CN203661404U - Bonding structure of high-smoothness step blind slot circuit board - Google Patents
Bonding structure of high-smoothness step blind slot circuit board Download PDFInfo
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- CN203661404U CN203661404U CN201320764123.3U CN201320764123U CN203661404U CN 203661404 U CN203661404 U CN 203661404U CN 201320764123 U CN201320764123 U CN 201320764123U CN 203661404 U CN203661404 U CN 203661404U
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- rigid plate
- blind slot
- milling
- pressing structure
- wiring board
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Abstract
The utility model is a bonding structure of a high-smoothness step blind slot circuit board. The bonding structure comprises a thin rigid plate, a dielectric layer, and a thick rigid plate which are sequentially bonded; a milling half-slot region is arranged on a surface of the thick rigid plate; a window region corresponding the milling half-slot region is arranged on the dielectric layer; and a polyimide film layer is adhered to the milling half-slot region by an epoxy resin adhesive layer. The bonding structure of the utility model can greatly improve the smoothness of the surface of the circuit board after bonding, and can effectively solve the problem that the outer line film is not tight and the problem that after the resin fills the hole, the resin residue in the concave region cannot be polished off; the polyimide film can effectively prevent the adhesive from flowing to the slot region, and the excellent adhesive resistance effect is realized; and at the same time, the problems in the prior art that using of the FR - 4 plate and other plates causes the sliding and eventually the boundary delamination can be effectively solved.
Description
Technical field
The utility model relates to printed wiring board technical field, particularly relates to a kind of pressing structure of high smooth ladder blind slot wiring board.
Background technology
Along with electronic product develops rapidly to the direction of miniaturization, densification, high-flatness, Highgrade integration and multifunction, also more and more higher to printed wiring board requirement, especially the generation of the ladder blind slot printed board of high integration, high density, high planarization has met above requirement.
The printed board of highdensity ladder blind slot can be installed in blind slot district various components and parts, can effectively utilize installing space; Conventionally adopt the binding agent mode that groove milling of flow model PP sheet is not windowed to produce owing to having the blind slot pcb board of hierarchic structure, the part of windowing in groove milling just can be inserted various components and parts, has the advantages such as densification, highly integrated, high planarization.Due to its significant superiority, high planarization ladder blind slot printed circuit board prospect in an increasingly wide range of applications.
At present, the pcb board of hierarchic structure adopts the binding agent mode that groove milling of flow model pp sheet is not windowed to produce conventionally, and because this technique exists height fall in the district of windowing, the plate face in the district of windowing after pressing easily produces depression (as shown in Figure 1).Affect the making of follow-up flow process, as filling holes with resin, outer-layer circuit etc.In order to prevent depression, some conventional ways are pad FR-4 tabula rasa, silica gel pieces etc. in fluting, but due to FR-4 tabula rasa with Silicone Rubber is inviscid is easy to the slip border layering that causes slotting.
Utility model content
Based on this, the purpose of this utility model is to provide a kind of pressing structure of high smooth ladder blind slot wiring board.
Concrete technical scheme is as follows:
A kind of pressing structure of high smooth ladder blind slot wiring board, this pressing structure comprises the thin rigid plate, dielectric layer and the thick rigid plate that stack gradually, the plate face of described thick rigid plate is provided with milling half groove region, described dielectric layer is provided with the windowed regions corresponding with milling half groove region, and described milling is pasted polyimides rete by epoxy glue layer on half groove region.
In an embodiment, the size of the each length of side of described polyimides rete is than the little 0.1-1mm of size of the described milling half each length of side in groove region therein.
In an embodiment, the thickness difference of described polyimides rete and described dielectric layer is 5-10 μ m therein.
In an embodiment, the thickness difference between described thin rigid plate and described thick rigid plate is 0.5-1mm therein.
In an embodiment, milling half groove depth in described milling half groove region is the 1/3-1/2 of thick rigid plate thickness therein.
In an embodiment, described thin rigid plate is individual layer rigid plate or multilayer rigid plate therein, and described thick rigid plate is individual layer rigid plate or multilayer rigid plate.
Advantage of the present utility model:
Pressing structure of the present utility model can improve the planarization on lamination rear board surface greatly, and can effectively solving outer-layer circuit, to make pad pasting not tight, and after filling holes with resin, recess resin residue polishing such as does not fall at the problem; And polyimides rete can effectively stop solation to slotted zones, resistance glue effect is splendid; Meanwhile, can also effectively solve the problem that slippage that available technology adopting FR-4 plate etc. causes causes border layering.
Accompanying drawing explanation
Fig. 1 is the wiring board schematic diagram that produces depression in prior art;
Fig. 2 is the utility model pressing structure schematic diagram.
Description of reference numerals:
101, thin rigid plate; 102, thick rigid plate; 103, dielectric layer; 104, polyimides rete.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further elaborated.
With reference to figure 2, the pressing structure of a kind of high smooth ladder blind slot wiring board of the present embodiment, this pressing structure comprises the thin rigid plate 101, dielectric layer 103 and the thick rigid plate 102 that stack gradually, the plate face of described thick rigid plate is provided with milling half groove region, described dielectric layer is provided with the windowed regions corresponding with milling half groove region, and described milling is pasted polyimides rete 104 by epoxy glue layer on half groove region.
The size of the each length of side of described polyimides rete is than the little 0.1-1mm of size of the described milling half each length of side in groove region.
The thickness difference of described polyimides rete and described dielectric layer is 5-10 μ m.
Thickness difference between described thin rigid plate and described thick rigid plate is 0.5-1mm.
Milling half groove depth in described milling half groove region is the 1/3-1/2 of thick rigid plate thickness.
Described thin rigid plate is individual layer rigid plate or multilayer rigid plate, and described thick rigid plate is individual layer rigid plate or multilayer rigid plate.
The smooth ladder blind slot of the height wiring board being prepared by the pressing structure of the smooth ladder blind slot of above-mentioned height wiring board, preparation method is as follows:
1. make according to a conventional method the thin rigid plate of one side circuit;
2. make according to a conventional method the thick rigid plate with milling half groove region, milling half groove depth in milling half groove region is the 1/3-1/2 of thick rigid plate thickness;
The milling half groove region of 3. polyimides (PI) film being carried out being pasted on by epoxy glue layer after sharp processing thick rigid plate, the size of the each length of side of polyimides rete is than the little 0.1-1mm of size of the milling half each length of side in groove region;
4. according to a conventional method will be not flow model pp sheet (dielectric layer) window, windowed regions size is corresponding with milling half groove region, and the gross thickness of the thickness of PI rete and PP sheet poor be 5-10 μ m;
5. after thin rigid plate, pp sheet, the thick rigid plate of posting PI rete being stacked gradually to walkthrough riveted, carry out lamination treatment;
6. the plate after lamination the operation such as outer-layer circuit, filling holes with resin make after, by control dark milling by the half groove region of milling in thick rigid plate together with PI rete mill off, thereby make the printed board of a kind of high planarization ladder blind slot.
The dielectric layer of this pressing structure is during with 1 PP sheet, depression can be down to below 5um from 55um, during with 2 PP sheets, depression can be down to below 5um from 110um, the unclean problem of cull polishing caves in while solving the tight problem of circuit making pad pasting and filling holes with resin completely, and polyimides rete can effectively stop solation to slotted zones, resistance glue effect is splendid; Meanwhile, can also effectively solve the problem that slippage that available technology adopting FR-4 plate etc. causes causes border layering.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (6)
1. the pressing structure of one kind high smooth ladder blind slot wiring board, it is characterized in that, this pressing structure comprises the thin rigid plate, dielectric layer and the thick rigid plate that stack gradually, the plate face of described thick rigid plate is provided with milling half groove region, described dielectric layer is provided with the windowed regions corresponding with milling half groove region, and described milling is pasted polyimides rete by epoxy glue layer on half groove region.
2. the pressing structure of the smooth ladder blind slot of height according to claim 1 wiring board, is characterized in that, the size of the each length of side of described polyimides rete is than the little 0.1-1mm of size of the described milling half each length of side in groove region.
3. the pressing structure of the smooth ladder blind slot of height according to claim 1 wiring board, is characterized in that, the thickness difference of described polyimides rete and described dielectric layer is 5-10 μ m.
4. the pressing structure of the smooth ladder blind slot of height according to claim 1 wiring board, is characterized in that, the thickness difference between described thin rigid plate and described thick rigid plate is 0.5-1mm.
5. the pressing structure of the smooth ladder blind slot of height according to claim 1 wiring board, is characterized in that, milling half groove depth in described milling half groove region is the 1/3-1/2 of thick rigid plate thickness.
6. according to the pressing structure of the smooth ladder blind slot of the height wiring board described in claim 1-5 any one, it is characterized in that, described thin rigid plate is individual layer rigid plate or multilayer rigid plate, and described thick rigid plate is individual layer rigid plate or multilayer rigid plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320764123.3U CN203661404U (en) | 2013-11-26 | 2013-11-26 | Bonding structure of high-smoothness step blind slot circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320764123.3U CN203661404U (en) | 2013-11-26 | 2013-11-26 | Bonding structure of high-smoothness step blind slot circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203661404U true CN203661404U (en) | 2014-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320764123.3U Expired - Fee Related CN203661404U (en) | 2013-11-26 | 2013-11-26 | Bonding structure of high-smoothness step blind slot circuit board |
Country Status (1)
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| CN (1) | CN203661404U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104619131A (en) * | 2015-02-13 | 2015-05-13 | 广州杰赛科技股份有限公司 | Asymmetric flex-rigid combined circuit board and preparation method thereof |
| CN105188283A (en) * | 2015-08-06 | 2015-12-23 | 高德（无锡）电子有限公司 | Manufacturing technique of stepped-design-based PCB |
| CN110536563A (en) * | 2019-09-20 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | Fly tail hierarchic structure rigid-flex combined board and production method |
| CN111182732A (en) * | 2020-02-28 | 2020-05-19 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
-
2013
- 2013-11-26 CN CN201320764123.3U patent/CN203661404U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104619131A (en) * | 2015-02-13 | 2015-05-13 | 广州杰赛科技股份有限公司 | Asymmetric flex-rigid combined circuit board and preparation method thereof |
| CN104619131B (en) * | 2015-02-13 | 2017-12-01 | 广州杰赛科技股份有限公司 | Asymmetric rigid-flexible combined circuit board and preparation method thereof |
| CN105188283A (en) * | 2015-08-06 | 2015-12-23 | 高德（无锡）电子有限公司 | Manufacturing technique of stepped-design-based PCB |
| CN110536563A (en) * | 2019-09-20 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | Fly tail hierarchic structure rigid-flex combined board and production method |
| CN111182732A (en) * | 2020-02-28 | 2020-05-19 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN111182732B (en) * | 2020-02-28 | 2023-01-10 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20211126 |