CN103692724A - Double-face copper clad baseplate with composite type transparent insulation layer - Google Patents
Double-face copper clad baseplate with composite type transparent insulation layer Download PDFInfo
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- CN103692724A CN103692724A CN201310718882.0A CN201310718882A CN103692724A CN 103692724 A CN103692724 A CN 103692724A CN 201310718882 A CN201310718882 A CN 201310718882A CN 103692724 A CN103692724 A CN 103692724A
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Abstract
The invention discloses a double-face copper clad baseplate with a composite type transparent insulation layer. The transparent insulation layer comprises a first copper clad layer, a first transparent insulation polymer layer, a transparent adhesive layer and a second copper clad layer which are sequentially arranged. The double-face copper clad baseplate adopts the insulation layer compounded by transparent polyimide and a transparent resin material, thus having very good transmittance and high heat resistance, and having no discolouring phenomenon after being processed by a downstream soft circuit board, and therefore the defect that previous polyimide is yellow-brown and is low in transmittance is overcome, and the double-face copper clad baseplate has high transparency.
Description
Technical field
The present invention relates to a kind of Double-sided copper clad laminate, relate in particular to a kind of transparent insulating layer composite type double sided copper clad laminate.
Background technology
At present, along with the development of electronic technology industry, electronic system, in compact, high-fire resistance, multifunctionality, densification, low-cost future development, starts towards transparence future development.Transparent smart mobile phone, transparency LED, transparent plate computer etc. will be no longer conceptions of species, but the material object being seen everywhere, thus the substrate of the transparent insulating layer of high-performance and high-transmittance be selected to very important influence factor.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of transparent insulating layer composite type double sided copper clad laminate, there is high-fire resistance, through high temperature process insulating barrier, do not produce variable color, can keep highly transparent.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of transparent insulating layer composite type double sided copper clad laminate, comprises the first copper foil layer, the first transparent insulation polymeric layer, transparent adhesive tape adhesion coating and the second copper foil layer that set gradually.
As a further improvement on the present invention, between described the second copper foil layer and transparent adhesive tape adhesion coating, be also provided with the second transparent insulation polymeric layer.
As a further improvement on the present invention, described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance polyimides (PI) film, transparent thermoplastic polyimides (TPI) film and transparent liquid crystal polymer (LCP) film one of them.
As a further improvement on the present invention, polyimides (PI) film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance, thickness is 5～25um.
As a further improvement on the present invention, described the first copper foil layer and the second copper foil layer are selected from respectively a kind of in rolled copper foil (RA copper), electrolytic copper foil (ED copper) and high extension Copper Foil (HD copper).
As a further improvement on the present invention, the thickness of described the first copper foil layer and the second copper foil layer is 3～35um.
As a further improvement on the present invention, the thickness of described the first copper foil layer and the second copper foil layer is 3～9um.
As a further improvement on the present invention, described the first copper foil layer is 0.8～1.2um near a side of described the first transparent insulation polymeric layer and the second copper foil layer near the surface roughness Rz of a side of described transparent adhesive tape adhesion coating.
As a further improvement on the present invention, described transparent adhesive tape adhesion coating is a kind of in polyvinyl butyral resin resin (PVB) glue system, SGA system, polyester adhesive system, polyurethane adhesive system and TPI (TPI) glue system.
As a further improvement on the present invention, described transparent adhesive tape adhesion coating is polyvinyl butyral resin resin (PVB) glue system, and its thickness is 5～25um.
The invention has the beneficial effects as follows: this transparent insulating layer composite type double sided copper clad laminate is the insulating barrier that has adopted transparent polyimides and transparent resin material to be composited, there is good light transmittance, high-fire resistance, and through downstream FPC processing procedure nondiscolouring, overcome in the past polyimides yellow-brown, the shortcoming that light transmittance is low, still keeps highly transparent.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present invention 1 structural representation;
Fig. 2 is the embodiment of the present invention 2 structural representations.
By reference to the accompanying drawings, make the following instructions:
101a---the first copper foil layer
101b---the second copper foil layer
102a---the first transparent insulation polymeric layer
102b---the second transparent insulation polymeric layer
103---transparent adhesive tape adhesion coating
The specific embodiment
By reference to the accompanying drawings, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiment, the simple equivalence of in every case being done with the present patent application the scope of the claims and description changes and modifies, within all still belonging to patent covering scope of the present invention.
Embodiment 1:
The thick Copper Foil of one 9um is provided, and be coated with silica-based replacement clear polyimides colloid with this Copper Foil matsurface, and obtain an one side copper clad laminate after being dried clear polyimides (PI) layer that formation 7.5um is thick, again at the PI of this one side copper clad laminate face painting polyethylene butyral glue, through short time prebake conditions, the PI face of the same one side copper clad laminate of pressing (or Copper Foil M/S face) again, the pressure giving by the gap between roller and roller, make two one side copper clad laminates by middle adhesion coating close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, finally form a kind of transparent insulating layer composite type double sided copper clad laminate.Its structure as shown in Figure 1, comprise successively from top to bottom the first copper foil layer 101a, the first transparent insulation polymeric layer 102a, transparent adhesive tape adhesion coating 103, the second transparent insulation polymeric layer 102b and the second copper foil layer 101b, the first copper foil layer 101a and the second copper foil layer 101b thickness are 9um, the thickness of the first transparent insulation polymeric layer 102a and the second transparent insulation polymeric layer 102b is 7.5um, and transparent adhesive tape adhesion coating 103 thickness are 7.5um.
Embodiment 2:
The thick Copper Foil of one 9um is provided, and be coated with silica-based replacement clear polyimides colloid with this Copper Foil matsurface, and obtain an one side copper clad laminate after being dried clear polyimides (PI) layer that formation 7.5um is thick, again at the PI of this one side copper clad laminate face painting polyethylene butyral glue, through short time prebake conditions, the Copper Foil of the uncoated silica-based replacement clear polyimides colloid of pressing one again, the pressure giving by the gap between roller and roller, make one side copper clad laminate and Copper Foil by middle adhesion coating close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, finally form a kind of transparent insulating layer composite type double sided copper clad laminate.Its structure as shown in Figure 2, comprise successively from top to bottom the first copper foil layer 101a, the first transparent insulation polymeric layer 102a, transparent adhesive tape adhesion coating 103 and the second copper foil layer 101b, the first copper foil layer 101a and the second copper foil layer 101b thickness are 9um, the thickness of the first transparent insulation polymeric layer 102a is 7.5um, and transparent adhesive tape adhesion coating 103 thickness are 7.5um.
The transparent insulating layer composite type double sided copper clad laminate of above-mentioned two embodiment and existing opaque composite type double sided copper clad laminate are carried out to peel strength and light transmittance test, and its test result is as shown in table 1.
Table 1: substrate properties comparison
Wherein, in above-described embodiment, the first copper foil layer and the second copper foil layer can be selected from respectively a kind of in rolled copper foil (RA copper), electrolytic copper foil (ED copper) and high extension Copper Foil (HD copper), and the first copper foil layer is between 0.8～1.2um near a side of the first transparent insulation polymeric layer and the second copper foil layer near the surface roughness Rz of a side of transparent adhesive tape adhesion coating.
The first transparent insulation polymeric layer and the second transparent insulation polymeric layer can be selected from polyimides (PI) film, transparent thermoplastic polyimides (TPI) film or transparent liquid crystal polymer (LCP) film of high-transmittance, are preferably polyimides (PI) film of high-transmittance.
Transparent adhesive tape adhesion coating is selected from a kind of in polyvinyl butyral resin resin (PVB) glue system, SGA system, polyester adhesive system, polyurethane adhesive system and TPI (TPI) glue system, is preferably polyvinyl butyral resin resin (PVB) glue system.Polyvinyl butyral resin resin (PVB) glue system, the transparency that tool is higher, cold resistance, resistance to impact, ultra-violet resistance are good.
In order to realize the high grade of transparency, total thickness of insulating layer of transparent insulating layer composite type double sided copper clad laminate of the present invention can not be too thick, and total thickness of insulating layer is best at 15～25um.
In addition, in the present invention, the formation principle of clear polyimides is: in polyimide structures, introduce containing fluoro substituents or side group, utilize the electronegativity that fluorine atom is larger, cut off the conjugation of electron cloud, suppress the formation of CTC; Reduce the content of fragrant result in PI molecule, as adopted dianhydride or the diamine monomer with alicyclic structure, reduce the probability that CTC forms; Introduce nonplanar structure, sulfuryl structure, silicon substrate structure, a position replacement structure etc. and reduce conjugation.
The adjustment that the present invention fills a prescription by colloid, reached transparent insulation polymeric layer and the approaching thermal coefficient of expansion of substratum transparent, thereby form a kind of globality, the FPC material of high dimensional stability, and depth of camber is less, and the stability of size harmomegathus is better.
Claims (10)
1. a transparent insulating layer composite type double sided copper clad laminate, is characterized in that: comprise the first copper foil layer (101a), the first transparent insulation polymeric layer (102a), transparent adhesive tape adhesion coating (103) and the second copper foil layer (101b) that set gradually.
2. transparent insulating layer composite type double sided copper clad laminate according to claim 1, is characterized in that: between described the second copper foil layer (101b) and transparent adhesive tape adhesion coating (103), be also provided with the second transparent insulation polymeric layer (102b).
3. transparent insulating layer composite type double sided copper clad laminate according to claim 2, is characterized in that: polyimide film, transparent thermoplastic polyimide film and transparent liquid crystal polymer film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance one of them.
4. transparent insulating layer composite type double sided copper clad laminate according to claim 3, is characterized in that: the polyimide film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance, thickness is 5～25um.
5. according to the transparent insulating layer composite type double sided copper clad laminate described in any one in claim 1 to 4, it is characterized in that: described the first copper foil layer and the second copper foil layer are selected from respectively a kind of in rolled copper foil, electrolytic copper foil and high extension Copper Foil.
6. transparent insulating layer composite type double sided copper clad laminate according to claim 5, is characterized in that: the thickness of described the first copper foil layer and the second copper foil layer is 3～35um.
7. transparent insulating layer composite type double sided copper clad laminate according to claim 5, is characterized in that: the thickness of described the first copper foil layer and the second copper foil layer is 3～9um.
8. transparent insulating layer composite type double sided copper clad laminate according to claim 5, is characterized in that: described the first copper foil layer is 0.8～1.2um near a side of described the first transparent insulation polymeric layer and the second copper foil layer near the surface roughness Rz of a side of described transparent adhesive tape adhesion coating.
9. according to the transparent insulating layer composite type double sided copper clad laminate described in any one in claim 1 to 4, it is characterized in that: described transparent adhesive tape adhesion coating is a kind of in polyvinyl butyral resin resin glue system, SGA system, polyester adhesive system, polyurethane adhesive system and TPI glue system.
10. transparent insulating layer composite type double sided copper clad laminate according to claim 9, is characterized in that: described transparent adhesive tape adhesion coating is polyvinyl butyral resin resin glue system, and its thickness is 5～25um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310718882.0A CN103692724A (en) | 2013-12-23 | 2013-12-23 | Double-face copper clad baseplate with composite type transparent insulation layer |
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| CN201310718882.0A CN103692724A (en) | 2013-12-23 | 2013-12-23 | Double-face copper clad baseplate with composite type transparent insulation layer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110239163A (en) * | 2019-06-13 | 2019-09-17 | 陈建义 | A kind of flexible printed circuit board substrate improving adhesive property between PI film and Cu foil |
| CN110337177A (en) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59205790A (en) * | 1983-05-09 | 1984-11-21 | 住友電気工業株式会社 | Transparent printed circuit board |
| US4806432A (en) * | 1985-11-21 | 1989-02-21 | Shin-Etsu Chemical Co., Ltd. | Copper-foiled laminated sheet for flexible printed circuit board |
| JPH0389586A (en) * | 1989-08-31 | 1991-04-15 | Nippon Mektron Ltd | Flexible circuit board and manufacture thereof |
| CN101045358A (en) * | 2007-03-07 | 2007-10-03 | 东华大学 | Preparation method for FCCL |
| WO2008029776A1 (en) * | 2006-09-04 | 2008-03-13 | Toray Industries, Inc. | Light transparent electromagnetic wave shield member and method for manufacturing the same |
| CN201499374U (en) * | 2009-05-12 | 2010-06-02 | 昆山雅森电子材料科技有限公司 | Double-side copper foil baseplate structure |
| CN101959935A (en) * | 2008-02-25 | 2011-01-26 | 日立化成杜邦微系统股份有限公司 | Polyimide precursor composition, polyimide film and transparent flexible film |
| CN103192563A (en) * | 2013-04-24 | 2013-07-10 | 昆山翰辉电子科技有限公司 | Composite double-faced copper foil substrate for flexible printed circuit board |
| CN203818668U (en) * | 2013-12-23 | 2014-09-10 | 松扬电子材料(昆山)有限公司 | Combined type two-sided copper foil base plate of transparent insulating layer |
-
2013
- 2013-12-23 CN CN201310718882.0A patent/CN103692724A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59205790A (en) * | 1983-05-09 | 1984-11-21 | 住友電気工業株式会社 | Transparent printed circuit board |
| US4806432A (en) * | 1985-11-21 | 1989-02-21 | Shin-Etsu Chemical Co., Ltd. | Copper-foiled laminated sheet for flexible printed circuit board |
| JPH0389586A (en) * | 1989-08-31 | 1991-04-15 | Nippon Mektron Ltd | Flexible circuit board and manufacture thereof |
| WO2008029776A1 (en) * | 2006-09-04 | 2008-03-13 | Toray Industries, Inc. | Light transparent electromagnetic wave shield member and method for manufacturing the same |
| CN101045358A (en) * | 2007-03-07 | 2007-10-03 | 东华大学 | Preparation method for FCCL |
| CN101959935A (en) * | 2008-02-25 | 2011-01-26 | 日立化成杜邦微系统股份有限公司 | Polyimide precursor composition, polyimide film and transparent flexible film |
| CN201499374U (en) * | 2009-05-12 | 2010-06-02 | 昆山雅森电子材料科技有限公司 | Double-side copper foil baseplate structure |
| CN103192563A (en) * | 2013-04-24 | 2013-07-10 | 昆山翰辉电子科技有限公司 | Composite double-faced copper foil substrate for flexible printed circuit board |
| CN203818668U (en) * | 2013-12-23 | 2014-09-10 | 松扬电子材料(昆山)有限公司 | Combined type two-sided copper foil base plate of transparent insulating layer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110239163A (en) * | 2019-06-13 | 2019-09-17 | 陈建义 | A kind of flexible printed circuit board substrate improving adhesive property between PI film and Cu foil |
| CN110337177A (en) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
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Application publication date: 20140402 |
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