate structure of electromagnetic shield membrane | |
| CN205071454U (en) | Printed circuit board prevents slow -witted structure | |
| CN204539610U (en) | Fpc plate | |
| CN205071457U (en) | Multilayer flexible circuit board of static is prevented in realization | |
| CN205071486U (en) | Off normal structure is prevented to multilayer circuit board | |
| CN206024250U (en) | A kind of metal base circuit board that can arbitrarily bend rotation | |
| CN202310291U (en) | Rapid heat radiation glass fabric copper-clad plate | |
| CN203884076U (en) | Flexible circuit board of novel connecting structure | |
| CN205946369U (en) | Soft or hard combines circuit board | |
| CN205071455U (en) | Multilayer circuit plate structure of low noise | |
| CN206452610U (en) | Integrate rigidity and flexible two sided pcb | |
| CN205071453U (en) | Interval post structure of multilayer circuit board | |
| CN205071598U (en) | High -efficient type multilayer circuit board heat conduction structure | |
| CN204560006U (en) | A kind of half flexible PCB | |
| CN204014268U (en) | A kind of flexibility with effectiveness is covered metal substrate | |
| CN204560024U (en) | A kind of half flexible circuit board assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160316 Termination date: 20211110 |