CN207075120U - The double-layer PCB board component of height radiating - Google Patents
The double-layer PCB board component of height radiating Download PDFInfo
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- CN207075120U CN207075120U CN201720831610.5U CN201720831610U CN207075120U CN 207075120 U CN207075120 U CN 207075120U CN 201720831610 U CN201720831610 U CN 201720831610U CN 207075120 U CN207075120 U CN 207075120U
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- pcb board
- copper coin
- aluminium alloy
- radiating
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Abstract
The double-layer PCB board component of height radiating, including the 3rd copper coin and the second copper coin；The copper coin is at two, is bonded in respectively on the front/rear end of pcb board aluminium alloy fixed mount, and the front end face of this two panels copper coin or rear end face are also equipped with the first pcb board and the second pcb board respectively；The pcb board aluminium alloy fixed mount is that divide into two parts up and down by the 3rd copper coin, the underrun copper sheet of the aluminium alloy radiator structure of I-shaped structure is seated on the bottom surface of aluminium alloy, further accelerate the downward radiating rates of two PCB using copper sheet, in order to accelerate two upward radiating rates of pcb board, the heat abstractor of I-shaped structure is made into two parts up and down, it is middle to be connected further through one piece of copper sheet, so as to accelerate the upward radiating rate of pcb board, in summary, it can be seen that, utilize the fast essential concept of copper product heat-transfer rate, make the double-layer assembly of two pieces of pcb board compositions, carry out multi-angle radiating, accelerate radiating rate.
Description
Technical field
It the utility model is related to double-layer combined pcb board technical field of structures, more particularly to the double-layer PCB board group of high radiating
Part.
Background technology
The title of circuit board has:Wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin circuit
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board makes circuit miniaturization, directly perceivedization, for permanent circuit
Batch production and optimization electrical appliance layout play an important role.
The inventors discovered that existing double-layer combined pcb board, after combination is installed, because most of backrest-type merges
Together, or only with one layer of simple aluminium alloy plate cellular-type it is close together, this installation relation, and radiating subassembly are simple
Structure, make radiating effect poor, and radiating rate is slow.
Then, inventor in view of this, adhere to the relevant industries for many years it is abundant design and develop and the experience of actual fabrication,
Improvement is studied for existing structure and missing, there is provided a kind of double-layer PCB board component of high radiating, is had more to reach
The more purpose of practical value.
Utility model content
The purpose of this utility model is the double-layer PCB board component for providing high radiating, to solve to carry in above-mentioned background technology
The existing double-layer combined pcb board gone out, after combination is installed, because most of backrest-type merges, or only with one
The simple aluminium alloy plate cellular-type of layer is close together, this installation relation, and the simple structure of radiating subassembly, makes radiating effect
Difference, and the problem of radiating rate is slow.
The purpose and effect of the double-layer PCB board component of the high radiating of the utility model, are reached by technological means in detail below：
The double-layer PCB board component of height radiating, wherein, the double-layer PCB board component of height radiating includes：
First pcb board, the second pcb board, aluminum alloy bottom plate, pcb board aluminium alloy fixed mount, the first copper coin, the 3rd copper coin and
Second copper coin；
The copper coin is at two, is bonded in respectively on the front/rear end of pcb board aluminium alloy fixed mount, and this two panels copper coin
Front end face or rear end face are also equipped with the first pcb board and the second pcb board respectively；The top surface front and rear sides of the aluminum alloy bottom plate are equal
Second copper coin at one is installed, and at two second copper coin the top surface bottom surface with pcb board aluminium alloy fixed mount respectively；The PCB
Plate aluminum alloy fixed mount is that divide into two parts up and down by the 3rd copper coin.
Further, the pcb board aluminium alloy fixed mount is I-shaped structure, and first copper coin is exactly to distinguish at front and rear two
It is bonded on the front and rear groove surface of I-shaped structure, and the first PCB installed in the end face of the first copper coin by screw
Plate and the second pcb board.
Further, the pcb board aluminium alloy fixed mount is divided into two parts up and down by the 3rd copper coin, and wherein top is divided into biography
The aluminium alloy radiating rib structure of system, lower part are erect and are fixed at two on the top surface of second copper coin.
With existing structure in comparison, the utility model has the following advantages that：
1. by the use of I-shaped structure aluminium alloy radiator structure as installation double-layer PCB board sub-assembly heat dissipation element,
By in the groove of the I-shaped structure of front and rear sides, pacify the faster copper sheet of heat-transfer rate respectively, then two pieces of pcb boards are pacified respectively
On the two copper sheets, to make the two pcb boards implement quick heat radiating, the aluminium alloy radiator structure of I-shaped structure respectively
Underrun copper sheet be seated on the bottom surface of aluminium alloy, further accelerate the downward radiating rates of two PCB using copper sheet, be
Accelerate the upward radiating rate of two pcb boards, the heat abstractor of I-shaped structure is made into two parts up and down, it is middle and logical
One piece of copper sheet connection is crossed, so as to accelerate the upward radiating rate of pcb board, in view of the foregoing it is apparent that, utilize copper product heat conduction speed
Fast essential concept is spent, makes the double-layer assembly of two pieces of pcb board compositions, carries out multi-angle radiating, accelerate radiating rate.
Brief description of the drawings
Fig. 1 is the utility model overlooking the structure diagram；
Fig. 2 is the utility model main structure diagram (in the case of not installing pcb board)；
Fig. 3 is the utility model side structure schematic view.
In figure：1st, the first pcb board, the 2, second pcb board, 3, aluminum alloy bottom plate, 4, pcb board aluminium alloy fixed mount, 5, first
Copper coin, the 6, the 3rd copper coin, the 7, second copper coin.
Embodiment
Below, embodiment of the present utility model is will be explained in, the example is shown in the accompanying drawings and the description below.Although will
The utility model is described with reference to exemplary embodiment, it is to be understood that the description does not really want the utility model to be limited to this to show
The embodiment of example property.On the contrary, the utility model will not only cover the exemplary embodiment, but also cover various replacements,
Change, equivalent and other embodiment, it can be included in spirit of the present utility model and the model that appended claims are limited
In enclosing.
Referring to Fig. 1 to accompanying drawing 3, the double-layer PCB board component of height radiating, include：
First pcb board 1, the second pcb board 2, aluminum alloy bottom plate 3, pcb board aluminium alloy fixed mount 4, the first copper coin 5, the 3rd bronze medal
The copper coin 7 of plate 6 and second；
Copper coin 5 is at two, is bonded in respectively on the front/rear end of pcb board aluminium alloy fixed mount 4, and this two panels copper coin 5
Front end face or rear end face are also equipped with the first pcb board 1 and the second pcb board 2 respectively；The top surface front and rear sides of aluminum alloy bottom plate 3 are equal
Second copper coin 7 at one is installed, and at two second copper coin 7 the top surface bottom surface with pcb board aluminium alloy fixed mount 4 respectively；Pcb board
Aluminium alloy fixed mount 4 is that divide into two parts up and down by the 3rd copper coin 6.
The preferred embodiment of the double-layer PCB board component of high radiating as described above, wherein, pcb board aluminium alloy fixed mount 4
For ease of the I-shaped structure of installation, the first copper coin of two panels 5 is exactly the front and rear groove surface for being bonded in I-shaped structure respectively
On, and the first pcb board 1 and the second pcb board 2 installed in the end face of the first copper coin 5 by screw, make the He of the first pcb board 1
The heat energy of electronic component output on second pcb board 2, the pcb board aluminium of I-shaped structure is quickly sent to by the first copper coin 5
On alloy fixed mount 4.
The preferred embodiment of the double-layer PCB board component of high radiating as described above, wherein, pcb board aluminium alloy fixed mount 4
Two parts up and down are divided into by the 3rd copper coin 6, wherein top is divided into traditional aluminium alloy radiating rib structure, and lower part is erect and is fixed on
At two on the top surface of second copper coin 7, fixed because copper coin heat-transfer rate and heat conductivility are preferable, therefore using pcb board aluminium alloy
3rd copper coin 6 of frame 4 implements upward quick heat radiating, and utilizes the bottom surface of pcb board aluminium alloy fixed mount 4 and the second copper coin 7 and the
The contact of one copper coin 5, implements downward quick heat radiating；
The operation principle of the present embodiment：
The first copper coin of two panels 5 is exactly to be bonded in respectively on the front and rear groove surface of I-shaped structure, and in the first copper coin 5
End face the first pcb board 1 and the second pcb board 2 installed by screw, make electronics member on the first pcb board 1 and the second pcb board 2
The heat energy of part output, quickly it is sent on the pcb board aluminium alloy fixed mount 4 of I-shaped structure, installs by the first copper coin 5
When, aluminum alloy bottom plate 3 is implemented to fix with other stand-by equipment relevant positions, using aluminum alloy bottom plate 3 that second copper coin 7 is quick
The heat transmitted downwards implements the radiating of final large area.
In summary, although the utility model is described in detail with reference to the foregoing embodiments, for this area
For technical staff, it can still modify to the technical scheme described in foregoing embodiments, or to which part
Technical characteristic carries out equivalent substitution, all within the spirit and principles of the utility model, any modification for being made, equivalent substitution,
Improve etc., it should be included within the scope of protection of the utility model.
Claims (3)
1. the double-layer PCB board component of height radiating, it is characterised in that：The double-layer PCB board component of described high radiating includes：
First pcb board, the second pcb board, aluminum alloy bottom plate, pcb board aluminium alloy fixed mount, the first copper coin, the 3rd copper coin and second
Copper coin；
The copper coin is at two, is bonded in respectively on the front/rear end of pcb board aluminium alloy fixed mount, and the front end of this two panels copper coin
Face or rear end face are also equipped with the first pcb board and the second pcb board respectively；The top surface front and rear sides of the aluminum alloy bottom plate are respectively mounted
Have the second copper coin at one, and at two second copper coin the top surface bottom surface with pcb board aluminium alloy fixed mount respectively；The pcb board aluminium
Alloy fixed mount is that divide into two parts up and down by the 3rd copper coin.
2. the double-layer PCB board component of high radiating according to claim 1, it is characterised in that：The pcb board aluminium alloy is fixed
Frame is I-shaped structure, and first copper coin is exactly to be bonded in respectively on the front and rear groove surface of I-shaped structure at front and rear two, and
And the first pcb board and the second pcb board installed in the end face of the first copper coin by screw.
3. the double-layer PCB board component of high radiating according to claim 1, it is characterised in that：The pcb board aluminium alloy is fixed
Frame is divided into two parts up and down by the 3rd copper coin, and wherein top is divided into traditional aluminium alloy radiating rib structure, and lower part, which is erect, fixes
At two on the top surface of second copper coin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720831610.5U CN207075120U (en) | 2017-07-11 | 2017-07-11 | The double-layer PCB board component of height radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720831610.5U CN207075120U (en) | 2017-07-11 | 2017-07-11 | The double-layer PCB board component of height radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207075120U true CN207075120U (en) | 2018-03-06 |
Family
ID=61522362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720831610.5U Active CN207075120U (en) | 2017-07-11 | 2017-07-11 | The double-layer PCB board component of height radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207075120U (en) |
-
2017
- 2017-07-11 CN CN201720831610.5U patent/CN207075120U/en active Active
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