CN219834718U - Heat radiating device of electronic equipment - Google Patents

Abstract

The utility model discloses a heat dissipating device of electronic equipment, which comprises a liquid cooling plate and a clamping mechanism, wherein the liquid cooling plate is provided with a liquid inlet, a liquid outlet and a micro-channel arranged between the liquid inlet and the liquid outlet, and the micro-channel is used for circulating cooling liquid; the clamping mechanism comprises a first clamping part and a second clamping part which are respectively arranged at two opposite sides of the liquid cooling plate and used for clamping and attaching the electronic equipment placed on the liquid cooling plate; the first clamping part and the second clamping part comprise an L-shaped clamp and a push-pull module, the push-pull module is fixed on one side of the liquid cooling plate, which is opposite to the electronic equipment, the L-shaped clamp comprises a connecting plate and a clamping plate which are arranged perpendicular to each other, the clamping plate is opposite to the side edge of the liquid cooling plate, the connecting plate is connected to the push-pull module, and the clamping plate is driven to move towards the liquid cooling plate under the driving of the push-pull module so as to clamp the electronic equipment placed on the liquid cooling plate from the opposite two side edges of the liquid cooling plate. According to the technical scheme, electronic equipment with different specifications and sizes can be clamped and attached to the liquid cooling plate, and efficient heat dissipation of the electronic equipment is achieved through the liquid cooling plate.

Description

Heat radiating device of electronic equipment

Technical Field

The present utility model relates to the field of electronic device heat dissipation technologies, and in particular, to a heat dissipation device for an electronic device.

Background

With the continuous iterative upgrade of the hardware of consumer electronic devices such as mobile phones and tablets, the computing processing task executed by the device is more complex, and especially high-power consumption chips such as a CPU (Central processing Unit) are afflicted with high heat. In order to ensure safe and normal operation of such electronic devices, a good heat dissipation design becomes extremely important.

In the prior art, besides the heat dissipation design of the electronic equipment, an external auxiliary heat dissipation device is gradually developed and applied, especially when a mobile phone and a tablet are used for running a large-scale game, the heat productivity is extremely high, and the peripheral heat dissipation device can quickly reduce the temperature of the peripheral heat dissipation device and improve the running efficiency of chips such as a CPU. The external auxiliary heat dissipation device mostly adopts air cooling heat dissipation, but for high-power consumption electronic products, the cooling performance of the peripheral fan is poor, and the cooling performance is poor.

Disclosure of Invention

The utility model provides a heat dissipation device of electronic equipment, which aims to solve the problem of poor heat dissipation effect of an external auxiliary heat dissipation device in the prior art.

In order to achieve the above object, the present utility model provides a heat dissipating device for an electronic device, including:

the liquid cooling plate is provided with a liquid inlet, a liquid outlet and a micro-flow channel arranged between the liquid inlet and the liquid outlet, and the micro-flow channel is used for circulating cooling liquid;

the clamping mechanism comprises a first clamping part and a second clamping part, and the first clamping part and the second clamping part are respectively arranged on two opposite sides of the liquid cooling plate and are used for clamping and attaching electronic equipment placed on the liquid cooling plate; wherein,,

the first clamping part and the second clamping part comprise L-shaped clamps and at least one push-pull module, the push-pull modules are fixed on one sides of the liquid cooling plate and the electronic equipment, the L-shaped clamps comprise connecting plates and clamping plates which are arranged vertically, the clamping plates are arranged opposite to the side edges of the liquid cooling plate, the connecting plates are connected to the push-pull modules of the clamping parts where the connecting plates are arranged, the clamping plates are driven to move towards the liquid cooling plate under the driving of the push-pull modules, and the first clamping parts and the second clamping parts respectively clamp the electronic equipment placed on the liquid cooling plate from the opposite side edges of the liquid cooling plate.

In some embodiments, the push-pull module includes a fixed block, a connecting rod and an elastic member, the connecting rod is fixedly connected to the liquid cooling plate through the fixed block, the connecting plate is movably connected with the fixed block through the connecting rod, and the elastic member is used for applying an elastic force to the connecting plate, wherein the elastic force is close to the fixed block.

In some embodiments, a sliding groove is concavely arranged on one side, close to the push-pull module, of the connecting plate, a limiting step is arranged on the position, close to the notch, of the sliding groove, the push-pull module further comprises a limiting block, two ends of the connecting rod are respectively connected with the fixed block and the limiting block, the limiting block is arranged in the sliding groove, and the limiting block is matched with the limiting step to limit the moving path of the connecting plate.

In some embodiments, the elastic piece is arranged between the fixed block and the connecting plate and is used for pulling the L-shaped clamp to move towards the fixed block; the elastic piece is a tension spring, one end of the elastic piece is connected with the fixed block, and the other end of the elastic piece is connected with the connecting plate;

in some embodiments, the elastic piece is arranged between the limiting block and the limiting step and is used for pushing the L-shaped clamp to move towards the fixed block; the elastic piece is a pressure spring, is sleeved on the connecting rod between the limiting block and the limiting step, and is abutted to one end of the connecting rod and the limiting step.

In some embodiments, the plurality of groups of push-pull modules in each clamping part are fixedly arranged on the liquid cooling plate, and the same number of sliding grooves are arranged on the connecting plate corresponding to the plurality of groups of push-pull modules.

In some embodiments, the clamping plate is provided with a profiling groove corresponding to the frame of the electronic device, so as to be used for clamping and stabilizing the clamped electronic device.

In some embodiments, the micro-fluidic channel is S-shaped, and includes a plurality of straight line segments and a plurality of bent segments formed by repeated bending, and a plurality of the straight line segments are arranged in parallel.

In some embodiments, the cross-sectional shape of the microchannel is circular or elliptical.

In some embodiments, the liquid cooling plate is used for being attached to one side of the electronic device, and a heat conducting piece is arranged on the side of the liquid cooling plate, and the heat conducting piece is heat conducting silica gel.

Compared with the prior art, the technical scheme of the utility model provides the heat dissipation device of the electronic equipment, which comprises the liquid cooling plate and the clamping mechanism, wherein the liquid cooling plate is a micro-channel liquid cooling plate, the clamping mechanism comprises the first clamping part and the second clamping part, the first clamping part and the second clamping part both comprise L-shaped clamps capable of moving towards the side edges of the liquid cooling plate, so that the clamping mechanism can adapt to the electronic equipment with different sizes and specifications, the electronic equipment is clamped and attached to the liquid cooling plate from two sides, the heat dissipation device and the electronic equipment are combined, efficient liquid cooling and heat dissipation are carried out based on the micro-channel liquid cooling plate, the electronic equipment is cooled in time, and the use function experience of the electronic equipment is ensured.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipating device of an electronic device according to an embodiment of the utility model;

FIG. 2 is a schematic side view of a heat dissipating device of an electronic device according to an embodiment of the utility model;

FIG. 3 is a schematic cross-sectional view of a clamping portion according to an embodiment of the present utility model;

fig. 4 is a schematic cross-sectional view of a liquid cooling plate according to an embodiment of the utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1-4, the present utility model provides a heat dissipating device 100 of an electronic apparatus, including: a liquid cooling plate 10 and a clamping mechanism 20. The liquid cooling plate 10 is provided with a liquid inlet 110, a liquid outlet 120 and a micro flow channel 130 arranged between the liquid inlet 110 and the liquid outlet 120, wherein the micro flow channel 130 is used for circulating cooling liquid; the clamping mechanism 20 comprises a first clamping part 210 and a second clamping part 220, wherein the first clamping part 210 and the second clamping part 220 are respectively arranged on two opposite sides of the liquid cooling plate 10 and are used for clamping and attaching electronic equipment placed on the liquid cooling plate 10; the first clamping portion 210 and the second clamping portion 220 each include an L-shaped clamp 21 and at least one push-pull module 22, the push-pull modules 22 are fixed on one side of the liquid cooling plate 10 opposite to the electronic device, the L-shaped clamp 21 includes a connecting plate 211 and a clamping plate 212 that are perpendicular to each other, the clamping plate 212 is opposite to the side of the liquid cooling plate 10, the connecting plate 211 is connected to the push-pull module 22 of the clamping portion where the connecting plate 211 is located, and the push-pull modules 22 are used for driving the clamping plate 212 to move towards the liquid cooling plate 10 under the driving of the push-pull modules 22, so that the first clamping portion 210 and the second clamping portion 220 clamp the electronic device placed on the liquid cooling plate 10 from two opposite sides of the liquid cooling plate 10.

The electronic device may be an intelligent device such as a mobile phone, a tablet computer, etc., and the sizes of the mobile phone and the tablet computer are smaller, so that the first clamping portion 210 and the second clamping portion 220 can be clamped and fixed from the side surface of the liquid cooling plate 10, and when the electronic device is designed, the space between two opposite sides of the liquid cooling plate 10, where the first clamping portion 210 and the second clamping portion 220 are correspondingly arranged, should be smaller than the size of the electronic device. It can be understood that after the electronic device is placed on the liquid cooling plate 10, edges of two opposite sides of the electronic device protrude from two opposite sides of the liquid cooling plate 10, and the clamping plates 212 of the L-shaped clamp 21 in each clamping portion can be driven by the push-pull module 22 to abut against and clamp the electronic device from two sides, so as to realize assembly of the electronic device and the heat dissipation device.

Further, the L-shaped clamps 21 in the first clamping portion 210 and the second clamping portion 220 always have a tendency to move toward each other under the driving of the push-pull structure corresponding thereto. When the electronic device is placed, manual intervention is needed first, the first clamping part 210 and the second clamping part 220 are placed after being moved back by overcoming the driving of the push-pull structure, and after the manual intervention is removed, the push-pull module 22 drives the first clamping part 210 and the second clamping part 220 to return, so as to clamp the electronic device. The clamping design enables the heat dissipation device to be applicable to electronic equipment with a certain size range.

And further, after the liquid cooling plate 10 is attached, the cooling liquid continuously circulated in the liquid cooling plate 10 absorbs and takes away the heat of the electronic equipment. The micro flow channels 130 are as full as possible of the liquid cooling plate 10 to increase the heat absorption area. In some preferred embodiments, the cooling liquid introduced into the micro flow channel 130 is an ethanol/water mixed solution with a strong heat exchange capability.

Referring to fig. 3, in some embodiments, the push-pull module 22 includes a fixing block 221, a connecting rod 222, and an elastic member 223, where the connecting rod 222 is fixedly connected to the liquid cooling plate 10 through the fixing block 221, the connecting plate 211 is movably connected to the fixing block 221 through the connecting rod 222, and the elastic member 223 is used to apply an elastic force to the connecting plate 211 toward the fixing block 221.

In the embodiment, the driving force of the push-pull module 22 driving the first clamping portion 210 and the second clamping portion 220 to perform the restoring action is provided by the elastic member 223, and the elastic member 223 always has elastic potential energy for restoring to the normal state, so as to drive the connecting plate 211 to move along the connecting rod 222 towards the fixing block 221 under the action of the elastic force, i.e. drive the clamping plate 212 to move towards the liquid cooling plate 10.

In some embodiments, the push-pull module 22 may also be a linear drive cylinder or the like.

Referring to fig. 3, in some embodiments, a sliding groove 2111 is concavely formed on a side of the connection plate 211 near the push-pull module 22, a limiting step 2112 is formed on a position of the sliding groove 2111 near a notch of the sliding groove, the push-pull module 22 further includes a limiting block 224, two ends of the connection rod 222 are respectively connected with the fixing block 221 and the limiting block 224, the limiting block 224 is disposed in the sliding groove 2111, and the limiting block 224 is matched with the limiting step 2112 to limit a moving path of the connection plate 211.

In this embodiment, the L-shaped clamp 21 can complete its movement through the connection relationship between the connection plate 211 and the push-pull module 22. Specifically, based on the engagement between the sliding groove 2111 and the connecting rod 222, the L-shaped clamp 21 is driven by the elastic member 223 to move along the connecting rod 222 in a direction toward the fixing block 221, and the moving direction is also a direction of the clamping plate 212 toward the side of the liquid cooling plate 10. And the limiting step 2112 can limit the movement of the limiting block 224 in the sliding groove 2111, so as to prevent the L-shaped clamp 21 from being separated from the connecting rod 222. The elastic member 223 is always in a state of releasing elastic potential energy, and in this state, the clamping plate 212 always has a movement tendency toward the side of the liquid cooling plate 10.

Referring to fig. 3, in some embodiments, an elastic member 223 is disposed between the fixing block 221 and the connecting plate 211, and is used to pull the L-shaped clamp 21 to move toward the fixing block 221, where the elastic member 223 is a tension spring, and one end of the telescopic spring sleeve is connected to the fixing block 221, and the other end is connected to the connecting plate 211. Further, the elastic member 223 is disposed between the limiting block 224 and the limiting step 2112, and is used for pushing the L-shaped clamp 21 to move towards the fixed block 221, the elastic member 223 is a compression spring, and is sleeved on the connecting rod 222 between the limiting block 224 and the limiting step 2112, one end of the elastic member abuts against the limiting block 224, and the other end of the elastic member abuts against the limiting step 2112.

In this embodiment, when the elastic member 223 is disposed between the fixing block 221 and the connecting plate 211, the elastic member 223 is a tension spring, and is elongated, and in a state of releasing elastic potential energy, the connecting plate 211 is pulled to move toward the direction of the fixing block 221, so as to drive the clamping plate 212 to attach to the side edge of the liquid cooling plate 10; while the elastic member 223 is disposed between the limiting block 224 and the limiting step 2112, the elastic member 223 is a compression spring, and is compressed, and in a state of releasing elastic potential energy, the elastic member will push the connecting plate 211 to move towards the direction of the fixing block 221, so as to drive the clamping plate 212 to attach to the side edge of the liquid cooling plate 10; or both the above two elastic members 223 are disposed in the heat dissipation device.

In some embodiments, a plurality of groups of push-pull modules 22 in each clamping part are fixedly arranged on the liquid cooling plate 10, and the connecting plates 211 are provided with the same number of sliding grooves 2111 corresponding to the plurality of groups of push-pull modules 22 so as to increase the stability of the L-shaped clamp 21; or groups of push-pull modules share the same fixed block 221.

In some embodiments, the clamping plate 212 is provided with a profiling groove (not shown in the drawings) corresponding to the frame of the electronic device, so as to be used for clamping and stabilizing the clamped electronic device.

Referring to fig. 4, in some embodiments, the micro flow channel 130 is disposed in an S shape, and includes a plurality of straight line segments 1301 and a plurality of bent segments 1302 formed by repeated bending, where the plurality of straight line segments 1301 are disposed in parallel. Further, the cross-sectional shape of the micro flow channel 130 may be circular or elliptical. Preferably, the cross-sectional shape of the micro flow channel 130 is circular, the flow channel path is S-shaped, and the flow resistance of the flow channel is greatly reduced, so that the convective heat transfer capability can be improved.

In some embodiments, a side of the liquid cooling plate 10, which is used to attach to the electronic device, is provided with a heat conducting member (not shown in the drawings), and the heat conducting member is a heat conducting silica gel. The heat-conducting silica gel not only can reduce the contact thermal resistance between the high-heat consumption consumer electronic product and the water cooling plate and increase the heat dissipation capacity, but also has certain buffering and vibration-resisting functions.

The above description of the preferred embodiments of the present utility model should not be taken as limiting the scope of the utility model, but rather should be understood to cover all modifications, variations and adaptations of the present utility model using its general principles and the following detailed description and the accompanying drawings, or the direct/indirect application of the present utility model to other relevant arts and technologies.

Claims (10)

1. A heat dissipating device for an electronic device, comprising:

the liquid cooling plate is provided with a liquid inlet, a liquid outlet and a micro-flow channel arranged between the liquid inlet and the liquid outlet, and the micro-flow channel is used for circulating cooling liquid;

the clamping mechanism comprises a first clamping part and a second clamping part, and the first clamping part and the second clamping part are respectively arranged on two opposite sides of the liquid cooling plate and are used for clamping and attaching electronic equipment placed on the liquid cooling plate; wherein,,

the first clamping part and the second clamping part comprise L-shaped clamps and at least one push-pull module, the push-pull modules are fixed on one sides of the liquid cooling plate and the electronic equipment, the L-shaped clamps comprise connecting plates and clamping plates which are arranged vertically, the clamping plates are arranged opposite to the side edges of the liquid cooling plate, the connecting plates are connected to the push-pull modules of the clamping parts where the connecting plates are arranged, the clamping plates are driven to move towards the liquid cooling plate under the driving of the push-pull modules, and the first clamping parts and the second clamping parts respectively clamp the electronic equipment placed on the liquid cooling plate from the opposite side edges of the liquid cooling plate.

2. The heat dissipating device of claim 1, wherein the push-pull module comprises a fixing block, a connecting rod and an elastic member, the connecting rod is fixedly connected to the liquid cooling plate through the fixing block, the connecting plate is movably connected with the fixing block through the connecting rod, and the elastic member is used for applying an elastic force to the connecting plate, wherein the elastic member is close to the fixing block.

3. The heat dissipating device of an electronic apparatus according to claim 2, wherein a sliding groove is concavely provided on a side of the connecting plate, which is close to the push-pull module, and a limiting step is provided on a side of the sliding groove, which is close to the notch of the sliding groove, the push-pull module further comprises a limiting block, two ends of the connecting rod are respectively connected with the fixing block and the limiting block, the limiting block is provided in the sliding groove, and the limiting block is matched with the limiting step to limit a moving path of the connecting plate.

4. A heat dissipating device for an electronic apparatus according to claim 3, wherein the elastic member is disposed between the fixing block and the connecting plate, and is configured to pull the L-shaped clip to move toward the fixing block; the elastic piece is a tension spring, one end of the elastic piece is connected with the fixed block, and the other end of the elastic piece is connected with the connecting plate.

5. The heat dissipating device of claim 3, wherein the elastic member is disposed between the stopper and the stopper step, and is configured to push the L-shaped clip to move toward the fixed block; the elastic piece is a pressure spring, is sleeved on the connecting rod between the limiting block and the limiting step, and is abutted to one end of the connecting rod and the limiting step.

6. The heat dissipating device of any of claims 1-5, wherein a plurality of groups of the push-pull modules in each clamping portion are fixedly disposed on the liquid cooling plate, and the connecting plate is provided with the same number of sliding grooves corresponding to the plurality of groups of push-pull modules.

7. The heat dissipating device of claim 6, wherein the clamping plate is provided with a profiling groove corresponding to a frame of the electronic device for clamping and stabilizing the clamped electronic device.

8. The heat dissipating device of claim 1, wherein the microchannel is S-shaped and comprises a plurality of straight line segments and a plurality of bent segments formed by repeated bending, and wherein the plurality of straight line segments are arranged in parallel.

9. The heat sink of claim 8, wherein the cross-sectional shape of the micro flow channel is circular or elliptical.

10. The heat dissipating device of claim 1, wherein the liquid cooling plate is provided with a heat conducting member on a side of the liquid cooling plate attached to the electronic device, and the heat conducting member is a heat conducting silica gel.