CN114245670A - Electronic device - Google Patents

Abstract

The application provides an electronic device, which includes: the heat radiator comprises a heating piece, a first bracket, a first radiator and a first elastic piece; the first support is fastened on one side of the heating part, and the first radiator is arranged on one side of the first support facing the heating part; the first elastic part is arranged between the first support and the first radiator, and the first elastic part is respectively abutted against the first support and the first radiator and provides elastic force to act on one side of the first radiator, which deviates from the heating part, so that the first radiator is abutted against the heating part. Through above-mentioned mode, can improve the contact compactness of first radiator and the piece that generates heat, reduce because of the not enough probability that influences the radiating effect of both contact compactednesses.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

A CPE (Customer Premises Equipment) is a mobile access device that receives digital mobile signals and forwards them as wireless WI-FI signals, and can convert digital mobile signals such as 4G and 5G into WI-FI signals, so that a plurality of mobile terminals in the WI-FI signal range can access a mobile communication network. At present, with the popularization of 5G communication technology, CPE equipment accessing 5G digital mobile signals often faces an over-temperature risk in the operation process. Therefore, the CPE equipment is cooled in an efficient cooling mode, so that the heating device of the CPE equipment can be maintained within a certain working temperature range, and the heat dissipation device has important significance for improving the reliability and the service life of the product.

Disclosure of Invention

An embodiment of the present application provides an electronic device, which includes: the heat radiator comprises a heating piece, a first bracket, a first radiator and a first elastic piece; the first bracket is fastened on one side of the heating part, and the first radiator is arranged on one side of the first bracket facing the heating part; the first elastic piece is arranged between the first support and the first radiator, and the first elastic piece is respectively abutted against the first support and the first radiator and provides elastic force to act on one side of the first radiator, which is deviated from the heating piece, so that the first radiator is abutted against the heating piece.

An embodiment of the present application further provides an electronic device, where the electronic device includes: the heat radiator comprises a heating piece, a first bracket, a first radiator, a first magnetic piece and a second magnetic piece; the first bracket is fastened on one side of the heating part, and the first radiator is arranged on one side of the first bracket facing the heating part; the first magnetic part is arranged on the first bracket, the second magnetic part is arranged on the first radiator, and the first magnetic part and the second magnetic part are oppositely arranged; the first magnetic part and the second magnetic part generate repulsive force to act on one side of the first heat radiator, which is far away from the heat generating part, so that the first heat radiator is abutted to the heat generating part.

The electronic equipment that this application embodiment provided sets up first radiator through the one side that generates heat the piece, and first radiator still with generate heat a looks butt for generate heat the heat that the piece produced at the operation in-process can dispel the heat through first radiator, in order to reduce the probability that generates heat the overtemperature appears at the operation in-process. Simultaneously, through set up first elastic component on the first support that is used for fixed first radiator, and this first elastic component still respectively with first support and first radiator looks butt, and provide the elasticity and act on the one side that deviates from first heat conduction pad at first radiator, make first elastic component can absorb the fit-up gap that first radiator appears in the assembling process because of the size is on the lower limit partially, in order to improve the contact compactness of first radiator and the piece that generates heat, reduce first radiator and the piece that generates heat and influence the probability of radiating effect because of the contact compactness is not enough.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a network system architecture provided in the present application;

FIG. 2 is a schematic diagram of the internal structure of the electronic device 10 of FIG. 1;

FIG. 3 is an exploded schematic view of the internal structure of the electronic device 10 of FIG. 2;

FIG. 4 is a cross-sectional view of the electronic device 10 of FIG. 2 taken along line V-V;

fig. 5 is a schematic structural view of the first bracket 200 in fig. 2;

FIG. 6 is an enlarged view of a portion of FIG. 4 at A;

FIG. 7 is a partial enlarged view at B in FIG. 4;

FIG. 8 is an enlarged view of a portion of FIG. 4 at C;

fig. 9 is a schematic structural view of the first heat sink 300 in fig. 2;

FIG. 10 is another enlarged partial view taken at A in FIG. 4;

FIG. 11 is a further enlarged fragmentary view at A in FIG. 4;

FIG. 12 is a schematic diagram of another internal structure of the electronic device 10 of FIG. 1;

fig. 13 is a schematic cross-sectional view vi-vi of another internal structure of the electronic device 10 of fig. 12.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a network system architecture according to an embodiment of the present disclosure.

The electronic device 10 provided in the embodiment of the present application may be a Customer Premise Equipment (CPE), which is commonly used for indoor/near field communication network switching, and may be a mobile signal access device that receives a mobile signal and forwards a WiFi signal, or a device that converts a high-speed 4G or 5G signal into a WiFi signal. As shown in fig. 1, the electronic device 10 may wirelessly establish a communication connection with a base station 20 to access a core network, so as to implement a network access function, further convert a public network (WAN) of an operator into a home Local Area Network (LAN) of a user, and support a plurality of terminal devices 30, such as a mobile phone, a tablet computer, a notebook computer, and a wearable device, to access the network. Meanwhile, the electronic device 10 may have a digital mobile communication module and a WI-FI communication module. The digital mobile communication module is typically a wireless 4G or 5G digital mobile communication module, which can access communication signals provided by the base station 20 through an antenna. The WI-FI communication module may provide local wireless data access services for the terminal device 30.

Generally, 5G mobile communication has 10-100 times of user rate requirement compared with 4G mobile communication: aiming at an enhanced Mobile BroadBand (eMBB) service, the peak rate index of an International Telecommunications Union (ITU) is 20Gbit/s at the downlink, 10Gbit/s at the uplink (the user experience rate index is 100Mbit/s at the downlink and 50Mbit/s at the uplink), and the time delay index is less than or equal to 4 ms. Meanwhile, the WI-FI technology is synchronously developed to 802.11ax (namely WI-FI 6), 2.4GHz and 5GHz frequency bands are supported, a/b/g/n/ac is compatible downwards, the highest bandwidth is 2.4Gbps, and the highest speed can reach 9.6 Gbps. However, in the case that the transmission rates of the 5G digital mobile communication module and the WI-FI communication module are synchronously increased, the power consumption of the electronic device 10 is also significantly increased, which imposes a severe requirement on the heat dissipation of the electronic device 10. Based on this, the electronic device 10 needs to design a corresponding heat dissipation structure to dissipate heat, so as to reduce the over-temperature risk occurring during the operation of the electronic device 10.

Referring to fig. 2 to 3, fig. 2 is a schematic diagram of an internal structure of the electronic device 10 in fig. 1, and fig. 3 is a schematic diagram of an exploded structure of the internal structure of the electronic device 10 in fig. 2.

As shown in fig. 2 to 3, the electronic device 10 may include: the heat sink includes a heat generating member 100, a first bracket 200, a first heat sink 300, and a first elastic member 400. The heat generating member 100 may be a heat source of the electronic device 10, which may emit a large amount of heat during the operation of the electronic device 10. The first bracket 200 may be fastened to one side of the heat generating member 100, and may be used to mount other components required for the electronic device 10, in addition to fixing the heat generating member 100 and the first heat sink 300. The first heat sink 300 may be disposed on the first bracket 200 and located on a side of the first bracket 200 facing the heat generating member 100, and may be used for conducting heat generated by the heat generating member 100. The first elastic element 400 may be disposed between the first bracket 200 and the first heat sink 300, and the first elastic element 400 may also be abutted against the first bracket 200 and the first heat sink 300 respectively, and provide an elastic force to act on the first heat sink 300, so that the first heat sink 300 is abutted against the heat generating element 100 under the elastic force. So set up, except can utilizing first radiator 300 to generate heat a 100 and dispel the heat, can also utilize first elastic component 400 to absorb the assembly clearance that first radiator 300 appears because of the size is on the lower limit to the side in the assembling process to improve the contact compactness of generating heat a 100 and first radiator 300, reduce and generate heat a 100 and influence the probability of radiating effect because of contact compactness is not enough with first radiator 300.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The heat generating member 100 may be an electronic device required for the electronic apparatus 10 to perform a function, and may generate a large amount of heat during the operation of the electronic apparatus 10, thereby causing the electronic apparatus 10 to have an over-temperature risk. As shown in fig. 2 to 3, the heat generating member 100 may be a circuit board integrated with the digital mobile communication module and the WI-FI communication module as previously described. Of course, besides the digital mobile communication module and the WI-FI communication module, the heat generating element 100 may also be integrated with other functional modules required by the electronic device 10, and the heat generating element 100 may also be integrated with a socket for connecting with an external device, such as a USB socket, a network cable socket, and a power socket, so as to establish a wired connection between the electronic device 10 and the external device. Alternatively, the heat generating component 100 may also be a functional device such as a battery that is independent from the circuit board, and only the heat generating component 100 needs to generate heat during the operation of the electronic device 10, which is not limited in this embodiment.

Referring to fig. 4 to 8, fig. 4 is a schematic cross-sectional view of the internal structure of the electronic device 10 of fig. 2 along v-v, fig. 5 is a schematic structural view of the first bracket 200 of fig. 2, fig. 6 is a partial enlarged view of a point a of fig. 4, fig. 7 is a partial enlarged view of a point B of fig. 4, and fig. 8 is a partial enlarged view of a point C of fig. 4.

The first bracket 200 may be fastened to one side of the heat generating member 100, and may be used to mount other components required for the electronic device 10, in addition to fixing the heat generating member 100 and the first heat sink 300. The material of the first bracket 200 may be hard plastic, so that the first bracket 200 may have a certain structural strength to facilitate fixing of the components required by the electronic device 10, and the overall weight of the electronic device 10 is reduced to improve the portability of the electronic device 10. Optionally, the material of the first bracket 200 may also be not limited to plastic, and the material may also be metal with better thermal conductivity, so that the first bracket 200 can also conduct heat quickly to the heat generated by the heat generating component 100, so as to improve the heat dissipation efficiency of the electronic device 10.

As shown in fig. 4 to 5, the first bracket 200 may include: a main body portion 210, a support portion 220, and a clip portion 230. Wherein, the body portion 210 may be fastened to one side of the heat generating member 100. The supporting portion 220 may be disposed on a side of the main body portion 210 facing the heat generating member 100, and may be used to support the first heat sink 300 so that the first heat sink 300 is abutted against the heat generating member 100. The clamping portion 230 may also be disposed on a side of the main body portion 210 facing the heat generating component 100, and the clamping portion 230 may also be clamped with a side of the first heat sink 300 facing the heat generating component 100, so as to limit a movement stroke of the first heat sink 300 under the action of the elastic force. Meanwhile, in order to simplify the manufacturing process, the main body 210, the supporting portion 220 and the fastening portion 230 may be integrally formed by an injection molding process.

Specifically, the body part 210 may be fastened to one side of the heat generating member 100 by a fixing member 201. As shown in fig. 4 to 5, the fixing member 201 may be a bolt, a screw hole 202 may be provided on a side of the body portion 210 facing the heat generating member 100, and the fixing member 201 may be screwed into the screw hole 202 after passing through the heat generating member 100 to lock the first bracket 200 on the side of the heat generating member 100. The main body 210 may be provided with an accommodating space 203 on a side facing the heat generating member 100, and the accommodating space 203 may be used for mounting the first heat sink 300, so as to reduce the stacking height of the heat generating member 100, the first bracket 200 and the first heat sink 300 and save the internal space of the electronic device 10.

As shown in fig. 5 to 6, the supporting portion 220 may be disposed in the accommodating space 203, and the supporting portion 220 may be disposed opposite to a side of the first heat sink 300 away from the heat generating component 100 and may abut against a side of the first heat sink 300 away from the heat generating component 100. So set up, supporting part 220 can carry out the forward support to first radiator 300 in first radiator 300 is close to the orientation that generates heat 100, is favorable to improving first radiator 300 and the contact compactness that generates heat 100, and then strengthens first radiator 300's heat conduction efficiency. An avoiding groove 221 may be further disposed on one side of the supporting portion 220 facing the first heat sink 300, and the avoiding groove 221 may be used for mounting the first elastic member 400, so as to provide an avoiding space for elastic deformation of the first elastic member 400. Meanwhile, the avoiding groove 221 may further penetrate through the supporting portion 220 and the main body portion 210, so that the avoiding groove 221 may communicate with a side of the main body portion 210 away from the first heat sink 300, and the heat conducted on the first heat sink 300 is rapidly taken away through the avoiding groove 221 by using the air flow formed in the electronic device 10.

Alternatively, the escape groove 221 may be provided on the side of the body portion 210 facing the first heat sink 300, and is not limited to being provided on the support portion 220. In addition, the design of the relief groove 221 may be eliminated, and the first elastic member 400 may be directly disposed between the supporting portion 220 and the first heat sink 300. Alternatively, the first elastic element 400 may be directly disposed between the main body portion 210 and the first heat sink 300, and only the first elastic element 400 needs to apply an elastic force to a side of the first heat sink 300 away from the heat generating element 100, so that the first heat sink 300 can be abutted against the heat generating element 100.

As shown in fig. 4 to 5, the clamping portion 230 may also be disposed in the accommodating space 203, and the clamping portion 230 may be clamped with the first heat sink 300 in a direction close to the heat generating member 100 after the first heat sink 300 is mounted in the accommodating space 203, so as to reduce the probability that the first heat sink 300 is separated from the accommodating space 203. With this arrangement, during the assembly process, the first heat sink 300 can be first assembled into the accommodating space 203 and then fixed by the clamping portion 230, and then the first bracket 200 with the first heat sink 300 can be locked on one side of the heat generating member 100. Compared with the scheme that the first heat sink 300 is firstly fixed on one side of the heat generating part 100, then the first support 200 is fixed on the same side of the heat generating part 100, and the first heat sink 300 is clamped by the first support 200 and the heat generating part 100 together, the method can not only eliminate parts required for fixing the first heat sink 300 and the heat generating part 100 so as to reduce the manufacturing cost of the first heat sink 300, but also is beneficial to simplifying the assembly process of the electronic device 10. Meanwhile, since the clamping portion 230 can be clamped with the first heat sink 300 in a direction close to the heat generating member 100, the clamping portion 230 can also limit the movement stroke of the first heat sink 300 under the action of the elastic force, thereby avoiding the problem that the heat generating member 100 is damaged due to the excessive extrusion of the first heat sink 300 and the heat generating member 100 under the action of the elastic force of the first elastic member 400.

As shown in fig. 5 and 7 to 8, the clip part 230 may include: a first catching portion 231 and a second catching portion 232. The first clamping portion 231 may be located at one end of the first heat sink 300, and the first clamping portion 231 may have elastic deformation capability. The second catching portion 232 may be located at the other opposite end of the first heat sink 300, and a vertical distance between the first catching portion 231 and the heat generating member 100 is smaller than a vertical distance between the second catching portion 232 and the heat generating member 100. Meanwhile, the number of the first catching portions 231 may be two, and one first catching portion 231 may be located at one side of the first heat sink 300 and the other catching portion 231 may be located at the other opposite side of the first heat sink 300. So set up, when first radiator 300 and first support 200 assembled, can put into accommodation space 203 with the one end slant of first radiator 300 earlier for one side of the orientation piece 100 that generates heat of first radiator 300 can with second joint portion 232 looks joint, then press into accommodation space 203 in another looks remote site with first radiator 300, and support the first joint portion 231 of relative both sides, make first joint portion 231 take place elastic deformation. After the first heat sink 300 is assembled in place, the first clamping portion 231 can be restored to the state before deformation and clamped with the other side of the first heat sink 300 facing the heat generating member 100, so that the assembly of the first heat sink 300 and the first bracket 200 is completed, and the whole assembly process is simple and convenient.

Optionally, the clamping portion 230 may also be divided into a first clamping portion 231 and a second clamping portion 232, and the specific arrangement manner and number thereof may be adjusted according to the assembly requirements of the first bracket 200 and the first heat sink 300, only that the clamping portion 230 can be clamped with the first heat sink 300 in the direction close to the heat generating component 100. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.

Referring to fig. 9 in conjunction with fig. 7 to 8, fig. 9 is a schematic structural diagram of the first heat sink 300 in fig. 2.

The first heat sink 300 can be used for conducting the heat generating member 100 to generate heat so as to perform a heat dissipating function. For example, the first heat sink 300 may be made of a material with a high thermal conductivity, such as copper or its alloy, aluminum or its alloy, etc., to improve the heat dissipation efficiency of the first heat sink 300 and reduce the over-temperature risk of the electronic device 10. As shown in fig. 7 to 9, the first heat sink 300 may include: a front plate 310, a rear plate 320, and heat dissipating fins 330. The front plate 310 may be disposed on a side of the main body 210 facing the heat generating member 100, and the front plate 310 may be in contact with the heat generating member 100. The rear plate 320 may be disposed on a side of the front plate 310 facing away from the heat generating component 100, and the rear plate 320 may also be abutted against the supporting portion 220 and the first elastic component 400, respectively. The heat dissipation fins 330 may be disposed between the front plate 310 and the rear plate 320 and connected to the front plate 310 and the rear plate 320, respectively, which may serve to increase the heat dissipation area of the first heat sink 300.

Further, the side of the front plate 310 facing the heat generating component 100 may be further clamped with the first clamping portion 231, and the side of the rear plate 320 facing the front plate 310 may be further clamped with the second clamping portion 232, so as to achieve the fixed assembly of the first bracket 200 and the first heat sink 300. Meanwhile, in order to avoid the first clamping portion 231 from affecting the abutment between the front plate 310 and the heat generating member 100, step surfaces 311 are further formed on two opposite sides of the front plate 310 and are disposed toward the heat generating member 100, and the step surfaces 311 may be disposed at intervals from the heat generating member 100, so as to provide an avoidance space for the first clamping portion 231 to be restored to a state before the first clamping portion 231 is deformed by using a gap between the step surfaces 311 and the heat generating member 100, so that the first clamping portion 231 does not interfere with the heat generating member 100 when being clamped with the step surfaces 311.

It can be understood that, after the first bracket 200 is locked on one side of the heat generating member 100 by the fixing member 201, the size of the space existing between the first bracket 200 and the heat generating member 100 is fixed, and is limited by the processing precision, and it is extremely difficult for the first heat sink 300 to be exactly matched with the space between the first bracket 200 and the heat generating member 100. Therefore, in order to ensure that the first heat sink 300 can be fitted into the space formed between the first bracket 200 and the heat generating member 100, the size of the first heat sink 300 is generally designed to be slightly smaller than the space between the first bracket 200 and the heat generating member 100, i.e., the lower limit of the size of the first heat sink 300. However, when the size of the first heat sink 300 is lower than the lower limit, an assembly gap may occur during the assembly process of the first heat sink 300 with the heat generating member 100 and the first bracket 200, which may cause the first heat sink 300 and the heat generating member 100 to be in loose contact or not in contact at all, and greatly affect the heat conduction efficiency of the first heat sink 300. Based on this, in the embodiment, the first elastic member 400 is disposed between the first bracket 200 and the first heat sink 300, and the first elastic member 400 can also provide elastic force to act on a side of the first heat sink 300 away from the heat generating member 100, so that the first elastic member 400 can absorb an assembly gap occurring in an assembly process, so as to improve the contact tightness between the first heat sink 300 and the heat generating member 100, and avoid the heat conduction efficiency of the first heat sink 300 from being affected by the assembly gap.

As shown in fig. 4 and 6, the first elastic member 400 may be disposed between the first bracket 200 and the first heat sink 300, and the first elastic member 400 may include: a connecting arm 410 and a convex hull 420 disposed on the connecting arm 410. The connection arm 410 may be disposed in the avoiding groove 221, and the connection arm 410 may be connected to a sidewall of the avoiding groove 221, which may be used to be elastically deformed to provide an elastic force to act on the first heat sink 300. The convex hull 420 may be located at an end of the connecting arm 410 away from the side wall of the avoiding groove 221 and be protruded out of the avoiding groove 221, and the convex hull 420 may also be located towards the rear plate 320, which may be used to abut against the rear plate 320. Meanwhile, the connecting arm 410, the convex hull 420 and the supporting portion 220 may also be an integral structure, that is, the connecting arm 410 and the convex hull 420 may also be made of hard plastic, and the connecting arm 410 and the convex hull may be integrally formed with the supporting portion 220 through an injection molding process. Thus, the first bracket 200 and the first elastic member 400 can be manufactured in the same process, which is beneficial to simplifying the production process.

Alternatively, the number of the first elastic members 400 may be plural, such as two, three, four or more, to further improve the contact tightness of the first heat sink 300 and the heat generating member 100. Meanwhile, the plurality of first elastic members 400 may also be uniformly distributed on a side of the rear plate 320 facing away from the front plate 310, so as to ensure the uniformity of the force applied to the rear plate 320. Accordingly, the number of the avoiding grooves 221 may be plural, and the number of the avoiding grooves 221 may be adapted to the number of the first elastic members 400. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

Specifically, when the first heat sink 300 is assembled in the accommodating space 203, the rear plate 320 contacts the convex hulls 420, and the convex hulls 420 drive the connecting arms 410 to displace towards the avoiding grooves 221 under the pushing of the rear plate 320 along with the assembly of the first heat sink 300, so that the connecting arms 410 are elastically deformed, thereby providing elastic force to act on the side of the rear plate 320 away from the front plate 310. At this time, the front plate 310 and the rear plate 320 can be respectively clamped with the first clamping portion 231 and the second clamping portion 232 under the action of elastic force, so as to fix the first heat sink 300 in the accommodating space 203 of the first bracket 200.

Further, when the heat generating member 100 is assembled with the first bracket 200 with the first heat sink 300, the heat generating member 100 contacts with the front plate 310 first, and the front plate 310 is pushed by the heat generating member 100 to drive the connecting arm 410 to displace towards the avoiding groove 221 through the rear plate 320 along with the locking of the heat generating member 100 and the main body portion 210, so that the connecting arm 410 is elastically deformed, thereby providing an elastic force to act on a side of the rear plate 320 departing from the front plate 310. At this time, the front plate 310 may abut against the heat generating member 100 under the action of the elastic force, so as to achieve the purpose of absorbing the assembly gap between the heat generating member 100, the first bracket 200 and the first heat sink 300 by the first elastic member 400, and improve the contact tightness between the first heat sink 300 and the heat generating member 100.

Accordingly, with the abutment of the front plate 310 and the heat generating member 100, the first and second catching portions 231 and 232 may release the catching state with the front plate 310 and the rear plate 320 to fix the first heat sink 300 in the accommodating space 203 using the locking force between the heat generating member 100 and the first bracket 200. At this time, besides the original function of fixing the first heat sink 300, the first engaging portion 231 and the second engaging portion 232 can also be used to limit the movement stroke of the first heat sink 300 under the action of the elastic force, so as to prevent the first heat sink 300 from being excessively abutted against the heat generating member 100 under the action of the elastic force of the first elastic member 400 to cause the heat generating member 100 to be damaged under some extreme conditions.

Referring to fig. 10 to 11, fig. 10 is another partial enlarged view of a point a in fig. 4, and fig. 11 is another partial enlarged view of a point a in fig. 4.

Alternatively, the first elastic member 400 may be a structural member independent from the support portion 220, in addition to the connection arm 410 and the convex hull 420 which are integrally constructed with the support portion 220. As shown in fig. 10, the first elastic member 400 may also be a spring, and the first elastic member 400 may be disposed in the escape groove 221, and one end thereof may be connected to the bottom wall of the escape groove 221, and the other opposite end thereof may be connected to a side of the rear plate 320 facing away from the front plate 310. In this way, the first elastic member 400 can still be elastically deformed to provide an elastic force to act on the rear plate 320, so that the front plate 310 can be abutted against the heat generating member 100. In order to facilitate the installation of the first elastic member 400, the avoiding groove 221 may not penetrate through the main body 210 and the supporting portion 220, and is not communicated with a side of the main body 210 away from the heat generating member 100. Alternatively, the avoiding groove 221 may only penetrate through a part of the main body 210 and the supporting portion 220, so that a part of the supporting portion 220 is left in the avoiding groove 221 to support the first elastic member 400 while communicating the side of the main body 210 away from the heat generating member 100. Of course, the first elastic member 400 may be directly disposed between the supporting portion 220 and the rear plate 320, and is not limited to be disposed in the escape groove 221.

Alternatively, the first elastic element 400 may be a spring, or may be a structural element with elasticity, such as a spring sheet, a silicone pad, and a rubber pad, so as to still provide elastic force to act on the first heat sink 300. For example, the first elastic member 400 may be a silicone pad, which may be formed by injecting a silicone material into the avoiding groove 221, and the first elastic member 400 may further protrude out of the avoiding groove 221 and cover a side of the supporting portion 220 facing the rear plate 320, so that the first elastic member 400 contacts the rear plate 320 and provides an elastic force to a side of the rear plate 320 facing away from the front plate 310.

Alternatively, instead of absorbing the fitting gap with elastic force, repulsive force may be used to absorb the fitting gap. As shown in fig. 11, the electronic device 10 may be further provided with a first magnetic member 400a and a second magnetic member 400 b. The first magnetic member 400a may be disposed on the supporting portion 220, and the first magnetic member 400a may be located in the avoiding groove 221. The second magnetic member 400b may be disposed on the back plate 320 and opposite to the first magnetic member 400a, and the first magnetic member 400a and the second magnetic member 400b have opposite magnetic properties. Thus, the first magnetic member 400a and the second magnetic member 400b can generate a repulsive force to act on the rear plate 320, so that the front plate 310 abuts against the heat generating member 100, thereby achieving the purpose of absorbing the assembly gap by the repulsive force and improving the contact tightness between the front plate 310 and the heat generating member 100. Alternatively, the first magnetic member 400a may be disposed on the main body 210 without being limited to only the supporting portion 220, and only the first magnetic member 400a may be disposed opposite to the second magnetic member 400 b.

Because the material of first radiator 300 is metal, in order to avoid first radiator 300 in with generate heat the butt in-process of piece 100, take place to scrape with generating heat piece 100 and lead to generating heat piece 100 and damage, electronic equipment 10 can also be provided with first thermal pad 500. As shown in fig. 4, the first thermal pad 500 may be disposed between the front plate 310 and the heat generating member 100, and the first thermal pad 500 may also elastically abut against the front plate 310 and the heat generating member 100, respectively. Wherein, first thermal pad 500 can have elastic deformation ability to play the cushioning effect between front bezel 310 and the piece 100 that generates heat, avoid generating heat that piece 100 and front bezel 310 take place to scratch and lead to generating heat piece 100 to damage. Meanwhile, in addition to the buffering function, the first thermal pad 500 may be compressed by a certain amount under the abutting of the front plate 310 and the heat generating member 100 to generate an elastic force acting on the front plate 310 and the heat generating member 100, so as to improve the contact tightness between the first thermal pad 500 and the front plate 310 and the heat generating member 100. That is, the first thermal pad 500 may also function to absorb the mounting gap.

So set up, in the assembling process, can be attached first thermal pad 500 on generating heat piece 100 earlier, then locking the first support 200 that will have first radiator 300 in the one side that generates heat piece 100 to utilize the locking force centre gripping first radiator 300 and first thermal pad 500 between piece 100 and the first support 200 that generates heat, make first thermal pad 500 can generate heat piece 100 and first radiator 300 elasticity butt respectively, thereby when utilizing first thermal pad 500 to play the cushioning effect, utilize first thermal pad 500 to absorb the fit-up gap. Accordingly, the first elastic member 400 can compensate for a portion of the compression of the first thermal pad 500 lost due to the absorption of the assembly gap, so as to ensure the compression of the first thermal pad 500, improve the contact tightness between the first thermal pad 500 and the front plate 310 and the heat generating member 100, and reduce the probability that the heat dissipation effect is affected by the insufficient contact tightness between the first thermal pad 500 and the front plate 310 and the heat generating member 100.

Alternatively, the design of the first thermal pad 500 may be eliminated. Meanwhile, in order to further improve the heat conduction efficiency, a heat conduction silicone grease may be filled between the front plate 310 and the heat generating member 100, so as to quickly conduct the heat generated by the heat generating member 100 to the first heat sink 300 for heat dissipation.

Referring to fig. 12, fig. 12 is a schematic view of another internal structure of the electronic device 10 in fig. 1, and fig. 13 is a schematic view of a cross-sectional structure of the electronic device 10 in fig. 12 along vi-vi.

As shown in fig. 12 to 13, in order to further improve the heat conduction efficiency and reduce the operating temperature of the heat generating member 100 during operation, the electronic device 10 may further include: a second bracket 600, a second heat sink 700, a second elastic member 800, and a second thermal pad 900. Wherein, the second bracket 600 may be fastened to the other opposite side of the heat generating member 100, and the second heat sink 700 may be disposed at a side of the second bracket 600 facing the heat generating member 100. The second elastic member 800 may be disposed between the second bracket 600 and the second heat sink 700, and the second elastic member 800 is further abutted against the second bracket 600 and the second heat sink 700, respectively, to provide an elastic force to act on a side of the second heat sink 700 away from the heat generating member 100. The second thermal pad 900 may be disposed between the heat generating member 100 and the second heat sink 700, and elastically abut against the heat generating member 100 and the second heat sink 700, respectively. Thus, the first heat sink 300 and the second heat sink 700 sandwich the heat generating member 100, and conduct heat to the heat generating member 100 from two opposite sides of the heat generating member 100, so as to improve the heat dissipation efficiency of the heat generating member 100. It is understood that the structures and the assembling manners of the second bracket 600, the second heat sink 700, the second elastic member 800 and the second thermal pad 900 may be the same as or similar to the structures and the assembling manners of the first bracket 200, the first heat sink 300, the first elastic member 400 and the first thermal pad 500, and thus, the description of this embodiment is omitted.

Further, in order to reduce the assembly process, the first and second holders 200 and 600 may be assembled with the heat generating member 100 in the same process. For example, the first and second brackets 200 and 600 may be simultaneously locked to opposite sides of the heat generating member 100 by the fixing member 201. The fixing member 201 may be inserted into the second bracket 600 and the heat generating member 100, and may be screwed into the screw hole 202 of the first bracket 200 after being inserted into the second bracket 600 and the heat generating member 100, so as to lock the first bracket 200 and the second bracket 600 at two opposite sides of the heat generating member 100.

In order to improve the appearance refinement of the electronic apparatus 10, the electronic apparatus 10 may be further provided with a housing 100 a. As shown in fig. 1, the housing 100a may be used to define an external appearance of the electronic device 10, and the housing 100a may be further formed with an accommodating chamber. The receiving cavity may be used to receive other functional devices required by the electronic device 10, such as a battery, a heat dissipation fan, a touch pad, and the like, besides the first bracket 200, the first heat sink 300, the first elastic member 400, the first thermal pad 500, the second bracket 600, the second heat sink 700, the second elastic member 800, and the second thermal pad 900. Meanwhile, the casing 100a may further be provided with function keys such as a power key, a WPS key, a switching key, and the like, may also be provided with sockets such as a USB socket, a network cable socket, a power socket, and the like, and may also be provided with various types of indicator lights. It should be noted that: the function keys can also be combined with various different control functions, namely, one key with multiple functions is realized; the patch socket may be designed according to actual use requirements, and is not limited herein. In addition, since the electronic device 10 can convert signals such as 5G into WiFi signals, a corresponding socket may be further provided on the electronic device 10, so that a user can insert a SIM card, a Nano-SIM card, a Micro-SIM card, or other types of user identification cards into the electronic device 10 directly or by means of a corresponding card holder through the socket.

The electronic device 10 provided by the embodiment of the application is provided with the first heat sink 300 on one side of the heat generating member 100, and the first heat sink 300 is further abutted to the heat generating member 100, so that heat generated by the heat generating member 100 in the operation process can be dissipated through the first heat sink 300, and the probability of over-temperature of the heat generating member 100 in the operation process is reduced. Meanwhile, the first elastic member 400 is arranged on the first support 200 for fixing the first heat sink 300, and the first elastic member 400 is also respectively abutted to the first support 200 and the first heat sink 300 and provides elastic force to act on one side of the first heat sink 300 departing from the first heat conducting pad 500, so that the first elastic member 400 can absorb an assembly gap of the first heat sink 300 in the assembly process due to the lower limit of the size, the contact tightness of the first heat sink 300 and the heat generating member 100 is improved, and the probability that the heat dissipation effect is influenced by the insufficient contact tightness of the first heat sink 300 and the heat generating member 100 is reduced.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (13)

1. An electronic device, characterized in that the electronic device comprises: the heat radiator comprises a heating piece, a first bracket, a first radiator and a first elastic piece;

the first bracket is fastened on one side of the heating part, and the first radiator is arranged on one side of the first bracket facing the heating part; the first elastic piece is arranged between the first support and the first radiator, and the first elastic piece is respectively abutted against the first support and the first radiator and provides elastic force to act on one side of the first radiator, which is deviated from the heating piece, so that the first radiator is abutted against the heating piece.

2. The electronic device of claim 1, further comprising: a first thermally conductive pad;

the first heat conducting pad is arranged between the heating part and the first radiator, and the first heat conducting pad is respectively elastically abutted against the heating part and the first radiator.

3. The electronic device according to claim 2, wherein a side of the first bracket facing the first heat sink is provided with a support portion configured to abut against a side of the first heat sink facing away from the first thermal pad after the first bracket is fastened to the side of the heat generating member.

4. The electronic device according to claim 3, wherein an avoiding groove for mounting the first elastic member is provided on a side of the supporting portion facing the first heat sink, and the avoiding groove is configured to provide an avoiding space required for elastic deformation of the first elastic member.

5. The electronic device of claim 4, wherein the first elastic member comprises: the connecting arm and the convex hull are arranged on the connecting arm;

the connecting arm is arranged in the avoiding groove and is connected with the side wall of the avoiding groove; the convex hull is arranged outside the avoidance groove and is abutted against one side of the first radiator, which is far away from the heating part; wherein, the linking arm is configured as after the convex closure with first radiator butt the evading inslot displacement and produce elastic deformation to provide elasticity and act on first radiator deviates from the one side of generating heat the piece.

6. The electronic device of claim 5, wherein the avoidance slot further communicates with a side of the first bracket facing away from the first heat sink.

7. The electronic device of claim 3, wherein a clamping portion is further disposed on a side of the first bracket facing the first heat sink, and the clamping portion is configured to be clamped with the first heat sink in a direction in which the first heat sink is close to the heat generating member, so as to limit a movement stroke of the first heat sink under the action of an elastic force.

8. The electronic device of claim 7, wherein the first heat sink comprises: the heat dissipation plate comprises a front plate, a rear plate and heat dissipation fins;

the front plate is arranged on one side of the first support facing the heating part and is abutted against the heating part; the rear plate is arranged on one side of the front plate, which is away from the heating part, and is abutted against the first elastic part and the supporting part; the heat dissipation fins are arranged between the front plate and the rear plate and are respectively connected with the front plate and the rear plate.

9. The electronic device of claim 8, wherein the card portion comprises: a first clamping part and a second clamping part;

the first clamping part is clamped with one side of the front plate facing the heating part; the second clamping portion is clamped with the rear plate towards one side of the front plate.

10. The electronic device according to claim 7, wherein a side of the first bracket facing the heat generating member is further provided with an accommodating space for mounting the first heat sink; the supporting part with joint portion all set up in the accommodation space.

11. The electronic device of claim 2, further comprising: the second bracket, the second radiator, the second elastic piece and the second heat conducting pad;

the second bracket is fastened at the other opposite side of the heating element, and the second radiator is arranged at one side of the second bracket facing the heating element; the second elastic part is arranged between the second bracket and the second radiator, is respectively abutted against the second bracket and the second radiator and provides elastic force to act on one side of the second radiator, which is far away from the heating part; the second heat conducting pad is arranged between the heating piece and the second radiator and is respectively elastically abutted against the heating piece and the second radiator.

12. The electronic device of claim 11, further comprising: a fixing member;

the fixing piece penetrates through the first support, the second support and the heating piece and is configured to lock the first support and the second support on two opposite sides of the heating piece respectively.

13. An electronic device, characterized in that the electronic device comprises: the heat radiator comprises a heating piece, a first bracket, a first radiator, a first magnetic piece and a second magnetic piece;

the first bracket is fastened on one side of the heating part, and the first radiator is arranged on one side of the first bracket facing the heating part; the first magnetic part is arranged on the first bracket, the second magnetic part is arranged on the first radiator, and the first magnetic part and the second magnetic part are oppositely arranged; the first magnetic part and the second magnetic part generate repulsive force to act on one side of the first heat radiator, which is far away from the heat generating part, so that the first heat radiator is abutted to the heat generating part.

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