CN212302417U

CN212302417U - Computer CPU radiator component

Info

Publication number: CN212302417U
Application number: CN202021448002.4U
Authority: CN
Inventors: 李军; 李麟
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2021-01-05
Anticipated expiration: 2030-07-21

Abstract

The utility model discloses a computer CPU radiator component relates to heat abstractor technical field. The utility model discloses mainly include the support frame of activity joint on the computer, fixed mounting has the thermal device piece that is used for collecting CPU and gives out on the support frame, the inside of device piece has thermal-arrest piece and water-cooling converter for the internally mounted of hollow structure and device piece, the device piece is closely laminated with CPU, still install on the device piece and be used for the radiating fin of device piece, the inside fixed mounting of fin has the water tank, be connected with first heat transfer subassembly between fin and the device piece, be connected with second heat transfer subassembly between the water tank and the inside water-cooling converter of device piece. The utility model discloses combine fin and water tank into an organic whole, both can dispel the produced heat of computer CPU simultaneously, and dual cooling can make computer CPU's cooling rate improve, has guaranteed CPU's performance.

Description

Computer CPU radiator component

Technical Field

The utility model relates to a heat abstractor technical field, concretely relates to computer CPU radiator component.

Background

A Central Processing Unit (CPU), which is one of the main devices of an electronic computer, is a core accessory in the computer. Its functions are mainly to interpret computer instructions and to process data in computer software. The CPU is responsible for reading the instructions, decoding the instructions and executing the core components of the instructions in all operations in the computer. The CPU includes an arithmetic logic unit, a register unit, an arithmetic unit, a control unit, and the like.

In this information age, where the economy is getting more and more, computers have been integrated into people's lives, computers bring much convenience to people, people have higher and higher requirements on computers, however, when the computer is in use, a large amount of running programs can cause the CPU of the computer to generate a large amount of heat, the CPU can rapidly heat up, the running speed of the whole computer can be reduced and even the computer can be harmed by overhigh temperature rise of the CPU, therefore, it is necessary to research a heat dissipation component for a computer CPU, and most of the existing CPU heat dissipation components cool the computer CPU by a single heat dissipation device, such as a fan, water cooling, etc., however, such a cooling efficiency is too low, and the cooling rate may not catch up with the heating rate of the CPU, thus causing the CPU to burn out, and these devices are often fixed to the computer and are very cumbersome to remove.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the problems in the background art, the present invention provides a heat sink component for a computer CPU.

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

a computer CPU heat sink structure comprising:

one end of the support frame is clamped with a fixed block, and the fixed block is fixed on a computer;

the device block is fixedly arranged on the support frame, is attached to the CPU and is used for collecting heat generated on the CPU;

the radiating fin is fixed at one end of the supporting frame, which is far away from the CPU, and is used for radiating heat of the device block;

the water tank is fixedly arranged inside the radiating fins and used for radiating heat for the device block;

the heat conduction device comprises a first heat transfer component and a second heat transfer component, the first heat transfer component is fixedly connected between the device block and the radiating fin, and the second heat transfer component is fixedly connected between the device block and the water tank.

Preferably, the support frame includes four mutually parallel and symmetrical landing legs, the quantity of fixed block is four, four the landing leg slides the joint respectively on four fixed blocks, the other end fixed mounting of four landing legs has the supporting shoe with landing leg mutually perpendicular, device piece fixed mounting is on the one side that the supporting shoe is close to CPU, fixed mounting has four connecting rods of mutual symmetry on the another side of supporting shoe, fin fixed mounting is at the other end of connecting rod, still install radiator fan between fin and the supporting shoe.

Preferably, the device block has a hollow structure, and a heat collecting plate and a water-cooling converter are fixedly mounted in the device block.

Preferably, the first heat transfer assembly comprises a plurality of mutually symmetrical heat collecting pipes arranged on two opposite sides of the support frame, one ends of the heat collecting pipes are fixedly connected with the device block, the other ends of the heat collecting pipes are fixedly connected with the radiating fins, and heat conducting media are filled in the heat collecting pipes.

Preferably, the second heat transfer assembly includes inlet tube and outlet pipe, the one end of inlet tube runs through inside and water-cooling converter fixed connection to the device piece, the other end and the water tank fixed connection of inlet tube just run through the inside to the water tank, the one end of outlet pipe runs through inside and water-cooling converter fixed connection to the device piece, the other end and the water tank fixed connection of outlet pipe just run through the inside to the water tank.

The utility model provides a computer CPU radiator component, mainly include the support frame of activity joint on the computer, fixed mounting has the thermal device piece that is used for collecting CPU and gives out on the support frame, the inside of device piece has thermal-arrest piece and water-cooling converter for the internally mounted of hollow structure and device piece, the device piece closely laminates with CPU, still install on the device piece and be used for being the radiating fin of device piece, the inside fixed mounting of fin has the water tank, be connected with first heat transfer subassembly between fin and the device piece, be connected with second heat transfer subassembly between water tank and the device piece. The utility model discloses combine fin and water tank into an organic whole, both can dispel the produced heat of computer CPU simultaneously, and dual cooling can make computer CPU's cooling rate improve, has guaranteed CPU's performance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a front view of the present invention;

FIG. 4 is a cross-sectional view taken along the direction A-A of the present invention;

FIG. 5 is a cross-sectional view taken along the direction B-B of the present invention;

fig. 6 is a cross-sectional view in the direction of C-C of the present invention.

In fig. 1-6:

1. a support frame; 2. a device block; 3. a heat sink; 4. a water tank; 5. a first heat transfer assembly; 6. a second heat transfer assembly; 11. a fixed block; 12. a support leg; 13. a support block; 14. a connecting rod; 15. a heat radiation fan; 51. a heat collecting pipe; 61. a water inlet pipe; 62. and (5) discharging a water pipe.

Detailed Description

The core of the specific embodiment is to provide a computer CPU radiator component, which integrates a heat sink and a water tank, and the heat sink and the water tank can simultaneously dissipate heat generated by a computer CPU, so that the cooling speed of the computer CPU can be increased by double cooling, the performance of the CPU is ensured, and the problem in the field at the present stage is solved.

Hereinafter, embodiments will be described with reference to the drawings. The embodiments described below do not limit the scope of the invention described in the claims. Further, the entire contents of the configurations shown in the following embodiments are not limited to those necessary as a solution of the invention described in the claims.

Fig. 1 to fig. 6 show a heat sink member for a CPU of a computer according to the present embodiment; the heat dissipation device mainly comprises a support frame 1 movably clamped on a computer, a device block 2 used for collecting heat emitted by a CPU is fixedly arranged on the support frame 1, the device block 2 is made of a material with strong heat conductivity, the device block 2 is tightly attached to the CPU, so that the device block 2 can absorb the heat on the CPU to the maximum extent, a heat dissipation sheet 3 used for dissipating the heat of the device block 2 is further arranged on the device block 2, the heat dissipation sheet 3 is composed of a plurality of aluminum sheets, as shown in figure 1, the structure and the heat dissipation performance on an air conditioner outdoor unit are similar to those of the air conditioner outdoor unit, a water tank 4 is fixedly arranged in the heat dissipation sheet 3, the water tank 4 can play a heat dissipation effect on the heat dissipation sheet 3, a first heat transfer component 5 is connected between the heat dissipation sheet 3 and the device block 2, a second heat transfer component 6 is connected between the water tank 4 and the device block 2, the heat of the device block 2 is transferred to the heat sink 3 through the first heat transfer member 5, and at the same time, the heat of the device block 2 is transferred to the water tank 4 through the second heat transfer member 6, and then is dissipated.

Furthermore, the support frame 1 comprises four parallel and symmetrical supporting legs 12, the number of the fixing blocks 11 is four, the four supporting legs 12 are respectively clamped on the four fixing blocks 11 in a sliding way, the heat dissipation component is arranged in the sliding and clamping way, the heat dissipation device can be taken down and replaced when not used or a component is damaged, the supporting blocks 13 perpendicular to the supporting legs 12 are fixedly mounted at the other ends of the four supporting legs 12, the device block 2 is fixedly mounted on one surface, close to a CPU, of the supporting block 13, four connecting rods 14 symmetrical to each other are fixedly mounted on the other surface of the supporting block 13, the heat dissipation fins 3 are fixedly mounted at the other ends of the connecting rods 14, heat dissipation fans 15 are further mounted between the heat dissipation fins 3 and the supporting block 13, the heat dissipation fans 15 can well dissipate heat, transmitted to the heat dissipation fins 3 and the water tank 4, of the device block 2 through the first heat transfer component 5 and the second heat transfer component 6, and.

Further, the inside of the device block 2 is a hollow structure, and the inside of the device block 2 is fixedly provided with a heat collecting sheet and a water-cooling converter. The heat collection fins enable the device block 2 to absorb heat from the CPU more quickly, and the water-cooled converter enables the device block 2 to be cooled down well.

Further, first heat transfer subassembly 5 is including setting up a plurality of mutual symmetrical thermal-collecting tubes 51 in the relative both sides of support frame 1, the one end and the device piece 2 fixed connection of a plurality of thermal-collecting tubes 51, thermal-collecting tube 51 sets up a plurality ofly, can be faster absorb the heat on the device piece 2, the other end and the 3 fixed connection of fin of a plurality of thermal-collecting tubes 51, the inside of a plurality of thermal-collecting tubes 51 all is filled with heat-conducting medium, heat-conducting medium's increase can make thermal speed increase on thermal-collecting tube 51 absorbing device piece 2, CPU's normal use has been guaranteed.

Further, second heat transfer assembly 6 includes inlet tube 61 and outlet pipe 62, the one end of inlet tube 61 runs through inside and the water-cooling converter fixed connection to device piece 2, inlet tube 61 takes away the heat of device piece 2 through the water-cooling converter, the other end of inlet tube 61 and water tank 4 fixed connection just run through to the inside of water tank 4, the one end of outlet pipe 62 runs through inside and the water-cooling converter fixed connection to device piece 2, outlet pipe 62 takes the heat of water-cooling converter to water tank 4 again, release the heat through water tank 4, the other end of outlet pipe 62 and water tank 4 fixed connection just run through to the inside of water tank 4.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A computer CPU heat sink structure, comprising:

the computer support comprises a support frame (1), wherein one end of the support frame (1) is clamped with a fixing block (11), and the fixing block (11) is fixed on a computer;

the device block (2) is fixedly arranged on the support frame (1), the device block (2) is attached to the CPU, and the device block (2) is used for collecting heat generated on the CPU;

the cooling fin (3) is fixed at one end, far away from the CPU, of the support frame (1), and the cooling fin (3) is used for cooling the device block (2);

the water tank (4), the water tank (4) is fixedly arranged inside the radiating fin (3), and the water tank (4) is used for radiating the device block (2);

the heat conduction device comprises a first heat transfer component (5) and a second heat transfer component (6), the first heat transfer component (5) is fixedly connected between the device block (2) and the radiating fin (3), and the second heat transfer component (6) is fixedly connected between the device block (2) and the water tank (4).

2. The computer CPU radiator component according to claim 1, wherein the supporting frame (1) comprises four parallel and symmetrical supporting legs (12), the number of the fixing blocks (11) is four, the four supporting legs (12) are respectively clamped on the four fixing blocks (11) in a sliding manner, the other ends of the four supporting legs (12) are fixedly provided with supporting blocks (13) which are perpendicular to the supporting legs (12), the device block (2) is fixedly arranged on one surface of the supporting blocks (13) close to the CPU, the other surface of the supporting blocks (13) is fixedly provided with four connecting rods (14) which are symmetrical to each other, the radiating fins (3) are fixedly arranged on the other ends of the connecting rods (14), and a radiating fan (15) is further arranged between the radiating fins (3) and the supporting blocks (13).

3. A radiator structure of computer CPU according to claim 1, characterized in that the inside of said device block (2) is hollow structure, and the inside of said device block (2) is fixedly installed with heat collecting fins and water cooling converter.

4. The computer CPU radiator component according to claim 1, wherein the first heat transfer assembly (5) comprises a plurality of mutually symmetrical heat collecting pipes (51) arranged at two opposite sides of the support frame (1), one ends of the plurality of heat collecting pipes (51) are fixedly connected with the device block (2), the other ends of the plurality of heat collecting pipes (51) are fixedly connected with the radiating fins (3), and heat conducting media are filled in the plurality of heat collecting pipes (51).

5. A computer CPU radiator unit according to claim 1, wherein the second heat transfer assembly (6) comprises a water inlet pipe (61) and a water outlet pipe (62), one end of the water inlet pipe (61) penetrates into the device block (2) and is fixedly connected with the water-cooled converter, the other end of the water inlet pipe (61) is fixedly connected with the water tank (4) and penetrates into the water tank (4), one end of the water outlet pipe (62) penetrates into the device block (2) and is fixedly connected with the water-cooled converter, and the other end of the water outlet pipe (62) is fixedly connected with the water tank (4) and penetrates into the water tank (4).