CN204539610U - Fpc plate - Google Patents

Fpc plate Download PDF

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Publication number
CN204539610U
CN204539610U CN201520122351.XU CN201520122351U CN204539610U CN 204539610 U CN204539610 U CN 204539610U CN 201520122351 U CN201520122351 U CN 201520122351U CN 204539610 U CN204539610 U CN 204539610U
Authority
CN
China
Prior art keywords
copper foil
base material
diaphragm
fpc plate
arch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520122351.XU
Other languages
Chinese (zh)
Inventor
叶水林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou He Hong Electronic Science And Technology Co Ltd
Original Assignee
Suzhou He Hong Electronic Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou He Hong Electronic Science And Technology Co Ltd filed Critical Suzhou He Hong Electronic Science And Technology Co Ltd
Priority to CN201520122351.XU priority Critical patent/CN204539610U/en
Application granted granted Critical
Publication of CN204539610U publication Critical patent/CN204539610U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of FPC plate, its drip irrigation device comprises base material and diaphragm, Copper Foil is provided with between base material and diaphragm, be fixedly connected with by adhesive linkage between Copper Foil with diaphragm, be fixedly connected with by adhesive linkage between base material with Copper Foil, it is protruding that described Copper Foil is provided with some arches near the side of base material along Copper Foil length direction linear array, described base material is provided with the groove with arch male cooperation, described diaphragm is provided with antistatic backing near one end of Copper Foil, high-temperature-resistant layer is provided with between described antistatic backing and diaphragm, by arranging protruding and setting and arch male cooperation on base material the groove of arch on Copper Foil, compared to original plane, arch projection and groove, the contact area of Copper Foil that can be larger and base material, bonding complete after, very good adhesive effect can be played, and, by increasing antistatic backing and high-temperature-resistant layer on diaphragm, effectively can play antistatic and resistant to elevated temperatures effect.

Description

FPC plate
Technical field
The utility model relates to a kind of circuit board, and more particularly, it relates to a kind of FPC plate.
Background technology
Flexible PCB (Flexible Printed Circuit Board) is the printed circuit made with flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.Such as it can free bend, winding, folding, can require to arrange arbitrarily according to space layout, and moves arbitrarily at three dimensions and stretch, thus reaches components and parts and assemble the integration be connected with wire.Utilize FPC greatly can reduce the volume of electronic product, be suitable for the needs of electronic product to high density, miniaturization, highly reliable future development.Therefore, FPC is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
Current existing flexible PCB, primarily of the base material that polyimides is made, logically on base material be gluingly provided with Copper Foil, Copper Foil is provided with diaphragm by hot pressing, existing flexible circuit board structure is simple, be provided with transparent adhesive tape, but the surface of existing base material and Copper Foil is all smooth between base material and Copper Foil, the contact area of such base material and Copper Foil and transparent adhesive tape will be very poor, and the adhesive effect between base material and Copper Foil will be caused so bad; And; existing diaphragm is owing to being only just made up of epoxy resin; structure is very simple, resistant to elevated temperatures poor-performing, and the function without antistatic; but in actual use; flexible PCB is expensive due to price comparison, all should be noted that and prevent electrostatic from causing damage to flexible PCB in use and the course of processing, and; because flexible PCB is in use in order to improve its fail safe, need that there is resistant to elevated temperatures performance.
Utility model content
For the deficiency that prior art exists, the purpose of this utility model is to provide a kind of FPC plate, can increase the contact area of base material and Copper Foil and transparent adhesive tape and then improves adhesive effect and can have antistatic and resistant to elevated temperatures function.
For achieving the above object, the utility model adopts following technical scheme, a kind of FPC plate, comprise base material, diaphragm and adhesive linkage, Copper Foil is provided with between base material and diaphragm, be fixedly connected with by adhesive linkage between Copper Foil with diaphragm, be fixedly connected with by adhesive linkage between base material with Copper Foil, it is protruding that described Copper Foil is provided with some arches near the side of base material along Copper Foil length direction linear array, described base material is provided with the groove with arch male cooperation, described diaphragm is provided with antistatic backing near one end of Copper Foil, high-temperature-resistant layer is provided with between described antistatic backing and diaphragm.
Preferably, the height of arch projection is 1/2nd of copper thickness, and the distance between adjacent arcuate projection is 1 ~ 2mm.
Preferably, described antistatic backing comprises the conductive nano carbon black antistatic PTFE coating be coated on diaphragm.
Preferably, described high-temperature-resistant layer comprises PI-EP nanometer composite layer.
Preferably, the thickness of described diaphragm is 13 μm ~ 25 μm, and the thickness of described base material is 13 μm ~ 50 μm, and the thickness of described conductive nano carbon black antistatic PTFE coating is 15 μm, and the thickness of PI-EP nanometer composite layer is 15 μm.
Preferably, described adhesive linkage comprises transparent adhesive tape.
The utility model hinge structure is compared to be had: by arranging protruding and setting and arch male cooperation on base material the groove of arch on Copper Foil; compared to original plane; arch projection and groove; the contact area of Copper Foil that can be larger and base material; bonding complete after, very good adhesive effect can be played, and; by increasing antistatic backing and high-temperature-resistant layer on diaphragm, antistatic and resistant to elevated temperatures effect effectively can be played.
Accompanying drawing explanation
Fig. 1 is the assembled view of the utility model FPC plate embodiment;
Fig. 2 is the cutaway view of the utility model FPC plate embodiment.
In figure: 1, base material; 11, groove; 2, diaphragm; 3, adhesive linkage; 4, punching hole; 5, antistatic backing; 6, Copper Foil; 61, arch is protruding; 7, high-temperature-resistant layer.
Embodiment
Below in conjunction with accompanying drawing, the utility model FPC plate embodiment is described further.
A kind of FPC plate, comprise base material 1 and diaphragm 2, Copper Foil 6 is provided with between base material 1 and diaphragm 2, flexible PCB is provided with the punching hole 4 for connecting related circuit, be fixedly connected with by adhesive linkage 3 between Copper Foil 6 with diaphragm 2, in the present embodiment, adhesive linkage 3 comprises transparent adhesive tape, be fixedly connected with by adhesive linkage 3 between base material 1 with Copper Foil 6, Copper Foil 6 is provided with some arch projections 61 near the side of base material 1 along Copper Foil 6 length direction linear array, base material 1 is provided with the groove 11 coordinated with arch protruding 61, diaphragm 2 is provided with antistatic backing 5 near one end of Copper Foil 6, high-temperature-resistant layer 7 is provided with between antistatic backing 5 and diaphragm 2, by arranging arch protruding 61 and arrange the groove 11 coordinated with arch protruding 61 on Copper Foil 6 on base material 1, compared to original plane, arch protruding 61 and groove 11, the contact area of Copper Foil 6 and base material 1 and adhesive linkage 3 can be increased, bonding complete after, very good adhesive effect can be played, and, by increasing antistatic backing 5 and high-temperature-resistant layer 7 on diaphragm 2, effectively can play antistatic and resistant to elevated temperatures effect, in the present embodiment, the height of arch projection 61 is 1/2nd of Copper Foil 6 thickness, distance between adjacent arcuate projection 61 is 1 ~ 2mm, arch protruding 61 and groove 11 are set like this, not only material can be saved, and good positioning action can be played again.
In the present embodiment; antistatic backing 5 comprises the conductive nano carbon black antistatic PTFE coating be coated on diaphragm 2; conductive nano carbon black antistatic PTFE coating knownly at present has good antistatic material; in " Shanghai coating " 07 phase in 2012 " research of conductive nano carbon black antistatic PTFE coating ", its preparation method and detailed performance are elaborated, do not repeat them here.
In the present embodiment, high-temperature-resistant layer 7 comprises PI-EP nanometer composite layer, PI-EP nanometer composite layer knownly at present has the tender material of good heat-resisting quantity, in " the preparation and property research of PI-EP nano composite material " of Yue Wei, its preparation method and detailed performance are elaborated, do not repeat them here.
The thickness of diaphragm 2 is 13 μm ~ 25 μm; the thickness of base material is 13 μm ~ 50 μm; the thickness of conductive nano carbon black antistatic PTFE coating is 15 μm; the thickness of PI-EP nanometer composite layer is 15 μm; be in the diaphragm 2 in this thickness and base material, have good flexibility and can ensure certain hardness again, the thickness of conductive nano carbon black antistatic PTFE coating is 15 μm; be in the antistatic backing 5 of this thickness, there is good anti-static effect.
Below be only preferred implementation of the present utility model; protection range of the present utility model is also not only confined to above-described embodiment; all technical schemes belonged under the utility model thinking all belong to protection range of the present utility model; should be understood that; for those skilled in the art; do not departing from the some improvements and modifications under the utility model principle prerequisite, these improvements and modifications also should be considered as protection range of the present utility model.

Claims (6)

1. a FPC plate; comprise base material, diaphragm and adhesive linkage; Copper Foil is provided with between base material and diaphragm; be fixedly connected with by adhesive linkage between Copper Foil with diaphragm; be fixedly connected with by adhesive linkage between base material with Copper Foil; it is characterized in that: it is protruding that described Copper Foil is provided with some arches near the side of base material along Copper Foil length direction linear array; described base material is provided with the groove with arch male cooperation; described diaphragm is provided with antistatic backing near one end of Copper Foil, is provided with high-temperature-resistant layer between described antistatic backing and diaphragm.
2. FPC plate according to claim 1, is characterized in that: the height of arch projection is 1/2nd of copper thickness, and the distance between adjacent arcuate projection is 1 ~ 2mm.
3. FPC plate according to claim 1 and 2, is characterized in that: described antistatic backing comprises the conductive nano carbon black antistatic PTFE coating be coated on diaphragm.
4. FPC plate according to claim 3, is characterized in that: described high-temperature-resistant layer comprises PI-EP nanometer composite layer.
5. FPC plate according to claim 4; it is characterized in that: the thickness of described diaphragm is 13 μm ~ 25 μm; the thickness of described base material is 13 μm ~ 50 μm, and the thickness of described conductive nano carbon black antistatic PTFE coating is 15 μm, and the thickness of PI-EP nanometer composite layer is 15 μm.
6. FPC plate according to claim 5, is characterized in that: described adhesive linkage comprises transparent adhesive tape.
CN201520122351.XU 2015-03-03 2015-03-03 Fpc plate Expired - Fee Related CN204539610U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520122351.XU CN204539610U (en) 2015-03-03 2015-03-03 Fpc plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520122351.XU CN204539610U (en) 2015-03-03 2015-03-03 Fpc plate

Publications (1)

Publication Number Publication Date
CN204539610U true CN204539610U (en) 2015-08-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520122351.XU Expired - Fee Related CN204539610U (en) 2015-03-03 2015-03-03 Fpc plate

Country Status (1)

Country Link
CN (1) CN204539610U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107911938A (en) * 2017-11-21 2018-04-13 河源耀国电子科技有限公司 A kind of FPC plates for LCD liquid crystal display screen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107911938A (en) * 2017-11-21 2018-04-13 河源耀国电子科技有限公司 A kind of FPC plates for LCD liquid crystal display screen

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150805

CF01 Termination of patent right due to non-payment of annual fee