CN216210430U - Heat dissipation device and projection equipment - Google Patents

Abstract

The embodiment of the utility model provides a heat dissipation device and projection equipment, and relates to the field of heat dissipation of projection equipment. The heat dissipation device comprises a semiconductor refrigeration piece, a first heat dissipation fan and a second heat dissipation fan, wherein the semiconductor refrigeration piece is provided with a cold air side and a hot air side, the first heat dissipation fan is installed on the cold air side, the air outlet direction of the first heat dissipation fan is opposite to the cold air side, the second heat dissipation fan is installed on the hot air side, and the air outlet direction of the second heat dissipation fan is opposite to the hot air side. When the heat dissipation device is used, the cold air side of the semiconductor refrigeration piece faces the part to be dissipated, the cold air side of the semiconductor refrigeration piece can cool gas, the first heat dissipation fan blows the cooled gas to the part to be dissipated, the heat dissipation capacity is optimized, the heat dissipation effect is improved, and meanwhile, the second heat dissipation fan can discharge the gas on the hot air side of the semiconductor refrigeration piece to avoid influencing the cold air side of the semiconductor refrigeration piece.

Description

Heat dissipation device and projection equipment

Technical Field

The utility model relates to the field of projection equipment heat dissipation, in particular to a heat dissipation device and projection equipment.

Background

The heat dissipation mode of the existing market projection equipment is mainly air-cooled heat dissipation and water-cooled heat dissipation, and the water-cooled heat dissipation mode is mainly used for heat dissipation by adopting an air-cooled heat dissipation mode at present because a water cooling system is large in size, high in price, high in heat dissipation efficiency of core components and relatively weak in heat dissipation efficiency of surrounding components.

The forced air cooling radiating mode reaches radiating purpose through the convection current, generally can improve the radiating effect through the increase wind speed, but the increase wind speed can lead to the radiating effect poor, influences the use and experiences the sense.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heat dissipation device and projection equipment, which can improve the heat dissipation effect in a mode of reducing the temperature of gas.

Embodiments of the utility model may be implemented as follows:

an embodiment of the present invention provides a heat dissipation apparatus, including:

a semiconductor chilling plate having a cold air side and a hot air side;

the cooling system comprises a first cooling fan and a second cooling fan, wherein the first cooling fan is arranged on the cold air side, the air outlet direction of the first cooling fan is opposite to the cold air side, the second cooling fan is arranged on the hot air side, and the air outlet direction of the second cooling fan is opposite to the hot air side.

Optionally, the first cooling fan and the cold air side are arranged at an interval, the cooling device further comprises a first radiator, one side of the first radiator is connected with the cold air side, and the other side of the first radiator is connected with the first cooling fan.

Optionally, the first heat sink includes a first bottom plate, a first side plate, and first heat dissipation fins, the first bottom plate is connected to the cold air side, the first side plate is connected to a side edge of the first bottom plate away from the cold air side, and the first heat dissipation fins are disposed on the first bottom plate.

Optionally, the second heat dissipation fan and the hot air side are arranged at an interval, the heat dissipation device further includes a second heat sink, one side of the second heat sink is connected with the hot air side, and the other side of the second heat sink is connected with the second heat dissipation fan.

Optionally, the second heat sink includes a second bottom plate, a second side plate, and second heat dissipation fins, the second bottom plate is connected to the hot air side, the second side plate is connected to a side edge of the second bottom plate away from the hot air side, and the second heat dissipation fins are disposed on the second bottom plate.

Optionally, the heat dissipation device further includes a heat conducting fin, and the semiconductor refrigeration fin is disposed on the heat conducting fin.

Optionally, a through hole is formed in the heat conducting sheet, and the semiconductor refrigeration sheet is arranged in the through hole.

The embodiment of the utility model also provides projection equipment, which comprises an optical machine and the heat dissipation device;

the number of the heat dissipation devices is multiple, and the cold air sides of all the heat dissipation devices face the parts, to be dissipated, of the optical machine.

Optionally, the projection apparatus further includes a wind guide, the wind guide is disposed on the cold air side, and the wind guide is configured to guide air.

Optionally, the heat dissipation device further includes a heat conducting fin, the semiconductor refrigeration fin is disposed on the heat conducting fin, the projection apparatus further includes a baffle, the baffle is connected to the heat conducting fin, and the baffle is used for separating the cold air side from the hot air side.

Optionally, the air guide is a mylar sheet.

The projection equipment with the heat dissipation device provided by the embodiment of the utility model has the beneficial effects that:

the heat dissipation device comprises a semiconductor refrigeration piece, a first heat dissipation fan and a second heat dissipation fan, wherein the semiconductor refrigeration piece is provided with a cold air side and a hot air side, the air outlet direction of the first heat dissipation fan is back to the cold air side, the air outlet direction of the second heat dissipation fan is back to the hot air side, when the heat dissipation device is used, the cold air side of the semiconductor refrigeration piece faces towards the part to be dissipated, the cold air side of the semiconductor refrigeration piece can cool gas, the first heat dissipation fan blows the cooled gas to the part to be dissipated, the heat dissipation capability is optimized, the heat dissipation effect is improved, meanwhile, the second heat dissipation fan can discharge the gas on the hot air side of the semiconductor refrigeration piece, and the influence on the cold air side of the semiconductor refrigeration piece is avoided.

This projection equipment includes ray apparatus and a plurality of heat abstractor, and all heat abstractor's cold wind side all sets up towards the heat dissipation part of treating of ray apparatus for the gas after a plurality of cold wind side cooling processes is whole to be blown to treating the heat dissipation part, has optimized the heat-sinking capability, has improved the radiating effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a first viewing angle of a projection apparatus provided in this embodiment;

fig. 2 is a schematic structural diagram of a second viewing angle of the projection apparatus provided in this embodiment;

fig. 3 is a schematic structural diagram of a heat dissipation device according to this embodiment.

Icon: 100-semiconductor refrigerating sheet; 110-cold air side; 120-hot air side; 200-a first heat dissipation fan; 300-a second heat dissipation fan; 400-a first heat sink; 410-a first backplane; 420-a first side panel; 430-first cooling fins; 500-a second heat sink; 510-a second backplane; 520-a second side plate; 530-second cooling fins; 600-a thermally conductive sheet; 700-an air guide member; 800-baffle plate; 1000-a heat sink; 2000-ray machine; 3000-complete machine shell; 3100-a first heat sink; 3200-a second heat sink; 3300-third thermovent; 3400-a fourth heat-dissipating port; 3500-fifth heat dissipation opening; 3600-a sixth heat dissipation port; 4000-projection apparatus.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually placed when the utility model is used, it is only for convenience of describing the present invention and simplifying the description, but it is not necessary to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and be operated, and thus, it should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

The heat dissipation mode of the projection equipment in the current market is mainly air-cooled heat dissipation and water-cooled heat dissipation, and the water-cooled heat dissipation mode is mainly used for heat dissipation by adopting an air-cooled heat dissipation mode because a water cooling system is large in size, high in price, high in heat dissipation efficiency of core components and relatively weak in heat dissipation efficiency of surrounding components.

The air-cooled radiating mode reaches radiating purpose through the convection current, generally can improve the radiating effect through the increase wind speed, but the noise also can increase thereupon when increasing the wind speed, influences the use and experiences the sense.

Referring to fig. 1, the present embodiment provides a projection apparatus 4000, where the projection apparatus 4000 includes a casing 3000, and the casing 3000 is rectangular.

In the above description, the relative positions in fig. 1 and fig. 2 are used for illustration, and the up, down, left, right, front and back directions shown in fig. 1 and fig. 2 can be understood as the relative positions of the projection apparatus 4000 in fig. 1 and fig. 2, or the relative positional relationship of the projection apparatus 4000 in the normal placement of the product.

Referring to the relative positions of fig. 1 and fig. 2, a first heat dissipation port 3100 is disposed on the left side of the casing 3000, a second heat dissipation port 3200 is disposed on the right side of the casing 3000, a third heat dissipation port 3300 is disposed on the front side of the casing 3000, a fourth heat dissipation port 3400 is disposed on the rear side of the casing 3000, a fifth heat dissipation port 3500 is disposed on the upper side of the casing 3000, and a sixth heat dissipation port 3600 is disposed on the lower side of the casing 3000.

Referring to fig. 2, the projection apparatus 4000 further includes an optical machine 2000 and a heat dissipation device 1000, wherein the optical machine 2000 and the heat dissipation device 1000 are both installed in the whole casing 3000, and the heat dissipation device 1000 can solve the above-mentioned technical problems and can improve the heat dissipation effect by reducing the gas temperature.

In this embodiment, the number of the heat dissipation devices 1000 is two, and the two heat dissipation devices 1000 are respectively disposed on two sides of the optical engine 2000, specifically, the two heat dissipation devices 1000 are respectively disposed on the portions of the optical engine 2000 to be dissipated.

In other embodiments, the number of the heat dissipation devices 1000 may be multiple, the heat dissipation devices 1000 are respectively disposed on two sides of the portion of the optical machine 2000 to be dissipated, and the heat dissipation devices 1000 are configured to blow air to dissipate heat of the portion to be dissipated simultaneously.

The projection apparatus 4000 further includes an air guide 700, one end of the air guide 700 is connected to the heat dissipation device 1000, the other end of the air guide 700 is connected to an inner side wall of the whole casing 3000, and the air guide 700 is used for guiding air generated by the heat dissipation device 1000, so as to ensure a good heat dissipation effect.

Specifically, the number of the air guide 700 is plural, and the air guide 700 is a mylar sheet, but in other embodiments, the air guide 700 may also be a fiber paper.

The projection apparatus 4000 further includes a baffle 800, the baffle 800 is connected to the whole casing 3000, and the heat sink 1000 is mounted on the whole casing 3000 through the baffle 800.

Referring to fig. 3, the heat dissipation device 1000 includes a semiconductor chilling plate 100, a first cooling fan 200 and a second cooling fan 300, the semiconductor chilling plate 100 has a cold side 110 and a hot side 120, the first cooling fan 200 is installed on the cold side 110, an air outlet direction of the first cooling fan 200 faces away from the cold side 110, the second cooling fan 300 is installed on the hot side 120, and an air outlet direction of the second cooling fan 300 faces away from the hot side 120.

The cold wind side 110 of semiconductor refrigeration piece 100 is towards the portion of waiting to dispel the heat of ray apparatus 2000, and first radiator fan 200 sets up the cold wind side 110 at semiconductor refrigeration piece 100, and the air-out direction of first radiator fan 200 is towards ray apparatus 2000, and first radiator fan 200 during operation produces the suction effect for around gas flow through behind the cold wind side 110, outwards flow out through first radiator fan 200, dispel the heat to ray apparatus 2000.

The hot wind side 120 of the semiconductor refrigeration sheet 100 faces away from the portion to be cooled of the optical machine 2000, the second cooling fan 300 is disposed on the hot wind side 120 of the semiconductor refrigeration sheet 100, and the air outlet direction of the second cooling fan 300 faces away from the hot wind side 120, and the second cooling fan 300 generates a suction effect when working, so that surrounding air flows through the hot wind side 120 and then flows out through the second cooling fan 300.

In the present embodiment, the number of the first heat dissipation fans 200 is two, and the number of the second heat dissipation fans 300 is two.

Specifically, two first heat dissipation fans 200 are disposed side by side, and two second heat dissipation fans 300 are disposed side by side.

In this embodiment, the first heat dissipation fan 200 is disposed at an interval from the cold air side 110, the heat dissipation device 1000 further includes a first heat dissipation device 400, one side of the first heat dissipation device 400 is connected to the cold air side 110, the other side of the first heat dissipation device 400 is connected to the first heat dissipation fan 200, wherein a rivet is disposed on the other end of the first heat dissipation device 400, and the first heat dissipation device 400 is connected to the first heat dissipation fan 200 through the rivet.

Specifically, the first heat sink 400 includes a first bottom plate 410, a first side plate 420 and first heat dissipation fins 430, the first bottom plate 410 is connected to the cold air side 110, the first side plate 420 is connected to a side edge of the first bottom plate 410 away from the cold air side 110, the first side plate 420 is used for mounting a rivet, and the first heat dissipation fins 430 are disposed on the first bottom plate 410, wherein the first heat dissipation fins 430 are disposed in parallel with the first side plate 420.

The relative position in fig. 3 is used for illustration, and the up-down direction shown in fig. 3 can be understood as the relative position of the heat dissipation device 1000 in fig. 3, or the relative position relationship of the product when the product is normally placed.

To explain the relative position of fig. 3, the number of the first side plates 420 is two, and the two first side plates 420 are respectively connected to the upper side and the lower side of the first bottom plate 410.

The number of the first heat dissipation fins 430 is multiple, the multiple first heat dissipation fins 430 are arranged at intervals, and a heat dissipation channel is formed between two adjacent first heat dissipation fins 430.

The second heat dissipation fan 300 is spaced from the hot air side 120, the heat dissipation device 1000 further includes a second heat dissipation device 500, one side of the second heat dissipation device 500 is connected to the hot air side 120, the other side of the second heat dissipation device 500 is connected to the second heat dissipation fan 300, a rivet column is disposed at the other end of the second heat dissipation device 500, and the second heat dissipation device 500 is connected to the second heat dissipation fan 300 through the rivet column.

Specifically, the second heat sink 500 includes a second bottom plate 510, a second side plate 520 and second heat dissipation fins 530, the second bottom plate 510 is connected to the hot air side 120, the second side plate 520 is connected to a side edge of the second bottom plate 510 away from the hot air side 120, the second side plate 520 is used for mounting a rivet, and the second heat dissipation fins 530 are disposed on the second bottom plate 510, wherein the second side plate 520 and the second heat dissipation fins 530 are disposed in parallel.

The number of the second side plates 520 is two, and the two second side plates 520 are connected to the upper and lower sides of the second base plate 510, respectively.

The number of the second heat dissipation fins 530 is plural, the plural second heat dissipation fins 530 are arranged at intervals, and a heat dissipation channel is formed between two adjacent second heat dissipation fins 530.

In addition, the heat dissipation device 1000 further includes a heat conductive sheet 600, and the semiconductor cooling sheet 100 is disposed on the heat conductive sheet 600. Specifically, a through hole is formed in the heat conducting plate 600, and the semiconductor refrigeration plate 100 is disposed in the through hole.

In this embodiment, the number of the semiconductor refrigeration pieces 100 is two, two through holes are formed in the heat conducting plate 600, the two through holes are arranged at intervals, and the two semiconductor refrigeration pieces 100 are respectively arranged in the two through holes.

Specifically, the heat conducting sheet 600 is a heat conducting silicone pad, and in other embodiments, the heat conducting sheet 600 may also be a metal plate or a heat conducting adhesive tape.

It is understood that the air guide 700 is disposed on the cold air side 110, and the air guide 700 is used to guide air.

Referring to fig. 2, one side of the air guide 700 is connected to the first cooling fan 200, the other side of the air guide 700 is connected to an inner side wall of the whole casing 3000, and the air guide 700 is used for guiding the cold air blown out by the first cooling fan 200, so as to ensure a good cooling effect on the portion of the optical machine 2000 to be cooled.

The baffle 800 is connected to the heat conductive sheet 600, and the baffle 800 is used to separate the cold wind side 110 from the hot wind side 120.

Specifically, the baffle 800 is connected to the heat conductive sheet 600, and the baffle 800 can separate the cold air side 110 from the hot air side 120, so as to prevent the cold air from the first cooling fan 200 and the hot air from the second cooling fan 300 from mixing.

In addition, the baffle 800 may also be used as a mounting bracket for the first heat sink 400 or the second heat sink 500, the first heat sink 400 is connected to one side of the baffle 800 by screws, and the second heat sink 500 is connected to the other side of the baffle 800 by screws.

More, the cold air side 110 and the hot air side 120 of the semiconductor are respectively provided with a temperature sensor, and the temperature change of the cold air side 110 and the hot air side 120 of the semiconductor refrigeration piece 100 is monitored in real time through the temperature sensors.

In this embodiment, the rotation speed adjustment parameters of the first cooling fan 200 and the second cooling fan 300 mainly depend on the temperature of the cold air side 110 of the semiconductor chilling plate 100, the temperature of the hot air side 120 of the semiconductor chilling plate 100, the ambient temperature, and the temperature of the optical machine 2000, and during the heat dissipation design process, an optimal balance can be achieved by adjusting the temperature of the cold air side 110 of the semiconductor chilling plate 100, the temperature of the hot air side 120 of the semiconductor chilling plate 100, and the rotation speed of the cooling fan according to different brightness of the optical machine.

In the present embodiment, the rotation speed of the second heat dissipation fan 300 is controlled by the temperature difference between the cold air side 110 and the hot air side 120 of the semiconductor cooling sheet 100, and the rotation speed of the second heat dissipation fan 300 is controlled according to whether the temperature difference between the cold air side 110 and the hot air side 120 of the semiconductor cooling sheet 100 exceeds a set threshold.

The rotation speed of the first cooling fan 200 is cooperatively controlled by the temperature of the cold air side 110 of the semiconductor cooling plate 100 and the temperature of the optical machine.

The voltage of the semiconductor cooling plate 100 is cooperatively controlled by the ambient temperature and the temperature of the optical machine.

The working principle of the heat dissipation device 1000 provided by this embodiment is as follows:

referring to fig. 1 and 2, when the heat dissipation device 1000 starts to work, ambient air can be sucked into the entire casing 3000 through the fifth heat dissipation opening 3500 and the sixth heat dissipation opening 3600, the air entering the entire casing 3000 is divided into the first heat dissipation device 400 and the second heat dissipation device 500, and respectively collected on the cold air side 110 and the hot air side 120 of the semiconductor chilling plate 100, then the first cooling fan 200 blows the air on the cold air side 110 to the optical machine 2000 for heat dissipation, and the air after heat dissipation is finally discharged through the third heat dissipation opening 3300 and the fourth heat dissipation opening 3400; the second heat dissipation fan 300 discharges the air on the hot wind side 120 through the first heat dissipation port 3100 and the second heat dissipation port 3200.

The heat dissipation device 1000 provided in this embodiment has at least the following advantages:

the cold wind side 110 of the semiconductor refrigeration piece 100 can cool the gas blown to the projection part to be cooled, so that the wind speed of the cooling fan can be reduced under the condition of ensuring the cooling effect, and the noise of the optical machine 2000 complete machine can be reduced to a certain extent.

To sum up, the embodiment of the utility model provides a heat dissipation apparatus 1000 and a projection apparatus 4000, the heat dissipation apparatus 1000 includes a semiconductor chilling plate 100, a first cooling fan 200 and a second cooling fan 300, the semiconductor chilling plate 100 has a cold side 110 and a hot side 120, the first cooling fan 200 is installed on the cold side 110, an air outlet direction of the first cooling fan 200 faces away from the cold side 110, the second cooling fan 300 is installed on the hot side 120, and an air outlet direction of the second cooling fan 300 faces away from the hot side 120, when the heat dissipation apparatus 1000 is used, the cold side 110 of the semiconductor chilling plate 100 faces towards a portion to be dissipated, the cold side 110 of the semiconductor chilling plate 100 can cool air, the first cooling fan 200 blows the cooled air towards the portion to be dissipated, thereby optimizing heat dissipation capacity and improving heat dissipation effect, and meanwhile, the second cooling fan 300 can exhaust the air from the hot side 120 of the semiconductor chilling plate 100, avoiding impact on the cold air side 110 of the semiconductor chilling plate 100.

This projection equipment 4000 includes ray apparatus 2000 and a plurality of heat abstractor 1000, and all heat abstractor 1000's cold wind side 110 all sets up towards the portion of treating the heat dissipation of ray apparatus 2000 for the gaseous whole the blowing of a plurality of cold wind side 110 cooling after handling is to treating the heat dissipation portion, has optimized the heat-sinking capability, has improved the radiating effect.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. A heat dissipating device, comprising:

a semiconductor chilling plate (100), the semiconductor chilling plate (100) having a cold air side (110) and a hot air side (120);

the cooling structure comprises a first cooling fan (200) and a second cooling fan (300), wherein the first cooling fan (200) is installed on the cold air side (110), the air outlet direction of the first cooling fan (200) is opposite to the cold air side (110), the second cooling fan (300) is installed on the hot air side (120), and the air outlet direction of the second cooling fan (300) is opposite to the hot air side (120).

2. The heat dissipating device according to claim 1, wherein the first heat dissipating fan (200) is disposed apart from the cool air side (110), the heat dissipating device (1000) further comprises a first heat sink (400), one side of the first heat sink (400) is connected to the cool air side (110), and the other side of the first heat sink (400) is connected to the first heat dissipating fan (200).

3. The heat dissipating device according to claim 2, wherein the first heat sink (400) comprises a first bottom plate (410), a first side plate (420) and first heat dissipating fins (430), the first bottom plate (410) is connected to the cold air side (110), the first side plate (420) is connected to a side edge of the first bottom plate (410) away from the cold air side (110), and the first heat dissipating fins (430) are disposed on the first bottom plate (410).

4. The heat dissipating device according to claim 1, wherein the second heat dissipating fan (300) is disposed apart from the hot wind side (120), the heat dissipating device (1000) further comprises a second heat sink (500), one side of the second heat sink (500) is connected to the hot wind side (120), and the other side of the second heat sink (500) is connected to the second heat dissipating fan (300).

5. The heat dissipating device as claimed in claim 4, wherein the second heat sink (500) comprises a second bottom plate (510), a second side plate (520) and second heat dissipating fins (530), the second bottom plate (510) is connected to the hot wind side (120), the second side plate (520) is connected to a side edge of the second bottom plate (510) away from the hot wind side (120), and the second heat dissipating fins (530) are disposed on the second bottom plate (510).

6. The heat dissipating device according to any one of claims 1 to 5, wherein the heat dissipating device (1000) further comprises a heat conducting sheet (600), and the semiconductor refrigeration sheet (100) is disposed on the heat conducting sheet (600).

7. The heat dissipating device as claimed in claim 6, wherein the heat conducting plate (600) is provided with a through hole, and the semiconductor chilling plate (100) is disposed in the through hole.

8. A projection device comprising an optical engine (2000) and the heat sink (1000) of any of claims 1-7;

the number of the heat dissipation devices (1000) is multiple, and the cold air sides (110) of all the heat dissipation devices (1000) are arranged towards the part, to be dissipated, of the optical machine (2000).

9. The projection apparatus according to claim 8, wherein the projection apparatus (4000) further comprises a wind guide (700), the wind guide (700) being disposed on the cool air side (110), the wind guide (700) being configured to guide air.

10. The projection apparatus according to claim 8, wherein the heat sink (1000) further comprises a heat conducting sheet (600), the semiconductor cooling sheet (100) is disposed on the heat conducting sheet (600), the projection apparatus (4000) further comprises a baffle (800), the baffle (800) is connected to the heat conducting sheet (600), and the baffle (800) is used for separating the cold wind side (110) from the hot wind side (120).

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