CN111902025A - Heat dissipation back splint and electronic equipment subassembly - Google Patents
Heat dissipation back splint and electronic equipment subassembly Download PDFInfo
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- CN111902025A CN111902025A CN202010769637.2A CN202010769637A CN111902025A CN 111902025 A CN111902025 A CN 111902025A CN 202010769637 A CN202010769637 A CN 202010769637A CN 111902025 A CN111902025 A CN 111902025A
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- Prior art keywords
- heat dissipation
- heat
- movable
- assembly
- clip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses heat dissipation back splint and electronic equipment subassembly belongs to electronic equipment heat dissipation technical field. The heat dissipation back splint comprises a back splint shell, heat dissipation fins and a movable heat dissipation assembly; the back splint shell and the radiating fins enclose an accommodating groove, the radiating fins are connected with the electronic equipment under the condition that the electronic equipment is assembled in the accommodating groove, one side of the back splint shell, which is far away from the accommodating groove, is provided with an installing groove, the movable radiating assembly is movably arranged in the installing groove, and the movable radiating assembly is connected with the radiating fins; the movable heat dissipation assembly is provided with a first position and a second position, and under the condition that the movable heat dissipation assembly is located at the first position, at least part of the movable heat dissipation assembly retracts into the mounting groove; and under the condition that the movable heat dissipation assembly is at the second position, part of the movable heat dissipation assembly extends out of the back clamp shell. The scheme can solve the problem of poor heat dissipation performance of the electronic equipment.
Description
Technical Field
The application belongs to the technical field of electronic equipment heat dissipation, and particularly relates to a heat dissipation back splint and an electronic equipment assembly
Background
With the rapid development of electronic devices, the functions of electronic devices not only have basic functions of calling and sending short messages, but also have other functions of games, photographing, videos and the like. With the increasingly higher configuration and stronger performance of electronic equipment, various electronic components generate more and more heat during operation, and influence on the electronic equipment is more and more serious, so that heat dissipation of the electronic equipment becomes more and more important.
In order to better dissipate heat of electronic equipment, a heat dissipation back clip is usually installed on the electronic equipment at present, and the heat dissipation back clip can assist the electronic equipment in dissipating heat, so that the heat dissipation performance of the electronic equipment can be improved.
In the process of implementing the creation of the present invention, the inventor finds that in the related art, when the electronic device runs a large-scale game or software, the electronic device has a large heat value, so that it is difficult for the heat dissipation back clip to dissipate the heat of the electronic device in time, and further, the heat is accumulated on the electronic device and the heat dissipation back clip, so that the heat dissipation performance of the electronic device is poor.
Disclosure of Invention
The embodiment of the application aims to provide a heat dissipation back splint and an electronic equipment assembly, and the problem that the heat dissipation performance of electronic equipment is poor can be solved.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a heat dissipation back clip which is applied to electronic equipment and comprises a back clip shell, heat dissipation fins and a movable heat dissipation assembly;
the back splint shell and the radiating fins are enclosed into an accommodating groove, the radiating fins are connected with the electronic equipment under the condition that the electronic equipment is assembled in the accommodating groove, one side of the back splint shell, which is far away from the accommodating groove, is provided with an installing groove, the movable radiating assembly is movably arranged in the installing groove, and the movable radiating assembly is connected with the radiating fins;
the movable heat dissipation assembly is provided with a first position and a second position, and under the condition that the movable heat dissipation assembly is located at the first position, at least part of the movable heat dissipation assembly retracts into the mounting groove; and under the condition that the movable heat dissipation assembly is in the second position, part of the movable heat dissipation assembly extends out of the back clamp shell.
The embodiment of the application provides an electronic equipment assembly, which comprises the heat dissipation back clip.
In the embodiment of the application, when the heat productivity of the electronic equipment is lower, the movable heat dissipation assembly is located at the first position, at least part of the movable heat dissipation assembly retracts into the mounting groove, and the heat of the electronic equipment is transferred to the movable heat dissipation assembly through the heat dissipation sheet and then dissipated through the movable heat dissipation assembly; when the heat productivity of the electronic equipment is higher, the movable heat dissipation assembly is located at the second position, at the moment, the part of the movable heat dissipation assembly extends out of the back splint shell, the part of the heat dissipation sheet is exposed in the environment, at the moment, part of heat of the electronic equipment is transferred to the movable heat dissipation assembly through the heat dissipation sheet and then dissipated out of the movable heat dissipation assembly, and the other part of heat directly contacts with air through the exposed part of the heat dissipation sheet to exchange heat.
Drawings
Fig. 1 and fig. 2 are schematic structural diagrams of a movable heat dissipation assembly of a first electronic device assembly in a first position according to an embodiment of the present application;
fig. 3 and 4 are schematic structural diagrams illustrating a movable heat dissipation assembly of a first electronic device assembly in a second position according to an embodiment of the present application;
FIG. 5 is an exploded view of a first electronic device assembly disclosed in an embodiment of the present application;
fig. 6 and 7 are schematic structural diagrams illustrating a movable heat dissipation assembly of a second electronic device assembly in a first position according to an embodiment of the present application;
fig. 8 and 9 are schematic structural diagrams illustrating a movable heat dissipation assembly of a second electronic device assembly in a second position according to an embodiment of the present application;
FIG. 10 is an exploded view of a second electronic device assembly disclosed in an embodiment of the present application;
fig. 11 is a cross-sectional view of an electronic device package as disclosed in an embodiment of the present application.
Description of reference numerals:
100-electronic equipment,
210-back splint shell, 211-accommodating groove, 212-installing groove, 220-radiating fin, 230-movable radiating component, 231-shell part, 2311-exhaust port, 232-first heat conducting fin, 233-first gas driving device, 240-second heat conducting fin, 250-second gas driving device, 260-third gas driving device, 270-supporting plate, 280-driving mechanism, 281-driving source and 282-rack.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The heat dissipation back clip provided by the embodiment of the present application is described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Referring to fig. 1 to 11, an embodiment of the present application discloses a heat dissipation back clip, which is applied to an electronic device 100, and the heat dissipation back clip is used for auxiliary heat dissipation of the electronic device 100, so as to improve a heat dissipation effect of the electronic device 100. The disclosed heat-dissipating back clip includes a back clip housing 210, heat sink fins 220, and a movable heat sink assembly 230.
The back clip housing 210 provides a mounting base for other components of the heat dissipation back clip, and the back clip housing 210 and the heat dissipation fins 220 enclose a receiving groove 211. In a state where the electronic device 100 is mounted in the receiving groove 211, the heat sink 220 is connected to the electronic device 100, specifically, the heat sink 220 is thermally connected to the electronic device, where the thermal connection means that there is heat transfer between two connected components, and at this time, the heat of the electronic device 100 is transferred to the heat sink 220.
One side of the back clip housing 210 departing from the receiving groove 211 is provided with a mounting groove 212, the movable heat dissipation assembly 230 is movably disposed in the mounting groove 212, the movable heat dissipation assembly 230 is connected to the heat sink 220, and specifically, the movable heat dissipation assembly 230 is connected to the heat sink 220 in a heat conducting manner. In a specific heat dissipation process, heat generated by the electronic device 100 is transferred to the heat sink 220, and the heat on the heat sink 220 exchanges heat with air in the environment through the movable heat dissipation assembly 230, so as to achieve the purpose of auxiliary heat dissipation of the electronic device 100. Alternatively, the heat sink 220 may be made of a material with good thermal conductivity, such as copper material, aluminum material, etc.
The movable heat sink assembly 230 has a first position and a second position, with the movable heat sink assembly 230 in the first position, at least a portion of the movable heat sink assembly 230 is retracted into the mounting slot 212; with the movable heat sink assembly 230 in the second position, a portion of the movable heat sink assembly 230 protrudes out of the back clip housing 210. During the movement of the movable heat dissipation assembly 230 between the first position and the second position, the movable heat dissipation assembly 230 may rotate relative to the back-clip housing 210, or the movable heat dissipation assembly 230 may move relative to the back-clip housing 210, or the movable heat dissipation assembly 230 may be in a combination of rotation and movement, and the specific movement manner of the movable heat dissipation assembly 230 is not limited herein.
It should be noted that, in the case that the portion of the movable heat dissipation assembly 230 extends out of the back-clip housing 210, the heat on the heat sink 220 can still be transferred to the movable heat dissipation assembly 230. The heat conduction area between the movable heat sink 230 and the heat sink 220 affects the heat transfer, so that when the portion of the movable heat sink 230 extends out of the back-clip housing 210, the heat of the heat sink 220 can be efficiently transferred to the movable heat sink 230.
In a specific operation process, when the heat value of the electronic device 100 is low, the movable heat dissipation assembly 230 is in the first state, at this time, at least a portion of the movable heat dissipation assembly 230 is retracted into the mounting groove 212, and the heat of the electronic device 100 is transferred to the movable heat dissipation assembly 230 through the heat dissipation sheet 220 and then dissipated through the movable heat dissipation assembly 230; when the heat value of the electronic device 100 is high, the movable heat dissipation assembly 230 is located at the second position, at this time, a portion of the movable heat dissipation assembly 230 extends out of the back-clip housing 210, a portion of the heat dissipation plate 220 is exposed in the environment, a portion of the heat of the electronic device 100 is transferred to the movable heat dissipation assembly 230 through the heat dissipation plate 220, and then is dissipated by the movable heat dissipation assembly 230, and another portion of the heat is directly contacted with the air through the exposed portion of the heat dissipation plate 220 to exchange heat.
In the embodiment of the present application, when the heat productivity of the electronic device 100 is higher, the movable heat dissipation assembly 230 can be extended out of the back clip housing 210, so as to increase the heat dissipation area of the heat dissipation back clip, and make the heat dissipation performance of the heat dissipation back clip higher.
While a specific configuration of the active heat sink assembly 230 is disclosed herein, other configurations may be used and are not limited thereto. Specifically, the movable heat dissipation assembly 230 may include a housing portion 231, a first heat conductive sheet 232, and a first gas driving device 233. The housing 231 provides a mounting base for other components of the movable heat dissipation assembly 230, the first heat conduction plate 232 is connected to the heat dissipation plate 220 in a heat conduction manner, and heat on the heat dissipation plate 220 can be transferred to the first heat conduction plate 232. First conducting strip 232 and first gas drive device 233 all can set up in casing portion 231, and first conducting strip 232 and casing portion 231 can enclose into first wind-guiding space, and first conducting strip 232 and first gas drive device 233 can set up relatively, and the gas vent 2311 can be seted up to the lateral wall of casing portion 231, and gas vent 2311 and first wind-guiding space can be linked together, and first wind-guiding space is linked together through gas vent 2311 and external environment.
In a specific operation process, heat of the heat dissipation plate 220 is transferred to the first heat conduction plate 232, the temperature of the first heat conduction plate 232 is increased, so that the temperature of air in the first air guiding space is increased, and the first air driving device 233 can drive cold air in an external environment and hot air in the first air guiding space to realize convection.
In this scheme, convection current can be realized with the outside cold air of casing portion 231 to the hot-air in casing portion 231 to first gas drive device 233 to realize the high-efficient heat transfer of heat dissipation back splint, and then make the heat on the heat dissipation back splint in time effluvium, the heat is difficult to the gathering on the heat dissipation back splint, has further improved the heat dispersion of heat dissipation back splint.
Alternatively, the first gas driving device 233 may comprise at least one of a fan, an air pump and an air bag, since the air pump and the air bag mainly consist of a cylinder and a push rod, the cylinder is fixedly connected with the back splint housing 210, and the push rod moves relative to the cylinder to drive the air movement. However, in this structure, the back splint housing 210 needs to reserve enough space for the push rod to move, and therefore occupies a large space inside the back splint housing 210, and for this reason, in an alternative embodiment, the first air driving device 233 may be a fan, and in this scheme, the fan can drive air to move by the rotation of the fan blades. The fan is small in size, so that the fan occupies a small space in the back-clip housing 210.
In addition, the inflator and the air bag need the push rod to move in a reversing mode, when the push rod is reversed, air does not receive driving force, air backflow is easily caused, and therefore the heat dissipation efficiency of the heat dissipation back clamp is low.
Alternatively, the first heat conducting sheet 232 may be a copper sheet, and of course, may also be another metal heat conducting sheet, which is not limited herein.
In order to improve the heat dissipation performance of the heat dissipation back clip, in another alternative embodiment, a second air guiding space may be disposed on a side of the back clip housing 210 away from the receiving groove 211, the second air guiding space and the receiving groove 211 are respectively located on two sides of the heat dissipation plate 220, and when the movable heat dissipation assembly 230 is located at the first position, the first air guiding space and the second air guiding space may be communicated through the air outlet 2311. In this scheme, the second air guiding space can be communicated with the external environment through the air outlet 2311, and the first air driving device 233 can drive hot air in the second air guiding space and cold air of the external environment to realize convection, so that the heat dissipation performance of the heat dissipation back clip is better.
In an optional embodiment, the heat dissipation back clip disclosed herein may further include a second heat conducting strip 240, the heat dissipation plate 220 is connected to the first heat conducting strip 232 through the second heat conducting strip 240, the heat dissipation plate 220 transfers heat to the first heat conducting strip 232 through the second heat conducting strip 240, and a heat conductivity coefficient of the second heat conducting strip 240 may be greater than a heat conductivity coefficient of the heat dissipation plate 220, at this time, the heat of the heat dissipation plate 220 can be quickly transferred to the second heat conducting strip 240, so that the heat of the heat dissipation plate 220 is dissipated, and thus the heat dissipation performance of the heat dissipation back clip is better. Alternatively, the second heat conducting sheet 240 may be a copper sheet, and of course, may also be another metal heat conducting sheet, which is not limited herein.
Further, the first heat-conducting sheet 232 may be provided with a first sliding portion, and the second heat-conducting sheet 240 may be provided with a second sliding portion, and the first sliding portion and the second sliding portion may be slidably connected. At this time, the movable heat sink assembly 230 can slide relative to the back-clip housing 210, so that the movable heat sink assembly 230 can be extended or retracted conveniently.
Optionally, the first sliding portion may be a sliding groove formed in the first heat-conducting strip 232, and the second sliding portion may be a sliding protrusion formed in the second heat-conducting strip 240, where the sliding protrusion is in sliding fit with the sliding groove, so as to enable the movable heat dissipation assembly 230 to slide relative to the back-clip housing 210. Or, the edge of the second heat-conducting strip 240 is provided with a sliding groove, and the edge of the first heat-conducting strip 232 is clamped in the sliding groove, so that the first heat-conducting strip 232 and the second heat-conducting strip 240 slide relative to each other, and the movable heat dissipation assembly 230 slides relative to the back splint housing 210.
When the movable heat sink 230 exceeds the sliding stroke, the movable heat sink 230 is easily separated from the housing 231, and the movable heat sink 230 fails, thereby reducing the heat dissipation performance of the heat dissipation back clip. In an alternative embodiment, the first heat conducting sheet 232 may be provided with a first limiting portion, and the second heat conducting sheet 240 may be provided with a second limiting portion, where the first limiting portion and the second limiting portion are in limiting fit in the extending direction of the movable heat dissipating assembly 230 when the movable heat dissipating assembly 230 is in the second position. In this scheme, the first spacing portion and the second spacing portion can prevent the sliding stroke of the movable heat dissipation assembly 230 from exceeding the sliding range, so that the cooperation of the movable heat dissipation assembly 230 is not easy to fail, and the stability of the structure is improved.
Optionally, the first limiting portion may be a first limiting protrusion, the second limiting portion may be a second limiting protrusion, and when the movable heat dissipation assembly 230 is located at the second position, the first limiting protrusion and the second limiting protrusion are in limiting fit in the extending direction of the movable heat dissipation assembly 230, of course, the first limiting portion and the second limiting portion may also be other structures, which is not limited herein.
In order to improve the heat exchange efficiency of the heat dissipation back clip, in another embodiment, the number of the exhaust ports 2311 may be multiple, and the exhaust ports 2311 are spaced and arranged around the housing portion 231. This scheme has increased the area of gas vent 2311 to can improve the convection velocity of hot-air and cold air, and then improve the heat exchange efficiency of heat dissipation back splint.
In order to further improve the heat dissipation performance of the heat dissipation back clip, in an optional embodiment, the heat dissipation back clip disclosed in the embodiment of the present application further includes a second gas driving device 250 and a third gas driving device 260, both the second gas driving device 250 and the third gas driving device 260 are disposed in the back clip housing 210, and the second gas driving device 250 and the third gas driving device 260 may be respectively located at two sides of the movable heat dissipation assembly 230. In this scheme, the second gas driving device 250 and the third gas driving device 260 can drive the hot air in the back splint housing 210 and the cold air in the external environment to realize convection, so as to realize the auxiliary heat dissipation of the heat dissipation back splint and further improve the heat dissipation performance of the heat dissipation back splint.
Alternatively, the second air moving device 250 and the third air moving device 260 may be in communication with the second air guiding space described above.
As shown in fig. 11, when the movable heat dissipation assembly 230 is at the first position, at least a portion of the air outlet 2311 is communicated with the second air guiding space, and when the movable assembly is at the first position, the first air driving device 233 may draw cold air in an external environment into the housing portion 231, and the cold air takes away hot air in the housing portion 231, and then enters the second air guiding space through the air outlet 2311, and finally is exhausted by the second air driving device 250 and the third air driving device 260, at this time, the first air driving device 233 draws air, and the second air driving device 250 and the third air driving device 260 exhaust air, and a moving path of the first air driving device 233, the second air driving device 250, and the third air driving device 260 drives air to be longer, so that the cold air can exchange heat sufficiently, and the heat dissipation performance of the heat dissipation back clip can be improved.
In the above embodiment, the second gas driving device 250 and the third gas driving device 260 may be evacuated from the external environment, and the first gas driving device 233 may be evacuated from the external environment, and the specific functions of the first gas driving device 233, the second gas driving device 250, and the third gas driving device 260 are not limited herein.
Optionally, the second and third pneumatic drive means 250, 260 may comprise at least one of a fan, a pump and an air bladder. Because of the small size of the fan, the second and third gas-moving devices 250 and 260 may be fans in the present application.
In general, when the electronic apparatus 100 runs a large game, the heat generation amount of the electronic apparatus 100 is high. A user generally holds the electronic device 100 in a horizontal direction during a game, that is, the user generally holds the electronic device 100 along a length direction of the electronic device 100, and therefore, in an alternative embodiment, the mounting slot 212 may penetrate along a width direction of the back clip housing 210, the width direction of the back clip housing 210 is the same as the width direction of the electronic device 100, and the movable heat dissipation assembly 230 may move along the penetrating direction of the mounting slot 212. In this scheme, the movable heat dissipation assembly 230 extends out of the back clip housing 210 or retracts into the back clip housing 210 along the width direction of the electronic device 100, so as not to affect the user to transversely hold the electronic device 100, and meanwhile, after the movable heat dissipation assembly 230 extends out, the movable heat dissipation assembly 230 is far away from the holding position of the user's hands, so that the hot air dissipated by the movable heat dissipation assembly 230 is not easily blown to the user's hands, and the user experience can be improved.
Of course, the movable heat dissipation assembly 230 may move along the thickness direction or the length direction of the heat dissipation back clip, which is not limited herein. Specifically, the thickness direction of the heat dissipation back clip refers to the direction of the notch of the heat dissipation back clip in the receiving groove 211.
In the above embodiment, when the electronic device 100 directly contacts the heat sink 220, the heat sink back clip and the electronic device 100 are easily worn away during the mounting and dismounting processes, and the structural stability of the heat sink 220 is poor. In an alternative embodiment, the heat dissipation back clip may further include a supporting plate 270, the supporting plate 270 is disposed on a side of the heat dissipation plate 220 facing away from the movable heat dissipation assembly 230, and the heat dissipation plate 220 overlaps the supporting plate 270. In a state where the electronic apparatus 100 is fitted in the receiving groove 211, the electronic apparatus 100 is in contact with the supporting plate 270, the supporting plate 270 serves to support the electronic apparatus 100, and heat of the electronic apparatus 100 is transferred to the heat sink 220 via the supporting plate 270. In this scheme, the supporting plate 270 covers the surface of the heat sink 220, so that the electronic device 100 is not in direct contact with the heat sink 220, and the heat sink 220 is not easily worn, thereby improving the structural stability of the heat sink 220.
Alternatively, the supporting plate 270 may be a rigid structure, but there is a difference between the rigid structure and the housing of the electronic device 100, so that the heat dissipation back clip cannot make good contact with the housing of the electronic device 100, and the area of the contact surface between the electronic device 100 and the heat dissipation back clip is smaller, thereby making the heat dissipation area of the electronic device 100 smaller.
In another alternative embodiment, the supporting plate 270 may be an elastic structure member, and the electronic device 100 and the supporting plate 270 may be elastically contacted with each other when the electronic device 100 is assembled in the receiving groove 211. In this scheme, the supporting plate 270 is pressed by the surface of the casing of the electronic device 100, and the supporting plate 270 may deform correspondingly according to the shape of the casing of the electronic device 100, so that the structure of the supporting plate 270 matches the structure of the casing of the electronic device 100, and the contact area between the heat dissipation back clip and the electronic device 100 is large, thereby improving the heat dissipation performance of the electronic device 100.
Optionally, the supporting plate 270 may be made of a material such as heat conductive silicone, heat conductive rubber, or heat conductive foam, and of course, other elastic heat conductive materials may also be used without limitation.
In addition, the supporting plate 270 has elasticity, so the supporting plate 270 is not easy to scratch the shell of the electronic device 100 during the process of disassembling and assembling the electronic device 100.
The process of extending or retracting the movable heat dissipation assembly 230 into or out of the back clip housing 210 can be manually driven by a user, but the manual operation mode has a problem of low precision, and for this reason, in an alternative embodiment, the heat dissipation back clip disclosed in the present application can further include a driving mechanism 280, the driving mechanism 280 can be disposed in the back clip housing 210, and the driving mechanism 280 can drive the movable heat dissipation assembly 230 to move between the first position and the second position. In this embodiment, the driving mechanism 280 can precisely drive the movable heat dissipation assembly 230 to extend out of or retract into the back splint housing 210, and simultaneously, the user can trigger the driving mechanism 280 to move in a wireless control manner, so as to drive the movable heat dissipation assembly 230 to extend out of the back splint housing 210 or retract into the back splint housing 210, thereby facilitating the operation of the heat dissipation back splint.
The driving mechanism 280 can drive the movable heat sink 230 to move in various ways, for example, the driving mechanism 280 can be a servo motor, the servo motor is directly connected to the movable heat sink 230, and the servo motor drives the movable heat sink 230 to rotate relative to the back-clip housing 210. Of course, the type of the motor may also be a stepping motor, a dc brushless motor, etc., and the embodiment of the present invention is not limited thereto.
While a specific configuration of the driving mechanism 280 is provided herein, other configurations may be employed, and are not limited herein. Specifically, the driving mechanism 280 may include a driving motor 281 and a rack 282, the driving motor 281 may be disposed on the back-clip housing 210, the rack 282 is disposed on the movable heat sink 230, an extending direction of the rack 282 may be the same as a moving direction of the movable heat sink 230, the driving motor 281 is in transmission connection with the rack 282, a driving shaft of the driving motor 281 is engaged with the rack 282, and the driving motor 281 drives the rack 282 so that the rack 282 drives the movable heat sink 230 to move. In this scheme, be provided with the profile of tooth that meshes with rack 282 on the drive shaft of driving motor 281, the drive shaft of driving motor 281 meshes with rack 282 mutually, and the meshing transmission has the advantage that transmission efficiency and transmission precision are all higher to meshing driven compact structure can reduce shared space among the transmission process, thereby makes the heat dissipation back splint more frivolous.
Alternatively, the rack 282 may be a straight rack, or a helical rack, or other types of racks 282, and the specific type of rack 282 is not limited herein.
In an alternative embodiment, the heat-dissipating back clip may further comprise a temperature detection device electrically connected to the driving mechanism 280, and the temperature detection device may be used to detect the temperature of the heat-dissipating back clip. The heat dissipation back splint can preset a first temperature threshold value, and the first temperature threshold value can be set according to the heat dissipation performance of the heat dissipation back splint. Under the condition that the temperature of the heat dissipation back clip is less than the first temperature threshold, the movable heat dissipation assembly 230 can be located at the first position, at this time, the two conditions can be divided, when the movable heat dissipation assembly 230 starts to be located at the second position, after the heat dissipation back clip performs heat dissipation, the temperature of the heat dissipation back clip is reduced, further the temperature of the heat dissipation back clip is less than the first temperature threshold, at this time, the driving mechanism 280 receives the retraction signal, and therefore the movable heat dissipation assembly 230 is retracted into the back clip shell 210. In the second case, the movable heat sink 230 is at the first position, and at this time, the temperature of the back-clip housing 210 is low, and the movable heat sink 230 is at the first position, which can meet the heat dissipation requirement of the electronic device 100, and further, the movable heat sink 230 does not need to be extended out.
When the temperature of the heat dissipation back clip is greater than or equal to the first temperature threshold, the driving mechanism 280 drives the movable heat dissipation assembly 230 to move to the second position, and at this time, the movable heat dissipation assembly 230 is located at the first position and cannot meet the heat dissipation requirement of the electronic device 100, so that the movable heat dissipation assembly 230 moves to the second position.
In the scheme, the temperature detection device can monitor the temperature of the heat dissipation back splint and further can adjust the heat dissipation performance of the heat dissipation back splint, so that the safety of the heat dissipation back splint is guaranteed, and the use performance of the heat dissipation back splint is improved. Alternatively, the temperature detection device may be a temperature sensor, and of course, may also be other temperature measurement components.
In a specific operation process, when the temperature detection device detects that the temperature of the heat dissipation back clip is greater than or equal to the first temperature threshold, the electronic device 100 may receive the extension prompt signal, and the user may determine whether the movable heat dissipation assembly 230 extends, and when the user sends the extension signal of the movable heat dissipation assembly 230, the driving mechanism 280 drives the movable heat dissipation assembly 230 to extend out of the housing.
When the temperature detection device detects that the temperature of the heat dissipation back clip is lower than the first temperature threshold, at this time, the temperature of the heat dissipation back clip is lower, so that the heat generation amount of the electronic device 100 is smaller, the electronic device 100 receives the retraction prompt signal, and the user can determine whether the movable heat dissipation assembly 230 is retracted, and when the user sends the retraction signal of the movable heat dissipation assembly 230, the driving mechanism 280 drives the movable heat dissipation assembly 230 to retract into the back clip housing 210.
In order to improve the moving efficiency of the movable heat sink assembly 230 when extending or retracting, in an alternative embodiment, the number of the driving mechanisms 280 may be multiple, and a plurality of the driving mechanisms 280 may be provided at intervals. In this scheme, the movable heat sink 230 receives a larger driving force, so that the driving mechanism 280 has a larger moving speed, and the moving efficiency of the movable heat sink 230 during extension or retraction can be improved. Specifically, the number of the driving mechanisms 280 may be two, and the two driving mechanisms 280 may not only enable the movable heat dissipation assembly 230 to have a larger moving efficiency, but also not easily cause structural redundancy of the heat dissipation back clip. The driving mechanism 280 may be disposed on the same side of the back-clip housing 210, or disposed on both sides of the back-clip housing 210. The number and arrangement positions of the driving mechanisms 280 are not limited herein.
Alternatively, the heat sink 220 may be a thermoelectric cooling plate having a cold end and a hot end, the hot end being in heat-conducting connection with the movable heat dissipation assembly 230, the cold end facing the electronic device 100 in a state where the electronic device 100 is mounted in the receiving groove 211. The cold side is used to absorb heat from the electronic device 100 and the hot side is used to transfer the heat to the movable heat sink assembly 230 or radiate the heat into the air, thereby dissipating the heat from the electronic device 100. In this scheme, cold junction and hot junction formation temperature difference, the cold junction is great with electronic equipment 100's temperature difference for the efficiency of heat transfer, consequently improved the heat dispersion of heat dissipation back splint.
In another alternative embodiment, the notch of the receiving groove 211 may be provided with a clamping portion, and the electronic device 100 may be clamped in the receiving groove 211 by the clamping portion. In this scheme, a part of the clamping portion can cover the edge of the display screen of the electronic device 100, so that the clamping portion can play a clamping role on the electronic device 100, and the electronic device 100 can be prevented from sliding out of the heat dissipation back clamp, and the heat dissipation back clamp and the electronic device 100 are in tight contact.
In addition, the heat dissipation back clip can also protect the electronic device 100, so that the damage probability of the electronic device 100 can be reduced, and the service life of the electronic device 100 can be further prolonged.
The embodiment of the application also discloses an electronic equipment assembly, and the electronic equipment assembly comprises electronic equipment and the heat dissipation back clip in any embodiment.
The electronic device related to the embodiment of the present application may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, and the like, and the embodiment of the present application does not limit a specific kind of the electronic device.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (13)
1. A heat dissipation back clip is applied to electronic equipment and is characterized by comprising a back clip shell (210), heat dissipation fins (220) and a movable heat dissipation component (230);
the back splint shell (210) and the heat radiating fins (220) enclose a containing groove (211), under the condition that the electronic equipment (100) is assembled in the containing groove (211), the heat radiating fins (220) are connected with the electronic equipment (100), one side of the back splint shell (210) departing from the containing groove (211) is provided with a mounting groove (212), the movable heat radiating component (230) is movably arranged in the mounting groove (212), the movable heat radiating component (230) is connected with the heat radiating fins (220), and the movable heat radiating component (230) can move between a first position and a second position;
with the movable heat sink assembly (230) in the first position, at least a portion of the movable heat sink assembly (230) is retracted into the mounting slot (212); when the movable heat dissipation assembly (230) is in the second position, a portion of the movable heat dissipation assembly (230) protrudes out of the back clip housing (210).
2. The heat dissipation back clip of claim 1, wherein the movable heat dissipation assembly (230) comprises a housing portion (231), a first heat conducting fin (232), and a first air driving device (233), the first heat conducting fin (232) is connected to the heat dissipation fin (220), the first heat conducting fin (232) and the first air driving device (233) are both disposed on the housing portion (231), the first heat conducting fin (232) and the housing portion (231) enclose a first air guiding space, the first heat conducting fin (232) is disposed opposite to the first air driving device (233), an air outlet (2311) is opened on a side wall of the housing portion (231), and the air outlet (2311) is communicated with the first air guiding space.
3. The heat dissipation back clip of claim 2, wherein a second air guiding space is provided at a side of the back clip housing (210) facing away from the receiving groove (211), and when the movable heat dissipation assembly (230) is in the first position, the first air guiding space and the second air guiding space are communicated through the air outlet (2311).
4. The heat dissipation back clip of claim 2, further comprising a second heat conductive sheet (240), wherein the heat sink (220) is connected to the first heat conductive sheet (232) through the second heat conductive sheet (240), the first heat conductive sheet (232) is provided with a first sliding portion, the second heat conductive sheet (240) is provided with a second sliding portion, and the first sliding portion is slidably connected to the second sliding portion.
5. The heat dissipation clip as recited in claim 4, wherein the first heat conductive sheet (232) is provided with a first stopper portion, and the second heat conductive sheet (240) is provided with a second stopper portion;
under the condition that the movable heat dissipation assembly (230) is at the second position, the first limiting part and the second limiting part are in limiting fit in the extending direction of the movable heat dissipation assembly (230).
6. The heat dissipating back clip of claim 2, wherein the number of the vents (2311) is plural, and the plurality of vents (2311) are spaced apart and disposed around the housing portion (231).
7. The heat-dissipating back clip of claim 1, further comprising a second gas-driven device (250) and a third gas-driven device (260), wherein the second gas-driven device (250) and the third gas-driven device (260) are both disposed on a side of the back clip housing (210) facing away from the receiving groove (211), and the second gas-driven device (250) and the third gas-driven device (260) are respectively disposed on two sides of the movable heat-dissipating component (230).
8. The heat dissipation clip as recited in claim 1, further comprising a support plate (270), wherein the support plate (270) is disposed on a side of the heat sink (220) facing away from the movable heat dissipation component (230), and wherein the electronic device (100) is in contact with the support plate (270) when the electronic device (100) is assembled in the receiving cavity (211).
9. The heat dissipating back clip of claim 1, further comprising a drive mechanism (280), the drive mechanism (280) disposed within the back clip housing (210), the drive mechanism (280) driving the movable heat dissipating component (230) between the first position and the second position.
10. The heat dissipation back splint according to claim 9, wherein the driving mechanism (280) comprises a driving motor (281) and a rack (282), the driving motor (281) is disposed on the back splint housing (210), the rack (282) is disposed on the movable heat dissipation assembly (230), the rack (282) extends in the same direction as the movable heat dissipation assembly (230), the driving motor (281) is in transmission connection with the rack (282), and the driving motor (281) drives the rack (282) to move the movable heat dissipation assembly (230).
11. The heat-dissipating back clip of claim 9, further comprising a temperature sensing device electrically connected to the drive mechanism (280), the temperature sensing device for sensing a temperature of the heat-dissipating back clip;
the movable heat dissipation assembly (230) is in the first position if the temperature of the heat dissipation back clip is less than a first temperature threshold;
the driving mechanism drives the movable heat dissipation assembly (230) to move to the second position when the temperature of the heat dissipation back clip is greater than or equal to the first temperature threshold.
12. The heat dissipating clip of claim 1, wherein the heat sink (220) is a thermoelectric cooling fin having a cold side and a hot side, the hot side being connected to the movable heat dissipating component (230), the cold side facing the electronic device (100) with the electronic device (100) fitted in the receiving slot (211).
13. An electronic device assembly comprising the electronic device and the heat dissipation clip of any one of claims 1-12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010769637.2A CN111902025B (en) | 2020-08-03 | 2020-08-03 | Heat dissipation back splint and electronic equipment subassembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010769637.2A CN111902025B (en) | 2020-08-03 | 2020-08-03 | Heat dissipation back splint and electronic equipment subassembly |
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| CN111902025B CN111902025B (en) | 2022-10-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113329590A (en) * | 2021-05-07 | 2021-08-31 | 维沃移动通信有限公司 | Electronic device |
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| WO2019112573A1 (en) * | 2017-12-06 | 2019-06-13 | Hewlett-Packard Development Company, L.P. | Electronic devices with movable air flow devices |
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| CN111902025B (en) | 2022-10-18 |
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