CN208540366U - A kind of heat radiating type control panel for air-conditioning - Google Patents
A kind of heat radiating type control panel for air-conditioning Download PDFInfo
- Publication number
- CN208540366U CN208540366U CN201821207405.2U CN201821207405U CN208540366U CN 208540366 U CN208540366 U CN 208540366U CN 201821207405 U CN201821207405 U CN 201821207405U CN 208540366 U CN208540366 U CN 208540366U
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- China
- Prior art keywords
- main control
- additional cooler
- conditioning
- control panel
- control chip
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of heat radiating type control panel for air-conditioning, it include: substrate, through-hole on the substrate, main control chip on the substrate and above the through-hole, far from several elements of the main control chip on the substrate, the first additional cooler above the main control chip, it is the second additional cooler below the main control chip, the thermal plastic insulation adhesive layer being respectively arranged between the main control chip and first additional cooler and second additional cooler, first additional cooler section is in " E " font, the cross section of second additional cooler is in "Ji" type.The utility model increases heat dissipation area, strengthens the heat dissipation effect of control panel by way of two sides install additional cooler additional above and below for main control chip；The connection type being bonded using insulating heat-conductive adhesive, simple to operate, good heat dissipation effect, while there is insulation effect again.
Description
Technical field
The utility model relates to control panel technical field more particularly to a kind of heat radiating type control panels for air-conditioning.
Background technique
With the development of science and technology, circuit control panel is more and more is applied to automated production equipment and intellectual product
In.When in use, electronic component therein can generate a large amount of heat to control panel, if these heats can not scatter and disappear, it will burn
Bad electronic component.The especially biggish electronic component of power dissipation ratio, the heat generated in use process is excessive, and is unable to get effectively
Scatter and disappear, can not only damage itself, the other elements on circuit board can also be damaged.The heat dissipation effect of existing pcb board is not
Ideal, technical staff can hold heat release hole to preferably radiate on pcb board, but this aperture plays the lost of heat
It acts on very little.
Therefore, the prior art is defective, needs to improve.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of heat radiating type control panel for air-conditioning.
The technical solution of the utility model is as follows: a kind of heat radiating type control panel for air-conditioning, comprising: substrate is set to institute
State through-hole on substrate, on the substrate and be located above the through-hole main control chip, be set to it is separate on the substrate
Several elements of the main control chip, are set to the main control chip at the first additional cooler above the main control chip
Lower section is the second additional cooler, be respectively arranged on the main control chip and first additional cooler and second auxiliary dissipates
Thermal plastic insulation adhesive layer between hot device, first additional cooler include: to connect with the thermal plastic insulation adhesive layer
Heat sink, several cooling fins above the heat sink and the heat sink strip set on cooling fin two sides described in every, institute
It states heat sink and the cooling fin surrounds the accommodating chamber that a cross section is in " E " font jointly, the cross section of the heat sink strip is in " T "
Font, the cross section of second additional cooler are in "Ji" type.
Further, the substrate is copper-clad laminate.
Further, the every cooling fin two sides are symmetrically arranged with three heat sink strips.
Further, first additional cooler passes through aluminium extruded technique, the work of anode processing using aluminum-magnesium alloy material
Sequence is integrated into.
Further, the material of second additional cooler is copper.
Further, second additional cooler and the substrate side wall and lower surface are separately positioned, and described second is auxiliary
Help radiator with a thickness of 1mm-3mm.
Further, the thermal plastic insulation adhesive layer with a thickness of 0.3mm-1.0mm.
Further, the through-hole is rectangle.
Further, the size of the through-hole is less than the size of the main control chip.
Further, the size of first additional cooler is greater than or equal to the size of the main control chip.
Using the above scheme, the idle call heat radiating type control panel of the utility model, structure is simple, good heat dissipation effect.Pass through
The mode for installing additional cooler additional for two sides above and below main control chip, increases heat dissipation area, strengthens the heat dissipation effect of control panel；
It is simple to operate using the connection type of insulating heat-conductive adhesive, the aperture on substrate and additional cooler is avoided, simultaneously
It also avoids between main control chip and additional cooler there are gap, good heat dissipation effect, while there is insulation effect again.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the utility model for the heat radiating type control panel of air-conditioning.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used for explaining this
Utility model is not used to limit the utility model.
Referring to Fig. 1, the utility model provides a kind of heat radiating type control panel for air-conditioning, comprising: substrate 1 is set to institute
It states the through-hole 2 on substrate, the main control chip 3 on the substrate 1 and above the through-hole 2, be set on the substrate 1
Far from several elements 4 of the main control chip 3, the first additional cooler 5 set on the main control chip 3 above, be set to described in
It is the second additional cooler 6 below main control chip 3, is respectively arranged on the main control chip 3 and first additional cooler 5 and institute
State the thermal plastic insulation adhesive layer 7 between the second additional cooler 6.By the way that auxiliary heat dissipation is arranged in 3 two sides of main control chip
The mode of device reinforces the heat dissipation of the main control chip 3.The heat release hole very little that the PCB substrate of Traditional control plate is opened, heat dissipation effect is not
Good, the utility model is not influencing the main control chip 3 under the premise of being installed on the substrate 1, by the master control core
The heat dissipation effect of 3 lower section of main control chip is reinforced in 3 lower section aperture of piece.The size of the through-hole 2 is less than the main control chip 3
Size, do not influence installation and circuit connection of the main control chip 3 on the substrate 1 in this way.Theoretically, the through-hole 2
It can be designed to arbitrary shape, specifically, the shape of through-hole 2 described in the present embodiment is rectangle, and the through-hole 2 of rectangle is easy to
Molding, and be conducive to the installation of second additional cooler 6.The substrate 1 is copper-clad laminate, the thermal coefficient of copper foil
Height is conducive to conduction of the substrate 1 to heat.
Please participate in Fig. 1 again, first additional cooler 5 includes: dissipating of connecting with the thermal plastic insulation adhesive layer 7
Hot plate 51, several cooling fins 52 above the heat sink 51 and the heat dissipation set on 52 two sides of cooling fin described in every
Item 53, the heat sink 51 surround the accommodating chamber that a cross section is in " E " font, the heat sink strip 53 with the cooling fin 52 jointly
Cross section it is T-shaped, every 52 two sides of cooling fin are symmetrically arranged with three heat sink strips 53.First auxiliary dissipates
The above-mentioned design of hot device 5 is provided to increasing heat radiation area, reinforces heat dissipation effect.First additional cooler 5 uses magnalium
Alloy material is made up of the integrated process of aluminium extruded technique, anode processing, and the thermal coefficient of magnesium-aluminium alloy material is high, heat dissipation
Fastly, be conducive to the heat loss of the main control chip 3.In order to which more effectively heat is conducted away, first additional cooler 5
Size be greater than or equal to the main control chip 3 size.
Fig. 1 is please participated in again, and the cross section of second additional cooler 6 is in "Ji" type, and top is fitted in the master
The lower section of chip 3 is controlled, convenient for conducting the heat of 3 lower section of main control chip to the external world, while by second additional cooler 6
Part positioned at 1 lower surface of substrate is bent, and is more advantageous to the planarization for keeping 1 lower surface of substrate, is convenient for subsequent control
The installation of making sheet.Second additional cooler 6 and 1 side wall of substrate and lower surface are separately positioned, are conducive to radiate.It is described
The material of second additional cooler 6 is copper, second additional cooler 6 with a thickness of 1mm-3mm, the thermal coefficient of copper is high,
Be conducive to the conduction of heat.
Traditional radiator is fixed by screws on substrate, can be had the gap between such radiator and chip, due to sky
Gas is unfavorable for the conduction of heat, so heat dissipation effect is undesirable, the utility model uses the thermal plastic insulation adhesive layer 7 by institute
The first additional cooler 5 is stated to be bonded on the main control chip 3 with second additional cooler 6, it is easy to operate, without dissipating
Hot device upper opening is fixed, while the thermal plastic insulation adhesive layer 7 also acts as the effect of insulated enclosure.The insulating heat-conductive
Gluing oxidant layer 7 with a thickness of 0.3mm-1.0mm, in order to improve bonding force, the thickness of the thermal plastic insulation adhesive layer 7 was not easy
It is thin, while in order to not influence heat dissipation effect, the thickness of the thermal plastic insulation adhesive layer 7 is also not easy blocked up.
In conclusion the idle call heat radiating type control panel of the utility model, structure is simple, good heat dissipation effect.Based on
The mode that chip or more two sides install additional cooler additional is controlled, heat dissipation area is increased, strengthens the heat dissipation effect of control panel；Using
The connection type of insulating heat-conductive adhesive, it is simple to operate, the aperture on substrate and additional cooler is avoided, while also keeping away
Exempt between main control chip and additional cooler there are gap, good heat dissipation effect, while there is insulation effect again.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (10)
1. a kind of heat radiating type control panel for air-conditioning characterized by comprising substrate, is set the through-hole on the substrate
In on the substrate and be located above the through-hole main control chip, on the substrate it is several far from the main control chip
Element, the first additional cooler above the main control chip below the main control chip are the second auxiliary heat dissipations
Device, the insulating heat-conductive being respectively arranged between the main control chip and first additional cooler and second additional cooler
Gluing oxidant layer, first additional cooler include: the heat sink connecting with the thermal plastic insulation adhesive layer, are set to described dissipate
Several cooling fins above hot plate and the heat sink strip set on cooling fin two sides described in every, the heat sink and the heat dissipation
Piece surrounds the accommodating chamber that a cross section is in " E " font jointly, and the cross section of the heat sink strip is T-shaped, second auxiliary
The cross section of radiator is in "Ji" type.
2. the heat radiating type control panel according to claim 1 for air-conditioning, which is characterized in that the substrate is copper foil covered
Pressing plate.
3. the heat radiating type control panel according to claim 1 for air-conditioning, which is characterized in that the every cooling fin two sides
It is symmetrically arranged with three heat sink strips.
4. the heat radiating type control panel according to claim 3 for air-conditioning, which is characterized in that first additional cooler
It is integrated into using aluminum-magnesium alloy material.
5. the heat radiating type control panel according to claim 1 for air-conditioning, which is characterized in that second additional cooler
Material be copper.
6. the heat radiating type control panel according to claim 5 for air-conditioning, which is characterized in that second additional cooler
It is separately positioned with the substrate side wall and lower surface, second additional cooler with a thickness of 1mm-3mm.
7. the heat radiating type control panel according to claim 1 for air-conditioning, which is characterized in that the insulating heat-conductive adhesive
Layer with a thickness of 0.3mm-1.0mm.
8. the heat radiating type control panel according to claim 1 for air-conditioning, which is characterized in that the through-hole is rectangle.
9. the heat radiating type control panel according to claim 8 for air-conditioning, which is characterized in that the size of the through-hole is less than
The size of the main control chip.
10. the heat radiating type control panel according to claim 1 for air-conditioning, which is characterized in that first auxiliary heat dissipation
The size of device is greater than or equal to the size of the main control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821207405.2U CN208540366U (en) | 2018-07-27 | 2018-07-27 | A kind of heat radiating type control panel for air-conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821207405.2U CN208540366U (en) | 2018-07-27 | 2018-07-27 | A kind of heat radiating type control panel for air-conditioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208540366U true CN208540366U (en) | 2019-02-22 |
Family
ID=65385504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821207405.2U Active CN208540366U (en) | 2018-07-27 | 2018-07-27 | A kind of heat radiating type control panel for air-conditioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208540366U (en) |
-
2018
- 2018-07-27 CN CN201821207405.2U patent/CN208540366U/en active Active
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