CN212623971U - Semiconductor refrigeration formula notebook computer heat dissipation support - Google Patents
Semiconductor refrigeration formula notebook computer heat dissipation support Download PDFInfo
- Publication number
- CN212623971U CN212623971U CN202021893894.9U CN202021893894U CN212623971U CN 212623971 U CN212623971 U CN 212623971U CN 202021893894 U CN202021893894 U CN 202021893894U CN 212623971 U CN212623971 U CN 212623971U
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- cover plate
- heat dissipation
- fan
- hook
- notebook computer
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Abstract
The utility model discloses a semiconductor refrigeration type notebook computer radiating bracket, which is applied to the field of computer equipment and comprises a cover plate, a base, a radiating module and a first fan; wherein the cover plate is provided with a mounting hole and a hook; the base is provided with a mounting foot and a hook seat; the mounting holes and the mounting feet are hinged through screws; the hook is hung on the hook seat; the first fan is arranged on the base, and the wind direction of the first fan is downward; the heat dissipation modules are at least provided with two and are arranged on the base. The cover plate angle adjusting range of the utility model is large, and the angle of the cover plate can be adjusted by hanging the hook on the telescopic rod of the hook seat; in addition, cold air generated by the semiconductor refrigeration sheet is blown upwards through the second fan, the first fan is blown downwards to form convection, heat generated by the notebook computer is taken away, and a good heat dissipation effect is achieved.
Description
Technical Field
The utility model relates to a computer equipment technical field, more specifically the utility model relates to a semiconductor refrigeration formula notebook computer heat dissipation support that says so.
Background
For notebook computers, heat dissipation is the most critical factor in the performance and portability countermeasures, and the heat dissipation of notebook computers is always the bottleneck in the core technology of notebook computers. Sometimes, the notebook computer will be killed wonderfully, which is generally caused by over-high system temperature. To address this problem, heat-dissipating bases have been designed.
The existing notebook computer heat dissipation base is generally composed of a metal or plastic shell and 2-4 built-in fans, which can play a certain role in heat dissipation, but in the field, it is desirable to further improve the heat dissipation performance.
Simultaneously, the angle modulation of heat dissipation base among the prior art adopts the mode of stabilizer blade to adjust, just also only exists and uses two kinds of angle modulation of stabilizer blade and not use the stabilizer blade, and obviously the suitability of angle modulation is low.
Therefore, how to provide a heat dissipation base with high angle adjustment applicability and good heat dissipation effect is a problem that needs to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above, the utility model provides a semiconductor refrigeration type notebook computer heat dissipation bracket, the cover plate angle adjustment range is large, and the adjustment of the cover plate angle is realized by hanging the hook on the telescopic rod of the hook seat; in addition, cold air generated by the semiconductor refrigeration sheet is blown upwards through the second fan, the first fan is blown downwards to form convection, heat generated by the notebook computer is taken away, and a good heat dissipation effect is achieved.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor refrigeration type notebook computer radiating bracket comprises a cover plate, a base, a radiating module and a first fan; wherein the cover plate is provided with a mounting hole and a hook; the base is provided with a mounting foot and a hook seat; the mounting hole and the mounting foot are hinged through a screw; the hook is hung on the hook seat; the first fan is arranged on the base, and the wind direction of the first fan is downward; the heat dissipation modules are at least provided with two heat dissipation modules and are arranged on the base.
Through the technical scheme, the utility model discloses a technological effect: the angle of the cover plate can be adjusted by hanging the hook on the telescopic rod of the hook seat, so that the angle adjustment is more applicable, and the heat dissipation effect is better by combining air cooling with semiconductor refrigeration.
Preferably, in the above semiconductor refrigeration type notebook computer heat dissipation bracket, the heat dissipation module includes: the upper cover plate, the semiconductor refrigerating plate, the lower cover plate and the second fan are arranged on the upper cover plate; the lower cover plate is of a groove structure, and the semiconductor refrigerating sheet is arranged in the groove structure; the second fan and the upper cover plate are fixed on the lower cover plate through screws, wherein the second fan is in an upward direction.
Through the technical scheme, the utility model discloses a technological effect: and the semiconductor refrigerating sheet is adopted for refrigerating, cold air is blown upwards through the second fan and is exchanged with hot air above, convection is formed, and heat dissipation is carried out.
Preferably, in the semiconductor refrigeration type notebook computer heat dissipation bracket, two hook seats are provided; the hook comprises a limiting sheet, a hook seat main body, a telescopic rod and a spring; the hook seat main body is provided with a through hole, and the telescopic rod and the spring are arranged in the through hole; the near end surfaces of the two hook seats are provided with sliding grooves, and the limiting pieces are inserted into the sliding grooves; one end of the spring is abutted against the limiting sheet, and the other end of the spring is abutted against the telescopic rod; the telescopic rod is of a round table structure.
Through the technical scheme, the utility model discloses a technological effect: the telescopic rod on the hook seat extends outwards under the action of the spring and is matched with the hook of the cover plate to adjust the angle of the cover plate.
Preferably, in the semiconductor refrigeration type notebook computer heat dissipation bracket, at least one circle of groove is formed in the circular truncated cone structure.
Through the technical scheme, the utility model discloses a technological effect: the groove is convenient for the hook on the cover plate to limit, and the hook is prevented from falling off.
Preferably, in the semiconductor refrigeration type notebook computer heat dissipation bracket, the semiconductor refrigeration piece, the first fan and the second fan are electrically connected in parallel.
Through the technical scheme, the utility model discloses a technological effect: the parallel connection mode can be realized by arranging a switch on each path and selectively starting the switches.
Preferably, in the above semiconductor refrigeration type notebook computer heat dissipation bracket, the upper cover plate is provided with a vent groove.
Preferably, in the semiconductor refrigeration type notebook computer heat dissipation bracket, a ventilation window is arranged on the cover plate, and the opening position of the ventilation window corresponds to the heat dissipation module.
Through the technical scheme, the utility model discloses a technological effect: due to the arrangement of the ventilation window, the cold air can be conveniently contacted with the heat dissipation part of the notebook computer, and the heat dissipation effect is improved.
Preferably, in the semiconductor refrigeration type notebook computer heat dissipation bracket, at least one through hole is formed, and the number of the telescopic rods and the number of the springs correspond to the number of the through holes.
Through the technical scheme, the utility model discloses a technological effect: the arrangement of the through holes enables the adjustment of the angle of the cover plate to provide a plurality of options.
According to the technical scheme, compared with the prior art, the utility model discloses a semiconductor refrigeration type notebook computer radiating support, the cover plate angle adjusting range is large, and the cover plate angle is adjusted by hanging the hook on the telescopic rod of the hook seat; in addition, cold air generated by the semiconductor refrigeration sheet is blown upwards through the second fan, the first fan is blown downwards to form convection, heat generated by the notebook computer is taken away, and a good heat dissipation effect is achieved. The one end that the apron is close to the user is articulated through screw and base, hangs the couple on the telescopic link of couple seat, if need be littleer with angle modulation, only need press into the through-hole with the telescopic link and hang the couple on the telescopic link that is close to the below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic view of the cover plate structure of the present invention;
FIG. 2 is a schematic view of the base structure of the present invention;
fig. 3 is a sectional view of the mounting seat of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the utility model discloses a semiconductor refrigeration type notebook computer radiating support, the cover plate angle adjusting range is large, and the angle of the cover plate is adjusted by hanging the hook on the telescopic rod of the hook seat; in addition, cold air generated by the semiconductor refrigeration sheet is blown upwards through the second fan, the first fan is blown downwards to form convection, heat generated by the notebook computer is taken away, and a good heat dissipation effect is achieved.
A semiconductor refrigeration type notebook computer heat dissipation bracket, as shown in fig. 1-3, a cover plate 1, a base 2, a heat dissipation module 21 and a first fan 22; wherein, the cover plate 1 is provided with a mounting hole 11 and a hook 12; the base 2 is provided with a mounting foot 23 and a hook seat 24; the mounting hole 11 and the mounting leg 23 are hinged through a screw; the hook 12 is hung on the hook seat 24; the first fan 22 is installed on the base 2 with its wind direction downward; at least two heat dissipation modules 21 are provided and mounted on the base 2.
Specifically, as shown in fig. 2, four heat dissipation modules are provided (wherein the second fans of two heat dissipation modules are not shown).
In order to further optimize the above technical solution, the heat dissipation module 21 includes: an upper cover plate 211, a semiconductor chilling plate 212, a lower cover plate 213 and a second fan 214; the lower cover plate 213 is a groove structure, and the semiconductor refrigeration piece 212 is arranged in the groove structure; the second fan 214 and the upper cover plate 211 are fixed on the lower cover plate 213 by screws, wherein the second fan 214 faces upwards.
Further, the semiconductor refrigeration piece comprises a cold end surface and a hot end surface; wherein the cold end face faces the second fan;
in order to further optimize the technical scheme, two hook seats 24 are arranged; each hook seat 24 comprises a limiting piece 241, a hook seat main body 242, an expansion rod 243 and a spring 244; the hook base main body 242 is provided with a through hole 246, and the telescopic rod 243 and the spring 244 are arranged in the through hole 246; the near end surfaces of the two hook seats 24 are provided with sliding grooves, and the limiting pieces 241 are inserted into the sliding grooves; one end of the spring 244 abuts against the limiting sheet 241, and the other end abuts against the telescopic rod 243; the extension rod 243 has a circular truncated cone structure.
In order to further optimize the above technical solution, the circular truncated cone structure is provided with at least one circle of groove 245.
In order to further optimize the above technical solution, at least one through hole 246 is provided, and the number of the extension rods 243 and the number of the springs 244 correspond to the number of the through holes 246.
As shown in fig. 2, two through holes are provided, when the hook is hung on the telescopic rod far away from the base, in order to adjust the angle small, the telescopic rod can be pressed into the through holes by using tools, when the extension of the telescopic rod (the length of the telescopic rod exceeding the end surface close to the hook) is smaller than the distance between the hook and the end surface close to the hook, the end surface of the telescopic rod is supported by the hook, and the hook is hung on the telescopic rod close to the base, so that the angle adjustment is completed.
Or the limiting sheet is drawn out, and the telescopic rod far away from the base is taken out.
In order to further optimize the above technical solution, the semiconductor cooling plate 212, the first fan 22 and the second fan 214 are electrically connected in parallel.
In order to further optimize the above technical solution, the upper cover plate 211 is provided with a vent groove 215.
In order to further optimize the above technical solution, the cover plate 1 is provided with a ventilation window 13, and the opening position of the ventilation window 13 corresponds to the heat dissipation module 21.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A semiconductor refrigeration type notebook computer radiating bracket is characterized by comprising a cover plate, a base, a radiating module and a first fan; wherein the cover plate is provided with a mounting hole and a hook; the base is provided with a mounting foot and a hook seat; the mounting hole and the mounting foot are hinged through a screw; the hook is hung on the hook seat; the first fan is arranged on the base, and the wind direction of the first fan is downward; the heat dissipation modules are at least provided with two heat dissipation modules and are arranged on the base.
2. The semiconductor refrigeration type notebook computer heat dissipation bracket of claim 1, wherein the heat dissipation module comprises: the upper cover plate, the semiconductor refrigerating plate, the lower cover plate and the second fan are arranged on the upper cover plate; the lower cover plate is of a groove structure, and the semiconductor refrigerating sheet is arranged in the groove structure; the second fan and the upper cover plate are fixed on the lower cover plate through screws, wherein the second fan is in an upward direction.
3. The semiconductor refrigeration type notebook computer heat dissipation bracket as recited in claim 1, wherein two hook seats are provided; each hook seat comprises a limiting piece, a hook seat main body, a telescopic rod and a spring; the hook seat main body is provided with a through hole, and the telescopic rod and the spring are arranged in the through hole; the near end surfaces of the two hook seats are provided with sliding grooves, and the limiting pieces are inserted into the sliding grooves; one end of the spring is abutted against the limiting sheet, and the other end of the spring is abutted against the telescopic rod; the telescopic rod is of a round table structure.
4. The cooling rack for semiconductor refrigeration type notebook computer according to claim 3, wherein the circular truncated cone structure is provided with at least one circle of groove.
5. The heat dissipation bracket for the semiconductor refrigeration type notebook computer as claimed in claim 3, wherein at least one through hole is provided, and the number of the telescopic rods and the number of the springs correspond to the number of the through holes.
6. The semiconductor refrigeration type notebook computer heat dissipation bracket as recited in claim 2, wherein the semiconductor refrigeration sheet, the first fan and the second fan are electrically connected in parallel.
7. The cooling rack for semiconductor refrigerating notebook computer as claimed in claim 2, wherein the upper cover plate is provided with a ventilation slot.
8. The heat dissipation bracket for the semiconductor refrigeration type notebook computer as claimed in claim 1, wherein a ventilation window is disposed on the cover plate, and the ventilation window is disposed at a position corresponding to the heat dissipation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021893894.9U CN212623971U (en) | 2020-09-03 | 2020-09-03 | Semiconductor refrigeration formula notebook computer heat dissipation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021893894.9U CN212623971U (en) | 2020-09-03 | 2020-09-03 | Semiconductor refrigeration formula notebook computer heat dissipation support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212623971U true CN212623971U (en) | 2021-02-26 |
Family
ID=74705245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021893894.9U Expired - Fee Related CN212623971U (en) | 2020-09-03 | 2020-09-03 | Semiconductor refrigeration formula notebook computer heat dissipation support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212623971U (en) |
-
2020
- 2020-09-03 CN CN202021893894.9U patent/CN212623971U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210226 Termination date: 20210903 |