CN109257870A - A kind of double-layer PCB board component of perfect heat-dissipating - Google Patents
A kind of double-layer PCB board component of perfect heat-dissipating Download PDFInfo
- Publication number
- CN109257870A CN109257870A CN201811236645.XA CN201811236645A CN109257870A CN 109257870 A CN109257870 A CN 109257870A CN 201811236645 A CN201811236645 A CN 201811236645A CN 109257870 A CN109257870 A CN 109257870A
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- CN
- China
- Prior art keywords
- pcb board
- copper sheet
- aluminium alloy
- double
- fixed frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of double-layer PCB board components of perfect heat-dissipating, including third copper sheet and the second copper sheet；The copper sheet is to be bonded on the front/rear end of pcb board aluminium alloy fixed frame respectively, and the front end face of this two panels copper sheet or rear end face are also equipped with the first pcb board and the second pcb board respectively at two；The pcb board aluminium alloy fixed frame is that two parts up and down are divided by third copper sheet, the underrun copper sheet of the aluminium alloy radiator structure of I-shaped structure is located on the bottom surface of aluminium alloy, further accelerate the downward radiating rate of two PCB using copper sheet, in order to accelerate two upward radiating rates of pcb board, the radiator of I-shaped structure is made into two parts up and down, centre is connected further through one piece of copper sheet, to accelerate the upward radiating rate of pcb board, in summary, it can be seen that, utilize the fast essential concept of copper product heat-transfer rate, the double-layer assembly for forming two pieces of pcb boards, carry out multi-angle heat dissipation, accelerate radiating rate.
Description
Technical field
The present invention relates to double-layer combined pcb board technical field of structures, more particularly to the double-layer PCB board component of high heat dissipation.
Background technique
The title of circuit board has: wiring board, pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin route
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, for fixed circuit
Batch production and optimization electrical appliance layout play an important role.
The inventors discovered that existing double-layer combined pcb board, after combination installation, since most of backrest-type merges
Together, or only with one layer of simple aluminium alloy plate cellular-type be close together, this installation relation and radiating subassembly it is simple
Structure keeps heat dissipation effect poor, and radiating rate is slow.
Then, inventor is in view of this, adhere to that the relevant industries are abundant for many years designs and develops and the experience of actual fabrication,
Improvement is studied for existing structure and missing, a kind of double-layer PCB board component of perfect heat-dissipating is provided, to reach
To the purpose with more more practical value.
Summary of the invention
The purpose of the present invention is to provide a kind of double-layer PCB board components of perfect heat-dissipating, to solve above-mentioned background technique
The existing double-layer combined pcb board of middle proposition since most of backrest-type merges, or is only adopted after combination installation
It is close together with one layer of simple aluminium alloy plate cellular-type, the simple structure of this installation relation and radiating subassembly imitates heat dissipation
Fruit is poor, and the problem that radiating rate is slow.
The present invention a kind of purpose and effect of the double-layer PCB board component of perfect heat-dissipating, by the institute of technological means in detail below
Reach:
A kind of a kind of double-layer PCB board component of perfect heat-dissipating, wherein double-layer PCB board component packet of perfect heat-dissipating
It has included:
First pcb board, the second pcb board, aluminum alloy bottom plate, pcb board aluminium alloy fixed frame, the first copper sheet, third copper sheet and
Second copper sheet；
The copper sheet is to be bonded on the front/rear end of pcb board aluminium alloy fixed frame respectively, and this two panels copper sheet at two
Front end face or rear end face are also equipped with the first pcb board and the second pcb board respectively；The top surface front and rear sides of the aluminum alloy bottom plate are equal
Second copper sheet at one is installed, and at two second copper sheet the top surface bottom surface with pcb board aluminium alloy fixed frame respectively；The PCB
Plate aluminum alloy fixed frame is that two parts up and down are divided by third copper sheet.
Further, the pcb board aluminium alloy fixed frame is I-shaped structure, and first copper sheet is exactly to distinguish at front and back two
The first PCB for being bonded on the front and back groove surface of I-shaped structure, and being installed in the end face of the first copper sheet by screw
Plate and the second pcb board.
Further, the pcb board aluminium alloy fixed frame is divided into two parts up and down by third copper sheet, and middle and upper part is divided into biography
The aluminium alloy heat dissipation rib structure of system, lower part is erect and is fixed at two on the top surface of second copper sheet.
In comparison with existing structure, the present invention has the advantage that
1. using the aluminium alloy radiator structure of I-shaped structure as installation double-layer PCB board sub-assembly heat dissipation element,
By in the groove of the I-shaped structure of front and rear sides, pacify the faster copper sheet of heat-transfer rate respectively, then two pieces of pcb boards are pacified respectively
On the two copper sheets, to make the two pcb boards implement rapid cooling, the aluminium alloy radiator structure of I-shaped structure respectively
Underrun copper sheet be located on the bottom surface of aluminium alloy, further accelerate the downward radiating rate of two PCB using copper sheet, be
Accelerate the upward radiating rate of two pcb boards, the radiator of I-shaped structure is made into two parts up and down, it is intermediate and logical
One piece of copper sheet connection is crossed, thus accelerate the upward radiating rate of pcb board, in view of the foregoing it is apparent that, utilize the thermally conductive speed of copper product
Fast essential concept is spent, the double-layer assembly for forming two pieces of pcb boards carries out multi-angle heat dissipation, accelerates radiating rate.
Detailed description of the invention
Fig. 1 is overlooking structure diagram of the present invention；
Fig. 2 is schematic view of the front view of the present invention (in the case where not installing pcb board)；
Fig. 3 is side structure schematic view of the present invention.
In figure: 1, first pcb board, the 2, second pcb board, 3, aluminum alloy bottom plate, 4, pcb board aluminium alloy fixed frame, 5, first
Copper sheet, 6, third copper sheet, the 7, second copper sheet.
Specific embodiment
In the following, will be explained in the embodiment of the present invention, the example is shown in the accompanying drawings and the description below.Although will combine
The exemplary embodiment description present invention, it is to be understood that the description is not really wanted to limit the invention to the illustrative implementation
Example.On the contrary, the present invention will not only cover the exemplary embodiment, but also cover various replacements, it is changing, equivalent and
Other embodiments may include in the spirit and scope of the present invention as defined in the appended claims.
Referring to Fig. 1 to attached drawing 3, a kind of double-layer PCB board component of perfect heat-dissipating includes:
First pcb board 1, the second pcb board 2, aluminum alloy bottom plate 3, pcb board aluminium alloy fixed frame 4, the first copper sheet 5, third copper
Plate 6 and the second copper sheet 7；
Copper sheet 5 is to be bonded on the front/rear end of pcb board aluminium alloy fixed frame 4 respectively, and this two panels copper sheet 5 at two
Front end face or rear end face are also equipped with the first pcb board 1 and the second pcb board 2 respectively；The top surface front and rear sides of aluminum alloy bottom plate 3 are equal
Second copper sheet 7 at one is installed, and at two second copper sheet 7 the top surface bottom surface with pcb board aluminium alloy fixed frame 4 respectively；Pcb board
Aluminium alloy fixed frame 4 is that two parts up and down are divided by third copper sheet 6.
The preferred embodiment of the double-layer PCB board component of a kind of perfect heat-dissipating as described above, wherein pcb board aluminium closes
Golden fixed frame 4 is the I-shaped structure being easily installed, and the first copper sheet of two panels 5 is exactly before being bonded in I-shaped structure respectively
On rearward recess face, and the first pcb board 1 and the second pcb board 2 installed in the end face of the first copper sheet 5 by screw, make first
The thermal energy of electronic component output on pcb board 1 and the second pcb board 2, is quickly transmitted to I-shaped structure by the first copper sheet 5
Pcb board aluminium alloy fixed frame 4 on.
The preferred embodiment of the double-layer PCB board component of a kind of perfect heat-dissipating as described above, wherein pcb board aluminium closes
Golden fixed frame 4 is divided into two parts up and down by third copper sheet 6, and middle and upper part is divided into traditional aluminium alloy heat dissipation rib structure, lower part
Setting is fixed at two on the top surface of second copper sheet 7, since copper sheet heat-transfer rate and heating conduction are preferable, utilizes pcb board
The third copper sheet 6 of aluminium alloy fixed frame 4 implements upward rapid cooling, and utilizes 4 bottom surface of pcb board aluminium alloy fixed frame and second
The contact of copper sheet 7 and the first copper sheet 5, implements downward rapid cooling；
The working principle of the present embodiment:
The first copper sheet of two panels 5 is exactly to be bonded on the front and back groove surface of I-shaped structure respectively, and in the first copper sheet 5
End face the first pcb board 1 and the second pcb board 2 installed by screw, make electronics member on the first pcb board 1 and the second pcb board 2
The thermal energy of part output is quickly transmitted on the pcb board aluminium alloy fixed frame 4 of I-shaped structure by the first copper sheet 5, installation
When, aluminum alloy bottom plate 3 and other stand-by equipment relevant positions are implemented to fix, using aluminum alloy bottom plate 3 that second copper sheet 7 is quick
The heat transmitted downwards implements the heat dissipation of final large area.
In conclusion although the present invention is described in detail referring to the foregoing embodiments, for the technology of this field
For personnel, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technology
Feature is equivalently replaced, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on, and
It should be included within protection scope of the present invention.
Claims (3)
1. a kind of double-layer PCB board component of perfect heat-dissipating, it is characterised in that: a kind of double-deck PCB of perfect heat-dissipating
Board group part includes:
First pcb board, the second pcb board, aluminum alloy bottom plate, pcb board aluminium alloy fixed frame, the first copper sheet, third copper sheet and second
Copper sheet；
The copper sheet is to be bonded on the front/rear end of pcb board aluminium alloy fixed frame respectively, and the front end of this two panels copper sheet at two
Face or rear end face are also equipped with the first pcb board and the second pcb board respectively；The top surface front and rear sides of the aluminum alloy bottom plate are respectively mounted
Have the second copper sheet at one, and at two second copper sheet the top surface bottom surface with pcb board aluminium alloy fixed frame respectively；The pcb board aluminium
Alloy fixed frame is that two parts up and down are divided by third copper sheet.
2. a kind of double-layer PCB board component of perfect heat-dissipating according to claim 1, it is characterised in that: the pcb board aluminium
Alloy fixed frame is I-shaped structure, and first copper sheet is exactly the front and back groove for being bonded in I-shaped structure respectively at front and back two
On face, and the first pcb board and the second pcb board installed in the end face of the first copper sheet by screw.
3. a kind of double-layer PCB board component of perfect heat-dissipating according to claim 1, it is characterised in that: the pcb board aluminium
Alloy fixed frame is divided into two parts up and down by third copper sheet, and middle and upper part is divided into traditional aluminium alloy heat dissipation rib structure, lower part
Setting is fixed at two on the top surface of second copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811236645.XA CN109257870A (en) | 2018-10-23 | 2018-10-23 | A kind of double-layer PCB board component of perfect heat-dissipating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811236645.XA CN109257870A (en) | 2018-10-23 | 2018-10-23 | A kind of double-layer PCB board component of perfect heat-dissipating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109257870A true CN109257870A (en) | 2019-01-22 |
Family
ID=65045726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811236645.XA Pending CN109257870A (en) | 2018-10-23 | 2018-10-23 | A kind of double-layer PCB board component of perfect heat-dissipating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109257870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020258447A1 (en) * | 2019-06-26 | 2020-12-30 | 昆山首源电子科技有限公司 | Joined multi-layer circuit board |
| CN113163593A (en) * | 2021-05-21 | 2021-07-23 | 中山市基信锁芯有限公司 | Circuit board assembly of circuit board for sensor |
-
2018
- 2018-10-23 CN CN201811236645.XA patent/CN109257870A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020258447A1 (en) * | 2019-06-26 | 2020-12-30 | 昆山首源电子科技有限公司 | Joined multi-layer circuit board |
| CN113163593A (en) * | 2021-05-21 | 2021-07-23 | 中山市基信锁芯有限公司 | Circuit board assembly of circuit board for sensor |
| CN113163593B (en) * | 2021-05-21 | 2023-07-18 | 中山市基信锁芯有限公司 | Circuit board assembly of circuit board for sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190122 |
|
| WD01 | Invention patent application deemed withdrawn after publication |