CN214335615U - Mainboard heat dissipation insulating piece for computer - Google Patents
Mainboard heat dissipation insulating piece for computer Download PDFInfo
- Publication number
- CN214335615U CN214335615U CN202023072123.6U CN202023072123U CN214335615U CN 214335615 U CN214335615 U CN 214335615U CN 202023072123 U CN202023072123 U CN 202023072123U CN 214335615 U CN214335615 U CN 214335615U
- Authority
- CN
- China
- Prior art keywords
- heat
- layer
- heat dissipation
- computer
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a mainboard heat dissipation insulating piece for computer, through mainboard and computer case fixed connection, insulating layer and mainboard fixed connection, the opposite side fixed connection of heat-conducting layer and insulating layer, equal heat layer and heat-conducting layer opposite side fixed connection, heat dissipation layer and soaking layer opposite side fixed connection, two upper framves can be dismantled with the heat dissipation layer respectively and be connected, two springs respectively with two upper frame fixed connection, the opposite side of two springs respectively with two lower frame fixed connection, two lower frames respectively with two upper frame sliding connection, the opposite side of two lower frames can be dismantled with the heat dissipation insulating piece respectively and be connected, mount and computer case fixed connection, motor and mount fixed connection, flabellum and motor output end fixed connection, four heat dissipation callus on the sole respectively with computer case fixed connection, there is the space in the heat dissipation insulating piece has been solved, influence the heat absorption of heat dissipation insulating piece, The problem of heat dissipation effect.
Description
Technical Field
The utility model relates to a heat dissipation insulating piece technical field especially relates to a mainboard heat dissipation insulating piece for computer.
Background
With the popularization and popularity of notebook computers, the trend is that the functions of a CPU are more and more powerful, but the development trend of the appearance size is more and more light and thin; along with the calculation speed of CPU and other electronic parts in the heat dissipation insulating piece is faster and faster, the line density is bigger and bigger, the heat that the spare part of notebook computer produced also constantly increases to the temperature that leads to the computer mainboard also constantly increases, and because the size is littleer and smaller, has proposed higher and higher requirement to the heat dissipation, current mainboard heat dissipation insulating piece is when carrying out the heat conduction heat dissipation, probably has the space because of the area of contact between the heat dissipation insulating piece, thereby influences heat absorption, the radiating effect of heat dissipation insulating piece.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mainboard heat dissipation insulating piece for computer aims at solving and has the space in the heat dissipation insulating piece, influences the heat absorption of heat dissipation insulating piece, radiating effect's problem.
In order to achieve the above purpose, the utility model provides a heat dissipation insulation sheet for a computer motherboard,
the mainboard heat dissipation insulation sheet for the computer comprises a computer shell, a mainboard, a heat dissipation insulation sheet, two holding frames, a heat dissipation assembly and four heat dissipation foot pads, wherein the mainboard is fixedly connected with the computer shell and is positioned inside the computer shell, the computer shell is provided with a heat dissipation port, the heat dissipation port is positioned on one side of the computer shell, the heat dissipation insulation sheet comprises an insulation layer, a heat conduction layer, a heat equalizing layer and a heat dissipation layer, the insulation layer is fixedly connected with the mainboard and is positioned on one side close to the heat dissipation port, the heat conduction layer is fixedly connected with the other side of the insulation layer, the heat equalizing layer is fixedly connected with the other side of the heat conduction layer, the heat dissipation layer is fixedly connected with the other side of the heat equalizing layer, the holding frames comprise an upper frame, a spring and a lower frame, the two upper frames are detachably connected with the heat dissipation layer respectively and are positioned on two sides of the heat dissipation layer, two the spring respectively with two upper ledge fixed connection all is located inside the upper ledge, two the opposite side of spring respectively with two lower frame fixed connection, two the lower ledge respectively with two upper ledge sliding connection, all is located inside the upper ledge, two the opposite side of lower ledge respectively with the connection can be dismantled to the heat dissipation insulating piece, all is located the both sides of heat dissipation insulating piece, radiator unit includes mount, motor and flabellum, the mount with computer case fixed connection all is located heat dissipation department, the motor with mount fixed connection, and be located inside the computer case, the flabellum with motor output end fixed connection, four heat dissipation callus on the sole respectively with computer case fixed connection all is located and is close to heat dissipation department.
The heat dissipation insulating sheet further comprises a flame-retardant layer, and the flame-retardant layer is fixedly connected with the heat dissipation layer and is located on one side far away from the heat equalization layer.
The heat dissipation insulating sheet further comprises a protective layer, wherein the protective layer is fixedly connected with the flame-retardant layer and is positioned on one side far away from the heat dissipation layer.
The heat dissipation insulating sheet further comprises five double-sided adhesive tapes, and five double-sided adhesive tapes are respectively connected with the insulating layer, the heat conducting layer, the heat equalizing layer, the heat dissipation layer and the flame retardant layer in a fixed connection mode and are located on one side of the mainboard.
The heat dissipation insulating sheet of the mainboard for the computer comprises a protective cover, wherein the protective cover is fixedly connected with the computer shell and is positioned around the heat dissipation assembly.
The heat dissipation assembly further comprises a shock pad, one side of the shock pad is fixedly connected with the fixing frame and located on the periphery of the fixing frame, and the other side of the shock pad is fixedly connected with the computer shell and located on the heat dissipation port.
The utility model discloses a mainboard heat-dissipation insulating sheet for computer, through mainboard and computer shell fixed connection, and be located inside the computer shell, the computer shell has the thermovent, the thermovent is located one side of the computer shell, heat-dissipation insulating sheet includes insulating layer, heat-conducting layer, soaking layer and heat dissipation layer, the insulating layer with mainboard fixed connection, and be located near one side of the thermovent, the heat-conducting layer with the opposite side fixed connection of insulating layer, soaking layer with the opposite side fixed connection of heat-conducting layer, heat dissipation layer with soaking layer opposite side fixed connection, keep the frame including upper frame, spring and lower frame, two upper frames respectively with heat dissipation layer can dismantle the connection, all be located heat dissipation layer both sides, two springs respectively with two upper frames fixed connection, are all positioned in the upper frame, the other sides of the two springs are respectively fixedly connected with the two lower frames, the two lower frames are respectively connected with the two upper frames in a sliding way and are both positioned in the upper frame, the other sides of the two lower frames are respectively detachably connected with the heat dissipation insulating sheet and are both positioned on both sides of the heat dissipation insulating sheet, the heat dissipation assembly comprises a fixing frame, a motor and fan blades, the fixing frame is fixedly connected with the computer shell and is positioned at the heat dissipation opening, the motor is fixedly connected with the fixing frame, and be located inside the computer case, the flabellum with motor output fixed connection, four the heat dissipation callus on the sole respectively with computer case fixed connection all is located and is close to heat dissipation department has solved the heat dissipation and has had the space in the heat dissipation and insulation piece, influences the heat absorption of heat dissipation and insulation piece, radiating effect's problem.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a cross-sectional view of a heat-dissipating insulating sheet of a motherboard for a computer;
FIG. 2 is a schematic view of a heat-dissipating insulating sheet of a motherboard for a computer;
FIG. 3 is a bottom view of the heat-dissipating insulation sheet of the motherboard for a computer;
FIG. 4 is a schematic structural diagram of a heat sink assembly;
fig. 5 is a cross-sectional view of a heat dissipating insulation sheet.
1-computer shell, 2-heat dissipation foot pad, 3-heat dissipation insulation sheet, 4-heat dissipation port, 6-heat dissipation assembly, 7-protective cover, 8-mainboard, 9-holding frame, 31-insulation layer, 32-heat conduction layer, 33-heat equalization layer, 34-heat dissipation layer, 35-flame retardant layer, 36-protective layer, 37-double-sided tape, 61-fixing frame, 62-motor, 63-fan blade, 64-shock pad, 91-upper frame, 92-lower frame and 93-spring.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", and the like refer to the orientation or positional relationship as shown in the drawings, which is for convenience of description and simplicity of description, and does not indicate or imply that the referenced device or element must be constructed and operated in a particular orientation or orientation, and thus, is not to be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 5, the present invention provides a heat-dissipating insulation sheet for a computer motherboard, comprising a computer housing 1, a motherboard 8, a heat-dissipating insulation sheet 3, two holding frames 9, a heat-dissipating component 6 and four heat-dissipating foot pads 2, wherein the motherboard 8 is fixedly connected to the computer housing 1 and is located inside the computer housing 1, the computer housing 1 has a heat-dissipating port 4, the heat-dissipating port 4 is located on one side of the computer housing 1, the heat-dissipating insulation sheet 3 comprises an insulation layer 31, a heat-conducting layer 32, a soaking layer 33 and a heat-dissipating layer 34, the insulation layer 31 is fixedly connected to the motherboard 8 and is located on one side close to the heat-dissipating port 4, the heat-conducting layer 32 is fixedly connected to the other side of the insulation layer 31, the soaking layer 33 is fixedly connected to the other side of the heat-conducting layer 32, and the heat-dissipating layer 34 is fixedly connected to the other side of the soaking layer 33, the retaining frame 9 comprises an upper frame 91, springs 93 and a lower frame 92, wherein the two upper frames 91 are detachably connected with the heat dissipation layer 34 respectively and are located at two sides of the heat dissipation layer 34, the two springs 93 are fixedly connected with the two upper frames 91 respectively and are located inside the upper frames 91, the other sides of the two springs 93 are fixedly connected with the two lower frames 92 respectively, the two lower frames 92 are slidably connected with the two upper frames 91 respectively and are located inside the upper frames 91, the other sides of the two lower frames 92 are detachably connected with the heat dissipation insulation sheet 3 respectively and are located at two sides of the heat dissipation insulation sheet 3, the heat dissipation assembly 6 comprises a fixing frame 61, a motor 62 and fan blades 63, the fixing frame 61 is fixedly connected with the computer housing 1 and is located at the heat dissipation port 4, and the motor 62 is fixedly connected with the fixing frame 61, and is located inside computer housing 1, flabellum 63 with motor 62 output fixed connection, four heat dissipation callus on the sole 2 respectively with computer housing 1 fixed connection, all be located near thermovent 4.
In this embodiment, the computer is under operating condition, heat dissipation insulating sheet 3 is right computer case 1 is inside the heat that produces on the mainboard 8 absorbs heat, conducts heat and dispels the heat, radiator unit 6 is right the heat that heat dissipation insulating sheet 3 gived dispels the heat with higher speed, makes computer case 1's constancy of temperature, heat dissipation callus on the sole 2 increases distance between computer case 1 and the contact surface is supplementary radiator unit 6 dispels the heat, heat dissipation insulating sheet 3 is at the during operation, insulating layer 31 blocks the electric current on the mainboard 8, avoids electrocuteeing, heat on the mainboard 8 32 will heat derivation, even heat layer 33 will heat evenly distributed on the heat-conducting layer 32 increases the radiating effect, heat dissipation layer 34 will the heat on even heat layer 33 dispels the heat, radiator unit 6 work makes on the mount 61 the motor 62 drive flabellum 63 rotates will the radiating heat of heat dissipation layer 34 The volume, follow with higher speed the thermovent 4 is discharged, on the heat dissipation insulating piece 3 keep the frame 9 the upper ledge 91 with the lower ledge 92 will the heat dissipation insulating piece 3 block, the upper ledge 91 with between the lower ledge 92 the spring 93, to the upper ledge 91 with the power of moving to the center is applyed to the lower ledge 92, makes the clamping force of keeping the frame 9 is more firm, has solved heat dissipation insulating piece 3 internal existence space, influences heat absorption, the radiating effect of heat dissipation insulating piece.
Further, the heat dissipation insulating sheet 3 further includes a flame retardant layer 35, and the flame retardant layer 35 is fixedly connected to the heat dissipation layer 34 and located on one side away from the heat equalizing layer 33.
In the present embodiment, in order to avoid the heat radiation insulating sheet 3 from spontaneously combusting or softening and deforming due to an excessively high temperature absorbed by the heat radiation insulating sheet 3, the flame retardant layer 35 is provided on the heat radiation layer 34 of the heat radiation insulating sheet 3.
Further, the heat dissipation insulating sheet 3 further includes a protection layer 36, and the protection layer 36 is fixedly connected to the flame retardant layer 35 and is located on a side away from the heat dissipation layer 34.
In this embodiment, in order to avoid the heat dissipation insulating sheet 3 from being scratched by other objects, the protective layer 36 is disposed on the flame retardant layer 35 of the heat dissipation insulating sheet 3, and the protective layer 36 is the lowest end, which is uniform for the clamping force of the holding frame 9, and plays a role in protecting the heat dissipation insulating sheet 3 from deformation.
Further, the heat dissipation insulating sheet 3 further includes five double-sided tapes 37, five double-sided tapes 37 respectively with the insulating layer 31 the heat conducting layer 32 the heat equalizing layer 33 the heat dissipation layer 34 with the flame retardant layer 35 fixed connection is all located away from one side of the motherboard 8.
In the present embodiment, in order to make the insulating layer 31, the heat conducting layer 32, the soaking layer 33, the heat dissipating layer 34, the flame retardant layer 35 and the protective layer 36 sufficiently contact each other, the double-sided tape 37 is provided on the insulating layer 31, the heat conducting layer 32, the soaking layer 33, the heat dissipating layer 34 and the flame retardant layer 35 to be bonded in both directions, thereby preventing the heat absorbing and dissipating effects of the heat dissipating insulating sheet 3 from being affected by the generation of voids.
Furthermore, mainboard heat dissipation insulating sheet for the computer still includes safety cover 7, safety cover 7 with computer case 1 fixed connection, and be located radiator unit is all around.
In this embodiment, in order to prevent the heat dissipation assembly 6 from being stuck by other objects during operation and affecting the heat dissipation effect of the heat dissipation assembly 6, the protective cover 7 is disposed around the heat dissipation assembly 6 to protect the heat dissipation assembly 6.
Further, heat dissipation insulating piece 3 still includes shock pad 64, one side of shock pad 64 with mount 61 fixed connection, and be located mount 61 is all around, the opposite side of shock pad 64 with computer case 1 fixed connection, and be located on the thermovent 4.
In the present embodiment, in order to increase the stability of the heat sink 6, the shock absorbing pad 64 is provided on the fixing frame 61 of the heat sink 6, so that the stability of the heat sink 6 is increased.
The utility model discloses a mainboard heat-dissipation insulating sheet for computer, under the computer operating condition, heat absorption, heat transfer and heat dissipation are carried out to the heat that produces on the mainboard 8 inside the computer shell 1 to heat dissipation insulating sheet 3, heat dissipation subassembly 6 carries out the heat dissipation with higher speed to the heat that heat dissipation insulating sheet 3 said distributes, makes the temperature of computer shell 1 be invariable, heat dissipation callus on the sole 2 increases the distance between computer shell 1 and the contact surface, assists heat dissipation subassembly 6 dispel the heat, heat dissipation insulating sheet 3 is in operation, insulating layer 31 blocks the electric current on mainboard 8, avoids the electric shock, heat conduction layer 32 exports the heat on the mainboard 8, heat-homogenizing layer 33 evenly distributes the heat on heat conduction layer 32, increases the radiating effect, heat dissipation layer 34 dispels the heat on homogenizing layer 33, heat dissipation subassembly 6 works and makes, the motor 62 drive on the mount 61 the flabellum 63 rotates will the radiating heat of heat dissipation layer 34, follow with higher speed the thermovent 4 discharges, on the heat dissipation insulating piece 3 keep the frame 9 the upper ledge 91 with the lower ledge 92 will the heat dissipation insulating piece 3 block, the upper ledge 91 with between the lower ledge 92 the spring 93, to the upper ledge 91 with the power to the central motion is applyed to the lower ledge 92, makes the block power that keeps the frame 9 is more firm, has solved the heat dissipation insulating piece 3 and has existed the space, influence the heat absorption, the radiating effect of heat dissipation insulating piece.
The above disclosure is only a preferred embodiment of the heat-dissipating insulation sheet for computer motherboard, and certainly, the scope of the present invention should not be limited thereto, and one of ordinary skill in the art can understand that all or part of the processes of the above embodiments can be realized, and the equivalent variations according to the claims of the present invention still belong to the scope covered by the present invention.
Claims (6)
1. A mainboard heat-dissipation insulating sheet for a computer is characterized by comprising a computer shell, a mainboard, a heat-dissipation insulating sheet, two holding frames, a heat-dissipation assembly and four heat-dissipation foot pads, wherein the mainboard is fixedly connected with the computer shell and is positioned inside the computer shell, the computer shell is provided with a heat-dissipation port, the heat-dissipation port is positioned at one side of the computer shell, the heat-dissipation insulating sheet comprises an insulating layer, a heat-conducting layer, a heat-equalizing layer and a heat-dissipation layer, the insulating layer is fixedly connected with the mainboard and is positioned at one side close to the heat-dissipation port, the heat-conducting layer is fixedly connected with the other side of the insulating layer, the heat-equalizing layer is fixedly connected with the other side of the heat-conducting layer, the heat-dissipation layer is fixedly connected with the other side of the heat-equalizing layer, the holding frames comprise an upper frame, a spring and a lower frame, and the two upper frames are respectively detachably connected with the heat-dissipation layer, are respectively positioned at two sides of the heat dissipation layer, the two springs are respectively fixedly connected with the two upper frames and are respectively positioned in the upper frames, the other sides of the two springs are respectively fixedly connected with the two lower frames, the two lower frames are respectively connected with the two upper frames in a sliding way and are respectively positioned in the upper frames, the other sides of the two lower frames are respectively detachably connected with the heat dissipation insulation sheet and are respectively positioned at two sides of the heat dissipation insulation sheet, the heat dissipation assembly comprises a fixing frame, a motor and fan blades, the fixing frame is fixedly connected with the computer shell and is positioned at the heat dissipation opening, the motor is fixedly connected with the fixing frame, and the four heat dissipation foot pads are respectively fixedly connected with the computer shell and are all positioned close to the heat dissipation opening.
2. The heat-dissipating insulating sheet for a motherboard of a computer as claimed in claim 1, wherein the heat-dissipating insulating sheet further comprises a flame-retardant layer, and the flame-retardant layer is fixedly connected to the heat-dissipating layer and located on a side away from the heat-equalizing layer.
3. The heat-dissipating insulating sheet for a motherboard of a computer as claimed in claim 2, wherein the heat-dissipating insulating sheet further comprises a protective layer, and the protective layer is fixedly connected to the flame-retardant layer and located at a side away from the heat-dissipating layer.
4. The heat-dissipating insulating sheet for a motherboard of a computer as claimed in claim 3, wherein the heat-dissipating insulating sheet further comprises five double-sided tapes, and the five double-sided tapes are respectively fixedly connected to the insulating layer, the heat-conducting layer, the soaking layer, the heat-dissipating layer and the flame-retardant layer and are located on a side away from the motherboard.
5. The heat-dissipating insulation sheet for a computer motherboard of claim 1, wherein the heat-dissipating insulation sheet for a computer motherboard comprises a protection cover, and the protection cover is fixedly connected to the computer housing and located around the heat-dissipating assembly.
6. The heat-dissipating insulating sheet for a motherboard of a computer as claimed in claim 1, wherein the heat-dissipating assembly further comprises a shock-absorbing pad, one side of the shock-absorbing pad is fixedly connected to the fixing frame and located around the fixing frame, and the other side of the shock-absorbing pad is fixedly connected to the housing of the computer and located on the heat-dissipating opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023072123.6U CN214335615U (en) | 2020-12-18 | 2020-12-18 | Mainboard heat dissipation insulating piece for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023072123.6U CN214335615U (en) | 2020-12-18 | 2020-12-18 | Mainboard heat dissipation insulating piece for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214335615U true CN214335615U (en) | 2021-10-01 |
Family
ID=77900465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023072123.6U Active CN214335615U (en) | 2020-12-18 | 2020-12-18 | Mainboard heat dissipation insulating piece for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214335615U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114806450A (en) * | 2022-03-11 | 2022-07-29 | 深圳市法鑫忠信新材料有限公司 | Uniform heat dissipation fireproof film for mobile phone battery and preparation method thereof |
-
2020
- 2020-12-18 CN CN202023072123.6U patent/CN214335615U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114806450A (en) * | 2022-03-11 | 2022-07-29 | 深圳市法鑫忠信新材料有限公司 | Uniform heat dissipation fireproof film for mobile phone battery and preparation method thereof |
| CN114806450B (en) * | 2022-03-11 | 2023-10-24 | 深圳市法鑫忠信新材料有限公司 | Soaking heat dissipation fireproof film for mobile phone battery and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20050030714A1 (en) | Heat dissipating structure for computer host | |
| US7180747B2 (en) | Heat dissipation device for a computer mother board | |
| TWM519269U (en) | Heat dissipation buffer conductive composite molding structure of mobile electronic device | |
| CN214335615U (en) | Mainboard heat dissipation insulating piece for computer | |
| CN215730874U (en) | Large-capacity solid state hard disk easy to radiate heat | |
| CN201327611Y (en) | Computer case, mainboard and computer with case and mainboard | |
| CN108811469A (en) | Electronics protective shell with heat sinking function | |
| TWI669601B (en) | Thermal buffered conductive composite forming structure of mobile electronic device (4) | |
| US7460368B2 (en) | Cooling-fan-free system module | |
| US20220256741A1 (en) | Control device | |
| TW202306480A (en) | Thermal management system for electronic device | |
| CN212181406U (en) | Electronic device | |
| JP2015026670A (en) | Heat radiator | |
| CN212906202U (en) | Dustproof heat dissipation protective housing of memory bank | |
| CN207836053U (en) | A kind of electronic device | |
| CN221125268U (en) | USB flash disk main control packaging structure | |
| CN211293845U (en) | Computer hardware heat dissipation case | |
| CN219758749U (en) | PCIe card | |
| CN220087834U (en) | Heat radiation structure and head-mounted display device | |
| CN216120287U (en) | High-strength loss-proof integrated circuit chip | |
| CN218122584U (en) | Radiating computer motherboard structure | |
| CN218158947U (en) | Dustproof heat abstractor of computer hardware | |
| CN216437861U (en) | Mobile phone touch display module with efficient heat dissipation function | |
| CN215872380U (en) | Heat radiation structure and radiator | |
| CN219626325U (en) | Data storage assembly and radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |