CN110337177A - It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust - Google Patents
It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust Download PDFInfo
- Publication number
- CN110337177A CN110337177A CN201910544241.5A CN201910544241A CN110337177A CN 110337177 A CN110337177 A CN 110337177A CN 201910544241 A CN201910544241 A CN 201910544241A CN 110337177 A CN110337177 A CN 110337177A
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- copper foil
- hole
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of with the circuit board of pad and preparation method thereof that can bear high thrust, the circuit board includes circuit board body, the circuit board body is equipped with pad, the pad includes insulating layer substrate, copper foil, the tow sides of insulating layer substrate are arranged in the copper foil, and the pad is equipped with micro through-hole, and the micro through-hole runs through insulating layer substrate and copper foil, copper facing is filled in the micro through-hole, the copper facing is connected with the copper foil of insulating layer substrate tow sides.The present invention solves that the pad peel strength on available circuit plate is low, bears the low problem of thrust after leading to stick component.
Description
Technical field
The present invention relates to technical field of electronic components more particularly to a kind of circuits with the pad that can bear high thrust
Plate and preparation method thereof.
Background technique
With the development of electronic product currently on the market, the small and exquisite product of more and more finenesses occurs, institute on these products
Component is also smaller and smaller, such as some mobile phone backlight products, above used LED light it is smaller and smaller, just due to this,
Weld pad required for these LED light also becomes smaller and smaller therewith.In this case, by these lesser electronics member devices
Part is welded on pad, if applying a horizontal external force (thrust) to it, since pad is too small, the peel strength of pad is just
Not enough, pad will be very easy to fall off, so that the electronic component being attached to above will also be turned down therewith.So smaller
Pad will have a direct impact on pad and stick the thrust that can be born after component, lead to the member being welded on pad in this case
Device is easy to fall off because of external force, causes large effect to the use of product.And the pad on existing circuit board is not increasing
In the case where being welded with disc area, the problem cannot be all efficiently solved.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide a kind of with can bear high thrust
The circuit board of pad, can obviously increase the peel strength of pad, so that thrust can be born by achieving the effect that increase.
The second object of the present invention is to provide a kind of method that production has the circuit board for the pad that can bear high thrust,
The peel strength of pad can be obviously increased with the circuit board that its method makes, so that thrust can be born by achieving the effect that increase.
An object of the present invention adopts the following technical scheme that realization:
A kind of circuit board with the pad that can bear high thrust, including circuit board body, the circuit board body include
Insulating layer substrate and pad for welding component are covered with copper foil on the pad, and the circuit board body reverse side is corresponding
The position of front pad is also covered with copper foil, and the pad is equipped with micro through-hole, the micro through-hole through insulating layer substrate and
Copper foil, the micro through-hole is interior to be filled with copper facing, and the copper facing is connected with the copper foil of circuit board tow sides.
Further, the circuit board body is FPC flexible circuit board.
Further, the insulating layer substrate is made of polyimides.
Further, the copper foil is connected by thermoplastic polyimide with insulating layer substrate.
Further, the diameter of the micro through-hole is 0.03mm.
Further, the micro through-hole has 8.
Further, the micro through-hole is set in qually spaced on pad.
The second object of the present invention adopts the following technical scheme that realization:
A method of the circuit board that there is the pad that can bear high thrust for making above-mentioned any one, including it is following
Step:
S11, the pad of circuit board body is punched, generates micro through-hole and runs through copper foil and insulating layer substrate；
S12, copper foil is also covered in the position of circuit board body reverse side corresponding circuits plate ontology front pad；
S13, the same position that each micro through-hole is corresponded on the copper foil at the circuit board body back side are punched；
S14, copper facing filling perforation is carried out in each micro through-hole；
Or:
S21, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad；
S22, the pad of circuit board body is punched, generates micro through-hole and runs through circuit board front copper foil, insulating layer
Substrate and circuit board reverse side copper foil；
S23, copper facing filling perforation is carried out in each micro through-hole.
Further, step S11 is also included the following specific steps:
S111, when the pad back side is not routed, directly execution S113；
S112, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S113；
S113, pad is punched, generates the micro through-hole through front copper foil and insulating layer substrate.
Further, step S21 is also included the following specific steps:
S211, when the pad back side is not routed, directly execution S213；
S212, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S213；
S213, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad.
Compared with prior art, the beneficial effects of the present invention are:
Increase multiple micro through-holes on the pad of circuit board, full copper facing, the insulation of copper facing and pad are filled in through-hole
The copper foil of layer substrate tow sides is connected.Insulating layer substrate tow sides can be realized using the pad of the circuit board of the structure
Copper foil through hole in copper facing connection, reinforce the combination dynamics of copper foil and insulating layer substrate, with this to greatly increase single side copper
The peel strength of foil, so that further increasing pad sticks the thrust that can be born after electronic component.The technical solution can have
The pad peel strength that effect ground solves on available circuit plate is low, bears the low problem of thrust after leading to stick component.
Detailed description of the invention
Fig. 1 is the positive structure schematic of one embodiment of the invention
Fig. 2 is the reverse structure schematic of one embodiment of the invention
Fig. 3 is schematic cross-section at the pad of one embodiment of the invention
In figure: 1, circuit board body 2, pad 3, micro through-hole 4, insulating layer substrate 5, copper foil 6, copper facing
Specific embodiment
Below in conjunction with attached drawing and specific embodiment, the present invention is described further.
Embodiment one:
With reference to Fig. 1-Fig. 3, a kind of circuit board with the pad 2 that can bear high thrust, including circuit board body 1 are provided,
The circuit board body 1 includes insulating layer substrate 4 and the pad 2 for welding component, is covered with copper foil 5 on the pad 2,
The position that 1 reverse side of circuit board body corresponds to front pad 2 is also covered with copper foil 5, and the pad 2 is equipped with micro through-hole 3, institute
It states micro through-hole 3 and is filled with copper facing 6, the copper facing 6 and circuit in insulating layer substrate 4 and copper foil 5, the micro through-hole 3
The copper foil 5 of plate tow sides is connected.
In the present embodiment, circuit board is made of circuit board body 1.Specifically, circuit board body 1 includes an insulating layer
Substrate 4 and several pads 2, are covered with copper foil 5 in the tow sides of pad 2, and in pad 2 by way of laser boring
On be equipped with 8 micro through-holes 3 through tow sides copper foil 5 and insulating layer substrate 4, and in micro through-hole 3 plating by hole
Inside fill up copper facing 6.Herein, laser boring is only used as a preferred hole knockout, and hole knockout further includes and is not limited only to acid
It washes and the modes such as electrical discharge machining.
Different from common circuit board, copper foil 5 is arranged on insulating layer substrate 4, if pad 2 is too small, copper foil 5 and absolutely
The bonding dynamics of edge layer substrate 4 is also small, and copper foil 5 is also easy for being stripped, so that the electronic components such as LED light are being welded to pad
It is also easy for after on 2 because being turned down by thrust, influences very much the using effect of product.
It, will be upper since the copper foil 5 of the tow sides of pad 2 is passed through 3 filling perforation of micro through-hole using the circuit board of the structure
Lower two layers of connection, single side copper foil 5 will receive the holdback force of another side copper foil 5 when by peeling force, to considerably increase
The peel strength of single side copper foil 5.After sticking component in the front of pad 2, the thrust that pad 2 can be born is also increased.This
Kind of mode can efficiently solve that the pad peel strength on available circuit plate is low, bear thrust after leading to stick component
Low problem.
Preferably, circuit board body 1 is FPC flexible circuit board.FPC flexible circuit board have Distribution density it is high, it is light-weight,
The feature that thickness is thin, bending is good can require any arrangement with free bend, winding, folding according to space layout, and
Three-dimensional space arbitrarily moves and flexible, to reach the integration that components and parts assembling is connected with conducting wire.It can be big using FPC flexible board
The big volume for reducing electronic product, is applicable in the needs that electronic product develops to high density, miniaturization, highly reliable direction, more meets
To the requirement as small as possible of entire electronic product.
Preferably, insulating layer substrate 4 is made of polyimides.Polyimides is the optimal organic polymer material of comprehensive performance
One of material, high temperature resistant, partially without sharp melting point, have height up to 400 DEG C or more, -200~300 DEG C of long-term use temperature range
Insulation performance.
Preferably, copper foil 5 is connected by thermoplastic polyimide with insulating layer substrate 4.Thermoplastic polyimide be
The special engineering plastics with good thermoplastic processability to grow up on the basis of traditional Thermocurable polyimide it
One, particularly suitable for the complicated product of one-pass molding, have with insulating layer substrate 4 made of polyimides in the present invention good
Adhesiveness.
Preferably, the diameter of micro through-hole 3 is 0.03mm.The too small micro through-hole 3 of diameter due to after filling perforation copper facing 6 with
5 contact area of copper foil is too small, effectively can not provide holdback force to copper foil 5, and the micro through-hole 3 for crossing major diameter then will affect
The degree of adhesion of copper foil 5 and insulating layer substrate 4 is suitable for implementation of the present invention so setting 0.03mm for the diameter of micro through-hole 3
Example.
Preferably, with reference to Fig. 1-Fig. 2, micro through-hole 3 is set in qually spaced on pad 2.Every two is miniature logical on pad 2
The all spaced sets of hole 3, and three adjacent micro through-holes 3 mutually setting triangular in shape, have stability according to triangle
Property, the micro through-hole 3 of this structure connect two sides copper foil 5 with more stability after filling perforation, the more difficult removing of copper foil 5,
The component being attached on pad 2 can also bear bigger thrust.
Embodiment two:
It provides for making circuit board of any one of the above-described embodiment one with the pad that can bear high thrust
Method, specifically includes the following steps:
S11, the pad 2 of circuit board substrate is carried out to laser boring, generation micro through-hole 3 is through front copper foil 5 and absolutely
Edge layer substrate 4；Certainly, laser boring is a kind of preferred hole knockout, and technical staff can also use pickling and electric spark
The various ways such as processing are punched；
S12, copper foil 5 is also covered in the position that 1 reverse side of circuit board body corresponds to front pad 2；
S13, the same position that each micro through-hole 3 is corresponded on the copper foil 5 at 1 back side of circuit board body are punched；Make
Obtain the effect for realizing that two sides copper foil 5 mutually restrains after implementing copper facing filling perforation operation；
S14, copper facing filling perforation is carried out in each micro through-hole 3.
Preferably, step S11 is also included the following specific steps:
S111, when 2 back side of pad is not routed, directly execution S113；
S112, it is routed when 2 back side of pad is equipped with, rewiring is got around 2 back side of pad, and executes S113；Herein
The cyberrelationship for also needing to analyze wiring must not change its cyberrelationship after paying attention to rewiring；
S113, laser boring is carried out to pad 2, generates the micro through-hole 3 through front copper foil 5 and insulating layer substrate 4.
Embodiment three:
It provides for making circuit board of any one of the above-described embodiment one with the pad that can bear high thrust
Method, specifically includes the following steps:
S21, copper foil 5 is covered in the position of circuit board reverse side corresponding circuits plate front pad 2；
S22, the pad 2 of circuit board body 1 is punched, generate micro through-hole 3 through circuit board front copper foil 5, absolutely
Edge layer substrate 4 and circuit board reverse side copper foil 5；The position of front copper foil first, which is corresponded to, in the reverse side of circuit board is covered with copper foil, it can be with
It it is covered with reverse side copper foil again needs the step of punching again after saving first punching.
S23, copper facing filling perforation is carried out in each micro through-hole 3.
Preferably, step S21 is also included the following specific steps:
S211, when 2 back side of pad is not routed, directly execution S213；
S212, it is routed when 2 back side of pad is equipped with, rewiring is got around 2 back side of pad, and executes S213；Herein
It is also required to the cyberrelationship of analysis wiring, its cyberrelationship must not be changed after paying attention to rewiring；
S213, copper foil 5 is covered in the position of circuit board reverse side corresponding circuits plate front pad 2.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied, and all any modifications made within principle of the invention are equal
Replacement, improvement etc., should be included within the scope of the present invention.
Claims (10)
1. a kind of circuit board with the pad that can bear high thrust, it is characterised in that: including circuit board body, the circuit board
Ontology includes insulating layer substrate and the pad for welding component, and copper foil, the circuit board body are covered on the pad
The position that reverse side corresponds to front pad is also covered with copper foil, and the pad is equipped with micro through-hole, and the micro through-hole is through insulation
Layer substrate and copper foil, the micro through-hole is interior to be filled with copper facing, and the copper facing is connected with the copper foil of circuit board tow sides.
2. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: the circuit board
Ontology is FPC flexible circuit board.
3. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: the insulating layer
Substrate is made of polyimides.
4. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: the copper foil is logical
Thermoplastic polyimide is crossed to be connected with insulating layer substrate.
5. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: described miniature logical
The diameter in hole is 0.03mm.
6. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: described miniature logical
Hole has 8.
7. the circuit board with the pad that can bear high thrust according to claim 6, it is characterised in that: described miniature logical
Hole is set in qually spaced on pad.
8. a kind of method that there is the circuit board for the pad that can bear high thrust for making any one of claim 1-7,
Characterized by comprising the following steps:
S11, the pad of circuit board body is punched, generates micro through-hole and runs through copper foil and insulating layer substrate；
S12, copper foil is also covered in the position of circuit board body reverse side corresponding circuits plate ontology front pad；
S13, the same position that each micro through-hole is corresponded on the copper foil at the circuit board body back side are punched；
S14, copper facing filling perforation is carried out in each micro through-hole；
Or:
S21, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad；
S22, the pad of circuit board body is punched, generates micro through-hole and runs through circuit board front copper foil, insulating layer substrate
And circuit board reverse side copper foil；
S23, copper facing filling perforation is carried out in each micro through-hole.
9. the method that production according to claim 8 has the circuit board for the pad that can bear high thrust, which is characterized in that
Step S11 is also included the following specific steps:
S111, when the pad back side is not routed, directly execution S113；
S112, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S113；
S113, pad is punched, generates the micro through-hole through front copper foil and insulating layer substrate.
10. the method that production according to claim 8 has the circuit board for the pad that can bear high thrust, feature exist
In step S21 is also included the following specific steps:
S211, when the pad back side is not routed, directly execution S213；
S212, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S213；
S213, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910544241.5A CN110337177A (en) | 2019-06-21 | 2019-06-21 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910544241.5A CN110337177A (en) | 2019-06-21 | 2019-06-21 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110337177A true CN110337177A (en) | 2019-10-15 |
Family
ID=68140531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910544241.5A Pending CN110337177A (en) | 2019-06-21 | 2019-06-21 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110337177A (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4862588A (en) * | 1988-07-21 | 1989-09-05 | Microelectronics And Computer Technology Corporation | Method of making a flexible interconnect |
| US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
| US5266746A (en) * | 1990-11-29 | 1993-11-30 | Mitsui Toatsu Chemicals, Inc. | Flexible printed circuit board having a metal substrate |
| US6809267B1 (en) * | 1998-08-13 | 2004-10-26 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
| US20060180344A1 (en) * | 2003-01-20 | 2006-08-17 | Shoji Ito | Multilayer printed wiring board and process for producing the same |
| US20090200074A1 (en) * | 2008-02-12 | 2009-08-13 | International Business Machines Corporation | Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
| US20110063811A1 (en) * | 2003-12-05 | 2011-03-17 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| CN202026529U (en) * | 2011-03-29 | 2011-11-02 | 京东方科技集团股份有限公司 | Printed circuit board |
| CN103379732A (en) * | 2012-04-13 | 2013-10-30 | 鸿富锦精密工业（深圳）有限公司 | Pad-reinforced printed circuit board |
| CN103692724A (en) * | 2013-12-23 | 2014-04-02 | 松扬电子材料(昆山)有限公司 | Double-face copper clad baseplate with composite type transparent insulation layer |
| CN203818668U (en) * | 2013-12-23 | 2014-09-10 | 松扬电子材料(昆山)有限公司 | Combined type two-sided copper foil base plate of transparent insulating layer |
| CN204578895U (en) * | 2015-04-24 | 2015-08-19 | 上海通铭信息科技有限公司 | Printed circuit board (PCB) |
| CN104859223A (en) * | 2015-05-21 | 2015-08-26 | 成都多吉昌新材料有限公司 | Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers |
| CN105792512A (en) * | 2016-03-31 | 2016-07-20 | 努比亚技术有限公司 | Pad reinforcing structure |
| CN106376175A (en) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | Printed circuit board and mobile terminal |
-
2019
- 2019-06-21 CN CN201910544241.5A patent/CN110337177A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4862588A (en) * | 1988-07-21 | 1989-09-05 | Microelectronics And Computer Technology Corporation | Method of making a flexible interconnect |
| US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
| US5266746A (en) * | 1990-11-29 | 1993-11-30 | Mitsui Toatsu Chemicals, Inc. | Flexible printed circuit board having a metal substrate |
| US6809267B1 (en) * | 1998-08-13 | 2004-10-26 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
| US20060180344A1 (en) * | 2003-01-20 | 2006-08-17 | Shoji Ito | Multilayer printed wiring board and process for producing the same |
| US20110063811A1 (en) * | 2003-12-05 | 2011-03-17 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| US20090200074A1 (en) * | 2008-02-12 | 2009-08-13 | International Business Machines Corporation | Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
| CN202026529U (en) * | 2011-03-29 | 2011-11-02 | 京东方科技集团股份有限公司 | Printed circuit board |
| CN103379732A (en) * | 2012-04-13 | 2013-10-30 | 鸿富锦精密工业（深圳）有限公司 | Pad-reinforced printed circuit board |
| CN103692724A (en) * | 2013-12-23 | 2014-04-02 | 松扬电子材料(昆山)有限公司 | Double-face copper clad baseplate with composite type transparent insulation layer |
| CN203818668U (en) * | 2013-12-23 | 2014-09-10 | 松扬电子材料(昆山)有限公司 | Combined type two-sided copper foil base plate of transparent insulating layer |
| CN204578895U (en) * | 2015-04-24 | 2015-08-19 | 上海通铭信息科技有限公司 | Printed circuit board (PCB) |
| CN104859223A (en) * | 2015-05-21 | 2015-08-26 | 成都多吉昌新材料有限公司 | Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers |
| CN105792512A (en) * | 2016-03-31 | 2016-07-20 | 努比亚技术有限公司 | Pad reinforcing structure |
| CN106376175A (en) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | Printed circuit board and mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101472400B (en) | Printed wiring board unit and method of making the same | |
| US20130029500A1 (en) | Connector and fabrication method thereof | |
| CN104904325A (en) | Flexible printed circuit | |
| CN109429427B (en) | Circuit board and manufacturing method thereof | |
| CN105762131A (en) | Package structure and manufacturing method thereof | |
| CN205071432U (en) | Flexible circuit board | |
| JP2022507049A (en) | Flexible connector and its manufacturing method | |
| CN110337177A (en) | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust | |
| CN207235030U (en) | Microphone and electronic equipment | |
| CN109887886A (en) | Signal connection three-dimensional vertical interconnecting structure and method | |
| CN210926014U (en) | Sip packaging structure of semiconductor chip | |
| CN101626011B (en) | Base plate having pad-free type conductive traces and using for encapsulation | |
| CN102437133A (en) | Semiconductor device | |
| CN202855947U (en) | Connecting member and electronic device comprising the same | |
| CN211580281U (en) | Prefabricated substrate, printed circuit board and electronic device | |
| CN206314073U (en) | A kind of battery modules flow pcb board | |
| US8625299B2 (en) | Circuit board with even current distribution | |
| CN213803596U (en) | Anisotropic conductive adhesive film | |
| CN209748929U (en) | Printed circuit board with diversified assembly | |
| KR20140095881A (en) | Flexible flat cable for LDVS | |
| CN112736517A (en) | Electric connector and integrated device comprising same | |
| CN203219614U (en) | Circuit board | |
| CN201590523U (en) | Plate end connector | |
| CN201563292U (en) | Grounding structure of circuit board | |
| CN102931168A (en) | Packaging substrate and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 510663 north of the first floor, No.9, Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangdong Province Applicant after: Guangzhou Yuankang Precision Electronics Co.,Ltd. Address before: 510700 north of the first floor of the first floor, No.9 Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangzhou City, Guangdong Province Applicant before: GUANGZHOU JP-WH PRECISION CIRCUIT Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191015 |
|
| RJ01 | Rejection of invention patent application after publication |