CN221103622U - Integrated circuit board convenient to heat dissipation - Google Patents
Integrated circuit board convenient to heat dissipation Download PDFInfo
- Publication number
- CN221103622U CN221103622U CN202322382155.3U CN202322382155U CN221103622U CN 221103622 U CN221103622 U CN 221103622U CN 202322382155 U CN202322382155 U CN 202322382155U CN 221103622 U CN221103622 U CN 221103622U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- radiator
- heat dissipation
- board body
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 238000000605 extraction Methods 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated circuit board convenient for heat dissipation, which relates to the field of circuit boards and comprises a circuit board body, wherein a radiator is arranged above the circuit board body, mounting pipes are fixedly arranged on two sides of the radiator, and screws in threaded connection with the mounting pipes are arranged on two sides of the circuit board body; the bottom of the radiator is detachably provided with a plurality of heat conducting plates, and the lower surfaces of the heat conducting plates are in contact with the upper surface of the circuit board body; the top of radiator has seted up the heat dissipation groove, and the center department of heat dissipation groove is equipped with solid fixed ring, gu both sides of solid fixed ring all are through the both sides fixed connection of dead lever and heat dissipation groove, and gu the inside fixed mounting of fixed ring has the air extraction fan, a plurality of evenly distributed's screw hole has been seted up to the tank bottom department of heat dissipation groove. The utility model adopts the structure of the radiator and the exhaust fan, so that the surface heat of the integrated circuit board can be rapidly dissipated, the heat dissipation is convenient, and the service life of the integrated circuit board is prolonged.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to an integrated circuit board convenient for heat dissipation.
Background
An integrated circuit board, also known as an integrated circuit board, is a carrier that carries integrated circuits, but often referred to as an integrated circuit board, also carries integrated circuits.
Most of the traditional integrated circuit boards can only dissipate heat in a natural cooling mode, and the slow heat dissipation is easy to accumulate heat on the surface of the circuit board and cannot be dissipated, so that electronic elements are burnt out, and the service life is shortened. For this reason, an integrated circuit board is proposed that facilitates heat dissipation.
Disclosure of utility model
The present utility model has been made in view of the above-mentioned problems occurring in the conventional integrated circuit board which facilitates heat dissipation.
Therefore, the utility model aims to provide the integrated circuit board convenient for heat dissipation, and solves the problem of poor heat dissipation effect of the existing integrated circuit board.
In order to achieve the above object, the present utility model provides the following technical solutions:
The integrated circuit board comprises a circuit board body, wherein a radiator is arranged above the circuit board body, mounting pipes are fixedly arranged on two sides of the radiator, and screws in threaded connection with the mounting pipes are arranged on two sides of the circuit board body; the bottom of the radiator is detachably provided with a plurality of heat conducting plates, and the lower surfaces of the heat conducting plates are in contact with the upper surface of the circuit board body; the top of radiator has seted up the heat dissipation groove, and the center department of heat dissipation groove is equipped with solid fixed ring, gu both sides of solid fixed ring all are through the both sides fixed connection of dead lever and heat dissipation groove, and gu the inside fixed mounting of fixed ring has the air extraction fan, a plurality of evenly distributed's screw hole has been seted up to the tank bottom department of heat dissipation groove.
Preferably, the circuit board body is provided with a mounting groove on two sides of the lower surface, and the screw is positioned in the mounting groove.
Preferably, the upper surface of the heat conducting plate is fixedly provided with a screw rod, and the upper surface of the heat conducting plate is connected with the radiator through the cooperation of the screw rod and the threaded hole.
Preferably, the two sides of the circuit board body are provided with mounting holes.
Further, the exhaust fan adopts a dustproof fan.
Preferably, the heat radiator is composed of a plurality of radiating fins, and the heat conducting plate and the heat radiator are made of the same material.
In the technical scheme, the utility model has the technical effects and advantages that:
1. according to the utility model, the heat of the surface of the circuit board body can be upwards transferred to the surface of the heat radiator through the heat radiator, the heat conducting plate and the exhaust fan which are arranged above the circuit board body, and then the heat in the heat radiating groove and the heat on the surface of the heat radiator can be extracted by matching with the exhaust fan, so that the surface of the circuit board body can be rapidly radiated, and the phenomenon that the electronic elements are burnt out due to overhigh heat on the surface of the circuit board body is avoided.
2. According to the circuit board, the mounting pipes and the screws are arranged, the mounting pipes on two sides of the radiator are in contact with two sides of the circuit board body, a gap is reserved between the radiator and the circuit board body, and the mounting pipes and the circuit board body can be fixed through the screws, so that the radiator can be fixedly arranged on the surface of the circuit board body.
3. According to the utility model, the screw rod arranged on the heat conducting plate can be connected with the threaded holes at different positions, so that the heat conducting plate can be contacted with the surface of the circuit board body at different positions.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top view of the heat sink of FIG. 1 according to the present utility model;
FIG. 3 is a top view of the heat conductive plate of FIG. 1 according to the present utility model.
Reference numerals illustrate:
1. A circuit board body; 2. a heat sink; 3. installing a pipe; 4. a screw; 5. a heat conductive plate; 6. a heat sink; 7. a fixing ring; 8. a fixed rod; 9. an exhaust fan; 10. a threaded hole; 11. a refund groove; 12. a screw; 13. and (5) mounting holes.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
The embodiment of the utility model discloses an integrated circuit board convenient for heat dissipation.
The utility model provides an integrated circuit board convenient for heat dissipation as shown in fig. 1-2, which comprises a circuit board body 1, wherein a radiator 2 is arranged above the circuit board body 1, mounting pipes 3 are fixedly arranged on two sides of the radiator 2, screws 4 in threaded connection with the mounting pipes 3 are arranged on two sides of the circuit board body 1, and the radiator 2 can be fixedly connected with the circuit board body 1 through the cooperation of the screws 4 and the mounting pipes 3; the bottom of the radiator 2 is detachably provided with a plurality of heat conducting plates 5, the lower surface of the heat conducting plates 5 is in contact with the upper surface of the circuit board body 1, the radiator 2 consists of a plurality of radiating fins, the heat conducting plates 5 and the radiator 2 are the same in material, the heat conducting plates 5 can transfer the heat on the surface of the circuit board body 1 upwards to the surface of the radiator 2, and the heat is dissipated through the radiator 2; the heat dissipation groove 6 has been seted up at the top of radiator 2, and the center department of heat dissipation groove 6 is equipped with solid fixed ring 7, gu fixed ring 7's both sides all pass through dead lever 8 and the both sides fixed connection of heat dissipation groove 6, and gu fixed ring 7's inside fixed mounting has air extraction fan 9, air extraction fan 9 adopts dustproof fan, a plurality of evenly distributed's screw hole 10 have been seted up to the tank bottom department of heat dissipation groove 6, air extraction fan 9 can take out the heat of heat dissipation groove 6 inside and the heat on radiator 2 surface, thereby can dispel the heat fast to the surface of circuit board body 1, avoid the phenomenon that circuit board body 1's surface heat is too high burns out electronic component.
In order to prevent the screw 4 from protruding out of the lower surface of the circuit board body 1 after being mounted, as shown in fig. 1, both sides of the lower surface of the circuit board body 1 are provided with the mounting-dismounting grooves 11, and the screw 4 is located inside the mounting-dismounting grooves 11.
In order to adjust the contact position between the heat conducting plate 5 and the circuit board body 1, as shown in fig. 1 and 3, a screw 12 is fixedly disposed on the upper surface of the heat conducting plate 5, and the upper surface of the heat conducting plate 5 is connected with the heat sink 2 through the cooperation of the screw 12 and the threaded hole 10.
Finally, in order to fixedly mount the circuit board body 1, as shown in fig. 1, mounting holes 13 are formed in both sides of the circuit board body 1, and bolts can be inserted into the mounting holes 13, so that the circuit board body 1 is fixedly mounted.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (6)
1. The utility model provides an integrated circuit board convenient to heat dissipation, includes circuit board body (1), its characterized in that: a radiator (2) is arranged above the circuit board body (1), mounting pipes (3) are fixedly arranged on two sides of the radiator (2), and screws (4) in threaded connection with the mounting pipes (3) are arranged on two sides of the circuit board body (1);
The bottom of the radiator (2) is detachably provided with a plurality of heat conducting plates (5), and the lower surfaces of the heat conducting plates (5) are in contact with the upper surface of the circuit board body (1);
The top of radiator (2) has seted up radiating groove (6), and the center department of radiating groove (6) is equipped with solid fixed ring (7), gu both sides of fixed ring (7) are all through dead lever (8) and radiating groove's (6) both sides fixed connection, and gu the inside fixed mounting of fixed ring (7) has air extraction fan (9), a plurality of evenly distributed's screw hole (10) have been seted up to radiating groove's (6) tank bottom department.
2. The integrated circuit board for facilitating heat dissipation of claim 1, wherein: the circuit board is characterized in that the two sides of the lower surface of the circuit board body (1) are provided with a withdrawal groove (11), and the screw (4) is positioned in the withdrawal groove (11).
3. The integrated circuit board for facilitating heat dissipation of claim 1, wherein: the upper surface of the heat conducting plate (5) is fixedly provided with a screw rod (12), and the upper surface of the heat conducting plate (5) is connected with the radiator (2) through the cooperation of the screw rod (12) and the threaded hole (10).
4. The integrated circuit board for facilitating heat dissipation of claim 1, wherein: mounting holes (13) are formed in two sides of the circuit board body (1).
5. The integrated circuit board for facilitating heat dissipation of claim 1, wherein: the exhaust fan (9) adopts a dustproof fan.
6. The integrated circuit board for facilitating heat dissipation of claim 1, wherein: the radiator (2) is composed of a plurality of radiating fins, and the heat conducting plate (5) and the radiator (2) are made of the same material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322382155.3U CN221103622U (en) | 2023-09-04 | 2023-09-04 | Integrated circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322382155.3U CN221103622U (en) | 2023-09-04 | 2023-09-04 | Integrated circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221103622U true CN221103622U (en) | 2024-06-07 |
Family
ID=91316820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322382155.3U Active CN221103622U (en) | 2023-09-04 | 2023-09-04 | Integrated circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221103622U (en) |
-
2023
- 2023-09-04 CN CN202322382155.3U patent/CN221103622U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205717062U (en) | A kind of Surface-mount LED lamp substrate | |
| CN201706440U (en) | LED lamp | |
| CN221103622U (en) | Integrated circuit board convenient to heat dissipation | |
| CN203722987U (en) | Simple heat radiation structure of multiple power devices | |
| CN209563078U (en) | The server cooling fin of interchangeable radiating fin | |
| CN202738247U (en) | Circuit board provided with improved heat dissipation performance | |
| CN221010384U (en) | LED lamp circuit board for light environment | |
| CN220798925U (en) | Porous ceramic radiating fin | |
| CN220985926U (en) | Porous ceramic circuit board | |
| CN219372979U (en) | Filter heat abstractor | |
| CN221598435U (en) | Circuit board shell with heat dissipation function | |
| CN221226217U (en) | Protective structure for multi-chip parallel high-power silicon carbide module | |
| CN219496740U (en) | Optical communication module with high heat dissipation rate | |
| CN211457519U (en) | PCB capable of efficiently dissipating heat | |
| CN220965267U (en) | Buffer type chip conduction heat dissipation structure | |
| CN210298195U (en) | High radiating double-deck PCB board subassembly | |
| CN221553725U (en) | High-efficient radiating electronic ceramic component coupling mechanism | |
| CN209879438U (en) | Radiator with rapid heat dissipation | |
| CN216491219U (en) | High-efficient radiating HDI circuit board | |
| CN220933456U (en) | Double heat dissipation device for computer | |
| CN219961204U (en) | Industrial power supply module device | |
| CN219228279U (en) | High-efficient heat dissipation type ultrathin LED die-casting aluminum sleeve | |
| CN219660293U (en) | Module power supply heat dissipation assembly | |
| CN212183811U (en) | High-precision circuit board | |
| CN214896508U (en) | Efficient heat dissipation device for computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |