CN216387485U - Optical module heat radiation structure, network card device and electronic equipment - Google Patents

Abstract

The utility model relates to an optical module heat dissipation structure, a network card device and electronic equipment. This optical module heat radiation structure includes: an optical module body; the mounting shell is covered on the optical module body, and the top of the mounting shell is provided with an opening; and the heat dissipation assembly is partially arranged at the top of the mounting shell, penetrates through the opening to be thermally connected with the optical module body, is partially positioned on the side surface of the mounting shell and extends along the height direction of the mounting shell. The radiating structure of the optical module can ensure the radiating of the optical module body, does not increase the overall height of the radiating structure of the optical module, reduces the height space size occupied by the radiating structure of the optical module, ensures the service performance of the optical module body, and increases the application range of the radiating structure of the optical module.

Description

Optical module heat radiation structure, network card device and electronic equipment

Technical Field

The utility model relates to the technical field of heat dissipation equipment, in particular to an optical module heat dissipation structure, a network card device and electronic equipment.

Background

With the rapid development of communication equipment, the integration degree and the assembly density of the communication equipment are continuously improved, so that the power consumption and the heat productivity of the equipment are increased rapidly while the powerful use function is provided and the use performance of the equipment is ensured. In all components of the communication equipment, the temperature specification of the optical module is relatively low, and the requirements of space contraction, pluggable performance and low temperature specification bring challenges to the heat dissipation of the optical module, and even become the bottleneck of the development of the whole product.

The Open computer Project NIC (OCP NIC) supports the ncsi (network Controller baseband interface) protocol more than other standard cards, and is therefore increasingly applied to servers. The space structure of the OCP network card limits the design of the glazing module of the OCP network card. At present, a radiator is not arranged on an optical module of an optical port OCP network card commonly used in the market, the service temperature of a server product is greatly limited, and meanwhile, the rotating speed of a fan is required to be high, so that the service performance of the server is influenced.

The existing optical module radiator technology mainly aims at radiating a standard network card optical module, and the radiating mode is that a structure responsible for radiating is arranged at the top of the optical module. Generally, an aluminum extruded radiator is arranged at the top of an optical module shell, a window is formed in the top of the shell, and the bottom of the radiator is in direct contact with an optical module to dissipate heat. If the flat plate radiator is used for radiating the optical module, the heat of the optical module is directly transferred to the flat plate, but the design has the advantages of small radiating area, poor radiating effect, complex structure and large volume, and is not convenient to apply to the OCP network card for radiating.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide an optical module heat dissipation structure, a network card device, and an electronic device that can reduce the height dimension, in order to solve the problem that the height dimension of the optical module body is high after the heat sink is added.

An optical module heat dissipation structure, comprising:

an optical module body;

the mounting shell is covered on the optical module body, and the top of the mounting shell is provided with an opening; and

and the heat dissipation assembly is partially arranged at the top of the mounting shell, penetrates through the opening to be thermally connected with the optical module body, is partially positioned on the side surface of the mounting shell and extends along the height direction of the mounting shell.

The utility model relates to an optical module heat radiation structure, wherein the top of a mounting shell is provided with an opening which can expose an optical module body in the mounting shell, the top of the mounting shell is provided with a heat radiation component, part of the heat radiation component is arranged at the top of the mounting shell, penetrates through the opening to be thermally connected with the optical module body, and part of the heat radiation component is positioned on the side surface of the mounting shell and extends along the height direction of the mounting shell. The heat emitted by the optical module body during working can be transferred to the heat dissipation assembly above the mounting shell and further transferred to the heat dissipation assembly on the side face, the heat of the optical module body is effectively dissipated through the heat dissipation assembly on the side face, and the temperature of the optical module body is reduced. According to the optical module heat dissipation structure, the heat dissipation assembly is partially arranged at the top of the mounting shell, and partially arranged on the side face of the mounting shell, so that the whole height of the optical module heat dissipation structure can not be increased while the heat dissipation of the optical module body is ensured, the problem that the height size of the optical module body is larger after a radiator is added at present is effectively solved, the height space size occupied by the optical module heat dissipation structure is reduced, the use performance of the optical module body is ensured, and the application range of the optical module heat dissipation structure is enlarged.

In one embodiment, the heat dissipation assembly includes a heat conducting member disposed on the mounting housing and thermally connected to the optical module body through the opening, and a heat dissipation member disposed at an end of the heat conducting member and located at a side of the mounting housing, the heat dissipation member extending in a height direction of the mounting housing.

The heat is transferred to the heat dissipation part on the side face of the mounting shell through the heat conduction part, the heat dissipation part dissipates the heat of the optical module body, and the height of the heat dissipation structure of the optical module can be reduced while the temperature of the optical module body is reduced.

In one embodiment, the heat conducting member includes a connecting plate disposed on the mounting housing, and a heat conducting plate protruding from a surface of the connecting plate facing the mounting housing and thermally connected to the optical module body through the opening.

The heat-conducting plate can pass through the opening and abut against the optical module body, so that the heat of the optical module body can be transferred to the connecting plate and transferred to the heat-radiating part on the side face of the mounting shell through the connecting plate.

In one embodiment, the heat dissipating member includes at least one supporting plate and at least one heat dissipating end, the at least one supporting plate is bent and disposed at an end of the heat conducting member and located at a side of the mounting housing, and each supporting plate is mounted with at least one heat dissipating end.

The supporting plate supports and transmits the heat of the connecting plate to the heat dissipation end, and the heat dissipation end dissipates the heat to ensure the heat dissipation effect of the optical module body.

In one embodiment, the heat dissipation end comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals along the height direction of the support plate.

The radiating fins can increase the radiating area and ensure the radiating effect.

In one embodiment, the heat dissipation end has at least one heat dissipation channel, and the heat dissipation channel penetrates through at least one heat dissipation fin along the height direction of the heat dissipation end.

The heat dissipation channel can further increase the heat dissipation area and ensure the heat dissipation effect.

In one embodiment, the optical module heat dissipation structure further includes at least one fixing member, and the fixing member is configured to fix the heat conducting member to the mounting housing and make the heat conducting member abut against the optical module body.

The fixing part ensures that the heat conducting part is reliably fixed on the mounting shell, so that the heat conducting plate is always kept in butt joint with the optical module body, and the heat transfer effect is ensured.

In one embodiment, the fixing member includes a crimping section contacting the heat conducting member and fastening sections disposed on both sides of the crimping section, the fastening sections being located on the side of the mounting housing and fastened to the mounting housing.

The crimping end contacts with the connecting plate, and the buckling section contacts with the mounting shell, so that the reliable fixation of the heat dissipation assembly is ensured.

In one embodiment, the fastening section has a fitting portion, and a side surface of the mounting housing has a connecting portion, and the fitting portion is in fit connection with the connecting portion to fix the fixing component to the mounting housing;

the matching part and the connecting part are of a protruding groove structure, or the matching part and the connecting part are of a buckling structure.

The fixing component can reliably fix the heat radiation assembly on the mounting shell through the matching connection of the matching part and the connecting part.

In one embodiment, the fixing component further comprises a detaching section, the detaching section is arranged at one end of the buckling section, which is far away from the crimping section, and is bent relative to the buckling section, and the detaching section is used for detaching the fixing component.

The disassembly of the fixing part is facilitated through the disassembly section, and then the later maintenance and the like of the heat dissipation assembly are facilitated.

In one embodiment, the detachment section has a detachment portion.

The disassembly part can facilitate the disassembly of the fixed part, and then the later maintenance of the heat dissipation assembly is facilitated.

In one embodiment, the crimping section comprises a first elastic section and second elastic sections arranged on two sides of the first elastic section, the second elastic sections are connected with the buckling sections, and the first elastic section is arranged in a concave mode relative to the two second elastic sections.

The first elastic section compresses tightly the connecting plate with the cooperation of second elastic section for the heat-conducting plate keeps the butt with the optical module body, and then guarantees the heat transfer effect.

In one embodiment, the surface of the connecting plate facing away from the heat-conducting plate has at least one retaining groove for receiving the pressure connection section of the retaining element.

The fixed slot can realize fixed part's fixed, avoids fixed part drunkenness.

A network card device comprises a network card main body and an optical module heat dissipation structure according to any technical characteristic, wherein the optical module body is arranged in the network card main body in a heat dissipation mode.

After the network card device adopts the optical module heat dissipation structure of the embodiment, the occupied height space can be reduced while the heat dissipation effect is ensured.

In one embodiment, when the network card main body is a single-port network card, the optical module heat dissipation structure includes an optical module body, a mounting housing, a heat dissipation assembly and at least one fixing component, the mounting housing is disposed on the single-port network card, the optical module body is disposed in the mounting housing, the heat dissipation assembly is disposed at the top of the mounting housing and partially disposed on a side surface of the mounting housing, and the fixing component is used for fixing the heat dissipation assembly to the mounting housing;

when the network card main body is a double-port network card, the optical module heat dissipation structure comprises two optical module bodies, two mounting shells, two heat dissipation assemblies and at least one fixing part, the two mounting shells are arranged in the double-port network card side by side, the optical module bodies are arranged in the corresponding mounting shells, the two heat dissipation assemblies are respectively arranged in the two mounting shells and are symmetrically arranged, and the at least one fixing part is used for fixing the two heat dissipation assemblies in the corresponding mounting shells simultaneously.

The network card main body can be a single-port network card or a double-port network card, and both can radiate heat through the radiating assembly, so that the occupied space is reduced, and the radiating effect is ensured.

An electronic device comprises a casing and a network card device according to any one of the above technical features, wherein the network card device is arranged in the casing.

After the network card device of the embodiment is adopted by the electronic equipment, the use performance of the electronic equipment can be ensured.

Drawings

Fig. 1 is a schematic diagram illustrating an optical module heat dissipation structure applied to a single-port network card according to an embodiment of the present invention;

fig. 2 is a schematic view illustrating the optical module body mounted on the network card body in the optical module heat dissipation structure shown in fig. 1;

fig. 3 is a perspective view of the optical module heat dissipation structure shown in fig. 1 applied to a single-port network card;

fig. 4 is a schematic diagram of the optical module heat dissipation structure shown in fig. 1 applied to a dual-port network card;

fig. 5 is a schematic view illustrating the optical module body mounted on the network card body in the optical module heat dissipation structure shown in fig. 4;

fig. 6 is a perspective view of the optical module heat dissipation structure shown in fig. 4 applied to a dual-port network card;

fig. 7 is a cross-sectional view of the optical module heat dissipation structure shown in fig. 1;

fig. 8 is a perspective view of a heat dissipation assembly in the light module heat dissipation structure shown in fig. 7 from an angle;

FIG. 9 is a perspective view of the heat dissipation assembly shown in FIG. 8 from another angle;

FIG. 10 is a front view of the heat sink assembly shown in FIG. 8;

fig. 11 is a perspective view of a fixing member in the heat dissipation structure of the optical module shown in fig. 7;

fig. 12 is a front view of the fixing member shown in fig. 11.

Wherein: 100. an optical module heat dissipation structure; 111. an optical module body; 112. installing a shell; 1121. an opening; 1122. a connecting portion; 120. a heat dissipating component; 121. a heat conductive member; 1211. a connecting plate; 12111. fixing grooves; 1212. a heat conducting plate; 122. a heat dissipating member; 1221. a support plate; 1222. a heat dissipation end; 12221. a heat dissipating fin; 12222. a heat dissipation channel; 130. a fixing member; 131. a crimping section; 1311. a first elastic section; 1312. a second elastic section; 132. a buckling section; 1321. a fitting portion; 133. disassembling the section; 1331. a detaching part; 200. the network card body.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, 2, 4, 5 and 7, the present invention provides a light module heat dissipation structure 100. The optical module heat dissipation structure 100 is applied to a network card device, and is used for dissipating heat of the optical module body 111 to reduce the temperature of the optical module body 111 and ensure the usability of the network card device. Of course, in other embodiments of the present invention, the optical module heat dissipation structure 100 may be applied to heat dissipation of other electronic devices, so as to ensure the performance of the electronic devices. In the present invention, the optical module heat dissipation structure 100 is used to dissipate heat of the optical module body 111 for example, and the heat dissipation principle of the optical module heat dissipation structure 100 for other electronic devices is substantially the same as the heat dissipation principle for the optical module body 111, which is not described herein again.

It can be understood that, at present, no radiator is configured for the optical module of the optical port OCP network card, and if the radiator of the standard network card is adopted to radiate heat to the optical module, the overall height of the optical module is increased after the radiator is arranged on the optical module, and the optical port OCP network card (Open computer Project NIC) in a smaller space cannot be used.

Therefore, the present invention provides a novel optical module heat dissipation structure 100, and the optical module heat dissipation structure 100 has a small overall height, can be applied to a small space, and can ensure a heat dissipation effect. The specific structure of the optical module heat dissipation structure 100 is described in detail below.

Referring to fig. 1, 2, 4, 5 and 7, in an embodiment, an optical module heat dissipation structure 100 includes an optical module body 111, a mounting case 112 and a heat dissipation assembly 120. The mounting housing 112 covers the optical module body 111, and an opening 1121 is formed in the top of the mounting housing 112. The heat sink 120 is partially disposed on the top of the mounting housing 112, passes through the opening 1121, is thermally connected to the optical module body 111, is partially disposed on the side of the mounting housing 112, and extends along the height direction of the mounting housing 112.

The optical module body 111 is a heat generating element of the optical module heat dissipation structure 100. When the network card device is in operation, the optical module body 111 can dissipate a large amount of heat. The optical module body 111 is mounted on the network card body 200 of the network card device, and for convenience of description of the orientation, a surface of the optical module body 111 contacting the network card body 200 is a bottom, a surface of the optical module body 111 opposite to the bottom is a top, and a peripheral side surface of the optical module body 111 is a side surface. It should be noted that, regardless of the orientation of the network card device in space, the description is made with reference to the above orientation.

The mounting housing 112 is fixed to the network card body 200, and encloses an installation space with the network card body 200, and the optical module body 111 is inserted into the installation space. The optical module body 111 is protected by the mounting case 112, so that the optical module body 111 is prevented from being touched by other parts by mistake, and foreign matters such as dust can be prevented from entering the optical module body 111. Alternatively, the mounting housing 112 may be a closed housing, a cage structure, or the like.

An opening 1121 is provided at the top of the mounting case 112, and the opening 1121 enables communication between the inside and outside environments of the mounting case 112, so that the optical module body 111 is exposed out of the mounting case 112 through the opening 1121. In this way, after the heat sink 120 is disposed on the top of the mounting case 112, the heat sink 120 can be thermally connected to the optical module body 111 in the mounting case 112 through the opening 1121. Therefore, heat dissipated when the optical module body 111 works can be transferred to the heat dissipation assembly 120, and then heat dissipation is performed through the heat dissipation assembly 120, so that the temperature of the optical module body 111 is reduced, and the use performance of the optical module body 111 is ensured.

Furthermore, the heat dissipation assembly 120 is partially located at the top of the mounting housing 112 and partially located at the side of the mounting housing 112, and the heat dissipation assembly 120 located at the side portion can extend along the mounting housing 112, so that heat dissipation is achieved at the side portion of the mounting housing 112 through the heat dissipation assembly 120. That is, the portion of the heat sink 120 on the top of the mounting case 112 performs a heat transfer function, and the portion of the heat sink 120 on the side of the mounting case 112 performs a heat dissipation function. Also, a portion of the heat sink assembly 120 at the top of the mounting housing 112 can protrude into the mounting housing 112 through the opening 1121 and be thermally connected to the mounting housing 112.

Thus, when the optical module body 111 generates heat during operation, the heat can be transferred to the heat dissipation assembly 120 at the top of the mounting housing 112, and then transferred to the heat dissipation assembly 120 at the side of the mounting housing 112 through the heat dissipation assembly 120 at the top of the mounting housing 112, and the heat is dissipated through the heat dissipation assembly 120 at the side of the mounting housing 112, so as to reduce the temperature of the optical module body 111, and further, because the heat dissipation assembly 120 is partially arranged behind the side of the mounting housing 112, the occupied space of the heat dissipation assembly 120 at the top of the mounting housing 112 can be reduced, the height of the heat dissipation assembly 120 is reduced, and further, the overall height of the optical module heat dissipation structure 100 is reduced, so that the optical module heat dissipation structure 100 can be applied to a smaller space, and the heat dissipation effect is ensured.

In the optical module heat dissipation structure 100 in the above embodiment, the heat dissipation assembly 120 is partially disposed at the top of the mounting housing 112, and partially disposed on the side of the mounting housing 112, so that the overall height of the optical module heat dissipation structure 100 is not increased while heat dissipation of the optical module body 111 is ensured, the problem that the height dimension of the optical module body is larger after a heat sink is added at present is effectively solved, the height space dimension occupied by the optical module heat dissipation structure 100 is reduced, the use performance of the optical module body 111 is ensured, and the application range of the optical module heat dissipation structure 100 is increased.

Referring to fig. 7 to 10, in an embodiment, the heat dissipation assembly 120 includes a heat conduction member 121 and a heat dissipation member 122, the heat conduction member 121 is disposed on the mounting housing 112 and is thermally connected to the optical module body 111 through the opening 1121, the heat dissipation member 122 is disposed at an end of the heat conduction member 121 and is located on a side surface of the mounting housing 112, and the heat dissipation member 122 extends along a height direction of the mounting housing 112.

The heat conducting member 121 is a heat conducting member of the heat dissipating assembly 120, and the heat dissipating member 122 is a heat dissipating member of the heat dissipating assembly 120. The heat conductive member 121 is disposed on the top of the mounting case 112, and the heat dissipation member 122 is disposed on the edge of the heat conductive member 121 and on the side of the mounting case 112. After the heat conduction member 121 is disposed on the top of the mounting case 112, a surface of the heat conduction member 121 contacting the mounting case 112 can protrude into the mounting case 112 through the opening 1121 of the mounting case 112 to contact the optical module body 111 in the mounting case 112. In this way, the heat generated by the optical module main body 111 can be transferred to the heat-conducting member 121, and further, the heat is transferred to the heat-radiating member 122 on the side surface of the mounting case 112 through the heat-conducting member 121, and the heat is radiated through the heat-radiating member 122.

The heat dissipation member 122 can extend in the height direction of the mounting case 112. That is to say, the heat dissipation member 122 has a certain length in the height direction, so that the heat dissipation area of the heat dissipation member 122 can be increased, the heat dissipation member 122 can effectively dissipate the transferred heat, the heat of the optical module body 111 is effectively reduced, and the usability of the optical module body 111 is ensured.

Optionally, the height of the heat dissipating member 122 is equal to or less than the height of the mounting case 112. At this time, the top of the heat dissipation member 122 is flush with the top of the mounting case 112, and the heat dissipation member 122 can be completely located on the side of the mounting case 112, and does not contact other devices on the top of the mounting case 112, thereby ensuring usability. Of course, the height of the heat dissipating member 122 may be slightly higher than the height of the mounting housing 112 if there are no other devices on the top of the mounting housing 112. In this case, the heat dissipation member 122 is partially positioned on the side surface of the mounting case 112, and partially exposed from the top of the mounting case 112, so that the heat dissipation area of the heat dissipation member 122 can be increased, and the heat dissipation effect of the heat dissipation member 122 can be ensured.

Referring to fig. 7 to 10, in an embodiment, the heat conducting member 121 includes a connecting plate 1211 and a heat conducting plate 1212, the connecting plate 1211 is disposed on the mounting housing 112, and the heat conducting plate 1212 is protruded from a surface of the connecting plate 1211 facing the mounting housing 112 and is thermally connected to the optical module body 111 through the opening 1121.

The connection plate 1211 is provided as a connection structure of the heat conduction member 121, an edge of the connection plate 1211 is connected to the heat dissipation assembly 120, and a heat conduction plate 1212 is provided on one surface of the connection plate 1211. The heat conducting plate 1212 is a heat conducting structure of the heat conducting member 121, the connecting plate 1211 is mounted on the mounting housing 112, one surface of the connecting plate 1211 having the heat conducting plate 1212 is attached to the mounting housing 112, at this time, the heat conducting plate 1212 can align with the opening 1121 and extend into the mounting housing 112 through the opening 1121, and the heat conducting plate 1212 can abut against the optical module body 111 in the mounting housing 112, so that the heat conducting plate 1212 and the optical module body 111 are thermally connected.

Thus, when the optical module body 111 generates a large amount of heat during operation, the heat of the optical module body 111 can be transferred to the heat conducting member 121, and then the heat conducting member 121 can transfer the heat to the connecting plate 1211, and the connecting plate 1211 transfers the heat to the heat dissipation assembly 120 on the side surface of the mounting housing 112, and the heat is dissipated through the heat dissipation assembly 120, so as to reduce the temperature of the optical module body 111 and ensure the usability of the optical module body 111.

The connecting plate 1211 is disposed in a flat plate shape, and the heat conducting plate 1212 is a protrusion structure on one surface of the connecting plate 1211. Of course, in other embodiments of the present invention, the heat conducting plate 1212 may have another structure capable of abutting against the optical module body 111 and transferring heat to the connecting plate 1211.

Referring to fig. 7 to 10, in an embodiment, the heat dissipating member 122 includes at least one supporting plate 1221 and at least one heat dissipating end 1222, the at least one supporting plate 1221 is bent and disposed at an end of the heat conducting member 121 and located at a side of the mounting housing 112, and each supporting plate 1221 is mounted with the at least one heat dissipating end 1222.

The support plate 1221 serves as a support for supporting the heat radiating end 1222 at the end of the connection plate 1211. After the heat dissipating end 1222 extends along the height direction of the mounting housing 112, the connection relationship between the heat dissipating end 1222 and the connecting plate 1211 is established by the supporting plate 1221, and the heat dissipating end 1222 is reliably located at the end of the connecting plate 1211. In one embodiment, the support plate 1221 is disposed perpendicular to the attachment plate 1211, the attachment plate 1211 is mounted on the top of the mounting housing 112, the support plate 1221 is disposed on the side of the mounting housing 112, and the support plate 1221 is disposed with the heat dissipating end 1222. Thus, the heat of the connection plate 1211 can be transferred to the heat radiating terminal 1222 through the support plate 1221, and the heat can be radiated through the heat radiating terminal 1222.

Optionally, each support plate 1221 corresponds to one heat dissipating end 1222. Optionally, the heat dissipating member 122 includes a supporting plate 1221 and a heat dissipating end 1222. At this time, the length of the supporting plate 1221 and the heat dissipating end 1222 is large enough to cover the side surface of the mounting housing 112, so as to ensure the heat dissipation requirement of the optical module body 111. Optionally, the heat dissipating member 122 includes a plurality of supporting plates 1221 and a plurality of heat dissipating ends 1222. Each support plate 1221 is provided with a heat dissipating end 1222, and adjacent support plates 1221 and the heat dissipating ends 1222 thereon are spaced apart. Of course, one supporting plate 1221 may correspond to a plurality of heat dissipating terminals 1222, and adjacent heat dissipating terminals 1222 are spaced apart from each other. Optionally, the heat dissipating end 1222 is integrally formed with the supporting plate 1221.

In one embodiment, as shown in fig. 8, the heat dissipating member 122 includes three support plates 1221 and three heat dissipating ends 1222. Install a heat dissipation end 1222 on every backup pad 1221, each backup pad 1221 and the last heat dissipation end 1222 interval of last sets up, can increase heat radiating area, guarantees the radiating effect, can also form two simultaneously and dodge the space, should dodge the space and be used for holding the fixed part 130 in the future, and it is repeated here to differ one.

Referring to fig. 7 to 10, in an embodiment, the heat dissipating end 1222 includes a plurality of heat dissipating fins 12221, and the plurality of heat dissipating fins 12221 are spaced apart from each other along a height direction of the supporting plate 1221. Radiating fin 12221 is the slice setting, and radiating fin 12221's one end sets up in backup pad 1221, and radiating fin 12221's the other end orientation extends in the direction of keeping away from backup pad 1221. The plurality of heat dissipation fins 12221 are arranged in parallel and at intervals, and the stacking direction of the plurality of heat dissipation fins 12221 is the height direction of the mounting case 112.

When the optical module body 111 generates heat during operation, the heat can be transferred to the heat conducting plate 1212 in contact with the optical module body 111, and is transferred to the connecting plate 1211 by the heat conducting plate 1212, and then the connecting plate 1211 can transfer the heat to at least one supporting plate 1221, and the at least one supporting plate 1221 can transfer the heat to each heat dissipation fin 12221 of the corresponding heat dissipation end 1222, and the heat is dissipated through each heat dissipation fin 12221, so that the temperature of the optical module body 111 is reduced, and the purpose of improving the temperature of the optical module body 111 is achieved. Meanwhile, the heat dissipation fins 12221 are located on the side surface of the mounting housing 112, which can also reduce the overall height of the optical module heat dissipation structure 100 and reduce the occupied space.

Referring to fig. 7 to 10, in an embodiment, the heat dissipating end 1222 has at least one heat dissipating channel 12222, and the heat dissipating channel 12222 penetrates at least one of the heat dissipating fins 12221 along a height direction of the heat dissipating end 1222. That is, the heat dissipation fins 12221 are cut in the height direction to form the heat dissipation passages 12222 on the heat dissipation fins 12221. Thus, the surface area of the heat dissipation fins 12221 can be increased, the heat dissipation area of the heat dissipation fins 12221 is further increased, the heat dissipation capability of the heat dissipation fins 12221 is further improved, and the heat dissipation effect of the heat dissipation assembly 120 is ensured.

Alternatively, a heat dissipation channel 12222 may be provided on one of the heat dissipation fins 12221; alternatively, the heat dissipation passages 12222 may be provided on at least two of the heat dissipation fins 12221. Illustratively, as shown in fig. 8, the heat dissipation passage 12222 penetrates the entire heat dissipation dimension in the height direction of the mounting case 112 to increase the heat dissipation area as much as possible.

Alternatively, the number of the heat dissipation passages 12222 is set according to the cross-sectional area of the heat dissipation end 1222. When the cross-sectional area of the heat dissipating end 1222 is small, a heat dissipating passage 12222 may be provided. When the cross-sectional area of the heat dissipating end 1222 is large, two or more heat dissipating channels 12222 may be provided, as the case may be. Illustratively, as shown in fig. 8, two heat dissipating ends 1222 of the heat dissipating member 122 each have one heat dissipating channel 12222, and the middle heat dissipating end 1222 has three heat dissipating channels 12222.

Referring to fig. 7, 8, 11 and 12, in an embodiment, the optical module heat dissipation structure 100 further includes at least one fixing member 130, and the fixing member 130 is configured to fix the heat conducting member 121 to the mounting housing 112 and make the heat conducting member 121 abut against the optical module body 111.

The fixing member 130 is used to fix the heat sink assembly 120, so that the heat sink assembly 120 can be reliably fixed to the top of the mounting housing 112, and the heat conducting plate 1212 can be always abutted to the optical module body 111, and thus, heat of the optical module body 111 can be always transferred out through the heat conducting plate 1212, and the heat dissipation effect of the optical module body 111 is ensured.

Specifically, the fixing member 130 contacts the connection plate 1211 and fixes the connection plate 1211 on the top of the mounting case 112, thereby reducing play of the heat dissipating member 122. It is to be noted that the specific form of the fixing member 130 is not limited in principle as long as the reliable fixing of the connecting plate 1211 to the mount case 112 can be achieved. In this embodiment, the fixing member 130 is an elastic member, and the heat conducting plate 1212 is kept in contact with the optical module body 111 by the elastic force of the fixing member 130, thereby ensuring the heat dissipation effect of the optical module body 111.

Alternatively, the number of the fixing members 130 is one. Alternatively, the number of the fixing members 130 is two, and the two fixing members 130 are provided at intervals on the connection plate 1211. Of course, the number of the fixing members 130 may be more in other embodiments of the present invention.

Referring to fig. 7 to 12, in an embodiment, the fixing member 130 includes a pressing section 131 and fastening sections 132 disposed at two sides of the pressing section 131, the pressing section 131 is in contact with the heat conducting member 121, and the fastening sections 132 are located at the side of the mounting housing 112 and are fastened to the mounting housing 112.

The press-fit section 131 is a portion where the fixing member 130 contacts the connecting plate 1211, and the engagement section 132 is a portion where the fixing member 130 is fixed to the mounting case 112. The buckling sections 132 are respectively disposed at two ends of the crimping section 131, and are bent with respect to the crimping section 131. When the heat dissipation assembly 120 is fixed by the fixing member 130, the pressing section 131 is placed on the connecting plate 1211, the two fastening sections 132 are placed on the side of the mounting housing 112, and the two fastening sections 132 are fastened to the mounting housing 112 respectively.

At this time, the pressing section 131 can press the connection plate 1211, so that the connection plate 1211 moves toward the mounting housing 1112, thereby ensuring reliable thermal connection between the thermal conduction plate 1212 and the optical module body 111. Once the heat conducting plate 1212 is separated from the optical module body 111, it indicates that the connecting plate 1211 moves away from the mounting housing 112, due to the limitation of the fixing member 130, when the connecting plate 1211 jacks up the crimping section 131, the crimping section 131 moves upward, and the buckling section 132 connected to the crimping section 131 applies a reaction force to the crimping section 131, so that the crimping section 131 presses down the connecting plate 1211, and the heat conducting plate 1212 can keep abutting against the optical module body 111, thereby ensuring the heat dissipation effect of the optical module body 111.

Referring to fig. 7 to 12, in an embodiment, the fastening section 132 has a fitting portion 1321, a side surface of the mounting housing 112 has a connecting portion 1122, and the fitting portion 1321 is fitted with the connecting portion 1122 to fix the fixing member 130 to the mounting housing 112. Specifically, engaging portion 1321 is provided in engaging section 132, and connecting portions 1122 are provided on both side surfaces of mounting case 112. After the press-connecting section 131 of the fixing member 130 contacts the connecting plate 1211, the two fastening sections 132 are respectively located on two side surfaces of the mounting housing 112, at this time, the matching portion 1321 on the fastening section 132 can be matched and connected with the connecting portion 1122 of the mounting housing 112, so that the fastening section 132 is fixed on the side surface of the mounting housing 112, and further the press-connecting section 131 can effectively fix the connecting plate 1211, so that the heat conducting plate 1212 and the optical module body 111 are always thermally connected, and the purpose of fixing the connecting plate 1211 by the fixing member 130 is achieved.

In the optical module heat dissipation structure 100 of the present invention, the fixing member 130 reliably fixes the heat dissipation member 120 to the mounting case 112, so that the heat conductive plate 1212 of the heat dissipation member 120 can maintain thermal connection with the optical module body 111. When the heat dissipation assembly 120 moves away from the mounting housing 112, the connection plate 1211 applies a force to the press-connecting section 131 to lift up, and since the engaging section 132 is fixed to the side surface of the mounting housing 112 through the matching portion 1321 and the connection portion 1122, the engaging section 132 can pull the press-connecting section 131, so that the press-connecting section 131 moves toward the mounting housing 112, and then the press-connecting section 131 can press the connection plate 1211, so that the connection plate 1211 is reliably fixed to the mounting housing 112, and the heat conduction plate 1212 abuts against the optical module body 111. In this way, the heat of the optical module body 111 can be transmitted to the heat dissipation fins 12221 through the heat conduction plate 1212, and the heat is dissipated through the heat dissipation fins 12221, so as to reduce the temperature of the optical module body 111.

In an embodiment, the matching portion 1321 and the connecting portion 1122 are in a protrusion-and-groove structure, or the matching portion 1321 and the connecting portion 1122 are in a snap structure. It should be noted that the form of the fitting portion 1321 and the connecting portion 1122 is not limited in principle, as long as the fastening section 132 can be fixed to the side surface of the mounting case 112. Illustratively, the mating portion 1321 is a groove and the connecting portion 1122 is a protrusion. In another embodiment of the present invention, the connecting portion 1122 may be a groove, and the matching portion 1321 may be a protrusion. Of course, the matching portion 1321 and the connecting portion 1122 may also be a snap connection or other connection structure for realizing a snap fit.

When the fixing member 130 is engaged with the mounting housing 112, the pressing sections 131 contact with the connecting plates 1211 of the heat conducting member 121, at this time, the fastening sections 132 are located at two sides of the mounting housing 112, the grooves of the two fastening sections 132 are respectively mounted on the protrusions at two sides of the mounting housing 112, and the heat dissipation assembly 120 is fixed on the mounting housing 112 through the engagement of the protrusions and the grooves.

Referring to fig. 7 to 12, in an embodiment, the fixing component 130 further includes a detaching section 133, the detaching section 133 is disposed at an end of the buckling section 132 away from the crimping section 131 and is bent relative to the buckling section 132, and the detaching section 133 is used for detaching the fixing component 130.

The detaching segment 133 is used to achieve quick detachment of the fixing member 130. It can be understood that, after the fixing member 130 is mounted on the heat dissipating assembly 120, the fixing member 130 is located in a small space, and the operator does not have to insert his/her hand into the fixing member when detaching the fixing member 130. After the disassembly section 133 is arranged, an operator directly operates the disassembly section 133 by using a disassembly tool, so that the disassembly of the fixed part 130 can be realized, and the operator can conveniently perform operations such as later maintenance. Illustratively, the removal tool is a forceps or other instrument capable of being grasped, having a hook, and the like.

One end of the detaching segment 133 is connected to the engaging segment 132, the other end of the detaching segment 133 is a free end, and the detaching segment 133 is bent relative to the engaging segment 132. That is, after the fastening section 132 is fastened to the mounting housing 112, the detaching section 133 is located at an outer side of the fastening section 132 away from the mounting housing 112 and extends toward the upper space. When the fixing member 130 is detached, the detaching segment 133 is directly clamped, and the pulling force is applied, so that the detachment of the fixing member 130 can be realized.

Referring to fig. 7 to 12, in an embodiment, the detaching segment 133 has a detaching portion 1331. The detaching portion 1331 is an operation structure on the detaching segment 133, which facilitates the operation of the detaching segment 133 by an operation tool, and further facilitates the detachment of the fixing member 130. Optionally, the detachment portion 1331 is a groove. In this way, the detaching tool extends into the groove, and then the mating portion 1321 of the fastening section 132 is separated from the connecting portion 1122 by the detaching tool, thereby detaching the fixing member 130. Of course, in other embodiments of the present invention, the detaching portion 1331 may also be a protrusion or other structure capable of being detached easily.

Referring to fig. 7 to 12, in an embodiment, the crimping segment 131 includes a first elastic segment 1311 and second elastic segments 1312 disposed at two sides of the first elastic segment 1311, the second elastic segments 1312 are connected to the buckling segment 132, and the first elastic segment 1311 is recessed with respect to the two second elastic segments 1312.

First elastic segment 1311 is a middle portion of crimping segment 131, second elastic segment 1312 is an edge portion of crimping segment 131, two second elastic segments 1312 are respectively located at two ends of first elastic segment 1311, and ends of two second elastic segments 1312 far away from first elastic segment 1311 are further respectively connected with two buckling segments 132 to form a shape as shown in fig. 11.

After the first elastic segment 1311 is connected to the two second elastic segments 1312, the first elastic segment 1311 is recessed with respect to the second elastic segments 1312. That is, the first elastic section 1311 is located at a lower position than the second elastic section 1312. When the pressing section 131 contacts the connection plate 1211, the first elastic section 1311 can contact the connection plate 1211, and a certain distance exists between the second elastic section 1312 and the connection plate 1211, so that an elastic compression space is formed, and good contact between the heat conduction plate 1212 and the optical module body 111 is ensured.

In this way, second elastic segment 1312 can apply a force to first elastic segment 1311, so that first elastic segment 1311 is elastically forced to press down connection plate 1211, and heat conduction plate 1212 can maintain thermal link with optical module body 111. When the connection plate 1211 moves away from the mounting housing 112, the connection plate 1211 applies a force to the first elastic segment 1311, and the engagement segment 132 is fixed to the mounting housing 112, so that the position of the second elastic segment 1312 remains unchanged, and the second elastic segment 1312 applies a reaction force to the first elastic segment 1311, so that the connection plate 1211 is reliably fixed to the mounting housing 112, and the thermal conductive plate 1212 is thermally connected to the optical module body 111, thereby ensuring good contact between the thermal conductive plate 1212 and the optical module body 111.

Referring to fig. 7 to 12, in an embodiment, a surface of the connecting plate 1211 facing away from the heat-conducting plate 1212 has at least one fixing groove 12111, and the fixing groove 12111 is used for mounting the crimping section 131 of the fixing member 130. The fixing grooves 12111 are used to limit the position of the fixing member 130, so that the fixing member 130 can be reliably fixed to the mounting housing 112, and the movement of the pressing section 131 on the connecting plate 1211 is avoided, thereby ensuring the fixing effect of the fixing member 130 on the heat dissipation assembly 120.

Alternatively, the number of the fixing members 130 is two, and the two fixing members 130 are provided on the connecting plate 1211 at intervals, and the connecting plate 1211 can be reliably fixed to the mounting case 112 by the two fixing members 130. When the fastening section 132 is fastened and fixed on the side of the mounting housing 112, the fastening section 132 can pass through the avoiding space between the two heat dissipating ends 1222 to be connected to the mounting housing 112. Of course, in other embodiments of the present invention, the number of the fixing members 130 may be one or more. It should be noted that the number of the fixing members 130 needs to be matched with the number of the connecting portions 1122 on the mounting housing 112 to ensure that the fixing members 130 can be reliably fixed on the mounting housing 112.

In one embodiment, the heat conducting member 121 and the heat dissipating member 122 are a single structure. Further, the heat conductive member 121 and the heat radiating member 122 are integrally formed by a grinder or the like. Further, the heat conducting member 121 is subjected to CNC machining (computer numerical control precision machining) to form a boss, thereby forming the heat conducting plate 1212.

Referring to fig. 7 to 12, in the optical module heat dissipation structure 100 of the present invention, the heat conducting member 121 and the heat dissipation member 122 form an inverted L-shaped heat sink, so that the heat dissipation fins 12221 are located on the side surface of the mounting housing 112, and the connection plate 1211 of the heat conducting member 121 and the heat conducting plate 1212 realize heat transfer of the optical module body 111, so that the heat of the optical module body 111 is transferred to the heat dissipation fins 12221 through the heat conducting plate 1212, the connection plate 1211 and the support plate 1221, and the heat of the optical module body 111 is dissipated through the heat dissipation fins 12221, so as to reduce the temperature of the optical module body 111, reduce the overall height of the optical module heat dissipation structure 100, reduce the occupied space, and increase the application range. Moreover, the optical module heat dissipation structure 100 has a simple structure, is convenient to mount and dismount, and is convenient for a user to use.

Referring to fig. 1 to 6, the present invention further provides a network card device, which includes a network card main body and the optical module heat dissipation structure 100 according to the above embodiment, wherein the optical module main body 111 is heat-dissipated and disposed in the network card main body. After the optical module heat dissipation structure 100 of the above embodiment is adopted in the network card device of the present invention, the height of the network card device can be reduced while the heat dissipation effect is ensured, and the usability of the network card device is ensured. Optionally, the network card main body is a single-port network card, and further, is a single-port OCP network card. Optionally, the network card main body is a dual-port network card, and further, is a dual-port OCP network card.

Referring to fig. 1 to 3, in an embodiment, when the network card main body is a single-port network card, the optical module heat dissipation structure 100 includes an optical module body 111, a mounting housing 112, a heat dissipation assembly 120, and at least one fixing member 130, where the mounting housing 112 is disposed in the single-port network card, the optical module body 111 is disposed in the mounting housing 112, the heat dissipation assembly 120 is disposed at the top of the optical module body 111 and is partially located on a side surface of the optical module body 111, and the fixing member 130 is used to fix the heat dissipation assembly 120 to the optical module body 111.

That is, when the network card main body is a single-port network card, one heat dissipation assembly 120 is fixed on one mounting housing 112 through at least one fixing component 130, so as to ensure the heat dissipation effect of the single-port network card. Specifically, the press-fit section 131 of the fixing member 130 contacts the connecting plate 1211 of the heat dissipation assembly 120, and the engaging sections 132 of the fixing member 130 are respectively located at two sides of the same mounting housing 112 and are engaged with the mounting housing 112, so that the heat dissipation assembly 120 is fixed on the optical module body 111.

Referring to fig. 4 to 6, in an embodiment, when the network card main body is a dual-port network card, the optical module heat dissipation structure 100 includes two optical module bodies 111, two mounting housings 112, two heat dissipation assemblies 120, and at least one fixing member 130, where the two mounting housings 112 are disposed in parallel in the dual-port network card, the optical module bodies 111 are mounted in the corresponding mounting housings 112, the two heat dissipation assemblies 120 are respectively disposed in the two optical module bodies 111 and are symmetrically arranged, and the at least one fixing member 130 is used to fix the two heat dissipation assemblies 120 to the corresponding optical module bodies 111 at the same time.

That is, when the network card body is a dual-port network card, the two heat dissipation members 122 are respectively fixed to the corresponding mounting housings 112 through the at least one fixing member 130, so as to ensure the fixing effect of the dual-port network card. Specifically, each optical module body 111 corresponds to one heat dissipation assembly 120, the two heat dissipation assemblies 120 are symmetrically arranged, and the heat dissipation fins 12221 of the two heat dissipation assemblies 120 are arranged towards a direction in which the two heat dissipation assemblies 120 face away from each other. The pressing section 131 of the fixing member 130 contacts with the connecting plates 1211 of the two heat dissipation assemblies 120 at the same time, and one engaging section 132 is engaged with the side of one of the mounting housings 112, and the other engaging section 132 is engaged with the side of the other mounting housing 112, so as to fix the two heat dissipation assemblies 120 at the same time.

It should be noted that the structure and principle of the fixing part 130 for fixing two heat dissipation assemblies 120 are substantially the same as those of the fixing part 130 for fixing one heat dissipation assembly 120, except that the length of the first elastic segment 1311 in the fixing part 130 is different, which is not described herein again.

The utility model also provides electronic equipment which comprises a shell and the network card device in the embodiment, wherein the network card device is arranged in the shell. The electronic equipment adopts the network card device, so that the use performance of the electronic equipment can be ensured.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An optical module heat radiation structure, comprising:

an optical module body;

the mounting shell is covered on the optical module body, and the top of the mounting shell is provided with an opening; and

and the heat dissipation assembly is partially arranged at the top of the mounting shell, penetrates through the opening to be thermally connected with the optical module body, is partially positioned on the side surface of the mounting shell and extends along the height direction of the mounting shell.

2. The optical module heat dissipation structure of claim 1, wherein the heat dissipation assembly includes a heat conduction member and a heat dissipation member, the heat conduction member is disposed on the mounting housing and is thermally connected to the optical module body through the opening, the heat dissipation member is disposed at an end of the heat conduction member and is located at a side of the mounting housing, and the heat dissipation member extends in a height direction of the mounting housing.

3. The optical module heat dissipation structure of claim 2, wherein the heat conduction member comprises a connection plate disposed on the mounting housing, and a heat conduction plate protruding from a surface of the connection plate facing the mounting housing and thermally connected to the optical module body through the opening.

4. The optical module heat dissipation structure of claim 3, wherein the heat dissipation member comprises at least one supporting plate and at least one heat dissipation end, the at least one supporting plate is bent and disposed at an end of the heat conduction member and located at a side of the mounting housing, and each supporting plate is mounted with at least one heat dissipation end;

the heat dissipation end comprises a plurality of heat dissipation fins which are arranged at intervals along the height direction of the support plate;

the heat dissipation end is provided with at least one heat dissipation channel, and the heat dissipation channel penetrates through at least one heat dissipation fin along the height direction of the heat dissipation end.

5. The optical module heat dissipation structure according to claim 3 or 4, further comprising at least one fixing member for fixing the heat conductive member to the mounting case and abutting the heat conductive member against the optical module body.

6. The optical module heat dissipation structure of claim 5, wherein the fixing member includes a press-fit section and fastening sections disposed on two sides of the press-fit section, the press-fit section is in contact with the heat conduction member, and the fastening sections are located on a side surface of the mounting housing and are fastened to the mounting housing;

the surface of the connecting plate, which is far away from the heat conducting plate, is provided with at least one fixing groove, and the fixing groove is used for installing the crimping section of the fixing part;

the buckling section is provided with a matching part, the side surface of the mounting shell is provided with a connecting part, and the matching part is matched and connected with the connecting part to fix the fixing component on the mounting shell;

the matching part and the connecting part are of a protruding groove structure, or the matching part and the connecting part are of a buckling structure.

7. The optical module heat dissipation structure of claim 6, wherein the fixing component further comprises a detaching segment, the detaching segment is disposed at an end of the fastening segment away from the pressing segment and is bent relative to the fastening segment, and the detaching segment is used for detaching the fixing component;

the disassembly section has a disassembly portion.

8. The optical module heat dissipation structure of claim 6, wherein the press-fit segment comprises a first elastic segment and second elastic segments disposed on two sides of the first elastic segment, the second elastic segments are connected to the fastening segment, and the first elastic segment is recessed with respect to the two second elastic segments.

9. A network card device, comprising a network card main body and the optical module heat dissipation structure of any one of claims 1 to 8, wherein the optical module main body is arranged in the network card main body in a heat dissipation manner;

when the network card main body is a single-port network card, the optical module heat dissipation structure comprises an optical module body, an installation shell, a heat dissipation assembly and at least one fixing part, wherein the installation shell is arranged on the single-port network card, the optical module body is arranged in the installation shell, the heat dissipation assembly is arranged at the top of the installation shell, part of the heat dissipation assembly is positioned on the side surface of the installation shell, and the fixing part is used for fixing the heat dissipation assembly on the installation shell;

when the network card main body is a double-port network card, the optical module heat dissipation structure comprises two optical module bodies, two mounting shells, two heat dissipation assemblies and at least one fixing part, the two mounting shells are arranged in the double-port network card side by side, the optical module bodies are arranged in the corresponding mounting shells, the two heat dissipation assemblies are respectively arranged in the two mounting shells and are symmetrically arranged, and the at least one fixing part is used for fixing the two heat dissipation assemblies in the corresponding mounting shells simultaneously.

10. An electronic device comprising a housing and the network card device of claim 9, the network card device being disposed in the housing.

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