CN211959300U - Back clamp type radiator for mobile phone - Google Patents
Back clamp type radiator for mobile phone Download PDFInfo
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- CN211959300U CN211959300U CN202020917232.4U CN202020917232U CN211959300U CN 211959300 U CN211959300 U CN 211959300U CN 202020917232 U CN202020917232 U CN 202020917232U CN 211959300 U CN211959300 U CN 211959300U
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Abstract
The utility model provides a mobile phone back clip type radiator, which comprises a front shell, a rear shell, an upper clip arm, a lower clip arm, a circuit board and a fan radiating component; the support frame is arranged outside the rear shell, two ends of the support frame are respectively connected to the side end face of the rear shell in a rotating mode, and the support frame can be unfolded or closed relative to the rear shell. The utility model has simple structure and convenient use, and can effectively cool and radiate the mobile phone in time by the fan radiating component when the mobile phone runs game software or watches videos by clamping and fixing the mobile phone by the upper clamping arm and the lower clamping arm; and the support frame can support the rear shell after being unfolded, so that the mobile phone can be placed on a desktop.
Description
Technical Field
The utility model relates to a cell-phone accessory technical field, especially a cell-phone back splint formula radiator with fan heat radiation structure.
Background
With the rapid development of smart phones, the functions of the smart phones are more and more. When a mobile phone runs game software with higher hardware performance or watches videos, a radiator arranged on the mobile phone is difficult to meet the heat dissipation requirement and is easy to generate heat, so that the service lives of a mobile phone battery and an electronic element are influenced, the problems of dead halt and battery explosion are caused in serious conditions, and certain potential safety hazards exist. Some external mobile phone radiators are provided in the market at present, most of the radiators adopt an air-cooled radiating mode, the radiating mode is single, the cooling effect is poor, and excessive heat cannot be effectively discharged in time; after the radiator is arranged on the mobile phone, the mobile phone cannot be placed on other supports due to the fact that the radiator is thick, and the radiator cannot be independently supported on a desktop. Therefore, there is a need for improvement and optimization of the existing heat sink for mobile phone, and a heat sink with both effective heat dissipation and supporting function is developed.
Disclosure of Invention
The utility model aims to solve the technical problem that a cell-phone back splint formula radiator that above-mentioned problem takes place can effectively be overcome to provide one kind, not only can in time cool off the heat dissipation to the cell-phone effectively through fan cooling module, can also be used for supporting the backshell with the support frame after expanding, and then make the cell-phone place on the desktop.
In order to solve the above technical problem, the utility model provides a mobile phone back clip type radiator, which comprises a front shell, a rear shell, an upper clip arm, a lower clip arm, a circuit board and a fan radiating component; the front shell and the rear shell are buckled to form an accommodating cavity, the fan radiating assembly is arranged in the accommodating cavity and is arranged on the back surface of the front shell, and the circuit board is arranged at the lower part of the fan radiating assembly and is electrically connected with the fan radiating assembly; the upper clamping arm and the lower clamping arm are respectively arranged on the upper end surface and the lower end surface of the front shell, and a clamping space for clamping and fixing the mobile phone is formed between the upper clamping arm and the lower clamping arm; the support frame is arranged outside the rear shell, two ends of the support frame are respectively connected to the side end face of the rear shell in a rotating mode, and the support frame can be unfolded or closed relative to the rear shell.
In the structure, the two ends of the support frame are respectively provided with the support arm rotating shaft, the side end face of the rear shell is provided with the corresponding shaft hole of the support arm rotating shaft, the support frame is connected to the end faces of the left side and the right side of the rear shell in a rotating mode through the support arm rotating shaft, the support frame can support the rear shell after being unfolded, and then the mobile phone can be placed on the desktop.
In the structure, a rotating shaft damping sleeve is arranged at the joint of the supporting arm rotating shaft and the shaft hole, and the rotating shaft damping sleeve is clamped between the outer wall surface of the supporting arm rotating shaft and the inner wall surface of the shaft hole.
In the structure, the fan heat dissipation assembly comprises a heat dissipation fan, a heat dissipation aluminum piece, a semiconductor refrigeration sheet, a heat conduction silica gel sheet and a heat conduction metal sheet; the front surface of the front shell is inwards sunken to form an embedding groove, the heat-conducting silica gel sheet and the heat-conducting metal sheet are arranged in the embedding groove, a notch for mounting the semiconductor refrigerating sheet is formed in the center of the embedding groove, and the semiconductor refrigerating sheet is fixedly mounted in the notch; the heat dissipation aluminum piece is provided with the heat dissipation fan and is arranged on the back surface of the upper semiconductor refrigeration piece.
In the structure, the upper clamping arm and the upper clamping arm are of 7-shaped structures and are arranged on the upper end surface and the lower end surface of the front shell in a parallel and opposite mode, the back surface of the front shell is respectively provided with two sliding through grooves in sliding fit with the upper clamping arm and the upper clamping arm, and the connecting ends of the upper clamping arm and the upper clamping arm are respectively installed in the corresponding sliding through grooves and can slide up and down along the sliding through grooves.
In the structure, an elastic piece is further connected between the upper clamping arm or the upper clamping arm and the front shell respectively, the elastic piece is a return spring, one end of the return spring is connected to the inner side surface of the front shell, and the other end of the return spring is connected to the end surface of the connecting end of the upper clamping arm or the lower clamping arm; when the upper clamping arm slides upwards or the lower clamping arm moves downwards, the upper clamping arm can reset through the corresponding elastic piece.
In the above structure, the upper and lower end faces of the rear shell are provided with openings through which the upper and lower clamp arms pass, and the free ends of the upper and lower clamp arms extend out of the accommodating cavity through the openings.
In the above structure, heat radiation windows are provided on the back surface and the side end surface of the rear case.
In the above structure, the circuit board is provided with a power interface, and the power interface is mounted on the lower end face of the rear shell.
The beneficial effects of the utility model reside in that: the utility model has simple structure and convenient use, and can effectively cool and radiate the mobile phone in time by the fan radiating component when the mobile phone runs game software or watches videos by clamping and fixing the mobile phone by the upper clamping arm and the lower clamping arm; and the support frame can support the rear shell after being unfolded, so that the mobile phone can be placed on a desktop.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the exploded structure of the present invention;
FIG. 3 is a partially exploded view of FIG. 2;
fig. 4 is another schematic structural diagram of the present invention.
In the figure: the cooling structure comprises a front shell 1, a rear shell 2, an upper clamping arm 3, a lower clamping arm 4, a fan cooling assembly 5, a circuit board 6, a support frame 7, a notch 11, a sliding through groove 12, an elastic piece 13, a shaft hole 21, an opening 22, a cooling window 23, a cooling fan 51, a cooling aluminum piece 52, a semiconductor refrigeration piece 53, a heat-conducting metal piece 54, a heat-conducting silicon rubber piece 55, a power interface 61, a support arm rotating shaft 71 and a rotating shaft damping sleeve 72.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-4, the present invention discloses a back clip type heat sink for mobile phone, which comprises a front shell 1, a rear shell 2, an upper clip arm 3, a lower clip arm 4, a circuit board 6 and a fan cooling assembly 5; the front casing 1 and the rear casing 2 are fastened to form a containing cavity (not shown), and the circuit board 6 and the fan heat dissipation assembly are arranged in the containing cavity and placed on the back surface of the front casing. More specifically, the circuit board 6 is fixed on the lower portion of the fan cooling module 5 and electrically connected to the fan cooling module 5; the upper clamping arm 3 and the lower clamping arm 4 are respectively arranged on the upper end surface and the lower end surface of the front shell 1, and a clamping space for clamping and fixing the mobile phone is formed between the upper clamping arm 3 and the lower clamping arm 4. A support frame 7 is arranged outside the rear shell 2, two ends of the support frame 7 are respectively connected to the side end face of the rear shell 2 in a rotating manner, and the support frame 7 can be unfolded or closed at the edge of the rear shell 2 relative to the rear shell 2.
Further, as shown in fig. 2, two ends of the supporting frame 7 are respectively provided with a supporting arm rotating shaft 71, the left and right end surfaces of the rear housing 2 are provided with shaft holes 21 corresponding to the supporting arm rotating shafts 71, and the supporting frame 7 is rotatably connected to the left and right end surfaces of the rear housing 2 through the supporting arm rotating shafts 71. As shown in fig. 4, the number of the supporting frames 7 can be set to 2 groups; when the mobile phone runs game software or watches videos, the supporting frame 7 can be unfolded relative to the rear shell 2, and the supporting frame 7 can support the rear shell 2 after being unfolded, so that the mobile phone can be placed on a desktop, and after the mobile phone is used, the supporting frame 7 can be closed at the edge of the rear shell 2.
Furthermore, a rotating shaft damping sleeve 72 is arranged at the joint of the support arm rotating shaft 71 and the shaft hole 21, the rotating shaft damping sleeve 72 is clamped between the outer wall surface of the support arm rotating shaft 71 and the inner wall surface of the shaft hole 21 and is in interference fit, namely, the rotating shaft damping sleeve 72 is used for increasing radial friction when the support arm rotating shaft 71 rotates relative to the rear shell 2, so that the support frame 7 can support the rear shell 2 after being unfolded.
Preferably, the fanning heat dissipation assembly 5 includes a heat dissipation fan 51, a heat dissipation aluminum member 52, a semiconductor cooling sheet 53, a heat conductive silicone sheet 55, and a heat conductive metal sheet 54; more specifically, the front surface of the front shell 1 is recessed inwards to form an embedding groove (not shown), the heat-conducting silicone sheet 55 and the heat-conducting metal sheet 54 are sequentially installed in the embedding groove from outside to inside, a notch 11 for installing the semiconductor refrigeration sheet 53 is formed in the center of the embedding groove, and the semiconductor refrigeration sheet 53 is fixedly installed in the notch 11; further, a heat dissipating fan 51 is provided on the heat dissipating aluminum 52, and the heat dissipating aluminum 52 is mounted on the back surface of the upper semiconductor cooling fin 53. That is to say, the mobile phone is fixed on the radiator through the centre gripping of upper arm lock 3 and lower arm lock 4, and the produced heat in the back of the mobile phone can be through heat conduction silica gel piece 55, heat conduction sheetmetal 54 and semiconductor refrigeration piece 53 heat dissipation, and radiator fan 51 can cool off the heat dissipation to semiconductor refrigeration piece 53 for the refrigeration efficiency of semiconductor refrigeration piece is high, and the cooling effect is good, can in time discharge too much heat effectively, prevents that the mobile phone can cause the problem of crash and battery explosion because of the high temperature.
Preferably, as shown in fig. 3, the upper clamping arm 3 and the upper clamping arm 4 are in a "7" type structure and are arranged on the upper end surface and the lower end surface of the front shell 1 in parallel and oppositely; more specifically, the back of the front housing 1 is provided with two sliding through slots 12 slidably engaged with the upper clamping arm 3 and the upper clamping arm 7, and the connecting ends of the upper clamping arm 3 and the upper clamping arm 4 are respectively installed in the corresponding sliding through slots 12 and can slide up and down along the sliding through slots 12. Furthermore, an elastic piece 13 is connected between the upper clamping arm 3 or the upper clamping arm 4 and the front shell 1 respectively, the elastic piece 13 is a return spring, one end of the return spring is connected to the inner side surface of the front shell 1, and the other end of the return spring is connected to the end surface of the connecting end of the upper clamping arm 3 or the lower clamping arm 4; after the use, the upper clamping arm 3 slides upwards or the lower clamping arm 4 moves downwards and can be reset through the corresponding elastic piece 13. Furthermore, the upper and lower end surfaces of the rear shell 2 are provided with openings 22 for the upper clamping arm 3 and the lower clamping arm 4 to pass through, and the free ends of the upper clamping arm 3 and the lower clamping arm 4 extend out of the accommodating cavity through the openings 22. Since the above sections are prior art, they are not discussed here in a cumulative sense.
Preferably, the rear surface and the side end surfaces of the rear case 2 are provided with heat radiation windows 23.
Preferably, the circuit board 6 is provided with a power interface 61, the power interface 61 is mounted on the lower end surface of the rear casing 2, and the power interface 61 is connected with an external power supply for supplying power to the heat dissipation fan assembly 5.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Claims (9)
1. A back splint type radiator for a mobile phone is characterized in that: the heat dissipation device comprises a front shell, a rear shell, an upper clamping arm, a lower clamping arm, a circuit board and a fan heat dissipation assembly; the front shell and the rear shell are buckled to form an accommodating cavity, the fan radiating assembly is arranged in the accommodating cavity and is arranged on the back surface of the front shell, and the circuit board is arranged at the lower part of the fan radiating assembly and is electrically connected with the fan radiating assembly; the upper clamping arm and the lower clamping arm are respectively arranged on the upper end surface and the lower end surface of the front shell, and a clamping space for clamping and fixing the mobile phone is formed between the upper clamping arm and the lower clamping arm; the support frame is arranged outside the rear shell, two ends of the support frame are respectively connected to the side end face of the rear shell in a rotating mode, and the support frame can be unfolded or closed relative to the rear shell.
2. The clip-on heat sink for cellular phone as claimed in claim 1, wherein: the both ends of support frame are equipped with the support arm pivot respectively, backshell side end face is equipped with the correspondence the shaft hole of support arm pivot, and the support frame passes through the support arm pivot and rotates to be connected in the terminal surface of backshell left and right sides, and the backshell can be supported after the support frame expandes, and then makes the cell-phone place on the desktop.
3. The clip-on heat sink for cellular phone as claimed in claim 2, wherein: and a rotating shaft damping sleeve is arranged at the joint of the supporting arm rotating shaft and the shaft hole, and is clamped between the outer wall surface of the supporting arm rotating shaft and the inner wall surface of the shaft hole.
4. The clip-on heat sink for cellular phone as claimed in claim 1, wherein: the fan radiating assembly comprises a radiating fan, a radiating aluminum piece, a semiconductor refrigerating sheet, a heat-conducting silica gel sheet and a heat-conducting metal sheet; the front surface of the front shell is inwards sunken to form an embedding groove, the heat-conducting silica gel sheet and the heat-conducting metal sheet are arranged in the embedding groove, a notch for mounting the semiconductor refrigerating sheet is formed in the center of the embedding groove, and the semiconductor refrigerating sheet is fixedly mounted in the notch; the heat dissipation aluminum piece is provided with the heat dissipation fan and is arranged on the back surface of the upper semiconductor refrigeration piece.
5. The clip-on heat sink for cellular phone as claimed in claim 1, wherein:
go up arm lock and last arm lock and be "7" type structure and parallel set up in to put oppositely the upper and lower terminal surface of preceding shell, preceding shell back is equipped with two respectively and goes up arm lock and last arm lock sliding fit's slip logical groove, goes up the link of arm lock and last arm lock and installs respectively in corresponding the slip logical inslot and can follow the slip logical groove and slide from top to bottom.
6. The clip-on heat sink for cellular phone as claimed in claim 1, wherein: elastic pieces are respectively connected between the upper clamping arm or the upper clamping arm and the front shell, each elastic piece is a return spring, one end of each return spring is connected to the inner side surface of the front shell, and the other end of each return spring is connected to the end surface of the connecting end of the upper clamping arm or the lower clamping arm; when the upper clamping arm slides upwards or the lower clamping arm moves downwards, the upper clamping arm can reset through the corresponding elastic piece.
7. The clip-on heat sink for cellular phone as claimed in claim 1, wherein: the upper end face and the lower end face of the rear shell are provided with openings through which the upper clamping arm and the lower clamping arm can penetrate, and the free ends of the upper clamping arm and the lower clamping arm extend out of the accommodating cavity through the openings.
8. The clip-on heat sink for cellular phone as claimed in claim 1, wherein: and heat dissipation windows are arranged on the back surface and the side end surface of the rear shell.
9. The clip-on heat sink for cellular phone as claimed in claim 1, wherein: the circuit board is provided with a power interface, and the power interface is mounted on the lower end face of the rear shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020917232.4U CN211959300U (en) | 2020-05-27 | 2020-05-27 | Back clamp type radiator for mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020917232.4U CN211959300U (en) | 2020-05-27 | 2020-05-27 | Back clamp type radiator for mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211959300U true CN211959300U (en) | 2020-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020917232.4U Active CN211959300U (en) | 2020-05-27 | 2020-05-27 | Back clamp type radiator for mobile phone |
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| Country | Link |
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| CN (1) | CN211959300U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI746352B (en) * | 2021-01-15 | 2021-11-11 | 華碩電腦股份有限公司 | Electronic system |
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2020
- 2020-05-27 CN CN202020917232.4U patent/CN211959300U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI746352B (en) * | 2021-01-15 | 2021-11-11 | 華碩電腦股份有限公司 | Electronic system |
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