CN218772543U

CN218772543U - Circuit board with radiating fins

Info

Publication number: CN218772543U
Application number: CN202222990757.2U
Authority: CN
Inventors: 李华军; 郑元刚
Original assignee: Shenzhen Hezhong Precision Electronics Co ltd
Current assignee: Shenzhen Hezhong Precision Electronics Co ltd
Priority date: 2022-11-10
Filing date: 2022-11-10
Publication date: 2023-03-28
Anticipated expiration: 2032-11-10

Abstract

The utility model discloses a take circuit board of fin, which comprises a circuit board, heat conduction device is installed to the circuit board lower extreme, a set of blind hole has all been opened to circuit board upper end left part and upper end right part, the circuit layer is installed to the circuit board upper end, two installation screws are all installed to circuit board upper end front portion and upper end rear portion, heat abstractor is installed jointly to circuit board left end and right-hand member, buffer is installed jointly to heat abstractor left end lower part and right-hand member lower part. A take circuit board of fin, through heat abstractor upper end fan and then blow to circuit board upper surface to dispel the heat to circuit board upper portion, heat conduction silicone grease and fin on the heat abstractor dispel the heat to the circuit board lower part, make the circuit board can go up the lower part and dispel the heat simultaneously, and then effectively improved the heat dispersion of circuit board, cushion the shock attenuation through buffer, and then improved the circuit board result of use.

Description

Circuit board with radiating fins

Technical Field

The utility model relates to a circuit board technical field, in particular to take circuit board of fin.

Background

Printed Circuit Boards (PCBs), also known as PCBs, are providers of electrical connections for electronic components, and PCBs miniaturize and visualize circuits and play an important role in mass production of fixed circuits and in optimizing electrical appliance layouts. Especially, nowadays, the electronic products are updated faster and faster, and the demand and use of the circuit board are also increasing.

The prior patent application No. 202120404156.1 discloses a heat dissipation printed circuit board, wherein the conventional circuit board is proposed to enhance the heat dissipation effect, and a metal substrate is generally used to absorb heat and dissipate heat from the circuit. However, the heat dissipation effect of the metal substrate is not particularly high, heat is often accumulated on the substrate and is difficult to dissipate and cool quickly, the overall performance of the circuit board is affected, most of the existing circuit boards have no shock absorption capacity, and premature damage can be caused when vibration occurs; in addition, the circuit board is not well protected after being installed, and is easy to scratch by the outside. In summary, the conventional circuit board has the following problems:

1. when the circuit board works for a long time, more heat can be generated in the circuit board to accumulate, the heat absorption and heat dissipation effects of the traditional metal substrate on the circuit are general, the circuit board is difficult to dissipate heat quickly, and the service life of the circuit board is further influenced; 2. when the circuit board is vibrated, the precise devices on the circuit board can shake along with the circuit board, and meanwhile, the circuit board is not well protected after being installed and is easy to scratch by external scratches, so that the overall performance of the circuit board is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a take circuit board of fin can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a take circuit board of fin, includes the circuit board, heat-transfer device is installed to the circuit board lower extreme, a set of blind hole has all been opened to circuit board upper end left part and upper end right part, circuit board installs the circuit layer in the upper end, two installation screws are all installed to circuit board upper end front portion and upper end rear portion, heat abstractor is installed jointly to circuit board left end and right-hand member, buffer is installed jointly to heat abstractor left end lower part and right-hand member lower part.

Preferably, the heat dissipation device comprises a protection plate and a mounting seat, two fixing screws are respectively mounted at the front part and the rear part of the upper end of the protection plate, mounting sleeves are respectively mounted at the left part and the right part of the upper end of the protection plate, fans are respectively mounted at the upper ends of the two mounting sleeves, the mounting seat is provided with two, two screw holes have all been opened to mounting seat upper end front portion and upper end rear portion the mounting seat passes through the installation screw to be installed respectively at circuit board left end and right-hand member, the guard plate passes through the fixed screw and installs in two mounting seats upper ends. Two fans on the heat dissipation device rotate to blow air, and the fans blow the air to the upper surface of the circuit board so as to dissipate heat of the upper part of the circuit board.

Preferably, the buffering device comprises two fixing frames, two fixing grooves are formed in the upper ends of the fixing frames, a group of spring dampers are installed at one ends corresponding to the fixing frames, and the fixing frames are installed at the ends, back to back, of the two mounting seats respectively. Carry out buffering shock attenuation through spring damper, install in the circuit board upper end by fixed screw through the guard plate moreover to protect the circuit board, and then improved circuit board result of use.

Preferably, the heat conduction device radiating fin, insulating heat conduction glue is all installed to radiating fin upper end left part and upper end right part, heat conduction silicone grease is installed at radiating fin upper end mid-mounting, the radiating fin is installed at the circuit board lower extreme. The heat conducting silicone grease and the insulating heat conducting glue on the heat conducting device can quickly transfer the heat at the lower part of the circuit board to the radiating fin to be dissipated.

Preferably, a gap exists between the mounting sleeve and the circuit board.

Preferably, the two fixing frames are both L-shaped.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. rotate through two fans on the heat abstractor and blow, the fan and then blows to the circuit board upper surface, in order to dispel the heat to circuit board upper portion, and simultaneously, through the heat conduction silicone grease on the heat conduction device, it has high thermal conductivity, splendid heat conductivity, good electrical insulation, the service temperature of broad, fine stability in use, lower consistency and good constructability, it is high to have bonding strength through insulating heat-conducting glue simultaneously, be the elastomer after the solidification, shock resistance, vibrations etc., the cured object still has good heat conduction simultaneously, heat dissipation function and excellent high low temperature resistance performance and electrical property, and then can dispel the heat to the fin fast with the heat of circuit board lower part transmission, can dispel the heat to the upper and lower part of circuit board simultaneously through heat abstractor and heat conduction device, and then effectively improved the heat dispersion of circuit board.

2. The device is fixed at a proper position through a fixing frame on the buffer device, when the fixing frame is vibrated and is shaken to be transmitted to the circuit board, the damping is buffered through the spring damper, and the device is installed at the upper end of the circuit board through the protection plate by the fixing screws, so that the circuit board is protected, and the using effect of the circuit board is improved.

Drawings

Fig. 1 is a schematic view of the overall structure of a circuit board with heat dissipation fins according to the present invention;

fig. 2 is a schematic view of the overall structure of the heat dissipation device of the circuit board with heat dissipation fins according to the present invention;

fig. 3 is a schematic view of the overall structure of the buffer device of the circuit board with heat dissipation fins according to the present invention;

fig. 4 is a schematic view of the overall structure of the heat conduction device of the circuit board with heat dissipation fins of the present invention.

In the figure: 1. a circuit board; 2. a heat sink; 3. a buffer device; 4. a heat conducting device; 5. a circuit layer; 6. blind holes; 7. mounting screws; 20. a protection plate; 21. installing a sleeve; 22. a fan; 23. a mounting base; 24. a screw hole; 25. fixing screws; 30. a fixed mount; 31. a spring damper; 32. a fixing groove; 40. a heat sink; 41. insulating heat-conducting glue; 42. and (3) heat-conducting silicone grease.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a circuit board with cooling fins comprises a circuit board 1, wherein a heat conducting device 4 is installed at the lower end of the circuit board 1, a group of blind holes 6 are formed in the left portion and the right portion of the upper end of the circuit board 1, a circuit layer 5 is installed at the upper end of the circuit board 1, two installation screws 7 are installed at the front portion and the rear portion of the upper end of the circuit board 1, a cooling device 2 is installed at the left end and the right end of the circuit board 1 together, and a buffering device 3 is installed at the lower portion of the left end and the lower portion of the right end of the cooling device 2 together.

The heat dissipation device 2 comprises a protection plate 20 and a mounting seat 23, wherein two fixing screws 25 are respectively mounted at the front part and the rear part of the upper end of the protection plate 20; in one embodiment, the protection plate 20 is mounted on the upper ends of the two mounting seats 23 by means of screws. The left part and the right part of the upper end of the protection plate 20 are both provided with mounting sleeves 21, the upper ends of the two mounting sleeves 21 are both provided with fans 22, two mounting seats 23 are arranged, the front parts and the rear parts of the upper ends of the two mounting seats 23 are both provided with two screw holes 24, the two mounting seats 23 are respectively mounted at the left end and the right end of the circuit board 1 through mounting screws 7, and the protection plate 20 is mounted at the upper ends of the two mounting seats 23 through fixing screws 25; a gap exists between the mounting sleeve 21 and the circuit board 1. In this embodiment, two fans 22 rotate to blow air, and the fans 22 blow the air to the upper surface of the circuit board 1 to dissipate heat from the upper portion of the circuit board 1.

The buffer device 3 comprises two fixing frames 30, two fixing frames 30 are arranged, two fixing grooves 32 are formed in the upper ends of the two fixing frames 30, a group of spring dampers 31 are arranged at the corresponding ends of the two fixing frames 30, and the two fixing frames 30 are respectively arranged at the opposite ends of the two mounting seats 23; both the two holders 30 are L-shaped. As a specific implementation manner, in the present embodiment, the spring damper 31 is used for buffering and damping, and the protection plate 20 is installed at the upper end of the circuit board 1 by the fixing screw 25, so that the circuit board 1 is protected, and the using effect of the circuit board 1 is improved.

The heat conducting device 4 is provided with a heat radiating fin 40, the left part of the upper end and the right part of the upper end of the heat radiating fin 40 are provided with insulating heat conducting glue 41, the middle part of the upper end of the heat radiating fin 40 is provided with heat conducting silicone grease 42, and the heat radiating fin 40 is arranged at the lower end of the circuit board 1. As a specific implementation manner, the upper thermal grease 42 and the insulating thermal paste 41 in this embodiment can rapidly transfer heat from the lower portion of the circuit board 1 to the heat sink 40 for dissipation.

It should be noted that, the utility model relates to a take circuit board of fin, at first fix the device in suitable position through mount 30 on buffer 3, receive vibrations and will rock when transmitting to circuit board 1 when mount 30, cushion the shock attenuation through spring damper 31, and install in circuit board 1 upper end by fixed screw 25 through guard plate 20, thereby protect circuit board 1, and then improved circuit board 1 result of use, when circuit board 1 is inside overheated, rotate through two fans 22 on heat abstractor 2 and blow, fan 22 and then blow wind to circuit board 1 upper surface, with dispel the heat to circuit board 1 upper portion, and simultaneously, through heat conduction silicone grease 42 on heat conduction device 4, it has the high thermal conductivity, splendid heat conductivity, good electrical insulation, the service temperature of broad, fine stability in use, lower consistency and good construction performance, it is high to have bonding strength simultaneously through insulating cement 41, be the elastomer after the solidification, shock resistance, vibrations, the cured substance still has good heat conduction, heat dissipation function and excellent resistant high low temperature performance and electrical property and the electrical property, and then can be with heat transfer the heat of 1 to circuit board lower part through heat abstractor heat dissipation device 4, effective heat dissipation performance has been carried out to circuit board 1 simultaneously.

The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a take circuit board of fin, includes circuit board (1), its characterized in that: heat-conducting device (4) are installed to circuit board (1) lower extreme, a set of blind hole (6) have all been opened to circuit board (1) upper end left part and upper end right part, circuit board (1) upper end is installed circuit layer (5), two installation screws (7) are all installed to circuit board (1) upper end front portion and upper end rear portion, heat abstractor (2) are installed jointly to circuit board (1) left end and right-hand member, buffer (3) are installed jointly to heat abstractor (2) left end lower part and right-hand member lower part.

2. A circuit board with heat sink according to claim 1, wherein: heat abstractor (2) are including guard plate (20) and mount pad (23), two fixed screw (25) are all installed to guard plate (20) upper end front portion and upper end rear portion, installation cover (21), two are all installed to guard plate (20) upper end left part and upper end right part fan (22) are all installed to installation cover (21) upper end, mount pad (23) are provided with two, two mount pad (23) upper end front portion and upper end rear portion have all been opened two screw holes (24), two mount pad (23) are installed respectively at circuit board (1) left end and right-hand member through installation screw (7), guard plate (20) are installed in two mount pad (23) upper ends through fixed screw (25).

3. The circuit board with heat sink according to claim 2, wherein: buffer (3) are including mount (30), mount (30) are provided with two, two fixed slot (32) have all been opened to mount (30) upper end, two a set of spring damper (31) are all installed to the one end that mount (30) correspond, two mount (30) are installed respectively in the one end that two mount pads (23) carried on the back mutually.

4. A circuit board with heat sink according to claim 1, wherein: the heat conduction device (4) is provided with a heat radiating fin (40), insulating heat conduction glue (41) is installed on the left portion of the upper end and the right portion of the upper end of the heat radiating fin (40), heat conduction silicone grease (42) is installed in the middle of the upper end of the heat radiating fin (40), and the heat radiating fin (40) is installed at the lower end of the circuit board (1).

5. The circuit board with heat sink according to claim 2, wherein: a gap exists between the mounting sleeve (21) and the circuit board (1).

6. A circuit board with heat sink according to claim 3, wherein: the two fixing frames (30) are both L-shaped.