CN218336867U - Radiator with atmosphere lamp function - Google Patents
Radiator with atmosphere lamp function Download PDFInfo
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- CN218336867U CN218336867U CN202221233460.5U CN202221233460U CN218336867U CN 218336867 U CN218336867 U CN 218336867U CN 202221233460 U CN202221233460 U CN 202221233460U CN 218336867 U CN218336867 U CN 218336867U
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- heat
- lamp
- heat sink
- radiator
- shell
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- 230000017525 heat dissipation Effects 0.000 claims description 61
- 239000004065 semiconductor Substances 0.000 claims description 47
- 238000005057 refrigeration Methods 0.000 claims description 36
- 238000001816 cooling Methods 0.000 claims description 13
- 239000011324 bead Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 9
- 230000005389 magnetism Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009423 ventilation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model belongs to the field of radiators, in particular to a radiator with an atmosphere lamp function, which is characterized in that the radiator comprises a shell, a radiating component, a lamp panel and a lamp shade, wherein the front end of the shell is provided with a fixing position for fixing on an external structure to be radiated; the lamp shade is fixed to be set up in the shell rear end, the lamp plate sets up between lamp shade and shell. In the radiator, the radiator is fixed on an external structure to be radiated through a fixing position, and the external structure to be radiated is radiated through a radiating component so as to realize the radiating effect; and can shine through the lamp plate that sets up at the shell rear end simultaneously for this radiator still has the function of atmosphere lamp in the radiating, and the function is abundanter, more can satisfy consumer's demand.
Description
Technical Field
The utility model belongs to the radiator field, in particular to a radiator structure.
Background
The heat radiator is a device or an instrument which transfers heat generated by machinery or other appliances in the working process in time so as to avoid influencing the normal work of the machinery or other appliances. Common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode. Most of the existing radiators only have a heat dissipation function, and the existing radiators are single in function and cannot meet the requirements of consumers.
As disclosed in the publication 1, an expandable mobile phone heat sink with an external fan is disclosed, which mainly includes: external radiator fan, external radiator fan support, external radiator fan electrically conducts interface (pogo pin connector), external extended circuit interface (pogo pin connector) of cell-phone radiator, external extended circuit interface (plug-in terminal connector) of cell-phone radiator, cell-phone radiator shell, circuit module, semiconductor refrigeration piece, left handle, right handle, cell-phone radiator side air outlet safety cover, cell-phone radiator semiconductor refrigeration piece heat dissipation module, cell-phone radiator back fan safety cover, radiator front panel, through the semiconductor refrigeration piece is to cell-phone back refrigeration cooling, through external radiator fan is to the cell-phone front cooling heat dissipation of cooling. The heat sink for a cellular phone disclosed in the publication 1 has the drawbacks of the prior art, and only has a heat dissipation function, and thus has a single function.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model discloses a first-hand object provides a radiator with atmosphere lamp function, and this radiator not only has the heat dissipation function, still has the atmosphere lamp function, and the function is abundanter.
In order to achieve the above object, the technical solution of the present invention is as follows.
A radiator with an atmosphere lamp function is characterized by comprising a shell, a radiating assembly, a lamp panel and a lampshade, wherein the front end of the shell is provided with a fixing position for fixing an external structure to be radiated; the lamp shade is fixed to be set up in the shell rear end, the lamp plate sets up between lamp shade and shell. In the radiator, the fixing position is fixed on an external structure to be radiated, and the radiating assembly is used for radiating the external structure to be radiated so as to realize the radiating effect; and can shine through the lamp plate that sets up at the shell rear end simultaneously for this radiator still has the function of atmosphere lamp in the radiating, and the function is abundanter, more can satisfy consumer's demand.
Here, the structure of the heat dissipation assembly may be implemented in various ways, such as a fan heat dissipation structure, a semiconductor refrigeration heat dissipation structure, a water cooling heat dissipation structure, and other heat dissipation structures; the fixing position can be fixed in various ways, such as magnetic attraction, screw connection and the like.
Furthermore, radiator unit is including semiconductor refrigeration piece, heat conduction bottom plate, the heat conduction bottom plate is fixed to be set up at the shell front end, fixed position is in heat conduction bottom plate one side, the semiconductor refrigeration piece is located between heat conduction bottom plate and the shell front end, just the laminating of semiconductor refrigeration piece cold junction is on heat conduction bottom plate opposite side. The semiconductor refrigerating sheet dissipates heat to the external structure through the heat-conducting bottom plate.
Furthermore, a magnetic attraction piece is arranged between the front end of the shell and the heat conduction bottom plate. The radiator is magnetically attracted on the external structure through the magnetic attraction piece, so that the radiator is convenient to use.
Furthermore, the heat dissipation assembly also comprises a heat dissipation fan, the heat dissipation fan is arranged in the shell, and the heat dissipation fan corresponds to the hot end of the semiconductor refrigeration sheet; the shell is provided with an air inlet and an air outlet corresponding to the heat dissipation fan. The arrangement of the heat radiation fan, the air inlet and the air outlet enables external air flow to continuously take away heat at the hot end of the semiconductor refrigeration piece, so that heat radiation is conducted inside the radiator.
The power supply of the radiator can also be supplied in various ways, such as supplying power to the semiconductor refrigeration piece and the radiator fan by a self-contained battery; or an external power supply interface can be arranged to supply power through an external power supply (such as a charger or commercial power).
Furthermore, the heat dissipation assembly further comprises a heat dissipation support, the hot end of the semiconductor refrigeration sheet is attached to the front side of the heat dissipation support, the heat dissipation fan is fixedly arranged on the rear side of the heat dissipation support, a plurality of heat dissipation protrusions are arranged on the rear side of the heat dissipation support, and the heat dissipation protrusions correspond to the air inlet. The fan radiates the heat end of the semiconductor refrigerating sheet through the radiating support, so that the heat of the heat end of the semiconductor refrigerating sheet can be continuously taken away by external air flow.
Furthermore, a first mounting groove for mounting the semiconductor refrigeration piece is formed in the front side of the heat dissipation support, the semiconductor refrigeration piece is arranged in the first mounting groove, and the hot end of the semiconductor refrigeration piece is attached to the side face of the first mounting groove. The arrangement of the first mounting groove enables the semiconductor refrigeration piece to be mounted more stably, the contact area of the semiconductor refrigeration piece and the heat dissipation support is larger, and the heat dissipation effect of the heat dissipation support can be improved.
Furthermore, the heat dissipation fan is arranged in the middle of the heat dissipation support, the plurality of heat dissipation protrusions are arranged on the outer side of the heat dissipation fan in a surrounding mode, more than two air inlets corresponding to the plurality of heat dissipation protrusions are arranged on the side face of the shell in a surrounding mode, and the more than two air inlets are arranged on the outer side of the heat dissipation fan in a surrounding mode. The heat dissipation bulge is arranged around the outer side of the heat dissipation fan, and the heat dissipation bulge, the heat dissipation bulge and more than two air inlets are arranged, so that the heat dissipation effect inside the heat sink can be enhanced.
Furthermore, a heat insulation sheet is arranged between the front end of the shell and the heat conduction bottom plate, an avoidance hole is formed in the middle of the heat insulation sheet corresponding to the semiconductor refrigeration sheet, and the cold end of the semiconductor refrigeration sheet penetrates through the avoidance hole; the side edge of the heat insulation sheet is provided with an annular groove surrounding the avoidance hole, the magnetic suction piece is of an annular structure, and the magnetic suction piece is arranged in the annular groove; the cold end of the semiconductor refrigeration piece and the front side face of the magnetic suction piece are flush with the front side face of the heat insulation piece, and the cold end of the semiconductor refrigeration piece and the front side face of the magnetic suction piece are attached to the heat conduction bottom plate.
Furthermore, the rear end of the air outlet is also provided with a shading support, the shading support is arranged between the lamp plate and the lampshade, a plurality of shading holes are formed in the shading support, a plurality of LED lamp beads are arranged on the lamp plate and are respectively arranged in the shading holes, and the LED lamp beads correspond to the lampshade through the corresponding shading holes. The shading holes of the shading support can avoid mutual interference among the plurality of LED lamp beads, so that the plurality of LED lamp beads have better luminous effect.
Further, the air outlet is located the shell rear end, and shading support, lamp plate and lamp shade are the loop configuration, shading support, lamp plate and lamp shade encircle in the air outlet outside.
Furthermore, a light guide hole corresponding to the air outlet is formed in the light shielding support, a plurality of light guide grooves are formed in the light shielding support, the plurality of light shielding holes are formed in the side edge of the light guide hole, one ends of the plurality of light guide grooves are respectively communicated with the plurality of light shielding holes, and the other ends of the plurality of light guide grooves are communicated with the light guide hole. The arrangement of the light guide holes enables light emitted by the LED lamp beads to be guided out from the air outlet, and the light effect of the radiator is better.
Furthermore, a protection part is fixedly arranged at the air guide hole, a plurality of air penetrating holes are formed in the protection part, and the heat dissipation fan corresponds to the air outlet through the air penetrating holes. The arrangement of the protection part can effectively protect the cooling fan and prevent an external structure from damaging the cooling fan through the air outlet; the user can be protected, and fingers of the user are prevented from extending into the radiating fan through the air outlet; the arrangement of the ventilation holes does not influence the heat dissipation fan to drive the air flow to be discharged from the air outlet.
Furthermore, a light-equalizing membrane is arranged between the shading support and the lampshade. The light-homogenizing film is a 3D light-homogenizing film.
Furthermore, a pickup microphone is also arranged on the lamp panel. The pickup microphone is prior art, through the setting of this structure, can be so that this atmosphere lamp has the pickup function, and the function is abundanter.
The utility model has the advantages that in the radiator, the radiator is fixed on the external structure to be cooled through the fixing position, and the external structure to be cooled is cooled through the cooling component, so as to realize the cooling effect; and can shine through the lamp plate that sets up at the shell rear end simultaneously for this radiator still has the function of atmosphere lamp in the radiating, and the function is abundanter, more can satisfy consumer's demand.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
Fig. 3 is a cross-sectional view of the present invention.
Fig. 4 is a schematic structural view of the light shielding bracket.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-4, a radiator with an atmosphere lamp function is characterized in that the radiator comprises a shell 1, a radiating component, a lamp panel 2 and a lampshade 3, wherein a fixing position for fixing on an external structure to be radiated is arranged at the front end of the shell 1, the radiating component is fixedly arranged at the front end of the shell 1, and the radiating component corresponds to the fixing position; the lamp shade 3 is fixed to be set up in 1 rear end of shell, and lamp plate 2 sets up between lamp shade 3 and shell 1. And the lamp panel is also provided with a pickup microphone.
In this embodiment, radiator unit is including semiconductor refrigeration piece 4, heat conduction bottom plate 5, and heat conduction bottom plate 5 is fixed to be set up at 1 front end of shell, and fixed position is located 5 one sides of heat conduction bottom plate, and semiconductor refrigeration piece 4 is located between 5 and the 1 front end of shell of heat conduction bottom plate, and the laminating of 4 cold junctions of semiconductor refrigeration piece is on 5 opposite sides of heat conduction bottom plate. The semiconductor chilling plates 4 are prior art.
In this embodiment, a magnetic member 6 is disposed between the front end of the housing 1 and the heat conductive bottom plate 5. A magnetic element 6. Preferably a magnet.
In this embodiment, the heat dissipation assembly further includes a heat dissipation fan 7, the heat dissipation fan 7 is disposed in the housing 1, and the heat dissipation fan 7 corresponds to the hot end of the semiconductor chilling plate 4; the housing 1 is provided with an air inlet 11 and an air outlet 12 corresponding to the heat dissipation fan 7.
In this embodiment, the heat dissipation assembly further includes a heat dissipation bracket 8, the hot end of the semiconductor cooling plate 4 is attached to the front side of the heat dissipation bracket 8, the heat dissipation fan 7 is fixedly disposed at the rear side of the heat dissipation bracket 8, the rear side of the heat dissipation bracket 8 is provided with a plurality of heat dissipation protrusions 81, and the heat dissipation protrusions 81 correspond to the air inlet 11.
In this embodiment, the front side of the heat dissipation bracket 8 is provided with a first mounting groove 82 for mounting the semiconductor refrigeration piece 4, the semiconductor refrigeration piece 4 is arranged in the first mounting groove 82, and the hot end of the semiconductor refrigeration piece 4 is attached to the side surface of the first mounting groove 82.
In this embodiment, the heat dissipating fan 7 is disposed in the middle of the heat dissipating bracket 8, the plurality of heat dissipating protrusions 82 are disposed around the outside of the heat dissipating fan 7, the side surface of the housing 1 is disposed around the two or more air inlets 11 corresponding to the plurality of heat dissipating protrusions, and the two or more air inlets 11 are disposed around the outside of the heat dissipating fan 7. The adjacent heat dissipating protrusions 82 have gaps therebetween, and the external air enters from the air inlet 11 and passes through the gaps between the plurality of heat dissipating protrusions 82, and is discharged from the air outlet 12 under the guidance of the heat dissipating fan 7, so that the process is circulated to continuously dissipate heat from the heat dissipating support 8 and the heat dissipating protrusions 82 thereon.
In the embodiment, a heat insulation sheet 9 is arranged between the front end of the shell 1 and the heat conduction bottom plate 5, an avoidance hole 91 is arranged in the middle of the heat insulation sheet 9 corresponding to the semiconductor refrigeration sheet 4, and the cold end of the semiconductor refrigeration sheet 4 penetrates through the avoidance hole 91; the side edge of the heat insulation sheet 9 is provided with an annular groove 92 surrounding the avoidance hole 91, the magnetic suction piece 6 is of an annular structure, and the magnetic suction piece 6 is arranged in the annular groove 92; the cold end of the semiconductor refrigeration piece 4 and the front side face of the magnetic suction piece 6 are flush with the front side face of the heat insulation piece 9, and the three are attached to the heat conduction bottom plate 5.
In this embodiment, the rear end of the air outlet 12 is further provided with a light shielding support 13, the light shielding support 13 is arranged between the lamp panel 2 and the lampshade 3, the light shielding support 13 is provided with a plurality of light shielding holes 131, the lamp panel 2 is provided with a plurality of LED lamp beads, the plurality of LED lamp beads are respectively arranged in the plurality of light shielding holes 131, and the LED lamp beads correspond to the lampshade 3 through the corresponding light shielding holes 131.
In this embodiment, the air outlet 12 is located the shell 1 rear end, and shading support 13, lamp plate 2 and lamp shade 3 are the loop configuration, and shading support 13, lamp plate 2 and lamp shade 3 encircle in the air outlet 12 outside.
In this embodiment, the light-shielding bracket 13 is provided with a light-guiding hole 132 corresponding to the air outlet 12, the light-shielding bracket 13 is provided with a plurality of light-guiding grooves 133, the plurality of light-shielding holes 131 are all disposed at the side of the light-guiding hole 132, one end of each of the plurality of light-guiding grooves 133 is respectively communicated with the plurality of light-shielding holes 131, and the other end of each of the plurality of light-guiding grooves 133 is communicated with the light-guiding hole 132.
In the present embodiment, the air guiding hole 132 is fixedly provided with a protecting portion 134, the protecting portion 134 is provided with a plurality of ventilation holes 135, and the heat dissipation fan 7 corresponds to the air outlet 12 through the ventilation holes 135.
In the present embodiment, a light-equalizing membrane 14 is provided between the light-shielding bracket 13 and the lamp housing 3.
The present invention is not intended to be limited to the particular embodiments shown and described, and all modifications, equivalents, and improvements made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A radiator with an atmosphere lamp function is characterized by comprising a shell, a radiating assembly, a lamp panel and a lampshade, wherein the front end of the shell is provided with a fixing position for fixing an external structure to be radiated; the lamp shade is fixed to be set up in the shell rear end, the lamp plate sets up between lamp shade and shell.
2. The heat sink with atmosphere lamp function as recited in claim 1, wherein the heat dissipation assembly comprises a semiconductor refrigeration sheet and a heat conducting bottom plate, the heat conducting bottom plate is fixedly disposed at the front end of the housing, the fixing position is located at one side of the heat conducting bottom plate, the semiconductor refrigeration sheet is located between the heat conducting bottom plate and the front end of the housing, and the cold end of the semiconductor refrigeration sheet is attached to the other side of the heat conducting bottom plate.
3. The heat sink with ambience lamp function as claimed in claim 2, wherein a magnetic member is disposed between the front end of the housing and the heat conducting bottom plate.
4. The heat sink with ambience lamp function as claimed in claim 2, wherein the heat sink assembly further comprises a heat dissipating fan, the heat dissipating fan is disposed in the housing, and the heat dissipating fan corresponds to the hot end of the semiconductor cooling plate; the shell is provided with an air inlet and an air outlet corresponding to the heat dissipation fan.
5. The heat sink with atmosphere lamp function as claimed in claim 4, wherein the heat sink assembly further comprises a heat sink bracket, the hot end of the semiconductor cooling plate is attached to the front side of the heat sink bracket, the heat dissipation fan is fixedly disposed on the rear side of the heat sink bracket, the rear side of the heat sink bracket is provided with a plurality of heat dissipation protrusions, and the heat dissipation protrusions correspond to the air inlets.
6. The heat sink with the atmosphere lamp function as recited in claim 5, wherein a first mounting groove for mounting the semiconductor chilling plate is formed in the front side of the heat sink bracket, the semiconductor chilling plate is arranged in the first mounting groove, and the hot end of the semiconductor chilling plate is attached to the side surface of the first mounting groove.
7. The heat sink with ambience lamp function as claimed in claim 5, wherein the heat dissipating fan is disposed in the middle of the heat dissipating bracket, the plurality of heat dissipating protrusions are disposed around the outside of the heat dissipating fan, the side of the housing is disposed with at least two air inlets corresponding to the plurality of heat dissipating protrusions, and the at least two air inlets are disposed around the outside of the heat dissipating fan.
8. The heat sink with atmosphere lamp function as recited in claim 3, wherein a heat insulating plate is disposed between the front end of the housing and the heat conducting bottom plate, an avoiding hole is disposed in the middle of the heat insulating plate corresponding to the semiconductor refrigerating plate, and the cold end of the semiconductor refrigerating plate passes through the avoiding hole; the side edge of the heat insulation sheet is provided with an annular groove surrounding the avoidance hole, the magnetic suction piece is of an annular structure, and the magnetic suction piece is arranged in the annular groove; the semiconductor refrigeration piece cold junction all flushes with the heat shield leading flank with magnetism to inhale a leading flank, and the three all laminates on heat conduction bottom plate.
9. The heat radiator with the atmosphere lamp function according to claim 4, wherein a shading support is further arranged at the rear end of the air outlet, the shading support is arranged between the lamp panel and the lampshade, a plurality of shading holes are formed in the shading support, a plurality of LED lamp beads are arranged on the lamp panel, the LED lamp beads are respectively arranged in the shading holes, and the LED lamp beads correspond to the lampshade through the corresponding shading holes.
10. The heat radiator with the atmosphere lamp function according to claim 9, wherein the air outlet is located at the rear end of the housing, the light shielding support, the lamp panel and the lamp shade are of an annular structure, and the light shielding support, the lamp panel and the lamp shade surround the outside of the air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221233460.5U CN218336867U (en) | 2022-05-19 | 2022-05-19 | Radiator with atmosphere lamp function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221233460.5U CN218336867U (en) | 2022-05-19 | 2022-05-19 | Radiator with atmosphere lamp function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336867U true CN218336867U (en) | 2023-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221233460.5U Active CN218336867U (en) | 2022-05-19 | 2022-05-19 | Radiator with atmosphere lamp function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336867U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118981236A (en) * | 2024-10-18 | 2024-11-19 | 南昌理工学院 | A computer external heat dissipation enhancement device |
-
2022
- 2022-05-19 CN CN202221233460.5U patent/CN218336867U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118981236A (en) * | 2024-10-18 | 2024-11-19 | 南昌理工学院 | A computer external heat dissipation enhancement device |
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