CN117249850A - Sensor with active heat dissipation structure - Google Patents
Sensor with active heat dissipation structure Download PDFInfo
- Publication number
- CN117249850A CN117249850A CN202311210830.2A CN202311210830A CN117249850A CN 117249850 A CN117249850 A CN 117249850A CN 202311210830 A CN202311210830 A CN 202311210830A CN 117249850 A CN117249850 A CN 117249850A
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- Prior art keywords
- sensor
- limit baffle
- support
- plate
- shell
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims description 15
- 230000003139 buffering effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 230000004888 barrier function Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/10—Elements for damping the movement of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a sensor with an active heat dissipation structure, which comprises a sensor shell, wherein the opposite surfaces of 2 sensor shells are fixedly connected with supporting side plates, the outer surface of one end of each supporting side plate is provided with a limit baffle, and a sensor body is arranged in a cavity between the sensor shell and the limit baffle. This have initiative heat radiation structure sensor, through the fresh air inlet in the cooling machanism, make this device during operation drive radiator fan through driving motor's output and rotate, make radiator fan draw in this device with external air from the fresh air inlet, because the fresh air inlet inclines towards radiator fan, this device of being convenient for improves the speed of air flow, and the cavity that produces through the support frame when the heat dissipation, be favorable to increasing the area of contact of air and this device inside components and parts, further improve this device radiating effect, reduce this device and exist detection error because of the high temperature, and the holistic life of this device of extension.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a sensor with an active heat dissipation structure.
Background
The sensor is capable of sensing information, converting the sensed information into information in other needed forms according to a certain rule and outputting the information so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like, has the characteristics of microminiaturization, digitization, intellectualization, multifunctionalization, systemization, networking and the like, is a primary link of realizing and automatic control, and has the main function of converting physical quantity into electric signals, the internal components of the sensor work through current, and in a certain working range, a proportional relation exists between the current and the temperature of the sensor, and when the current is too large and the bearing capacity of the sensor components is insufficient, circuit overload is formed, so that the sensor is scalded.
If the sensor can not timely dissipate heat in working, the service life of the sensor is shortened, the accuracy of working is reduced, the existing sensor is as a sensor with good heat dissipation effect disclosed in publication No. CN108811458A, the sensor supplies power to a fan through a storage battery, the fan is favorable for driving air to flow, the heat dissipation efficiency is improved, a buffer area is formed between a clamping groove and a sensor body through a rubber pad, the sensor body can be prevented from being damaged through collision by the cooperation of a guard plate, the sensor surface is exposed in air, hot air between the sensor and the guard plate is difficult to rapidly exhaust through rotation of the fan, the sensor can only protect two sides of the sensor body through the guard plate, and the practicability of the sensor in use is poor due to poor protection performance.
Disclosure of Invention
The invention aims to provide a sensor with an active heat dissipation structure, which is used for solving the problems that the surface of the sensor is exposed in the air, the hot air between the sensor and a guard plate is difficult to rapidly discharge through the rotation of a fan, and the guard plate can only protect two sides of a sensor body.
In order to achieve the above purpose, the present invention provides the following technical solutions: the sensor with the active heat dissipation structure comprises a sensor shell, wherein the opposite surfaces of the 2 sensor shells are fixedly connected with support side plates, a limit baffle is arranged on the outer surface of one end of each support side plate, a sensor body is arranged in a cavity between the sensor shell and the limit baffle, and connecting wires are arranged at two ends of the sensor body;
the buffer mechanism is arranged between the sensor shell and the sensor body and is used for limiting and fixing the sensor body and protecting, buffering and reducing damage to the sensor body;
the buffer mechanism includes:
the support frames are embedded on the opposite surfaces of the 2 limit baffles, the limit clamping plates are fixed on the surfaces of the two end sides of the support frames, the heat conduction clamping plates are arranged between the sensor shell and the sensor body, the support air bags are fixed on the surfaces of the heat conduction clamping plates facing the sensor shell, and the fixing clamping grooves are formed in the surfaces of the two end sides of the heat conduction clamping plates;
the heat dissipation mechanism is arranged on the surface of the upper sensor shell and the surface of the limit baffle and is used for actively dissipating heat of the device to prolong the service life;
the heat dissipation mechanism includes:
and the air inlet holes are uniformly formed in one end side surface of the limit baffle, the driving motor is embedded in the surface of the upper sensor shell, and the cooling fan is fixedly connected to the output end of the driving motor.
Preferably, the upper surface of sensor shell one end is provided with circular recess, and the bottom surface of sensor shell circular recess is provided with the filter screen, support curb plate and limit baffle constitution sliding connection, and be connected with the spring between support curb plate and the limit baffle.
Preferably, the outer surfaces of the two ends of the limiting baffle are fixedly connected with storage plates, and the surfaces of the 2 storage plates on the same side, which are opposite, are embedded with telescopic clamping plates.
Preferably, the storage plate and the sensor housing are arranged vertically, the storage plate and the telescopic clamping plate form sliding connection, a spring is connected between the storage plate and the telescopic clamping plate, and an arc-shaped groove is formed in the surface of the telescopic clamping plate.
Preferably, the cross section of support frame vertical direction is T type design, and the one end surface of support frame is provided with the spacing groove, support frame and limit baffle run through sliding connection, and are connected with the spring between support frame and the limit baffle, limit cardboard one end is the arc design.
Preferably, 2 the surface that the heat conduction splint is faced is laminated mutually with the surface of sensor body, support the gasbag for rectangular form design, and support the gasbag even row at the heat conduction splint surface to support the gasbag and for towards the storage plate setting.
Preferably, the lengths of the heat conduction clamping plate, the sensor body and the supporting air bag are smaller than the length of the sensor shell, the bottom surface of the cavity of the fixing clamping groove is of an inclined design, and the connecting wires and the telescopic clamping plate form clamping connection.
Preferably, the air inlet penetrates through one end, far away from the sensor shell groove, of the limit baffle, and the air inlet is inclined towards the cooling fan.
Compared with the prior art, the invention has the beneficial effects that: the sensor with the active heat dissipation structure comprises:
1. through the air inlet hole in the heat dissipation mechanism, the heat dissipation fan is driven to rotate through the output end of the driving motor when the device works, so that the heat dissipation fan pumps external air into the device from the air inlet hole, the air inlet hole inclines towards the heat dissipation fan, the device is convenient to improve the air flow speed, the contact area between the air and the internal components of the device is increased through the cavity generated by the support frame during heat dissipation, the heat dissipation effect of the device is further improved, the detection error of the device due to overhigh temperature is reduced, and the whole service life of the device is prolonged;
2. through the supporting airbag in the buffer gear, make this device when using, carry out spacingly to the sensor body through the support frame, the support frame promotes spacing cardboard simultaneously and carries out the block to the heat conduction splint, thereby make spacing cardboard promote fixed slot and improve the laminating tightness of heat conduction splint to the sensor body, this device is through the impact force between supporting airbag buffering sensor shell and the sensor body, and when this device works and intensifies, the supporting airbag is heated and expands, make the sensor shell slide through supporting the curb plate, thereby further improve the area of contact of air and sensor body in this device, thereby accelerate the heat dissipation of this device, effectively improve the speed and the effect of this device cooling;
3. through take in board and flexible cardboard, make this device during operation promote flexible cardboard through the inside spring of take in board and slide and be close to for 2 flexible cardboard carry out the centre gripping to connecting wire through the arc opening on surface and fix, improve this device to the barrier propterty of connecting wire, reduce the junction of connecting wire and sensor body and take place by the condition of buckling the damage, and improve this device's barrier propterty through sensor shell and limit baffle, increase this device and reduce the damage to the barrier propterty of sensor body.
Drawings
FIG. 1 is a schematic view of a connecting structure of a storage plate and a retractable clamping plate;
FIG. 2 is a schematic diagram of a three-dimensional structure of a connection between a limit baffle and an air inlet;
FIG. 3 is a schematic view of a connection structure of a heat conducting clamping plate and a supporting air bag;
FIG. 4 is a schematic view of a three-dimensional structure of a connection between a supporting side plate and a limit baffle plate;
FIG. 5 is a schematic view of a three-dimensional connection structure between a limiting clamping plate and a heat conducting clamping plate;
fig. 6 is an enlarged schematic view of the structure of fig. 5 a according to the present invention.
In the figure: 1. a sensor housing; 2. supporting the side plates; 3. a limit baffle; 4. a storage plate; 5. a retractable clamping plate; 7. a sensor body; 8. connecting wires;
buffer gear:
601. a support frame; 602. a limiting clamping plate; 603. a heat conductive clamping plate; 604. supporting the air bag; 605. a fixing slot;
heat dissipation mechanism:
901. an air inlet hole; 902. a driving motor; 903. a heat radiation fan.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the application provides a have initiative heat radiation structure sensor, this have initiative heat radiation structure sensor is connected limit baffle 3 through the support curb plate 2 on 2 sensor housing 1 surfaces, then fix heat conduction splint 603 through support frame 601 and spacing cardboard 602 in buffer gear, make 2 heat conduction splint 603 be close to each other and carry out the centre gripping fixedly to sensor body 7 after, and take in board 4 then promote flexible cardboard 5 to stretch out through inside spring, make flexible cardboard 5 carry out the block through the opening on surface and fix connecting wire 8, drive motor 902 drive radiator fan 903 rotation in the during operation through radiator mechanism simultaneously, thereby make radiator fan 903 accelerate the inside air flow of this device and ventilate the heat dissipation to this device, the efficiency of cooling is accelerated.
The sensor with the active heat dissipation structure will be described in detail below. The following description of the embodiments is not intended to limit the preferred embodiments.
The present application is described in detail below with reference to the attached drawings and detailed description.
Referring to fig. 1-6, a sensor with an active heat dissipation structure according to the present embodiment includes: the surfaces of the sensor shells 1 and 2 sensor shells 1, which are opposite, are fixedly connected with a supporting side plate 2, a limit baffle 3 is arranged on the outer surface of one end of the supporting side plate 2, a sensor body 7 is arranged in a cavity between the sensor shell 1 and the limit baffle 3, and connecting wires 8 are arranged at two ends of the sensor body 7;
the sensor with the active heat dissipation structure mainly comprises a sensor shell 1, a supporting side plate 2, a limit baffle 3, a storage plate 4, a telescopic clamping plate 5, a sensor body 7, a connecting wire 8, a buffer mechanism and a heat dissipation mechanism, wherein the sensor with the active heat dissipation structure provided by the embodiment is characterized in that the limit baffle 3 is installed through the supporting side plate 2 on the surface of the sensor shell 1, the buffer performance in the vertical direction of the sensor is improved through a spring between the supporting side plate 2 and the limit baffle 3, then 2 supporting frames 601 installed on the inner surface of the limit baffle 3 are clamped with heat conducting clamping plates 603 through the limit clamping plates 602 at two ends, the fixing clamping grooves 605 are extruded through the limit clamping plates 602, the fixing clamping grooves 605 drive the 2 heat conducting clamping plates 603 to clamp the sensor body 7, and meanwhile, the supporting air bags 604 on the surface of the heat conducting clamping plates 603 are propped against the inner surface of the sensor shell 1 to support and buffer, further improving the buffering performance, protecting the device through the containing plates 4 at two ends, pushing the telescopic clamping plate 5 to slide close through the springs in the containing plates 4, enabling the telescopic clamping plate 5 to clamp and fix the connecting wires 8 through the arc-shaped openings on the surfaces, preventing the connecting wires 8 from bending and damaging the joint of the sensor body 7, driving the cooling fan 903 to rotate through the driving motor 902 when the device dissipates heat, enabling the cooling fan 903 to suck external air from the air inlet 901, improving the air flow through the air inlet 901 which is obliquely arranged, pushing the hot air in the device to flow along with the air flow, guiding the hot air to the cooling fan 903 under the guiding of the strip-shaped supporting air bags 604, finally discharging the hot air out of the device for dissipating heat, thereby quickening the heat dissipation and cooling efficiency of the device.
In some embodiments, the cushioning mechanism comprises: the embedded support frame 601 of installing at 2 limit baffle 3 opposite surfaces, fix the limit clamping plate 602 at support frame 601 both ends side surface, set up the heat conduction splint 603 between sensor housing 1 and sensor body 7, fix the support gasbag 604 at heat conduction splint 603 towards sensor housing 1 surface, set up the fixed draw-in groove 605 at heat conduction splint 603 both ends side surface, when using this device, support heat conduction splint 603 through support frame 601 and limit clamping plate 602 of 2 limit baffle 3 opposite surfaces, place sensor body 7 between 2 heat conduction splint 603, then promote support frame 601 and limit clamping plate 602 slip along with limit baffle 3 inside spring, make limit clamping plate 602 surface promote fixed draw-in groove 605, make 2 heat conduction splint 603 hug closely at sensor body 7's surface, thereby increase sensor body 7's stability.
In some embodiments, the heat dissipation mechanism comprises: the air inlet 901 is uniformly formed in one end side surface of the limit baffle 3, the driving motor 902 is embedded in the surface of the upper sensor housing 1, the cooling fan 903 is fixedly connected to the output end of the driving motor 902, and the cooling fan 903 is driven to rotate by the driving motor 902 when the device works, so that the cooling fan 903 pumps outside air into the device from the air inlet 901 to cool, and hot air in the rotating part of the cooling fan 903 is discharged along with the cooling fan 903, so that the heat in the device is reduced, the working temperature of the device is reduced, and the heating damage of components of the device is reduced.
In some embodiments, the upper surface of one end of the upper sensor housing 1 is provided with a circular groove, and the bottom surface of the circular groove of the sensor housing 1 is provided with a filter screen, the support side plate 2 and the limit baffle 3 form sliding connection, and a spring is connected between the support side plate 2 and the limit baffle 3, when the cooling fan 903 rotates, external impurities are prevented from entering through the filter screen of the groove of the sensor housing 1, so that the cooling fan 903 discharges hot air in the device to dissipate heat, the stability of the device for a long time is improved, and the influence of high temperature on the detection of the device is reduced.
In some embodiments, the outer surfaces of the two ends of the limit baffle 3 are fixedly connected with the storage plates 4, and the surfaces of the storage plates 4 on the same side 2 are embedded with the telescopic clamping plates 5, when the sensor body 7 needs to be disassembled, the telescopic clamping plates 5 are retracted into the storage plates 4 by sliding, so that the telescopic clamping plates 5 loosen the connecting wires 8, and the sensor body 7 is convenient to disassemble subsequently.
In some embodiments, the storage plate 4 and the sensor housing 1 are vertically arranged, the storage plate 4 and the telescopic clamping plate 5 form sliding connection, a spring is connected between the storage plate 4 and the telescopic clamping plate 5, an arc-shaped groove is formed in the surface of the telescopic clamping plate 5, the telescopic clamping plate 5 is pushed to clamp and fix the connecting wire 8 through the spring inside the storage plate 4 during operation, bending damage of the connecting wire 8 and the joint of the sensor body 7 is reduced, and shielding protection is carried out on the direction of the connecting wire 8 of the device through the storage plate 4 and the telescopic clamping plate 5, so that the protection performance of the device is further improved.
In some embodiments, the cross section of support frame 601 vertical direction is T type design, and the one end surface of support frame 601 is provided with the spacing groove, support frame 601 and limit baffle 3 run through sliding connection, and be connected with the spring between support frame 601 and the limit baffle 3, limit clamp plate 602 one end is arc design, when installing sensor body 7, support frame 601 and limit clamp plate 602 through both sides carry out the centre gripping spacing to heat conduction clamp plate 603, then it is spacing to sensor body 7 centre gripping through heat conduction clamp plate 603, and when this device receives the impact, reduce the impact through limit baffle 3 and sensor housing 1, buffer the impact force through the spring between limit baffle 3 and the support frame 601 simultaneously, increase the stability of this device horizontal direction.
In some embodiments, the opposite surfaces of the 2 heat-conducting clamping plates 603 are attached to the outer surface of the sensor body 7, the supporting air bags 604 are of a strip-shaped design, the supporting air bags 604 are uniformly arranged on the surfaces of the heat-conducting clamping plates 603, the supporting air bags 604 are arranged towards the storage plate 4, after the heat-conducting clamping plates 603 clamp the sensor body 7, the sensor housing 1 is propped against the heat-conducting clamping plates 603, and when impacted, impact force is transmitted to the supporting air bags 604 through the sensor housing 1, so that the supporting air bags 604 absorb the impact force through the elasticity of the supporting air bags 604, and the stability of the device in the vertical direction is improved.
In some embodiments, the lengths of the heat conducting clamping plate 603, the sensor body 7 and the supporting air bag 604 are smaller than the length of the sensor housing 1, the bottom surface of the cavity of the fixing clamping groove 605 is of an inclined design, the connecting wire 8 and the telescopic clamping plate 5 form a clamping connection, and when the device works to generate heat, the supporting air bag 604 is heated and expanded, the supporting air bag 604 supports the sensor housing 1, so that the gap between the sensor housing 1 and the sensor body 7 is increased, the contact area between the air inside the device and the sensor body 7 is increased, the heat dissipation effect of the sensor body 7 is improved, and the air entering the device is guided by the strip-shaped supporting air bag 604 to flow to the heat dissipation fan 903, so that the device is convenient to improve the flow speed of the air, the hot air is accelerated to be discharged from the device, and the device is beneficial to quickly cooling.
In some embodiments, the air inlet 901 penetrates through one end of the limit baffle 3, which is far away from the groove of the sensor housing 1, and the air inlet 901 is designed to be inclined towards the cooling fan 903, when the cooling fan 903 rotates, external air is pumped into the device from the air inlet 901 through the air inlet 901, so that hot air in the device is conveniently pushed and discharged, and meanwhile, the air flowing speed is increased through the inclined design of the air inlet 901, so that the cooling effect of the device is effectively improved, and the practicability of the device is improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A sensor with an active heat sink structure, comprising: sensor housing (1), characterized in that:
the sensor comprises a sensor housing (1), wherein the opposite surfaces of 2 sensor housings (1) are fixedly connected with support side plates (2), a limit baffle (3) is arranged on the outer surface of one end of each support side plate (2), a sensor body (7) is arranged in a cavity between the sensor housing (1) and the limit baffle (3), and connecting wires (8) are arranged at two ends of the sensor body (7);
the buffer mechanism is arranged between the sensor shell (1) and the sensor body (7) and is used for limiting and fixing the sensor body (7) and protecting, buffering and reducing damage to the sensor body (7);
the buffer mechanism includes:
the sensor comprises a support frame (601) which is embedded on the opposite surfaces of 2 limit baffles (3), limit clamping plates (602) which are fixed on the surfaces of two end sides of the support frame (601), a heat conduction clamping plate (603) which is arranged between a sensor shell (1) and a sensor body (7), a support airbag (604) which is fixed on the surface of the heat conduction clamping plate (603) facing the sensor shell (1), and a fixing clamping groove (605) which is arranged on the surfaces of two end sides of the heat conduction clamping plate (603);
the heat dissipation mechanism is arranged on the surface of the upper sensor shell (1) and the surface of the limit baffle (3) and is used for actively dissipating heat of the device to prolong the service life;
the heat dissipation mechanism includes:
and the air inlet holes (901) are uniformly formed in one end side surface of the limit baffle (3), the driving motor (902) is embedded in the surface of the upper sensor shell (1), and the cooling fan (903) is fixedly connected with the output end of the driving motor (902).
2. A sensor with active heat sink structure as defined in claim 1, wherein: the top the upper surface of sensor shell (1) one end is provided with circular recess, and the bottom surface of sensor shell (1) circular recess is provided with the filter screen, support curb plate (2) and limit baffle (3) constitution sliding connection, and be connected with the spring between support curb plate (2) and limit baffle (3).
3. A sensor with active heat sink structure as defined in claim 1, wherein: the outer surfaces of two ends of the limiting baffle (3) are fixedly connected with storage plates (4), and the surfaces of the 2 storage plates (4) on the same side are embedded with telescopic clamping plates (5).
4. A sensor with active heat sink structure according to claim 3, wherein: the collecting plate (4) and the sensor housing (1) are vertically arranged, the collecting plate (4) and the telescopic clamping plate (5) form sliding connection, a spring is connected between the collecting plate (4) and the telescopic clamping plate (5), and an arc-shaped groove is formed in the surface of the telescopic clamping plate (5).
5. A sensor with active heat sink structure as defined in claim 1, wherein: the cross section of support frame (601) vertical direction is T type design, and the one end surface of support frame (601) is provided with the spacing groove, support frame (601) and limit baffle (3) run through sliding connection, and are connected with the spring between support frame (601) and limit baffle (3), limit cardboard (602) one end is the arc design.
6. A sensor with active heat sink structure as defined in claim 1, wherein: the surface that 2 heat conduction splint (603) are in opposite directions is laminated with the surface of sensor body (7), support gasbag (604) are rectangular form design, and support gasbag (604) evenly arrange in heat conduction splint (603) surface to support gasbag (604) are towards take in board (4) setting.
7. A sensor with active heat sink structure as defined in claim 1, wherein: the length of the heat conduction clamping plate (603), the length of the sensor body (7) and the length of the supporting air bag (604) are smaller than those of the sensor shell (1), the bottom surface of the cavity of the fixing clamping groove (605) is of an inclined design, and the connecting wire (8) and the telescopic clamping plate (5) form clamping connection.
8. A sensor with active heat sink structure as defined in claim 1, wherein: the air inlet hole (901) penetrates through one end, far away from the groove of the sensor shell (1), of the limit baffle (3), and the air inlet hole (901) is of an inclined design towards the cooling fan (903).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311210830.2A CN117249850A (en) | 2023-09-20 | 2023-09-20 | Sensor with active heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311210830.2A CN117249850A (en) | 2023-09-20 | 2023-09-20 | Sensor with active heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117249850A true CN117249850A (en) | 2023-12-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311210830.2A Pending CN117249850A (en) | 2023-09-20 | 2023-09-20 | Sensor with active heat dissipation structure |
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| CN (1) | CN117249850A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023046005A1 (en) | 2021-09-22 | 2023-03-30 | 烟台正海磁性材料股份有限公司 | High-remanence neodymium-iron-boron magnet, and preparation method therefor and use thereof |
-
2023
- 2023-09-20 CN CN202311210830.2A patent/CN117249850A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023046005A1 (en) | 2021-09-22 | 2023-03-30 | 烟台正海磁性材料股份有限公司 | High-remanence neodymium-iron-boron magnet, and preparation method therefor and use thereof |
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