CN110337177A - It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust - Google Patents

It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust Download PDF

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Publication number
CN110337177A
CN110337177A CN201910544241.5A CN201910544241A CN110337177A CN 110337177 A CN110337177 A CN 110337177A CN 201910544241 A CN201910544241 A CN 201910544241A CN 110337177 A CN110337177 A CN 110337177A
Authority
CN
China
Prior art keywords
pad
circuit board
copper foil
hole
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910544241.5A
Other languages
Chinese (zh)
Inventor
张宇
江克明
张岩
肖开祥
李华兵
王东州
温智敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINPENG YUANKANG (GUANGZHOU) PRECISION CIRCUIT CO Ltd
Original Assignee
JINPENG YUANKANG (GUANGZHOU) PRECISION CIRCUIT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JINPENG YUANKANG (GUANGZHOU) PRECISION CIRCUIT CO Ltd filed Critical JINPENG YUANKANG (GUANGZHOU) PRECISION CIRCUIT CO Ltd
Priority to CN201910544241.5A priority Critical patent/CN110337177A/en
Publication of CN110337177A publication Critical patent/CN110337177A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via

Abstract

The invention discloses a kind of with the circuit board of pad and preparation method thereof that can bear high thrust, the circuit board includes circuit board body, the circuit board body is equipped with pad, the pad includes insulating layer substrate, copper foil, the tow sides of insulating layer substrate are arranged in the copper foil, and the pad is equipped with micro through-hole, and the micro through-hole runs through insulating layer substrate and copper foil, copper facing is filled in the micro through-hole, the copper facing is connected with the copper foil of insulating layer substrate tow sides.The present invention solves that the pad peel strength on available circuit plate is low, bears the low problem of thrust after leading to stick component.

Description

It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust
Technical field
The present invention relates to technical field of electronic components more particularly to a kind of circuits with the pad that can bear high thrust Plate and preparation method thereof.
Background technique
With the development of electronic product currently on the market, the small and exquisite product of more and more finenesses occurs, institute on these products Component is also smaller and smaller, such as some mobile phone backlight products, above used LED light it is smaller and smaller, just due to this, Weld pad required for these LED light also becomes smaller and smaller therewith.In this case, by these lesser electronics member devices Part is welded on pad, if applying a horizontal external force (thrust) to it, since pad is too small, the peel strength of pad is just Not enough, pad will be very easy to fall off, so that the electronic component being attached to above will also be turned down therewith.So smaller Pad will have a direct impact on pad and stick the thrust that can be born after component, lead to the member being welded on pad in this case Device is easy to fall off because of external force, causes large effect to the use of product.And the pad on existing circuit board is not increasing In the case where being welded with disc area, the problem cannot be all efficiently solved.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide a kind of with can bear high thrust The circuit board of pad, can obviously increase the peel strength of pad, so that thrust can be born by achieving the effect that increase.
The second object of the present invention is to provide a kind of method that production has the circuit board for the pad that can bear high thrust, The peel strength of pad can be obviously increased with the circuit board that its method makes, so that thrust can be born by achieving the effect that increase.
An object of the present invention adopts the following technical scheme that realization:
A kind of circuit board with the pad that can bear high thrust, including circuit board body, the circuit board body include Insulating layer substrate and pad for welding component are covered with copper foil on the pad, and the circuit board body reverse side is corresponding The position of front pad is also covered with copper foil, and the pad is equipped with micro through-hole, the micro through-hole through insulating layer substrate and Copper foil, the micro through-hole is interior to be filled with copper facing, and the copper facing is connected with the copper foil of circuit board tow sides.
Further, the circuit board body is FPC flexible circuit board.
Further, the insulating layer substrate is made of polyimides.
Further, the copper foil is connected by thermoplastic polyimide with insulating layer substrate.
Further, the diameter of the micro through-hole is 0.03mm.
Further, the micro through-hole has 8.
Further, the micro through-hole is set in qually spaced on pad.
The second object of the present invention adopts the following technical scheme that realization:
A method of the circuit board that there is the pad that can bear high thrust for making above-mentioned any one, including it is following Step:
S11, the pad of circuit board body is punched, generates micro through-hole and runs through copper foil and insulating layer substrate;
S12, copper foil is also covered in the position of circuit board body reverse side corresponding circuits plate ontology front pad;
S13, the same position that each micro through-hole is corresponded on the copper foil at the circuit board body back side are punched;
S14, copper facing filling perforation is carried out in each micro through-hole;
Or:
S21, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad;
S22, the pad of circuit board body is punched, generates micro through-hole and runs through circuit board front copper foil, insulating layer Substrate and circuit board reverse side copper foil;
S23, copper facing filling perforation is carried out in each micro through-hole.
Further, step S11 is also included the following specific steps:
S111, when the pad back side is not routed, directly execution S113;
S112, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S113;
S113, pad is punched, generates the micro through-hole through front copper foil and insulating layer substrate.
Further, step S21 is also included the following specific steps:
S211, when the pad back side is not routed, directly execution S213;
S212, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S213;
S213, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad.
Compared with prior art, the beneficial effects of the present invention are:
Increase multiple micro through-holes on the pad of circuit board, full copper facing, the insulation of copper facing and pad are filled in through-hole The copper foil of layer substrate tow sides is connected.Insulating layer substrate tow sides can be realized using the pad of the circuit board of the structure Copper foil through hole in copper facing connection, reinforce the combination dynamics of copper foil and insulating layer substrate, with this to greatly increase single side copper The peel strength of foil, so that further increasing pad sticks the thrust that can be born after electronic component.The technical solution can have The pad peel strength that effect ground solves on available circuit plate is low, bears the low problem of thrust after leading to stick component.
Detailed description of the invention
Fig. 1 is the positive structure schematic of one embodiment of the invention
Fig. 2 is the reverse structure schematic of one embodiment of the invention
Fig. 3 is schematic cross-section at the pad of one embodiment of the invention
In figure: 1, circuit board body 2, pad 3, micro through-hole 4, insulating layer substrate 5, copper foil 6, copper facing
Specific embodiment
Below in conjunction with attached drawing and specific embodiment, the present invention is described further.
Embodiment one:
With reference to Fig. 1-Fig. 3, a kind of circuit board with the pad 2 that can bear high thrust, including circuit board body 1 are provided, The circuit board body 1 includes insulating layer substrate 4 and the pad 2 for welding component, is covered with copper foil 5 on the pad 2, The position that 1 reverse side of circuit board body corresponds to front pad 2 is also covered with copper foil 5, and the pad 2 is equipped with micro through-hole 3, institute It states micro through-hole 3 and is filled with copper facing 6, the copper facing 6 and circuit in insulating layer substrate 4 and copper foil 5, the micro through-hole 3 The copper foil 5 of plate tow sides is connected.
In the present embodiment, circuit board is made of circuit board body 1.Specifically, circuit board body 1 includes an insulating layer Substrate 4 and several pads 2, are covered with copper foil 5 in the tow sides of pad 2, and in pad 2 by way of laser boring On be equipped with 8 micro through-holes 3 through tow sides copper foil 5 and insulating layer substrate 4, and in micro through-hole 3 plating by hole Inside fill up copper facing 6.Herein, laser boring is only used as a preferred hole knockout, and hole knockout further includes and is not limited only to acid It washes and the modes such as electrical discharge machining.
Different from common circuit board, copper foil 5 is arranged on insulating layer substrate 4, if pad 2 is too small, copper foil 5 and absolutely The bonding dynamics of edge layer substrate 4 is also small, and copper foil 5 is also easy for being stripped, so that the electronic components such as LED light are being welded to pad It is also easy for after on 2 because being turned down by thrust, influences very much the using effect of product.
It, will be upper since the copper foil 5 of the tow sides of pad 2 is passed through 3 filling perforation of micro through-hole using the circuit board of the structure Lower two layers of connection, single side copper foil 5 will receive the holdback force of another side copper foil 5 when by peeling force, to considerably increase The peel strength of single side copper foil 5.After sticking component in the front of pad 2, the thrust that pad 2 can be born is also increased.This Kind of mode can efficiently solve that the pad peel strength on available circuit plate is low, bear thrust after leading to stick component Low problem.
Preferably, circuit board body 1 is FPC flexible circuit board.FPC flexible circuit board have Distribution density it is high, it is light-weight, The feature that thickness is thin, bending is good can require any arrangement with free bend, winding, folding according to space layout, and Three-dimensional space arbitrarily moves and flexible, to reach the integration that components and parts assembling is connected with conducting wire.It can be big using FPC flexible board The big volume for reducing electronic product, is applicable in the needs that electronic product develops to high density, miniaturization, highly reliable direction, more meets To the requirement as small as possible of entire electronic product.
Preferably, insulating layer substrate 4 is made of polyimides.Polyimides is the optimal organic polymer material of comprehensive performance One of material, high temperature resistant, partially without sharp melting point, have height up to 400 DEG C or more, -200~300 DEG C of long-term use temperature range Insulation performance.
Preferably, copper foil 5 is connected by thermoplastic polyimide with insulating layer substrate 4.Thermoplastic polyimide be The special engineering plastics with good thermoplastic processability to grow up on the basis of traditional Thermocurable polyimide it One, particularly suitable for the complicated product of one-pass molding, have with insulating layer substrate 4 made of polyimides in the present invention good Adhesiveness.
Preferably, the diameter of micro through-hole 3 is 0.03mm.The too small micro through-hole 3 of diameter due to after filling perforation copper facing 6 with 5 contact area of copper foil is too small, effectively can not provide holdback force to copper foil 5, and the micro through-hole 3 for crossing major diameter then will affect The degree of adhesion of copper foil 5 and insulating layer substrate 4 is suitable for implementation of the present invention so setting 0.03mm for the diameter of micro through-hole 3 Example.
Preferably, with reference to Fig. 1-Fig. 2, micro through-hole 3 is set in qually spaced on pad 2.Every two is miniature logical on pad 2 The all spaced sets of hole 3, and three adjacent micro through-holes 3 mutually setting triangular in shape, have stability according to triangle Property, the micro through-hole 3 of this structure connect two sides copper foil 5 with more stability after filling perforation, the more difficult removing of copper foil 5, The component being attached on pad 2 can also bear bigger thrust.
Embodiment two:
It provides for making circuit board of any one of the above-described embodiment one with the pad that can bear high thrust Method, specifically includes the following steps:
S11, the pad 2 of circuit board substrate is carried out to laser boring, generation micro through-hole 3 is through front copper foil 5 and absolutely Edge layer substrate 4;Certainly, laser boring is a kind of preferred hole knockout, and technical staff can also use pickling and electric spark The various ways such as processing are punched;
S12, copper foil 5 is also covered in the position that 1 reverse side of circuit board body corresponds to front pad 2;
S13, the same position that each micro through-hole 3 is corresponded on the copper foil 5 at 1 back side of circuit board body are punched;Make Obtain the effect for realizing that two sides copper foil 5 mutually restrains after implementing copper facing filling perforation operation;
S14, copper facing filling perforation is carried out in each micro through-hole 3.
Preferably, step S11 is also included the following specific steps:
S111, when 2 back side of pad is not routed, directly execution S113;
S112, it is routed when 2 back side of pad is equipped with, rewiring is got around 2 back side of pad, and executes S113;Herein The cyberrelationship for also needing to analyze wiring must not change its cyberrelationship after paying attention to rewiring;
S113, laser boring is carried out to pad 2, generates the micro through-hole 3 through front copper foil 5 and insulating layer substrate 4.
Embodiment three:
It provides for making circuit board of any one of the above-described embodiment one with the pad that can bear high thrust Method, specifically includes the following steps:
S21, copper foil 5 is covered in the position of circuit board reverse side corresponding circuits plate front pad 2;
S22, the pad 2 of circuit board body 1 is punched, generate micro through-hole 3 through circuit board front copper foil 5, absolutely Edge layer substrate 4 and circuit board reverse side copper foil 5;The position of front copper foil first, which is corresponded to, in the reverse side of circuit board is covered with copper foil, it can be with It it is covered with reverse side copper foil again needs the step of punching again after saving first punching.
S23, copper facing filling perforation is carried out in each micro through-hole 3.
Preferably, step S21 is also included the following specific steps:
S211, when 2 back side of pad is not routed, directly execution S213;
S212, it is routed when 2 back side of pad is equipped with, rewiring is got around 2 back side of pad, and executes S213;Herein It is also required to the cyberrelationship of analysis wiring, its cyberrelationship must not be changed after paying attention to rewiring;
S213, copper foil 5 is covered in the position of circuit board reverse side corresponding circuits plate front pad 2.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field For art personnel, the invention may be variously modified and varied, and all any modifications made within principle of the invention are equal Replacement, improvement etc., should be included within the scope of the present invention.

Claims (10)

1. a kind of circuit board with the pad that can bear high thrust, it is characterised in that: including circuit board body, the circuit board Ontology includes insulating layer substrate and the pad for welding component, and copper foil, the circuit board body are covered on the pad The position that reverse side corresponds to front pad is also covered with copper foil, and the pad is equipped with micro through-hole, and the micro through-hole is through insulation Layer substrate and copper foil, the micro through-hole is interior to be filled with copper facing, and the copper facing is connected with the copper foil of circuit board tow sides.
2. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: the circuit board Ontology is FPC flexible circuit board.
3. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: the insulating layer Substrate is made of polyimides.
4. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: the copper foil is logical Thermoplastic polyimide is crossed to be connected with insulating layer substrate.
5. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: described miniature logical The diameter in hole is 0.03mm.
6. the circuit board with the pad that can bear high thrust according to claim 1, it is characterised in that: described miniature logical Hole has 8.
7. the circuit board with the pad that can bear high thrust according to claim 6, it is characterised in that: described miniature logical Hole is set in qually spaced on pad.
8. a kind of method that there is the circuit board for the pad that can bear high thrust for making any one of claim 1-7, Characterized by comprising the following steps:
S11, the pad of circuit board body is punched, generates micro through-hole and runs through copper foil and insulating layer substrate;
S12, copper foil is also covered in the position of circuit board body reverse side corresponding circuits plate ontology front pad;
S13, the same position that each micro through-hole is corresponded on the copper foil at the circuit board body back side are punched;
S14, copper facing filling perforation is carried out in each micro through-hole;
Or:
S21, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad;
S22, the pad of circuit board body is punched, generates micro through-hole and runs through circuit board front copper foil, insulating layer substrate And circuit board reverse side copper foil;
S23, copper facing filling perforation is carried out in each micro through-hole.
9. the method that production according to claim 8 has the circuit board for the pad that can bear high thrust, which is characterized in that Step S11 is also included the following specific steps:
S111, when the pad back side is not routed, directly execution S113;
S112, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S113;
S113, pad is punched, generates the micro through-hole through front copper foil and insulating layer substrate.
10. the method that production according to claim 8 has the circuit board for the pad that can bear high thrust, feature exist In step S21 is also included the following specific steps:
S211, when the pad back side is not routed, directly execution S213;
S212, it is routed when the pad back side is equipped with, rewiring is got around the pad back side, and executes S213;
S213, copper foil is covered in the position of circuit board reverse side corresponding circuits plate front pad.
CN201910544241.5A 2019-06-21 2019-06-21 It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust Pending CN110337177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910544241.5A CN110337177A (en) 2019-06-21 2019-06-21 It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust

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Application Number Priority Date Filing Date Title
CN201910544241.5A CN110337177A (en) 2019-06-21 2019-06-21 It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust

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CN110337177A true CN110337177A (en) 2019-10-15

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Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862588A (en) * 1988-07-21 1989-09-05 Microelectronics And Computer Technology Corporation Method of making a flexible interconnect
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5266746A (en) * 1990-11-29 1993-11-30 Mitsui Toatsu Chemicals, Inc. Flexible printed circuit board having a metal substrate
US6809267B1 (en) * 1998-08-13 2004-10-26 Sony Chemicals Corporation Flexible printed wiring board and its production method
US20060180344A1 (en) * 2003-01-20 2006-08-17 Shoji Ito Multilayer printed wiring board and process for producing the same
US20090200074A1 (en) * 2008-02-12 2009-08-13 International Business Machines Corporation Circuit Substrate Having Post-Fed Die Side Power Supply Connections
US20110063811A1 (en) * 2003-12-05 2011-03-17 Ibiden Co., Ltd. Multilayer printed wiring board
CN202026529U (en) * 2011-03-29 2011-11-02 京东方科技集团股份有限公司 Printed circuit board
CN103379732A (en) * 2012-04-13 2013-10-30 鸿富锦精密工业(深圳)有限公司 Pad-reinforced printed circuit board
CN103692724A (en) * 2013-12-23 2014-04-02 松扬电子材料(昆山)有限公司 Double-face copper clad baseplate with composite type transparent insulation layer
CN203818668U (en) * 2013-12-23 2014-09-10 松扬电子材料(昆山)有限公司 Combined type two-sided copper foil base plate of transparent insulating layer
CN204578895U (en) * 2015-04-24 2015-08-19 上海通铭信息科技有限公司 Printed circuit board (PCB)
CN104859223A (en) * 2015-05-21 2015-08-26 成都多吉昌新材料有限公司 Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers
CN105792512A (en) * 2016-03-31 2016-07-20 努比亚技术有限公司 Pad reinforcing structure
CN106376175A (en) * 2016-08-31 2017-02-01 深圳天珑无线科技有限公司 Printed circuit board and mobile terminal

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862588A (en) * 1988-07-21 1989-09-05 Microelectronics And Computer Technology Corporation Method of making a flexible interconnect
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5266746A (en) * 1990-11-29 1993-11-30 Mitsui Toatsu Chemicals, Inc. Flexible printed circuit board having a metal substrate
US6809267B1 (en) * 1998-08-13 2004-10-26 Sony Chemicals Corporation Flexible printed wiring board and its production method
US20060180344A1 (en) * 2003-01-20 2006-08-17 Shoji Ito Multilayer printed wiring board and process for producing the same
US20110063811A1 (en) * 2003-12-05 2011-03-17 Ibiden Co., Ltd. Multilayer printed wiring board
US20090200074A1 (en) * 2008-02-12 2009-08-13 International Business Machines Corporation Circuit Substrate Having Post-Fed Die Side Power Supply Connections
CN202026529U (en) * 2011-03-29 2011-11-02 京东方科技集团股份有限公司 Printed circuit board
CN103379732A (en) * 2012-04-13 2013-10-30 鸿富锦精密工业(深圳)有限公司 Pad-reinforced printed circuit board
CN103692724A (en) * 2013-12-23 2014-04-02 松扬电子材料(昆山)有限公司 Double-face copper clad baseplate with composite type transparent insulation layer
CN203818668U (en) * 2013-12-23 2014-09-10 松扬电子材料(昆山)有限公司 Combined type two-sided copper foil base plate of transparent insulating layer
CN204578895U (en) * 2015-04-24 2015-08-19 上海通铭信息科技有限公司 Printed circuit board (PCB)
CN104859223A (en) * 2015-05-21 2015-08-26 成都多吉昌新材料有限公司 Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers
CN105792512A (en) * 2016-03-31 2016-07-20 努比亚技术有限公司 Pad reinforcing structure
CN106376175A (en) * 2016-08-31 2017-02-01 深圳天珑无线科技有限公司 Printed circuit board and mobile terminal

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Address after: 510663 north of the first floor, No.9, Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangdong Province

Applicant after: Guangzhou Yuankang Precision Electronics Co.,Ltd.

Address before: 510700 north of the first floor of the first floor, No.9 Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangzhou City, Guangdong Province

Applicant before: GUANGZHOU JP-WH PRECISION CIRCUIT Co.,Ltd.

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Application publication date: 20191015