CN215730874U - Large-capacity solid state hard disk easy to radiate heat - Google Patents
Large-capacity solid state hard disk easy to radiate heat Download PDFInfo
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- CN215730874U CN215730874U CN202122054265.8U CN202122054265U CN215730874U CN 215730874 U CN215730874 U CN 215730874U CN 202122054265 U CN202122054265 U CN 202122054265U CN 215730874 U CN215730874 U CN 215730874U
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Abstract
The utility model relates to the technical field of solid state disks, in particular to a high-capacity solid state disk easy to radiate heat, which comprises a heat conduction base, a circuit board, a heat conduction cover plate and a heat radiation assembly, wherein the circuit board is inserted in the upper end of the heat conduction base, the upper end of the circuit board is fixedly connected with a chip, the upper end of the chip is connected with the heat conduction cover plate, two sides of the heat conduction cover plate are provided with connecting structures and are fixedly connected to the outer side of the upper end of the heat conduction base through the connecting structures, and the heat radiation assembly is fixedly connected in the middle of the upper end of the heat conduction cover plate, so that the high-capacity solid state disk easy to radiate heat has the advantages that: can derive the heat that circuit board and chip gived off through setting up heat conduction structure to cool off the heat dissipation through heat radiation structure, prevent that high temperature from causing the damage to chip and circuit board, influence life, heat conduction structure wraps up the circuit board in addition, can play the guard action, can effectively prevent to cause the circuit board when receiving the collision on, increase the protection effect.
Description
Technical Field
The utility model relates to the technical field of solid state disks, in particular to a high-capacity solid state disk easy to radiate heat.
Background
A Solid State Disk (SSD), also called Solid State Drive, is a hard Disk made of an array of Solid State electronic memory chips.
In the prior art, a chip of a fixed hard disk can generate a large amount of heat in the operation process, and a normal solid state hard disk does not have a heat dissipation structure, so that heat cannot be effectively dissipated, the solid state hard disk can be damaged after long-time use, and the service life of the solid state hard disk is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-capacity solid state disk with easy heat dissipation so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an easy radiating large capacity solid state hard drives, includes heat conduction base, circuit board, heat conduction apron and radiator unit, the inside grafting circuit board in heat conduction base upper end, circuit board upper end fixed connection chip, the heat conduction apron is connected to the chip upper end, heat conduction apron both sides are equipped with connection structure and pass through connection structure fixed connection in the heat conduction base upper end outside, fixedly connected with radiator unit in the middle of the heat conduction apron upper end.
Preferably, the heat conduction base upper end both sides protrusion is equipped with the curb plate, the draw-in groove has been seted up in the curb plate outside, the circuit board passes through bolt fixed connection in the curb plate of heat conduction base upper end both sides.
Preferably, the upper end of the circuit board is fixedly connected with a plurality of chips, two ends of the circuit board extend out of the outer side of the heat conduction base, one end of the circuit board is integrally formed and provided with a connecting plug, and the middle of the other end of the circuit board is provided with a limiting groove for limiting and is limited by a limiting bolt.
Preferably, the lower end of the heat conduction cover plate protrudes to be provided with a heat conducting sheet, the heat conducting sheet is in a cover shape and corresponds to a chip on a circuit board, the heat conducting sheet is covered and attached to the outer side of the upper end of the chip, the heat conduction cover plate is fixedly connected with buckles on two sides of the heat conduction cover plate, the buckles comprise connecting rods, clamping blocks are arranged inside the lower ends of the connecting rods, the clamping blocks correspond to clamping grooves formed in the outer sides of side plates on the upper end of the heat conduction base, and the clamping blocks are fixed in the clamping grooves in a clamped mode.
Preferably, the upper end of the heat-conducting cover plate is fixedly connected with a plurality of uniformly distributed heat-radiating fins, a mounting groove is formed in the middle of each heat-radiating fin, and the heat-radiating assembly is fixedly connected in the mounting groove.
Preferably, radiator unit includes the shell, the shell includes the lower extreme mounting panel, mounting panel front and back end upside fixed connection backup pad, backup pad upper end fixed connection roof, the radiator unit left and right sides forms the heat conduction mouth, the inside centre of radiator unit rotates and is connected with the pivot, and pivot outside transmission is connected with the heat dissipation fan, the thermovent has been seted up in the middle of the roof upper end, fixedly connected with mount in the thermovent, the pivot upper end is rotated and is connected in the middle of the mount lower extreme.
Compared with the prior art, the utility model has the beneficial effects that:
the heat conducting structure can lead out the heat emitted by the circuit board and the chip, and the heat radiating structure can cool and radiate the heat to prevent the chip and the circuit board from being damaged by high temperature and influence the service life.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a front view of the present invention;
fig. 4 is a cross-sectional view of fig. 3.
In the figure: the heat-conducting module comprises a heat-conducting base 1, a circuit board 2, a heat-conducting cover plate 3, a heat-radiating assembly 4, a side plate 5, a clamping groove 6, a chip 7, a buckle 8, a heat-radiating fin 9, a mounting groove 10, a heat-conducting port 11, a heat-radiating fan 12, a heat-radiating port 13, a fixing frame 14 and a heat-conducting fin 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: a large-capacity solid state hard disk easy to radiate heat comprises a heat conduction base 1, a circuit board 2, a heat conduction cover plate 3 and a heat radiation component 4, wherein the circuit board 2 is inserted in the upper end of the heat conduction base 1, the upper end of the circuit board 2 is fixedly connected with a chip 7, the upper end of the chip 7 is connected with the heat conduction cover plate 3, two sides of the heat conduction cover plate 3 are provided with connecting structures and are fixedly connected to the outer side of the upper end of the heat conduction base 1 through the connecting structures, and the heat radiation component 4 is fixedly connected in the middle of the upper end of the heat conduction cover plate 3;
the heat conduction base is characterized in that side plates 5 are convexly arranged on two sides of the upper end of the heat conduction base 1, clamping grooves 6 are formed in the outer sides of the side plates 5, the circuit board 2 is fixedly connected into the side plates 5 on two sides of the upper end of the heat conduction base 1 through bolts, the circuit board 2 is wrapped by the heat conduction base 1, heat emitted by the lower end of the circuit board 2 can be led out, the heat conduction and heat dissipation effects are enhanced, a protection effect can be achieved, the internal circuit board 2 and the chip 7 are protected from being damaged, and the using effect is improved;
the upper end of the circuit board 2 is fixedly connected with a plurality of chips 7, two ends of the circuit board 2 extend out of the outer side of the heat conduction base 1, one end of the circuit board 2 is integrally formed and provided with a connecting plug, a limiting groove for limiting is formed in the middle of the other end of the circuit board 2, limiting is carried out through a limiting bolt, the position of the circuit board 2 can be limited after the circuit board 2 is inserted and installed through the limiting groove and the limiting bolt, the stability after installation is improved, and the using effect is improved;
the heat conducting sheet 15 is arranged at the lower end of the heat conducting cover plate 3 in a protruding mode, the heat conducting sheet 15 corresponds to the chip 7 on the circuit board 2 in a cover shape, the heat conducting sheet 15 is covered and connected to the outer side of the upper end of the chip 7 in a laminating mode, the buckles 8 are fixedly connected to the two sides of the heat conducting cover plate 3, each buckle 8 comprises a connecting rod, a clamping block is arranged inside the lower end of each connecting rod 8, each clamping block corresponds to a clamping groove 6 formed in the outer side of a side plate 5 at the upper end of the heat conducting base 1 and is clamped and fixed in the clamping groove 6, heat emitted from the chip 7 can be led out through the heat conducting sheet 15, the heat leading-out efficiency is higher, the waterproof and dustproof effects can be added to the chip 7, and the using effect is improved;
the upper end of the heat-conducting cover plate 3 is fixedly connected with a plurality of uniformly distributed radiating fins 9, the middle of each radiating fin 9 is provided with a mounting groove 10, a radiating assembly 4 is fixedly connected in each mounting groove 10, the guided heat can be radiated through the radiating fins 9, the radiating cooling performance is improved, the radiating assembly 4 can increase the radiating cooling speed, and the using effect is improved;
The working principle is as follows: the circuit board 2 is wrapped by the heat conduction base 1, the heat emitted from the lower end of the circuit board 2 can be led out, the heat conduction and heat dissipation effect is enhanced, the protective effect can be achieved, the internal circuit board 2 and the chip 7 are protected from being damaged, the use effect is increased, the position of the circuit board 2 can be limited after the circuit board 2 is inserted and installed through the limiting groove and the limiting bolt, the stability after installation is increased, the use effect is improved, the heat emitted from the chip 7 can be led out through the heat conducting sheet 15, the heat leading-out efficiency is higher, the waterproof and dustproof effect can be added to the chip 7, the use effect is improved, the led-out heat can be emitted through the heat dissipation fins 9, the heat dissipation and cooling performance is improved, the heat dissipation cooling speed of the heat dissipation component 4 can be increased, the use effect is improved, the heat emitted through the heat dissipation fins 9 can be extracted and can be discharged through the heat dissipation fan 12, the heat dissipation speed can be effectively increased, and the heat dissipation performance is improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an easy radiating large capacity solid state hard drives, includes heat conduction base (1), circuit board (2), heat conduction apron (3) and radiator unit (4), its characterized in that: the heat conduction cover plate is characterized in that the circuit board (2) is inserted inside the upper end of the heat conduction base (1), the circuit board (2) is fixedly connected with the chip (7) at the upper end, the heat conduction cover plate (3) is connected to the upper end of the chip (7), the two sides of the heat conduction cover plate (3) are provided with connecting structures and are fixedly connected to the outer side of the upper end of the heat conduction base (1) through the connecting structures, and the heat dissipation assembly (4) is fixedly connected to the middle of the upper end of the heat conduction cover plate (3).
2. A large capacity solid state hard disk easy to dissipate heat according to claim 1, characterized in that: the heat conduction base is characterized in that side plates (5) are arranged on two sides of the upper end of the heat conduction base (1) in a protruding mode, clamping grooves (6) are formed in the outer sides of the side plates (5), and the circuit board (2) is fixedly connected into the side plates (5) on the two sides of the upper end of the heat conduction base (1) through bolts.
3. A large capacity solid state hard disk easy to dissipate heat according to claim 1, characterized in that: the circuit board is characterized in that the upper end of the circuit board (2) is fixedly connected with a plurality of chips (7), the two ends of the circuit board (2) extend out of the heat conduction base (1), one end of the circuit board (2) is integrally formed and provided with a connecting plug, and a limiting groove used for limiting is formed in the middle of the other end of the circuit board (2) and is limited through a limiting bolt.
4. A large capacity solid state hard disk easy to dissipate heat according to claim 1, characterized in that: the heat conduction cover plate is characterized in that a heat conduction sheet (15) is arranged at the lower end of the heat conduction cover plate (3) in a protruding mode, the heat conduction sheet (15) is in a cover shape and corresponds to a chip (7) on a circuit board (2), the heat conduction sheet (15) is covered and attached to the outer side of the upper end of the chip (7), the heat conduction cover plate (3) is fixedly connected with buckles (8) on two sides, each buckle (8) comprises a connecting rod, a clamping block is arranged inside the lower end of the connecting rod (8), the clamping block corresponds to a clamping groove (6) formed in the outer side of a side plate (5) at the upper end of the heat conduction base (1), and the clamping are fixed in the clamping groove (6).
5. A large capacity solid state disk easy to dissipate heat according to claim 4, characterized in that: the heat-conducting cover plate is characterized in that a plurality of uniformly distributed heat dissipation fins (9) are fixedly connected to the upper end of the heat-conducting cover plate (3), a mounting groove (10) is formed in the middle of each heat dissipation fin (9), and the heat dissipation assembly (4) is fixedly connected in the mounting groove (10).
6. A large capacity solid state hard disk easy to dissipate heat according to claim 1, characterized in that: radiator unit (4) includes the shell, the shell includes the lower extreme mounting panel, mounting panel front and back end upside fixed connection backup pad, backup pad upper end fixed connection roof, radiator unit (4) left and right sides forms heat conduction mouth (11), the inside middle rotation of radiator unit (4) is connected with the pivot, and pivot outside transmission is connected with heat dissipation fan (12), thermovent (13) have been seted up in the middle of the roof upper end, fixedly connected with mount (14) in thermovent (13), the pivot upper end is rotated and is connected in the middle of mount (14) lower extreme.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122054265.8U CN215730874U (en) | 2021-08-27 | 2021-08-27 | Large-capacity solid state hard disk easy to radiate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122054265.8U CN215730874U (en) | 2021-08-27 | 2021-08-27 | Large-capacity solid state hard disk easy to radiate heat |
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| Publication Number | Publication Date |
|---|---|
| CN215730874U true CN215730874U (en) | 2022-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122054265.8U Active CN215730874U (en) | 2021-08-27 | 2021-08-27 | Large-capacity solid state hard disk easy to radiate heat |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115410607A (en) * | 2022-09-02 | 2022-11-29 | 深圳市嘉合劲威电子科技有限公司 | Anti-collision method of solid state disk |
| CN115410606A (en) * | 2022-09-02 | 2022-11-29 | 深圳市嘉合劲威电子科技有限公司 | Solid state hard drives who shocks resistance |
-
2021
- 2021-08-27 CN CN202122054265.8U patent/CN215730874U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115410607A (en) * | 2022-09-02 | 2022-11-29 | 深圳市嘉合劲威电子科技有限公司 | Anti-collision method of solid state disk |
| CN115410606A (en) * | 2022-09-02 | 2022-11-29 | 深圳市嘉合劲威电子科技有限公司 | Solid state hard drives who shocks resistance |
| CN115410606B (en) * | 2022-09-02 | 2024-05-14 | 深圳市嘉合劲威电子科技有限公司 | Solid state disk that shocks resistance |
| CN115410607B (en) * | 2022-09-02 | 2024-05-17 | 深圳市嘉合劲威电子科技有限公司 | Anti-collision method for solid state disk |
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