CN216437855U

CN216437855U - Semiconductor refrigeration radiator

Info

Publication number: CN216437855U
Application number: CN202123022072.0U
Authority: CN
Inventors: 胡世德
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-12-04
Filing date: 2021-12-04
Publication date: 2022-05-03
Anticipated expiration: 2031-12-04

Abstract

A semiconductor refrigeration radiator, comprising a radiator body, the radiator body comprising a shell and a bottom bracket covered at the lower end opening of the shell, a cavity is formed between the shell and the bottom bracket, and a cavity is installed in the cavity. A cooling fan, a cooling module, a semiconductor refrigerating sheet and a circuit board assembly, the outer shell is a hollow shell, a through hole is formed on the bottom support, and the semiconductor refrigerating sheet is embedded in the through hole. In the utility model, a stepped surface structure is arranged on the top surface of the heat sink, the stepped surface structure forms a flange ring at a position close to the axis, and the casing is provided with a groove surface that is clamped and clamped with the flange ring, and the groove surface passes through the groove surface. Clamping with the flange ring realizes the limit assembly of the heat sink, changing the traditional installation method of the heat sink, not only can reduce the redundant connection device to save the space occupied by the heat sink, but also facilitate the production and assembly, and improve the production efficiency.

Description

Semiconductor refrigeration radiator

Technical Field

The utility model relates to a radiator technical field specifically is a semiconductor refrigeration radiator.

Background

The radiator indicates that the work heat that is used for on the accelerating device outwards gives off, thereby play and prevent equipment because self operating temperature is too high thereby lead to the effect of burning out, the radiating piece generally adopts many wing-shaped aluminum alloy spare and heating source heat-conduction to be connected and realizes heat conduction heat dissipation, the aluminum alloy advantage lies in that heat transfer performance is good, many wing-shaped structure can effectually expand the area of aluminum alloy spare and air contact, therefore, both combine to play good heat conduction radiating effect, if need strengthen its radiating effect on this basis, then the mode commonly used is add the fan on the radiating piece, utilize the fan to form the air current, the air current can effectually take away the heat that is detained around the radiating piece with higher speed when the radiator gives off, thereby play better radiating effect.

In recent two years, due to the rapid development of the live broadcast industry and the rapid rise of network games, mobile phones and game machines are always in a high-frequency continuous running state, and the heat productivity in the state is quite large, so that the phenomenon that the mobile phones or the game machines are burnt out due to overheating can occur without attention, and in order to overcome the phenomenon, external radiators are clamped by the mobile phones and the game machines in the market, the equipment solves the problem that the mobile phones and the game machines process high-energy heating in an abnormal working state for a long time, and a semiconductor refrigerating piece is applied to realize high-energy refrigeration, so that the normal work of the mobile phones and the game machines can be guaranteed.

Meanwhile, since the heat sink is basically used together with a mobile phone or a game machine in this case, portability is particularly important for the heat sink, and therefore, the smaller the volume of the heat sink body, the more the heat sink body meets the use requirements of consumers, and therefore, optimization of structural assembly becomes crucial.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor refrigeration radiator through configuration optimization, changes the mounting means of traditional radiating piece, not only can practice thrift the occupation space of radiating piece, makes things convenient for the production equipment moreover, has improved production efficiency, can also play the effect of consolidating radiator body rigid structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor refrigeration radiator comprises a radiator body, wherein the radiator body comprises a shell and a bottom surface support covered at an opening at the lower end of the shell, a containing cavity is formed between the shell and the bottom surface support, a cooling fan, a cooling module, a semiconductor refrigeration sheet and a circuit board assembly are installed in the containing cavity, the shell is a hollow shell, a through hole is formed in the bottom surface support, the semiconductor refrigeration sheet is embedded in the through hole, a conduction plate covers one side of the bottom surface support, away from the shell, and is in conduction connection with the semiconductor refrigeration sheet, the cooling module is arranged on one side of the semiconductor refrigeration sheet, facing the shell, and is in conduction connection with the cooling module, the cooling fan is arranged on the cooling module, the end face of the cooling module, facing one side of the shell, is of a step face structure, and the step face close to the axis is upwards protruded to form a flange ring, and a groove surface is arranged on the inner wall surface of the shell at a position corresponding to the flange ring, and the flange ring is clamped in the groove surface to realize limiting installation.

Preferably, the semiconductor refrigeration piece and the cooling fan are both electrically connected with the circuit board assembly.

Preferably, inlay on the shell and be equipped with the leaded light spare, circuit board components electric connection is provided with the lamp plate, all be provided with luminous lamp pearl on circuit board components and the lamp plate, the relative luminous lamp pearl of leaded light spare sets up, luminous direction orientation leaded light spare of luminous lamp pearl sets up.

Preferably, the circuit board assembly is electrically connected with a control key and a USB interface, and the control key and the USB interface are both arranged in a through hole preset in the housing and extend out of the through hole.

Preferably, an electroplating decoration is attached to the outer wall surface of the shell.

Preferably, one side of the semiconductor refrigeration piece, which faces the conduction plate, is a refrigeration surface, and one side of the semiconductor refrigeration piece, which faces the heat dissipation module, is a heat dissipation surface.

Preferably, a protection gasket is arranged on one side, away from the semiconductor refrigeration sheet, of the conduction plate.

Preferably, the elastic buckling claws are elastically connected to the radiator body and are arranged at the edges of two opposite sides of the radiator body, and claw openings are arranged in opposite directions.

Preferably, the claw is detained including detaining claw support, reset spring, apron and claw mouth protection pad to elasticity, it is provided with spring mounting groove on the claw support to detain, all be provided with the spring fixing bolt on spring mounting groove and the radiator body, reset spring sets up in spring mounting groove and both ends respectively with two spring fixing bolt fixed connection, the apron lid is located on the spring mounting groove, it is "L type" support to detain the claw support, the claw mouth protection pad sets up in "L type" support medial surface department.

Compared with the prior art, the utility model discloses beneficial effect:

the utility model discloses, set up the step face structure at the top surface of the radiating piece, the step face structure forms the flange circle in the position that is close to the axle center, be provided with on the shell with the spacing recess face that clamps of flange circle, clamp through recess face and flange circle and realize the spacing assembly of radiating piece, change the mounting means of traditional radiating piece, not only can reduce unnecessary connecting device and practice thrift the occupation space of radiating piece, and convenient production equipment, and improve production efficiency, simultaneously, use the joint of radiating piece and shell to play the effect of supporting fixed shell, play the effect of reinforcing the rigid structure of radiator body, make the radiator body structure more firm, non-deformable damages; inlay on the shell and be equipped with leaded light spare, can form on the casing and dazzle various luminous effect, make the product dazzle cool more, have more science and technology and feel, be favorable to the marketing of product to be promoted.

Drawings

FIG. 1 is an exploded view of the structure of the present invention;

FIG. 2 is a schematic structural view of the present invention;

FIG. 3 is a perspective view of the first embodiment of the present invention;

fig. 4 is a perspective view of the product of the present invention.

In the figure: 1 a radiator body; 11 a housing; 111 groove faces; 112 a light guide; 113 electroplating the decorative piece; 12 a bottom bracket; 121 through holes; 13 a heat radiation fan; 14 a heat dissipation module; 141 flange rings; 142 a step surface; 15 semiconductor refrigerating sheets; 16 a circuit board assembly; 161 control keys; 162 a USB interface; 17 lamp panel; 18 luminous lamp beads; 2, a conductive plate; 3, a protective gasket; 4, elastic buckling claws; 41 between the buckling claws; 411 spring mounting slots; 412 a spring fixing bolt; 42 a return spring; 43 a cover plate; 44 jaw pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, in an embodiment of the present invention, a semiconductor refrigeration heat sink includes a heat sink body 1, the heat sink body 1 includes a housing 11 and a bottom bracket 12 covering an opening at a lower end of the housing 11, a cavity is formed between the housing 11 and the bottom bracket 12, a heat dissipation fan 13, a heat dissipation module 14, a semiconductor refrigeration sheet 15 and a circuit board assembly 16 are installed in the cavity, the housing 11 is a hollow housing, a through hole 121 is opened on the bottom bracket 12, the semiconductor refrigeration sheet 15 is embedded in the through hole 121, a conduction plate 2 is covered on a side of the bottom bracket 12 away from the housing 11, the conduction plate 2 covers the through hole 121 and is in conduction connection with the semiconductor refrigeration sheet 15, the heat dissipation module 14 is arranged on a side of the semiconductor refrigeration sheet 15 facing the housing 11, the semiconductor refrigeration sheet 15 is in conduction connection with the heat dissipation module 14, the heat generated by the mobile phone in use can be transferred to the semiconductor refrigeration piece 15 through the conduction plate 2, so as to achieve the purpose of heat dissipation and cooling, the heat dissipation module 14 is provided with the heat dissipation fan 13, the end surface of one side of the heat dissipation module 14 facing the housing 11 is of a step surface 142 structure, the step surface 142 close to the axis protrudes upwards to form a flange ring 141, the inner wall surface of the housing 11 is provided with a groove surface 111 at a position corresponding to the flange ring 141, and the flange ring 141 is clamped in the groove surface 111 to achieve limiting installation. The arrangement changes the mounting mode of the traditional heat dissipation piece, not only can reduce the occupation space of the redundant connecting device for saving the heat dissipation piece, but also is convenient for production and assembly.

Semiconductor refrigeration piece 15 and radiator fan 13 all with circuit board assembly 16 electric connection, semiconductor refrigeration piece 15 is the refrigeration face towards 2 one sides of conducting plate, is the cooling surface towards 14 one sides of heat radiation module, conducting plate 2 is kept away from 15 one sides of semiconductor refrigeration piece and is provided with protective pad 3, can reduce the friction of cell-phone and radiator body 1, avoids scraping colored wearing and tearing cell-phone.

The last leaded light 112 that is equipped with that inlays of

shell

11, 16 electric connection of circuit board subassembly is provided with lamp plate 17, all be provided with luminous lamp pearl 18 on circuit board subassembly 16 and the lamp plate 17, luminous lamp pearl 18 setting relatively of leaded light 112, luminous direction of luminous lamp pearl 18 sets up towards leaded light 112, can form on the casing and dazzle various luminous effects, makes the product dazzle cool more, has more scientific and technological sense, electric connection is provided with control button 161 and USB interface 162 on the circuit board subassembly 16, control button 161 and USB interface 162 all set up in the through-hole that shell 11 predetermines to outwards stretch out from the through-hole.

The outer wall surface of the housing 11 is provided with an electroplated decoration 113 in a fitting manner, so that the whole radiator body 1 has more aesthetic property.

Claw 4 is detained to elastic connection elasticity on radiator body 1, claw 4 is detained to elasticity sets up in radiator body 1 both sides edge in opposite directions and the claw mouth sets up in opposite directions, claw 4 is detained including detaining claw support 41, reset spring 42, apron 43 and claw mouth protection pad 44 to elasticity, it is provided with spring mounting groove 411 on the claw support 41 to detain, all be provided with spring fixing bolt 412 on spring mounting groove 411 and the radiator body 1, reset spring 42 sets up in spring mounting groove 411 and both ends respectively with two spring fixing bolt 412 fixed connection, apron 43 lid is located on spring mounting groove 411, it is "L type" support to detain claw support 41, claw mouth protection pad 44 sets up in "L type" support medial surface department, can firmly the centre gripping cell-phone be convenient for the heat dissipation, and the setting of claw mouth protection pad 44 has certain guard action to the cell-phone.

In summary, the following steps: the utility model discloses, set up the step face structure at the top surface of the radiating piece, the step face structure forms the flange circle in the position that is close to the axle center, be provided with on the shell with the spacing recess face that clamps of flange circle, clamp through recess face and flange circle and realize the spacing assembly of radiating piece, change the mounting means of traditional radiating piece, not only can reduce unnecessary connecting device and practice thrift the occupation space of radiating piece, and convenient production equipment, and improve production efficiency, simultaneously, use the joint of radiating piece and shell to play the effect of supporting fixed shell, play the effect of reinforcing the rigid structure of radiator body, make the radiator body structure more firm, non-deformable damages; inlay on the shell and be equipped with the leaded light spare, can form on the casing and dazzle various luminous effect, make the product dazzle cool more, have more scientific and technological sense, be favorable to the marketing of product to promote.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor refrigeration radiator comprises a radiator body (1), wherein the radiator body (1) comprises a shell (11) and a bottom surface support (12) covered at an opening at the lower end of the shell (11), a cavity is formed between the shell (11) and the bottom surface support (12), a heat radiation fan (13), a heat radiation module (14), a semiconductor refrigeration sheet (15) and a circuit board assembly (16) are installed in the cavity, the shell (11) is a hollow shell, a through hole (121) is formed in the bottom surface support (12), the semiconductor refrigeration sheet (15) is embedded in the through hole (121), a conduction plate (2) is covered on one side, away from the shell (11), of the bottom surface support (12), the conduction plate (2) covers the through hole (121) and is in conduction connection with the semiconductor refrigeration sheet (15), the heat radiation module (14) is arranged on one side, facing the shell (11), of the semiconductor refrigeration sheet (15), semiconductor refrigeration piece (15) and heat radiation module (14) conduction are connected, be provided with radiator fan (13) on heat radiation module (14), its characterized in that: the end face of one side, facing the shell (11), of the heat dissipation module (14) is of a stepped face (142) structure, the stepped face (142) close to the axis protrudes upwards to form a flange ring (141), a groove face (111) is arranged on the inner wall face of the shell (11) at a position corresponding to the flange ring (141), and the flange ring (141) is clamped in the groove face (111) to achieve limiting installation.

2. A semiconductor refrigeration and heat dissipation device as recited in claim 1, wherein: the semiconductor refrigerating sheet (15) and the cooling fan (13) are electrically connected with the circuit board assembly (16).

3. A semiconductor refrigeration and heat dissipation device as recited in claim 1, wherein: the LED lamp is characterized in that a light guide part (112) is embedded on the shell (11), the circuit board assembly (16) is electrically connected with the lamp panel (17), light-emitting lamp beads (18) are arranged on the circuit board assembly (16) and the lamp panel (17), the light guide part (112) is arranged opposite to the light-emitting lamp beads (18), and the light-emitting direction of the light-emitting lamp beads (18) is arranged towards the light guide part (112).

4. A semiconductor refrigeration radiator according to any one of claims 1, 2 and 3, wherein: the circuit board assembly (16) is electrically connected with a control key (161) and a USB interface (162), and the control key (161) and the USB interface (162) are arranged in a through hole preset in the shell (11) and extend out of the through hole.

5. A semiconductor refrigeration radiator according to claim 1 or 3, wherein: and an electroplating decoration (113) is attached to the outer wall surface of the shell (11).

6. A semiconductor refrigeration and heat dissipation device as recited in claim 1, wherein: the semiconductor refrigerating sheet (15) is a refrigerating surface facing one side of the conducting plate (2) and a radiating surface facing one side of the radiating module (14).

7. The semiconductor refrigeration radiator of claim 1 or 6, wherein: and a protective gasket (3) is arranged on one side, away from the semiconductor refrigeration sheet (15), of the conduction plate (2).

8. A semiconductor refrigeration and heat dissipation device as recited in claim 1, wherein: the heat radiator is characterized in that the heat radiator body (1) is elastically connected with elastic buckling claws (4), and the elastic buckling claws (4) are arranged at the edges of two opposite sides of the heat radiator body (1) and the claw openings are arranged oppositely.

9. A semiconductor refrigeration and heat dissipation device as recited in claim 8, wherein: elasticity is detained claw (4) and is including detaining claw support (41), reset spring (42), apron (43) and claw mouth protection pad (44), it is provided with spring mounting groove (411) on claw support (41) to detain, all be provided with spring fixing bolt (412) on spring mounting groove (411) and radiator body (1), reset spring (42) set up in spring mounting groove (411) and both ends respectively with two spring fixing bolt (412) fixed connection, apron (43) lid is located on spring mounting groove (411), it is "L type" support to detain claw support (41), claw mouth protection pad (44) set up in "L type" support medial surface department.