CN212211483U

CN212211483U - Heat dissipation device for mobile phone motherboard

Info

Publication number: CN212211483U
Application number: CN202020687300.2U
Authority: CN
Inventors: 郑洪明; 王青
Original assignee: Ganzhou Jiangyuan Electronic Co ltd
Current assignee: Ganzhou Jiangyuan Electronic Co ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-12-22
Anticipated expiration: 2030-04-29

Abstract

The utility model relates to the technical field of electronics, and discloses a heat dissipation device for a mobile phone mainboard, which comprises a graphite sheet, wherein a plurality of air holes which run through from top to bottom are arranged on the graphite sheet, an adhesive layer is arranged on the bottom surface of the graphite sheet, a release film is arranged on the bottom surface of the adhesive layer, a heat conduction plate is arranged above the graphite sheet, a plurality of inserting columns matched with the air holes are arranged on the bottom surface of the heat conduction plate, the heat conduction plate is arranged above the graphite sheet, the heat conductivity of the heat conduction plate is higher than that of the graphite sheet, the mixed design of the graphite and the heat conduction plate can improve the heat dissipation effect and reduce the cost, the inserting columns corresponding to the air holes are arranged on the bottom surface of the heat conduction plate, the inserting columns are inserted into the air hole bottom surface to be contacted with the surface of an electronic device, and the inserting columns can also compensate the heat conduction, thereby ensuring the heat dissipation effect.

Description

Heat dissipation device for mobile phone motherboard

Technical Field

The utility model relates to the field of electronic technology, specifically a heat abstractor for mobile phone motherboard.

Background

As electronic products such as mobile phones gradually turn to the trend of being light and thin, chip power consumption is getting larger and larger, and the heat dissipation problem of the electronic products is getting more and more prominent. In order to improve the heat dissipation problem of electronic products, graphite sheets are commonly used in the design of electronic products. The existing graphite flake is of a three-layer sandwich structure and sequentially comprises a graphite substrate, a double-faced adhesive and a release film from top to bottom. When assembling the graphite flake, tear off release film at first, then cover the graphite flake in the product and wait to dispel the heat the region.

Present current graphite flake appears the stranded gas phenomenon easily in the assembling process, the air is stranded between graphite flake and electronic product, the laminating quality of graphite flake has been reduced, lead to the increase of the contact thermal resistance between graphite flake and the electronic product, and then the radiating effect of graphite flake has been reduced, at present in order to solve the stranded gas problem, generally set up a plurality of gas pockets that run through from top to bottom on the graphite flake, so that when assembling the graphite flake, the release is stranded gas, however, the seting up of gas pocket, also can lead to the area of contact between graphite flake and the electronic product to reduce, reduce the radiating effect, therefore it is necessary to carry out the design improvement to it.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a heat abstractor for mobile phone motherboard has solved the problem that the background art provided.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat abstractor for mobile phone motherboard, includes the graphite flake, set up a plurality of gas pockets that run through from top to bottom on the graphite flake, the bottom surface of graphite flake is provided with the gluing layer, the bottom surface on gluing layer is provided with from the type membrane, the top of graphite flake is provided with the heat-conducting plate, the bottom surface of heat-conducting plate is provided with a plurality of and the post of inserting of gas pocket matching.

Preferably, the upper surface both sides of heat-conducting plate are provided with the guard plate, are located two the upper surface of heat-conducting plate between the guard plate is provided with a plurality of fin, and is a plurality of the fin is equidistant to be set up perpendicularly on the heat-conducting plate.

Preferably, the height and width of the protection plate are both greater than the height and width of the heat sink.

Preferably, the inner diameter of the air hole is consistent with the diameter of the inserted column, and the length of the inserted column is consistent with the depth of the air hole.

Preferably, the inserting column is welded with the heat conducting plate, and the inserting column and the heat conducting plate are both made of copper materials.

(III) advantageous effects

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this kind of a heat abstractor for mobile phone motherboard sets up the heat-conducting plate through the top at the graphite flake, and the heat conductivity of heat-conducting plate is higher than the graphite flake, and this kind of graphite is with the mixed design of heat-conducting plate, when can improving the radiating effect, reduce cost.

2. This kind of a heat abstractor for mobile phone motherboard through the bottom surface at the heat-conducting plate set up with the post of inserting that the gas pocket corresponds, inserts the post and inserts and establish gas pocket bottom surface and electronic equipment surface contact, this kind of design, inserts the post and also can compensate the graphite flake and can not the ability of heat conduction in gas pocket department, and then guarantees the radiating effect.

Drawings

Fig. 1 is a structural diagram of the whole heat dissipation device for a mobile phone motherboard according to the present invention;

fig. 2 is a schematic structural diagram of a position a of the present invention.

In the figure: 1 graphite flake, 2 heat-conducting plates, 3 from type membrane, 4 gluing layers, 5 gas pockets, 6 insert the post, 7 guard plates, 8 fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-2, a heat dissipation device for a mobile phone motherboard, includes a graphite sheet 1, a plurality of air holes 5 penetrating up and down are formed on the graphite sheet 1, the inner diameter of the air holes 5 is consistent with the diameter of an inserted column 6, the length of the inserted column 6 is consistent with the depth of the air holes 5, a plurality of cooling fins 8 are arranged on the upper surface of a heat conduction plate 2 between two protection plates 7, the cooling fins 8 are vertically arranged on the heat conduction plate 2 at equal intervals, a plurality of inserted columns 6 matched with the air holes 5 are arranged on the bottom surface of the heat conduction plate 2, the inserted columns 6 are welded with the heat conduction plate 2, the inserted columns 6 and the heat conduction plate 2 are both made of copper materials, an adhesive layer 4 is arranged on the bottom surface of the graphite sheet 1, a release film 3 is arranged on the bottom surface of the adhesive layer 4, the heat conduction plate 2 is arranged above the graphite sheet 1, the protection plates 7 are arranged on.

The working principle is as follows: during the use, at first tear and remove from type membrane 3, then paste graphite flake 1 and adorn on electronic equipment, during the assembly, the stranded gas between graphite flake 1 and the electronic equipment can be discharged through gas pocket 5, after the completion, cover heat-conducting plate 2 on graphite flake 1, and it corresponds with gas pocket 5 to insert post 6, press heat-conducting plate 2, make in inserting post 6 inserts gas pocket 5, the bottom surface of heat-conducting plate 2 and the laminating of the upper surface of graphite flake 1, the assembly is accomplished, when electronic equipment work produced heat, graphite flake 1 conducts the heat, and conduct to the outside through heat-conducting plate 2, insert post 6 simultaneously also with electronic equipment surface contact, further realize thermal conduction, and the heat dissipation efficiency is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat abstractor for mobile phone motherboard, includes graphite flake (1), its characterized in that, set up a plurality of gas pockets (5) that run through from top to bottom on graphite flake (1), the bottom surface of graphite flake (1) is provided with gluing layer (4), the bottom surface of gluing layer (4) is provided with from type membrane (3), the top of graphite flake (1) is provided with heat-conducting plate (2), the bottom surface of heat-conducting plate (2) is provided with a plurality of posts (6) of inserting that match with gas pocket (5).

2. The heat dissipating device for a main board of a cellular phone according to claim 1, wherein the heat conducting plate (2) is provided with a protective plate (7) on both sides of the upper surface thereof, the upper surface of the heat conducting plate (2) between the two protective plates (7) is provided with a plurality of heat dissipating fins (8), and the plurality of heat dissipating fins (8) are vertically arranged on the heat conducting plate (2) at equal intervals.

3. The heat sink for the main board of a mobile phone according to claim 2, wherein the height and width of the protection board (7) are greater than those of the heat sink (8).

4. The heat dissipation device for the main board of the mobile phone according to claim 1, wherein the inner diameter of the air hole (5) is consistent with the diameter of the plug-in post (6), and the length of the plug-in post (6) is consistent with the depth of the air hole (5).

5. The heat dissipating device for a motherboard of a mobile phone according to claim 1, wherein the insertion column (6) is welded to the heat conducting plate (2), and the insertion column (6) and the heat conducting plate (2) are both made of copper material.