CN215121665U - Heat sink device - Google Patents

Heat sink device Download PDF

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Publication number
CN215121665U
CN215121665U CN202120804370.6U CN202120804370U CN215121665U CN 215121665 U CN215121665 U CN 215121665U CN 202120804370 U CN202120804370 U CN 202120804370U CN 215121665 U CN215121665 U CN 215121665U
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heat dissipation
circuit board
sheet
dissipation device
cooling
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王策
曾光明
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Shenzhen Ranvoo Technology Co Ltd
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Shenzhen Ranvoo Technology Co Ltd
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Abstract

本实用新型公开了一种散热装置,包括外壳、电路板、制冷片以及防水隔片,外壳设有容纳腔,电路板、制冷片以及防水隔片均容纳于容纳腔内,电路板与制冷片电性连接并用于控制制冷片的工作状态,散热装置具有工作面,制冷片用于给工作面进行制冷,电路板靠近工作面的一侧设有电子元件,防水隔片贴附于电路板具有电子元件的一侧并覆盖住电子元件,电路板和防水隔片均设有与制冷片对应的通孔,制冷片的一侧穿过电路板和防水隔片并从通孔露出。通过在电路板设有电子元件的一侧设置防水隔片覆盖住电子元件,从而防止散热装置为移动设备的背部散热时凝聚成的水珠接触到电子元件而发生短路,并且制冷片、电路板和防水隔片的结构更加紧凑、小巧。

Figure 202120804370

The utility model discloses a heat dissipation device, which comprises a casing, a circuit board, a refrigeration sheet and a waterproof spacer. The casing is provided with an accommodating cavity, and the circuit board, the refrigeration sheet and the waterproof spacer are all accommodated in the accommodation cavity. The circuit board and the refrigeration sheet are all accommodated in the accommodation cavity. It is electrically connected and used to control the working state of the cooling sheet. The cooling device has a working surface, and the cooling sheet is used to cool the working surface. The side of the circuit board close to the working surface is provided with electronic components, and the waterproof spacer is attached to the circuit board. One side of the electronic element covers the electronic element, the circuit board and the waterproof spacer are provided with through holes corresponding to the cooling sheet, and one side of the cooling sheet passes through the circuit board and the waterproof spacer and is exposed from the through hole. A waterproof spacer is arranged on the side of the circuit board where the electronic components are arranged to cover the electronic components, so as to prevent the water droplets condensed when the heat sink dissipates heat for the back of the mobile device from contacting the electronic components and causing a short circuit, and the cooling sheet, the circuit board And the structure of the waterproof spacer is more compact and small.

Figure 202120804370

Description

Heat sink device
Technical Field
The utility model relates to a mobile device heat dissipation technical field especially relates to a heat abstractor.
Background
With the development of electronic equipment, game software becomes the most software installed by electronic equipment users, but part of games have high requirements on the running speed of the electronic equipment, a large amount of heat is generated after the games run for a long time, if the heat cannot be dissipated timely, the heat generated by the electronic equipment not only affects the use experience, but also affects the performance of the electronic equipment, and even seriously burns out hardware.
The radiator is used for radiating heat for the mobile electronic equipment so as to improve the working performance of the mobile electronic equipment and prolong the service life of the battery. At present, game software becomes the most software installed by electronic equipment users, but part of games have high requirements on the running speed of the electronic equipment, a large amount of heat can be generated after the games run for a long time, if the heat cannot be dissipated timely, the heat generated by the electronic equipment not only influences the use experience, but also influences the performance of the electronic equipment, and even seriously burns out hardware. Generally, the user can use external radiator to dispel the heat to electronic equipment, and the support of radiator can be through carrying out the joint with electronic equipment, and the radiator laminates with electronic equipment back mutually, when electronic equipment generates heat, dispels the heat through the radiator to dispel the heat for electronic equipment.
However, the existing radiator is easy to condense water vapor during refrigeration, and may be condensed into water drops when used for a long time, and the radiator is internally provided with a circuit board on which a plurality of electronic elements are arranged, so that when the water drops drop onto the circuit board, the circuit board is easy to be short-circuited and damaged.
SUMMERY OF THE UTILITY MODEL
In order to overcome the shortcoming and the deficiency that exist among the prior art, the utility model aims to provide a heat abstractor to solve among the prior art radiator owing to can condense the problem that the drop of water leads to the circuit board short circuit.
The purpose of the utility model is realized through the following technical scheme:
the utility model provides a heat abstractor, which comprises an outer shell, the circuit board, refrigeration piece and waterproof spacer, this shell is equipped with and holds the chamber, this circuit board, this refrigeration piece and this waterproof spacer all hold in this holds the intracavity, this circuit board and this refrigeration piece electric connection are used for controlling the operating condition of this refrigeration piece, this heat abstractor has the working face, this refrigeration piece is used for refrigerating for this working face, one side that this circuit board is close to this working face is equipped with electronic component, attached one side that this circuit board has this electronic component of this waterproof spacer covers this electronic component, this circuit board and this waterproof spacer all are equipped with the through-hole that corresponds with this refrigeration piece, one side of this refrigeration piece is passed this circuit board and this waterproof spacer and is exposed from this through-hole.
Further, this heat abstractor still includes heat conduction silica gel piece, and this shell is equipped with and holds the hole of dodging that the chamber switched on, and one side of this heat conduction silica gel piece is followed this and is dodged hole department and expose and form this working face.
Further, this heat abstractor still includes the wireless subassembly that charges, this wireless subassembly that charges is located between this refrigeration piece and this heat conduction silica gel piece and with this circuit board electric connection, this wireless subassembly that charges contacts with the cold junction face of this refrigeration piece, and this wireless subassembly that charges is used for carrying out wireless charging for the mobile device.
Further, this wireless subassembly that charges includes wireless charging coil and aluminum sheet, and this aluminum sheet contacts with the cold junction face of this refrigeration piece, and this wireless charging coil is located between this aluminum sheet and this heat conduction silica gel piece.
Further, this heat abstractor still includes the fan, and this fan holds in this holds the intracavity and with this circuit board electric connection, and this shell is equipped with the air intake and the air outlet that switch on with this holding chamber, and this fan drive gas gets into this holding intracavity and blows out from this air outlet from this air intake, and this fan is used for dispelling the heat to the hot terminal surface of this refrigeration piece.
Furthermore, the heat dissipation device also comprises a heat dissipation fin, the heat dissipation fin is accommodated in the accommodating cavity and is in contact with the hot end face of the refrigerating sheet, the circuit board is positioned between the heat dissipation fin and the waterproof spacer, and the heat dissipation fin is arranged around the outer edge of the fan.
Further, the heat dissipation device further comprises a wind shield, the wind shield is accommodated in the accommodating cavity and located on one side of the fan facing the air inlet, and the wind shield is used for preventing air from being blown out of the air inlet.
Further, this heat abstractor still includes light subassembly, and this light subassembly holds in this holds the intracavity and with this circuit board electric connection, and this deep bead is connected in the one side that this light subassembly kept away from this air intake.
Further, this light subassembly includes lamp shade and lamp plate, and this lamp shade is installed on this shell, and this lamp plate is located between this lamp shade and this deep bead, and this lamp plate is equipped with the lamp pearl towards one side of this lamp shade.
Further, the waterproof spacer is fixed with the circuit board through glue.
The utility model has the advantages that: heat abstractor includes the shell, the circuit board, refrigeration piece and waterproof spacer, the shell is equipped with and holds the chamber, the circuit board, refrigeration piece and waterproof spacer all hold in holding the intracavity, circuit board and refrigeration piece electric connection are used for controlling the operating condition of refrigeration piece, heat abstractor has the working face, the refrigeration piece is used for refrigerating for the working face, one side that the circuit board is close to this working face is equipped with electronic component, the attached one side that has electronic component in the circuit board of waterproof spacer covers electronic component. Set up waterproof spacer and cover electronic component through the one side that is equipped with electronic component at the circuit board to the drop of water that the heat abstractor condenses into when being the back heat dissipation of mobile device takes place the short circuit because of contacting electronic component, and one side of refrigeration piece passes circuit board and waterproof spacer and exposes from the through-hole, makes the structure of refrigeration piece, circuit board and waterproof spacer compacter, small and exquisite.
Drawings
Fig. 1 is a schematic front view of the heat dissipation device of the present invention;
fig. 2 is one of the rear-view split structural schematic diagrams of the heat dissipation device of the present invention;
fig. 3 is a schematic cross-sectional structure diagram of the heat dissipation device of the present invention;
fig. 4 is a schematic view of a front view of the heat dissipation device of the present invention;
fig. 5 is a second rear view of the heat dissipation device of the present invention.
In the figure: the heat dissipation device 10, hold chamber 101, working face 102, dodge hole 103, air intake 104, air outlet 105, through-hole 106, shell 11, front shell 11a, back casing 11b, circuit board 12, electronic component 121, charge interface 122, control switch 123, refrigeration piece 13, waterproof spacer 14, heat conduction silica gel piece 15, wireless charging assembly 16, wireless charging coil 161, aluminum sheet 162, fan 17, deep bead 171, radiating fin 18, light subassembly 19, lamp shade 191, lamp plate 192, lamp pearl 192 a.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the objects of the present invention, the following detailed description of the embodiments, structures, features and effects of the heat dissipation device according to the present invention with reference to the accompanying drawings and preferred embodiments is as follows:
fig. 1 is the utility model discloses well heat abstractor's main view structure schematic diagram, fig. 2 is the utility model discloses one of well heat abstractor's back split structure schematic diagram, fig. 3 is the utility model discloses well heat abstractor's cross-sectional structure schematic diagram, fig. 4 is the utility model discloses well heat abstractor's main view split structure schematic diagram, fig. 5 is the utility model discloses well heat abstractor's back split structure schematic diagram two.
As shown in fig. 1 to 5, the utility model provides a pair of heat abstractor 10, which comprises an outer shell 11, circuit board 12, refrigeration piece 13 (preferably semiconductor refrigeration piece) and waterproof spacer 14, shell 11 is equipped with and holds chamber 101, circuit board 12, refrigeration piece 13 and waterproof spacer 14 all hold in holding chamber 101, circuit board 12 and refrigeration piece 13 electric connection and be used for controlling the operating condition of refrigeration piece 13, heat abstractor 10 has working face 102, refrigeration piece 13 is used for refrigerating for working face 102, one side that circuit board 12 is close to working face 102 is equipped with electronic component 121, the attached one side that has electronic component 121 in circuit board 12 of waterproof spacer 14 covers electronic component 121. When the heat dissipation device 10 dissipates heat of a mobile device (e.g., a mobile phone, a tablet computer, a laptop computer, etc.), the heat dissipation device 10 is fixed to the back of the mobile device, and the working surface 102 is in contact with the back of the mobile device, thereby dissipating heat of the mobile device. The waterproof spacer 14 and the circuit board 12 are fixed by glue, and the waterproof spacer 14 is preferably a transparent PC (polycarbonate) sheet.
The utility model discloses a set up waterproof spacer 14 and cover electronic component 121 in one side that circuit board 12 was equipped with electronic component 121 to prevent that the drop of water that heat abstractor 10 condenses when the back heat dissipation for mobile device from contacting electronic component 121 and taking place the short circuit.
Further, the housing 11 is a hollow cylindrical structure as a whole, and the housing 11 includes a front case 11a and a rear case 11b connected to each other, and a receiving chamber 101 is formed between the front case 11a and the rear case 11 b.
Further, the heat dissipation device 10 further includes a heat-conducting silicone sheet 15, the rear housing 11b of the housing 11 is provided with an avoiding hole 103 communicated with the accommodating cavity 101, and one side of the heat-conducting silicone sheet 15 is exposed from the avoiding hole 103 and forms a working surface 102. In this embodiment, the rear case 11b is a circular ring structure, and one side of the thermal conductive silicone sheet 15 protrudes from the surface of the rear case 11b away from the front case 11a, so as to be in contact with the mobile device.
Further, the heat dissipation device 10 further includes a wireless charging assembly 16, the wireless charging assembly 16 is located between the refrigeration sheet 13 and the heat-conducting silicone sheet 15 and is electrically connected to the circuit board 12, the wireless charging assembly 16 is in contact with the cold end face of the refrigeration sheet 13, and the wireless charging assembly 16 is used for wirelessly charging the mobile device. Specifically, wireless charging assembly 16 includes wireless charging coil 161 and aluminum sheet 162, and aluminum sheet 162 contacts with the cold terminal surface of refrigeration piece 13, and wireless charging coil 161 is located between aluminum sheet 162 and the heat conduction silica gel piece 15. Among them, the aluminum sheet 162 has good thermal conductivity, thereby improving the heat dissipation effect to the wireless charging coil 161 and the mobile device. The heat of mobile device is through heat conduction silica gel piece 15 transmission to wireless charging assembly 16's aluminum sheet 162 on, then cools down for aluminum sheet 162 through the cold terminal surface of refrigeration piece 13. So that the heat sink 10 can not only dissipate heat of the mobile device, but also wirelessly charge the mobile device. Of course, in other embodiments, the wireless charging assembly 16 may not be provided, and the heat-conducting silicone sheet 15 directly contacts with the cold end surface of the cooling sheet 13, so as to dissipate heat of the mobile device.
Further, the heat dissipation device 10 further includes a fan 17, the fan 17 is accommodated in the accommodating cavity 101 and electrically connected to the circuit board 12, the housing 11 is provided with an air inlet 104 and an air outlet 105 communicated with the accommodating cavity 101, the fan 17 drives air to enter the accommodating cavity 101 from the air inlet 104 and blow out from the air outlet 105, and the fan 17 is used for dissipating heat from the hot end surface of the cooling fins 13.
Further, the heat dissipation device 10 further comprises a heat dissipation fin 18, the heat dissipation fin 18 is accommodated in the accommodating cavity 101 and is in contact with the hot end face of the cooling fin 13, the circuit board 12 is located between the heat dissipation fin 18 and the waterproof spacer 14, and the heat dissipation fin 18 is arranged around the outer edge of the fan 17. The heat generated at the hot end surface of the cooling fins 13 is transferred to the heat dissipation fins 18, and then is dissipated to the heat dissipation fins 18 through the fan 17.
In this embodiment, the circuit board 12 is disposed between the heat dissipating fin 18 and the wireless charging assembly 16, one side of the circuit board 12 having the electronic component 121 is far away from the heat dissipating fin 18, the circuit board 12 and the waterproof spacer 14 are both provided with through holes 106 corresponding to the cooling fins 13, one side of the cooling fins 13 penetrates through the circuit board 12 and the waterproof spacer 14 and is exposed from the through holes 106, so that the cooling fins 13, the circuit board 12 and the waterproof spacer 14 are more compact and small in structure. That is, the cold end face of the refrigeration sheet 13 contacts the aluminum sheet 162, and the hot end face of the refrigeration sheet 13 passes through the circuit board 12 and the waterproof spacer 14 through the through hole 106 and contacts the heat dissipation fin 18, so that the utilization rate of the accommodating cavity 101 can be improved, and the structure of the heat dissipation device 10 is more compact and small.
Further, the heat dissipating device 10 further includes a wind shielding plate 171, the wind shielding plate 171 is accommodated in the accommodating chamber 101 and is disposed on a side of the fan 17 facing the air inlet 104, and the wind shielding plate 171 is used for preventing air from being blown out from the air inlet 104. The wind shielding plate 171 is a circular ring-shaped structure and is disposed around an edge of the fan 17, and the wind shielding plate 171 is close to a front end (a side facing the air inlet 104) of the fan 17 to prevent hot wind blown by the fan 17 from streaming to the air inlet 104 and affecting a heat dissipation effect of the fan 17.
Further, the heat dissipation device 10 further includes a light assembly 19, the light assembly 19 is accommodated in the accommodating cavity 101 and electrically connected to the circuit board 12, and the wind shielding plate 171 is connected to a side of the light assembly 19 away from the air inlet 104. Specifically, light subassembly 19 includes lamp shade 191 and lamp plate 192, and lamp shade 191 installs on shell 11, and lamp plate 192 locates between lamp shade 191 and deep bead 171, and lamp plate 192 is equipped with lamp pearl 192a towards one side of lamp shade 191, and lamp pearl 192a is flickering the light of different colours (race horse lamp effect promptly) during operation for heat abstractor 10 is dazzling more when using. The lamp housing 191 and the wind screen 171 are preferably made of transparent PC (polycarbonate), and the wind screen 171 is disposed at the rear side (the side facing the heat conductive silicone sheet 15) of the light module 19, so as to avoid affecting the light effect of the light module 19. The light assembly 19 is a circular ring structure and is disposed around the edge of the fan 17, and the front case 11a of the housing 11 is provided with a light-transmitting sheet corresponding to the light assembly 19 so that light is emitted.
Further, still be equipped with the interface 122 that charges on the circuit board 12, thereby external power supplies power for circuit board 12, fan 17, refrigeration piece 13 and wireless subassembly 16 that charges through the interface 122 that charges.
Further, the housing 11 of the heat dissipation device 10 is provided with a control switch 123, the control switch 123 is mounted on the front housing 11a and electrically connected to the circuit board 12, and the control switch 123 has three position switches, which are respectively heat dissipation, heat dissipation plus wireless charging and wireless charging.
In this document, the terms of upper, lower, left, right, front, rear and the like are used to define the positions of the structures in the drawings and the positions of the structures relative to each other, and are only used for the sake of clarity and convenience in technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. It is also to be understood that the terms "first" and "second," etc., are used herein for descriptive purposes only and are not to be construed as limiting in number or order.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description in any form, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make some changes or modifications within the technical scope of the present invention without departing from the technical scope of the present invention, and the technical contents of the above disclosure can be utilized to make equivalent embodiments, but the technical contents of the present invention are not broken away from, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention all still belong to the protection scope of the technical solution of the present invention.

Claims (10)

1.一种散热装置,其特征在于,包括外壳(11)、电路板(12)、制冷片(13)以及防水隔片(14),该外壳(11)设有容纳腔(101),该电路板(12)、该制冷片(13)以及该防水隔片(14)均容纳于该容纳腔(101)内,该电路板(12)与该制冷片(13)电性连接并用于控制该制冷片(13)的工作状态,该散热装置(10)具有工作面(102),该制冷片(13)用于给该工作面(102)进行制冷,该电路板(12)靠近该工作面(102)的一侧设有电子元件(121),该防水隔片(14)贴附于该电路板(12)具有该电子元件(121)的一侧并覆盖住该电子元件(121),该电路板(12)和该防水隔片(14)均设有与该制冷片(13)对应的通孔(106),该制冷片(13)的一侧穿过该电路板(12)和该防水隔片(14)并从该通孔(106)露出。1. A heat dissipation device, characterized in that it comprises a housing (11), a circuit board (12), a cooling sheet (13) and a waterproof spacer (14), the housing (11) is provided with a accommodating cavity (101), the The circuit board (12), the cooling sheet (13) and the waterproof spacer (14) are all accommodated in the accommodating cavity (101), and the circuit board (12) is electrically connected to the cooling sheet (13) and used for controlling The working state of the cooling sheet (13), the heat dissipation device (10) has a working surface (102), the cooling sheet (13) is used for cooling the working surface (102), and the circuit board (12) is close to the working surface (102). One side of the surface (102) is provided with an electronic component (121), the waterproof spacer (14) is attached to the side of the circuit board (12) with the electronic component (121) and covers the electronic component (121) , both the circuit board (12) and the waterproof spacer (14) are provided with through holes (106) corresponding to the cooling sheet (13), and one side of the cooling sheet (13) passes through the circuit board (12) and the waterproof spacer (14) and exposed from the through hole (106). 2.根据权利要求1所述的散热装置,其特征在于,该散热装置(10)还包括导热硅胶片(15),该外壳(11)设有与该容纳腔(101)导通的避让孔(103),该导热硅胶片(15)的一侧从该避让孔(103)处露出并形成该工作面(102)。2. The heat dissipation device according to claim 1, characterized in that, the heat dissipation device (10) further comprises a thermally conductive silica gel sheet (15), and the casing (11) is provided with an escape hole that communicates with the accommodating cavity (101). (103), one side of the thermally conductive silicone sheet (15) is exposed from the escape hole (103) to form the working surface (102). 3.根据权利要求2所述的散热装置,其特征在于,该散热装置(10)还包括无线充电组件(16),该无线充电组件(16)位于该制冷片(13)与该导热硅胶片(15)之间并与该电路板(12)电性连接,该无线充电组件(16)与该制冷片(13)的冷端面相接触,该无线充电组件(16)用于给移动设备进行无线充电。3. The heat dissipation device according to claim 2, characterized in that, the heat dissipation device (10) further comprises a wireless charging assembly (16), and the wireless charging assembly (16) is located between the cooling sheet (13) and the thermally conductive silicone sheet Between (15) and electrically connected with the circuit board (12), the wireless charging assembly (16) is in contact with the cold end surface of the cooling sheet (13), and the wireless charging assembly (16) is used for charging a mobile device Wireless charging. 4.根据权利要求3所述的散热装置,其特征在于,该无线充电组件(16)包括无线充电线圈(161)和铝片(162),该铝片(162)与该制冷片(13)的冷端面相接触,该无线充电线圈(161)位于该铝片(162)与该导热硅胶片(15)之间。4. The cooling device according to claim 3, wherein the wireless charging assembly (16) comprises a wireless charging coil (161) and an aluminum sheet (162), the aluminum sheet (162) and the cooling sheet (13) The cold end surface of the wireless charging coil (161) is located between the aluminum sheet (162) and the thermally conductive silicone sheet (15). 5.根据权利要求1所述的散热装置,其特征在于,该散热装置(10)还包括风扇(17),该风扇(17)容纳于该容纳腔(101)内并与该电路板(12)电性连接,该外壳(11)设有与该容纳腔(101)导通的进风口(104)和出风口(105),该风扇(17)驱动气体从该进风口(104)进入该容纳腔(101)内并从该出风口(105)吹出,该风扇(17)用于对该制冷片(13)的热端面进行散热。5. The heat dissipation device according to claim 1, characterized in that, the heat dissipation device (10) further comprises a fan (17), and the fan (17) is accommodated in the accommodating cavity (101) and is connected with the circuit board (12) ) is electrically connected, the casing (11) is provided with an air inlet (104) and an air outlet (105) which are in conduction with the accommodating cavity (101), and the fan (17) drives the air to enter the air inlet (104) from the air inlet (104). Inside the accommodating cavity (101) and blowing out from the air outlet (105), the fan (17) is used to dissipate heat from the hot end face of the cooling fin (13). 6.根据权利要求5所述的散热装置,其特征在于,该散热装置(10)还包括散热翅片(18),该散热翅片(18)容纳于该容纳腔(101)内并与该制冷片(13)的热端面相接触,该电路板(12)位于该散热翅片(18)和该防水隔片(14)之间,该散热翅片(18)围绕该风扇(17)的外缘设置。6. The heat dissipation device according to claim 5, characterized in that, the heat dissipation device (10) further comprises a heat dissipation fin (18), and the heat dissipation fin (18) is accommodated in the accommodating cavity (101) and is connected with the heat dissipation fin (18). The hot end surfaces of the cooling fins (13) are in contact with each other, the circuit board (12) is located between the heat dissipation fins (18) and the waterproof spacer (14), and the heat dissipation fins (18) surround the fan (17). Outer edge settings. 7.根据权利要求5所述的散热装置,其特征在于,该散热装置(10)还包括挡风板(171),该挡风板(171)容纳于该容纳腔(101)内并位于该风扇(17)朝向该进风口(104)的一侧,该挡风板(171)用于防止气体从该进风口(104)吹出。7. The heat dissipation device according to claim 5, characterized in that, the heat dissipation device (10) further comprises a wind shield (171), and the wind shield (171) is accommodated in the accommodating cavity (101) and located in the The fan (17) faces the side of the air inlet (104), and the wind baffle (171) is used to prevent the air from blowing out of the air inlet (104). 8.根据权利要求7所述的散热装置,其特征在于,该散热装置(10)还包括灯光组件(19),该灯光组件(19)容纳于该容纳腔(101)内并与该电路板(12)电性连接,该挡风板(171)连接于该灯光组件(19)远离该进风口(104)的一侧。8. The heat dissipation device according to claim 7, characterized in that, the heat dissipation device (10) further comprises a lighting assembly (19), and the lighting assembly (19) is accommodated in the accommodating cavity (101) and is connected with the circuit board (12) Electrical connection, the wind deflector (171) is connected to the side of the lighting assembly (19) away from the air inlet (104). 9.根据权利要求8所述的散热装置,其特征在于,该灯光组件(19)包括灯罩(191)和灯板(192),该灯罩(191)安装在该外壳(11)上,该灯板(192)设于该灯罩(191)和该挡风板(171)之间,该灯板(192)朝向该灯罩(191)的一侧设有灯珠(192a)。9. The heat dissipation device according to claim 8, characterized in that, the lighting assembly (19) comprises a lampshade (191) and a lamp board (192), the lampshade (191) is mounted on the housing (11), and the lamp The plate (192) is arranged between the lampshade (191) and the wind shield (171), and a lamp bead (192a) is provided on the side of the lamp plate (192) facing the lampshade (191). 10.根据权利要求1-9任一项所述的散热装置,其特征在于,该防水隔片(14)与该电路板(12)通过胶水固定。10. The heat dissipation device according to any one of claims 1-9, wherein the waterproof spacer (14) and the circuit board (12) are fixed by glue.
CN202120804370.6U 2021-04-20 2021-04-20 Heat sink device Active CN215121665U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116780748A (en) * 2023-08-16 2023-09-19 广东泰琪丰电子有限公司 Uninterruptible power supply with waterproof function and waterproof control method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116780748A (en) * 2023-08-16 2023-09-19 广东泰琪丰电子有限公司 Uninterruptible power supply with waterproof function and waterproof control method thereof
CN116780748B (en) * 2023-08-16 2023-12-19 广东泰琪丰电子有限公司 Uninterruptible power supply with waterproof function and waterproof control method thereof

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