CN215872539U - Heat dissipation module and electronic product with same - Google Patents
Heat dissipation module and electronic product with same Download PDFInfo
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- CN215872539U CN215872539U CN202122407775.9U CN202122407775U CN215872539U CN 215872539 U CN215872539 U CN 215872539U CN 202122407775 U CN202122407775 U CN 202122407775U CN 215872539 U CN215872539 U CN 215872539U
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- cooling pipe
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Abstract
The utility model relates to the technical field, in particular to a heat dissipation module and an electronic product with the same. The heat dissipation module includes: the support piece is provided with a first heat dissipation port; the air blowing piece is arranged on the supporting piece, and an air outlet of the air blowing piece faces the first heat dissipation opening; and the liquid cooling pipe is arranged between the air outlet and the first heat dissipation opening, one end of the liquid cooling pipe is communicated with the refrigerant inlet, and the other end of the liquid cooling pipe is communicated with the refrigerant outlet. The heat that electronic product produced in the course of the work is through blowing the piece and outwards blowing, makes the inside air of heat dissipation module and the air around the heat dissipation module take place the heat exchange, cooperates the liquid cooling pipe that sets up in air outlet department simultaneously for the air that blows off can keep lower temperature from first thermovent, avoids because electronic product long-time operation ambient temperature risees, and the heat dissipation module that leads to worsens electronic product's cooling effect.
Description
Technical Field
The utility model relates to the technical field, in particular to a heat dissipation module and an electronic product with the same.
Background
With the rapid development of computer technology, notebook computers are thinner, smaller and lighter, but people are pursuing new notebook computers that are thinner, smaller and lighter. In the prior art, electronic products such as notebook computers and the like can generate heat seriously in the using process, the running speed of a CPU of the computer is slowed due to the defects caused by the heat generation of the computer, the program opening response is slow, the phenomena of blue screen and blockage occur, the phenomenon of sudden shutdown or incapability of continuing starting occurs, even the phenomenon of burning out a mainboard occurs, and the like, so that the service life of the whole computer and parts of each computer is shortened, the performance is reduced, and the overall quality of the notebook computer is seriously influenced.
In order to solve the heat dissipation problem, the heat dissipation of the existing electronic products such as the notebook computer and the like is mainly air-cooled forced convection heat dissipation, the heat of devices such as chips and the like is transferred to the metal fins through a heat pipe or VC and the like, and the heat is blown out of the system through fan air cooling. The capacity of an air-cooled heat dissipation system is limited, and when the product is used for a long time, the temperature around the product can rise, so that the heat dissipation capacity of the product is poor, the temperature of the product rises, and the normal operation of the product is influenced.
SUMMERY OF THE UTILITY MODEL
Therefore, the present invention is directed to overcome the defect that an air-cooled heat dissipation system of an electronic product in the prior art has poor heat dissipation capability after the product runs for a long time, and to provide a heat dissipation module and an electronic product having the same.
In order to solve the above technical problem, the present invention provides a heat dissipation module, including:
the support piece is provided with a first heat dissipation port;
the air blowing piece is arranged on the supporting piece, and an air outlet of the air blowing piece faces the first heat dissipation opening;
and the liquid cooling pipe is arranged between the air outlet and the first heat dissipation opening, one end of the liquid cooling pipe is communicated with the refrigerant inlet, and the other end of the liquid cooling pipe is communicated with the refrigerant outlet.
Optionally, a plurality of heat conducting fins are installed between the air outlet and the first heat dissipating opening, the plurality of heat conducting fins are parallel to each other, and the heat conducting fins are perpendicular to the first heat dissipating opening.
Optionally, the liquid cooling pipe sequentially penetrates through the plurality of heat conducting fins.
Optionally, the support member is fixedly provided with a heat conducting member, the heat conducting member at least comprises a heat radiating portion arranged in parallel with the liquid cooling pipe and a heat conducting portion extending away from the heat radiating portion, and the heat radiating portion is arranged between the air outlet and the first heat radiating opening.
Optionally, the support member is further provided with a second heat dissipation opening, and the second heat dissipation opening and the first heat dissipation opening are vertically arranged.
Optionally, the blowing part comprises a mounting shell and a fan mounted in the mounting shell, the air outlet is arranged at one side of the mounting shell, and the direction of the air outlet is perpendicular to the axial direction of the fan.
Optionally, the support member is a housing, and the refrigerant outlet and the refrigerant inlet are respectively disposed at two sides of the first heat dissipation opening along the length direction.
The utility model also provides an electronic product which is provided with the heat dissipation module.
The technical scheme of the utility model has the following advantages:
1. the utility model provides a heat radiation module, comprising: the support piece is provided with a first heat dissipation port; the air blowing piece is arranged on the supporting piece, and an air outlet of the air blowing piece faces the first heat dissipation opening; and the liquid cooling pipe is arranged between the air outlet and the first heat dissipation opening, one end of the liquid cooling pipe is communicated with the refrigerant inlet, and the other end of the liquid cooling pipe is communicated with the refrigerant outlet.
When the heat dissipation module is applied to electronic products such as notebook computers, the heat generated by the electronic products in the working process is blown outwards through the blowing piece, so that the heat exchange between the air inside the heat dissipation module and the air around the heat dissipation module occurs, and meanwhile, the liquid cooling pipe arranged at the air outlet is matched, a refrigerant is continuously introduced into the liquid cooling pipe through the refrigerant inlet, flows out from the refrigerant outlet after passing through the liquid cooling pipe, and exchanges heat with the hot air at the air outlet by the refrigerant at the liquid cooling pipe, so that the air blown out from the first heat dissipation port can keep a lower temperature, and the problem that the environmental temperature rises due to the long-time operation of the electronic products is avoided, and the cooling effect of the heat dissipation module on the electronic products is poor.
2. According to the heat dissipation module provided by the utility model, the plurality of heat conducting fins are arranged between the air outlet and the first heat dissipation opening, are parallel to each other and are vertical to the first heat dissipation opening. Through setting up the conducting strip for the temperature of refrigerant can carry out the heat transfer through between conducting strip and the hot-air, promotes the cooling ability of refrigerant to the air.
3. According to the heat dissipation module provided by the utility model, the heat conducting piece is fixedly arranged on the supporting piece, the heat conducting piece at least comprises the heat dissipation part arranged in parallel with the liquid cooling pipe and the heat conducting part extending away from the heat dissipation part, and the heat dissipation part is arranged between the air outlet and the first heat dissipation opening. Through setting up the heat conduction piece, convey the heat of support piece other positions to the radiating part through the heat conduction portion, because the radiating part is located air outlet department, be close to the setting of liquid cooling pipe, can realize concentrating the back to the heat in the support piece, cool down in unison, and then reduce the inside holistic average temperature of support piece.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present invention.
Fig. 2 is a top view of a heat dissipation module according to an embodiment of the utility model.
Fig. 3 is a side view of a heat dissipation module according to an embodiment of the utility model.
Fig. 4 is a schematic structural view illustrating a structure in which the blowing member and the heat conductive sheet are installed in cooperation according to an embodiment of the present invention.
Description of reference numerals: 1. a support housing; 2. a liquid-cooled tube; 3. a blowing member; 4. a heat conductive member; 5. a first heat dissipation port; 6. a second heat dissipation port; 7. a refrigerant inlet; 8. a refrigerant outlet; 9. a heat conductive sheet.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
As shown in fig. 1 to 4, the heat dissipation module provided in this embodiment includes: support piece, blast piece 3 and liquid cooling pipe 2. Support piece chooses the support shell 1 of cuboid shape for use in this embodiment, and it all installs in support shell 1 to blow 3 and liquid cooling pipe 2. The supporting shell 1 is provided with a first heat dissipation port 5 and a second heat dissipation port 6, the first heat dissipation port 5 is arranged on the right side face of the supporting shell 1, the second heat dissipation port 6 is arranged on the bottom face of the supporting shell 1, and the second heat dissipation port 6 and the first heat dissipation port 5 are vertically arranged.
The air blowing piece 3 is arranged in the cavity of the supporting shell 1, and the air outlet of the air blowing piece 3 faces the first heat dissipation port 5. The blowing piece 3 in the embodiment comprises an installation shell and a fan installed in the installation shell, the air outlet is formed in one side of the installation shell, and the direction of the air outlet is perpendicular to the axial direction of the fan. The liquid cooling pipe 2 is installed between the air outlet and the first heat dissipation opening 5, one end of the liquid cooling pipe 2 is communicated with the refrigerant inlet 7, and the other end of the liquid cooling pipe is communicated with the refrigerant outlet 8. The refrigerant outlet 8 and the refrigerant inlet 7 are respectively provided at both sides of the first heat dissipation opening 5 in the length direction. A plurality of heat-conducting fins 9 are arranged between the air outlet and the first heat-radiating opening 5, the plurality of heat-conducting fins 9 are parallel to each other, and the heat-conducting fins 9 are perpendicular to the first heat-radiating opening 5. The liquid cooling pipe 2 is sequentially arranged by penetrating through the plurality of heat conducting fins 9.
Still fixed mounting has heat-conducting piece 4 in the support shell 1, and heat-conducting piece 4 includes the heat dissipation part with liquid cooling pipe 2 parallel arrangement and keeps away from the heat conduction part that the heat dissipation part extends in this embodiment, and the heat dissipation part is installed between air outlet and first thermovent 5. And is fixedly connected above the plurality of heat-conducting fins 9. The heat conduction portion extends toward the inside of the support case 1.
The refrigerant flows through the external driving pump, and the heat of the system is continuously taken out of the system in a circulating manner and is cooled. Taking water as an example of the refrigerant, the temperature of the refrigerant inlet 7 is 25 degrees at room temperature, the temperature of the outlet water is 45 degrees, the flow rate of the water is 0.1M/s, the specific heat capacity value of the water is 4.2 x 103J/(Kg x C), the density is 1000Kg/M3, the quantity of heat taken away per second is Q C x M x T4.2 x 103 x 3.14 x (1.4 x 10-3) x 0.1 x 20 x 24.865J, and P Q/T24.865 w, which means that at least 24.864J more heat can be taken away per second at the first heat dissipation port 5, and the temperature of the air blown out from the first heat dissipation port 5 is kept at a low level.
When the heat dissipation module is applied to electronic products such as notebook computers, the heat generated by the electronic products in the working process is blown outwards through the blowing piece 3, so that the heat exchange between the air inside the heat dissipation module and the air around the heat dissipation module occurs, and meanwhile, the liquid cooling pipe 2 arranged at the air outlet is matched, a refrigerant is continuously introduced into the liquid cooling pipe 2 through the refrigerant inlet 7, flows out from the refrigerant outlet 8 after passing through the liquid cooling pipe 2, and the refrigerant exchanges heat with the hot air at the air outlet at the liquid cooling pipe 2, so that the air blown out from the first heat dissipation port 5 can keep a lower temperature, and the problem that the environmental temperature rises due to the long-time operation of the electronic products is avoided, and the cooling effect of the heat dissipation module on the electronic products is poor. Through the cooperation work of liquid cooling pipe 2 and piece 3 of blowing, can reduce the electronic product surface temperature such as notebook when long-time operation, improve electronic product's performance, improve user experience satisfaction.
As an alternative embodiment, the heat-conducting member includes a plurality of heat-conducting portions, each of which extends from the heat-radiating portion toward the inside of the support case.
Example 2
The present embodiment provides an electronic product, which may be a notebook computer, a tablet computer, a mobile phone, an MP4 player, and the like, wherein the electronic product is provided with the heat dissipation module described in embodiment 1. The electronic product is cooled through the cooperation of the air blowing piece and the liquid cooling pipe in the heat dissipation module, and when the electronic product is used for a long time, the temperature of the electronic product and the ambient temperature around the electronic product can be kept at a lower level, so that the stability of the electronic product in long-time operation is ensured.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the utility model.
Claims (8)
1. A heat dissipation module, comprising:
the support piece is provided with a first heat dissipation opening (5);
the air blowing piece (3) is arranged on the supporting piece, and an air outlet of the air blowing piece (3) faces the first heat dissipation opening (5);
the liquid cooling pipe (2) is installed between the air outlet and the first heat dissipation opening (5), one end of the liquid cooling pipe (2) is communicated with the refrigerant inlet (7), and the other end of the liquid cooling pipe is communicated with the refrigerant outlet (8).
2. The thermal module according to claim 1, wherein a plurality of heat-conducting fins (9) are installed between the air outlet and the first heat-dissipating opening (5), the plurality of heat-conducting fins (9) are parallel to each other, and the heat-conducting fins (9) are perpendicular to the first heat-dissipating opening (5).
3. The heat dissipation module according to claim 2, wherein the liquid-cooled tube (2) is sequentially disposed through the plurality of heat-conducting fins (9).
4. The heat dissipation module according to any one of claims 1 to 3, wherein the support member is fixedly mounted with a heat conduction member (4), the heat conduction member (4) includes at least a heat dissipation portion arranged parallel to the liquid cooling tube (2) and a heat conduction portion extending away from the heat dissipation portion, and the heat dissipation portion is mounted between the air outlet and the first heat dissipation opening (5).
5. The thermal module according to any of claims 1 to 3, wherein a second heat dissipation opening (6) is further disposed on the supporting member, and the second heat dissipation opening (6) is disposed vertically to the first heat dissipation opening (5).
6. The heat dissipation module according to any one of claims 1 to 3, wherein the blower (3) includes a mounting housing and a fan mounted in the mounting housing, the air outlet is disposed at one side of the mounting housing, and the air outlet is oriented perpendicular to an axial direction of the fan.
7. The heat dissipation module according to any one of claims 1 to 3, wherein the support member is a housing, and the coolant outlet (8) and the coolant inlet (7) are respectively disposed at two sides of the first heat dissipation opening (5) along a length direction thereof.
8. An electronic product, characterized in that, has the heat dissipation module of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122407775.9U CN215872539U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation module and electronic product with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122407775.9U CN215872539U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation module and electronic product with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215872539U true CN215872539U (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122407775.9U Active CN215872539U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation module and electronic product with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215872539U (en) |
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2021
- 2021-09-30 CN CN202122407775.9U patent/CN215872539U/en active Active
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