CN218383869U

CN218383869U - Computer case cooling system

Info

Publication number: CN218383869U
Application number: CN202222465301.4U
Authority: CN
Inventors: 关明慧; 胡从旭; 韦晓刚
Original assignee: Ziguang Computer Technology Co Ltd
Current assignee: Ziguang Computer Technology Co Ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2023-01-24
Anticipated expiration: 2032-09-15

Abstract

The utility model discloses a computer machine case cooling system, including quick-witted case and host computer heat dissipation module and the CPU heat dissipation module of setting at quick-witted incasement, CPU heat dissipation module includes: a second airflow driver; the air inlet channel is arranged at the air inlet of the second airflow driving piece, and the air inlet end of the air inlet channel is arranged close to the CPU main board; the air outlet channel is arranged at the air outlet of the second air flow driving piece, and the air outlet end of the air outlet channel extends to the side plate of the case and is communicated with the air outlet holes in the side plate; the second airflow driving part is suitable for driving the air inlet channel to suck cold airflow so as to cool the CPU mainboard in an air cooling way and discharge the cooled hot airflow through the exhaust holes in the side plate. The utility model discloses can prevent that the convection current from appearing in hot and cold air current in chassis inner chamber, avoid the hot gas flow to appear local backward flow in chassis inner chamber, can effectively reduce the system flow resistance, improve the cooling effect to inside and electrical components of system.

Description

Computer case cooling system

Technical Field

The utility model relates to a computer machine case heat dissipation technical field, concretely relates to computer machine case cooling system.

Background

With the rapid development of information technology, electronic devices are continuously being updated and occupy more and more important positions in daily work and life, and because the electronic devices use a large number of integrated circuits, high temperature can not only cause unstable system operation and shorten service life, but also possibly burn some parts. For the computer host, the heat causing high temperature comes from the inside of the computer case, and a plurality of components are disposed inside the case, wherein the main heat generating components include but are not limited to: CPU, display card and power supply. In order to ensure the service life and the use effect of the computer case, the computer case is generally added with a heat dissipation function.

In the prior art, most computer hosts adopt a cold air cooling system, which comprises a host cooling module and a CPU cooling module arranged in a chassis, wherein the host cooling module generally adopts an air duct form of front panel and side panel air inlet and rear panel air outlet, specifically, a host cooling fan sucks cold air from the front panel into the chassis, and hot air is discharged from the side panel and the rear panel of the chassis after cooling electrical components inside the host; the CPU heat radiation module adopts a heat radiation mode of air inlet from the side of the case side plate and air outlet from four sides, specifically, a CPU heat radiation fan sucks cold air flow from the side of the case, and hot air flow is blown out from four sides close to the top surface, the bottom surface, the front surface and the back surface of the case after flowing through the heat radiation fins. By the design, hot air flow generated by the CPU heat dissipation module, cold air flow sucked by the host heat dissipation module, cold air flow sucked by the CPU heat dissipation module and hot air flow generated by the host heat dissipation module are convected by cold and hot air flows in the case, so that cold and hot air flows in the system are disordered, local backflow is serious, the flow resistance of the system is high, the integral air output of the system is low, the temperatures of internal and partial key components (such as a hard disk) of the system and the surface of the case are high or exceed the standard, and the user experience is poor.

SUMMERY OF THE UTILITY MODEL

Therefore, the technical problem to be solved by the present invention is to overcome the defects of disordered cold and hot air flow, serious local backflow and large system flow resistance in the computer case heat dissipation system in the prior art, so that the whole air output of the system is low, and the temperature of the internal and partial key components (such as hard disk) of the system and the surface of the case is high or exceeds the standard.

Therefore, the embodiment of the utility model provides a computer machine case cooling system, this computer machine case cooling system include quick-witted case and host computer heat dissipation module and the CPU heat dissipation module of setting at quick-witted incasement, wherein, host computer heat dissipation module includes:

the first airflow driving part is arranged in the case and is configured to suck cold airflow from an air inlet hole on the front side of the case and drive the cold airflow to be discharged from an air outlet hole on the rear side of the case after cooling electrical components inside the case;

the CPU heat dissipation module comprises:

a second airflow driver;

the air inlet channel is arranged at the air inlet of the second airflow driving piece, the air inlet end of the air inlet channel is close to the CPU mainboard, and the air inlet channel is suitable for sucking cold airflow from three directions close to the front surface, the bottom surface and the top surface of the case;

the air outlet channel is arranged at the air outlet of the second air flow driving piece, and the air outlet end of the air outlet channel extends to the side plate of the case and is communicated with the air exhaust holes in the side plate;

the second air flow driving part is suitable for driving the air inlet channel to suck cold air flow from three directions close to the front surface, the bottom surface and the top surface of the case so as to cool the CPU mainboard in an air cooling way and discharge the cooled hot air flow through the exhaust holes in the side plates.

Optionally, the chassis is enclosed by a front panel, a rear panel, a top plate, a bottom plate, and a first side plate and a second side plate which are arranged oppositely, the CPU board is mounted and fixed on the first side plate, and the CPU heat dissipation module is mounted on the first side plate corresponding to the CPU board;

the second side plate and the rear plate are respectively provided with the air exhaust holes, the air inlet channel is positioned close to the first side plate, the air outlet channel is positioned close to the second side plate, and the air outlet end of the air outlet channel is abutted against the inner wall of the second side plate and is communicated with the air exhaust holes in the second side plate.

Optionally, an air inlet end of the air inlet channel covers the CPU board, and an air inlet is disposed on a peripheral wall of the air inlet channel near the air inlet end, and the air inlet includes:

the front side air inlet is arranged on the side wall of one side of the air inlet channel close to the front panel and is suitable for sucking cold air flow from the front of the case;

the top air inlet is arranged on the side wall of one side, close to the top plate, of the air inlet channel and is suitable for sucking cold air flow from the top surface of the case;

and the bottom air inlet is arranged on the side wall of one side, close to the bottom plate, of the air inlet channel and is suitable for sucking cold air flow from the bottom surface of the case.

Optionally, a cavity is arranged in the case, and the air inlet hole in the front panel, the air outlet hole in the rear panel and the air inlet of the air inlet channel are communicated with the cavity.

Optionally, the host heat dissipation module is disposed at a rear position close to the rear plate, and the CPU heat dissipation module is disposed between the host heat dissipation module and the front panel;

the air inlet channel is provided with a first air guide shell, the first air guide shell is close to the opening of the front panel side to form the front side air inlet, and the first air guide shell comprises a first air guide side wall arranged close to the rear panel side and two second air guide side walls connected to the upper side and the lower side of the first air guide side wall;

wherein, first wind-guiding lateral wall is connected between the air intake and the first curb plate of second air current driving piece, two second wind-guiding lateral wall one end with the air intake connection of second air current driving piece is the clearance setting of setting for respectively between the other end and the first curb plate, and the clearance between two second wind-guiding lateral walls and the first curb plate constitutes respectively top air intake and bottom air intake.

Optionally, the height of the first air guiding sidewall is set to be h1, and the height of the second air guiding sidewall is set to be h2, where h1 is not less than h2.

Optionally, the air outlet channel is provided with a second air guide shell with two open ends and closed periphery, one open end of the second air guide shell is connected to the air outlet of the second airflow driving part, and the other open end of the second air guide shell extends towards the second side plate and abuts against the second side plate and is communicated with the air exhaust hole in the second side plate.

Optionally, the CPU heat dissipation module further includes:

the cooling fin, with CPU mainboard contact or relative setting are in order to right the CPU mainboard cools off the temperature, the cooling fin install in be close to the one end of air inlet end in the inlet air duct, cold air current is suitable for from the air intake entering inlet air duct of cooling fin bottom and periphery in to behind the cooling fin, discharge through the hole of airing exhaust on air-out passageway and the second curb plate.

Optionally, the first airflow driver and the second airflow driver are both fans.

The utility model discloses technical scheme has following advantage:

1. the utility model discloses in, CPU heat dissipation module sets up with the CPU mainboard relatively for lower the temperature to the CPU mainboard, because the air-out end of air-out passageway extends to the curb plate of machine case and with the exhaust vent is linked together on the curb plate, the inspiratory cold air stream of inlet air passageway is after carrying out the forced air cooling to the CPU mainboard, and the hot gas flow after the cooling can directly follow the hole of airing exhaust on the curb plate through air-out passageway and discharge, prevents that hot gas flow and cold air stream from appearing the convection current in the machine case inner chamber, avoids the hot gas flow to appear local backward flow in the machine case inner chamber, thereby can effectively reduce the system flow resistance, improve the cooling effect to inside and electrical components of system.

In addition, the host heat dissipation module is used for dissipating heat and cooling the electrical element in the case, and the first airflow driving part can drive hot airflow which cools the electrical element to be directly discharged from the air outlet hole at the rear side of the case, so that the hot airflow is prevented from flowing back into the air inlet channel to influence the cooling effect on the CPU mainboard.

2. The utility model discloses in, the cold air current that is inhaled in the machine incasement chamber can be through front side air intake, top air intake and bottom air intake entering inlet air channel, realize that inlet air channel inhales the cold air current from the front that is close to quick-witted case, the three direction of bottom surface and top surface to carry out cooling to the CPU mainboard, and discharge through the hole of airing exhaust on the second curb plate under ordering about of second air current driving piece, can increase inlet air channel's air inlet area, improve the suction capacity of cold air current.

3. The utility model discloses a being close to the back plate side at inlet air channel and setting up first wind-guiding lateral wall, can avoiding second air current driving piece and first air current driving piece to robbing the wind to the air current is disorderly and local backward flow phenomenon appears between second air current driving piece and the first air current driving piece in order to avoid, can effectively reduce the flow resistance, and the flow field is more reasonable in the messenger system. In addition, gaps between the two second air guide side walls and the first side plate respectively form the top air inlet and the bottom air inlet, and the air guide plate can play a role in guiding flow; meanwhile, the first air guide shell is arranged close to the side opening of the front panel to form a front side air inlet, the cross section area of the front side air inlet is larger than that of the top air inlet and that of the bottom air inlet, and therefore the flow of cold air flow entering from the front side air inlet can be increased, and the flow resistance is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is an isometric view of a computer case of the present invention in one direction;

FIG. 2 is an isometric view of the computer case of the present invention in another orientation;

FIG. 3 is a schematic view of the structure of FIG. 1 with the second side panel removed;

FIG. 4 is an isometric view of a host heat sink module and a CPU heat sink module in one direction;

FIG. 5 is an isometric view of the host thermal module and the CPU thermal module in another direction;

FIG. 6 is an isometric view of the host thermal module and the CPU thermal module in yet another orientation.

Description of the reference numerals:

1. a chassis; 11. a front panel; 12. a back plate; 13. a top plate; 14. a base plate; 15. a first side plate; 16. a second side plate;

2. a host heat dissipation module; 21. a first airflow driver;

3. a CPU heat dissipation module; 31. a second airflow driver;

32. an air inlet channel; 321. a front side air inlet; 322. a top air inlet; 323. a bottom air inlet; 324. a first air guide shell; 325. a first air guiding side wall; 326. a second air guiding side wall;

33. an air outlet channel; 331. a second air guide shell;

34. and a heat sink.

Detailed Description

The technical solutions of the present invention will be described more clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Examples

As shown in fig. 1 to 6, wherein the direction of the arrow in fig. 3 indicates the flow direction of the air flow. The embodiment of the utility model provides a computer machine case cooling system, this computer machine case cooling system include quick-witted case 1 and host computer heat dissipation module 2 and the CPU heat dissipation module 3 of setting in quick-witted case 1, specifically, host computer heat dissipation module 2 includes first air current driving piece 21, first air current driving piece 21 sets up in quick-witted case 1, and first air current driving piece is configured as and inhales the cold air current from the fresh air inlet of the front side of quick-witted case 1, and orders about the cold air current after cooling the electrical components inside quick-witted case 1 discharge from the exhaust vent of the rear side of machine case 1; the CPU heat dissipation module 3 includes a second airflow driving member 31, an air inlet channel 32 and an air outlet channel 33, the air inlet channel 32 is disposed at an air inlet of the second airflow driving member 31, and an air inlet end of the air inlet channel 32 is disposed near the CPU board, and is adapted to suck cold airflow from three directions near the front, bottom and top of the chassis 1; the air outlet channel 33 is arranged at the air outlet of the second air flow driving member 31, and the air outlet end of the air outlet channel 33 extends to a side plate of the case 1 and is communicated with the air outlet hole on the side plate; the second airflow driving member 31 can drive the air inlet channel 32 to suck cold airflow from three directions close to the front, bottom and top of the case 1, so as to cool the CPU board by air cooling, and discharge the cooled hot airflow through the exhaust holes on the side plates. Optionally, the electrical components include a hard disk, an SSD, a memory, a graphics card, a power supply, and a CPU motherboard.

In this embodiment, the CPU thermal module 3 is disposed opposite to the CPU motherboard for cooling the CPU motherboard, because the air outlet end of the air outlet channel 33 extends to the side plate of the case 1 and is communicated with the air outlet on the side plate, the air inlet channel 32 sucks the cold air flow, and after cooling the CPU motherboard, the cooled hot air flow can be directly discharged from the air outlet on the side plate through the air outlet channel 33, so as to prevent convection between the hot air flow and the cold air flow in the inner cavity of the case 1, and avoid local backflow of the hot air flow in the inner cavity of the case 1, thereby effectively reducing the flow resistance of the system, and improving the cooling effect on the system interior and the electrical components.

In addition, the host heat dissipation module 2 is used for dissipating heat and cooling the electrical components, and the first airflow driving member 21 can drive hot airflow which cools the electrical components to be directly discharged from the air outlet hole at the rear side of the case 1, so as to prevent the hot airflow from flowing back into the air inlet channel 32 to affect the cooling effect on the CPU motherboard.

Optionally, the chassis 1 is enclosed by a front panel 11, a rear panel 12, a top plate 13, a bottom plate 14, and a first side plate 15 and a second side plate 16 which are arranged oppositely, the CPU board is mounted and fixed on the first side plate 15, and the CPU heat dissipation module 3 is mounted on the first side plate 15 corresponding to the CPU board; the second side plate 16 and the rear plate 12 are respectively provided with the air exhaust holes, the air inlet channel 32 is positioned near the 15 side of the first side plate, the air outlet channel 33 is positioned near the 16 side of the second side plate, and the air outlet end of the air outlet channel 33 is propped against the inner wall of the second side plate 16 and is communicated with the air exhaust holes on the second side plate 16. So set up, the inspiratory cold air current of second air current driving piece 31 is behind the cooling CPU mainboard, and the hot gas flow is direct discharges from the hole of airing exhaust on the second curb plate 16, prevents because of hot gas flow local backward flow or flow scurries in quick-witted case 1 inner chamber to cause hot gas flow and the cold air current in quick-witted case 1 inner chamber to appear the convection current, can effectively reduce the system flow resistance, improve the cooling effect to the inside and electrical components of system.

Optionally, the air inlet end of the air inlet channel 32 is covered outside the CPU board, and an air inlet is disposed on the peripheral wall of the air inlet channel 32 near the air inlet end, where the air inlet includes a front side air inlet 321, a top air inlet 322, and a bottom air inlet 323, and the front side air inlet 321 is disposed on the side wall of the air inlet channel 32 near the front panel 11, and is adapted to suck cold air from the front of the chassis 1; the top air inlet 322 is arranged on the side wall of the air inlet channel 32 close to the top plate 13 and is suitable for sucking cold air flow from the top surface of the chassis 1; the bottom air inlet 323 is disposed on a side wall of the air inlet channel 32 near the bottom plate 14, and is adapted to draw in cold air from the bottom surface of the chassis 1.

So set up, the cold air current that is inhaled in quick-witted case 1 inner chamber can get into inlet air channel 32 through front side air intake 321, top air intake 322 and bottom air intake 323, realize that inlet air channel 32 inhales the cold air current from the three direction that is close to quick-witted case 1 front, bottom surface and top surface to cool down the CPU mainboard, and discharge through the exhaust hole on the second curb plate 16 under the driving of second air current driving piece 31, can increase inlet air channel 32's air inlet area, improve the suction capacity of cold air current.

Optionally, a cavity is formed in the chassis 1, and the air inlet hole in the front panel 11, the air outlet hole in the rear panel 12, and the air inlet of the air inlet channel 32 are all communicated with the cavity.

Optionally, the host heat dissipation module 2 is disposed at a rear position close to the rear plate 12, and the CPU heat dissipation module 3 is disposed between the host heat dissipation module 2 and the front panel 11; the air intake duct 32 has a first air guiding casing 324, the first air guiding casing 324 is disposed near the front panel 11 side opening to form the front air intake 321, the first air guiding casing 324 includes a first air guiding sidewall 325 disposed near the rear panel 12 side and two second air guiding sidewalls 326 connected to the upper and lower sides of the first air guiding sidewall 325; the first air guiding side wall 325 is connected between the air inlet of the second air flow driving member 31 and the first side plate 15, one end of each of the two second air guiding side walls 326 is connected with the air inlet of the second air flow driving member 31, the other end of each of the two second air guiding side walls 326 is connected with the first side plate 15 through a set gap, and the gap between each of the two second air guiding side walls 326 and the first side plate 15 respectively forms the top air inlet 322 and the bottom air inlet 323.

So set up, set up first wind-guiding lateral wall 325 through being close to backplate 12 side at inlet air channel 32, can avoid second air current driving piece 31 and first air current driving piece 21 to robbing the wind to the air current is disorderly and local backward flow phenomenon appears between second air current driving piece 31 and the first air current driving piece 21, can effectively reduce the flow resistance, makes the interior flow field of system more reasonable. In addition, gaps between the two second air guiding side walls 326 and the first side plate 15 respectively form the top air inlet 322 and the bottom air inlet 323, so that the air guiding and guiding functions can be achieved; meanwhile, the first air guide housing 324 is disposed near the front panel 11 side opening to form the front side air inlet 321, and the cross-sectional area of the front side air inlet 321 is larger than that of the top air inlet 322 and the bottom air inlet 323, so that the flow rate of the cold airflow entering from the front side air inlet 321 can be increased, and the flow resistance can be reduced.

Optionally, the height of the first air guiding sidewall 325 is set to be h1, and the height of the second air guiding sidewall 326 is set to be h2, where h1 is not less than h2.

Optionally, the air outlet channel 33 has a second air guiding casing 331 with two open ends and a closed periphery, one end of the second air guiding casing 331 is open and connected to the air outlet of the second airflow driving member 31, and the other end of the second air guiding casing 331 extends toward the second side plate 16 and abuts against the second side plate 16, and is communicated with the air outlet hole of the second side plate 16.

Optionally, the CPU heat dissipation module 3 further includes a heat dissipation fin 34, the heat dissipation fin 34 contacts with or is disposed opposite to the CPU board, so as to cool the CPU board, the heat dissipation fin 34 is installed at one end close to the air inlet end in the air inlet channel 32, and the cold air flow is suitable for entering the air inlet channel 32 from the air inlets at the bottom and the periphery of the heat dissipation fin 34, and is discharged through the air outlet channel 33 and the air discharge holes on the second side plate 16 after cooling the heat dissipation fin 34.

Optionally, the first airflow driver 21 and the second airflow driver 31 are both fans, and preferably, the first airflow driver 21 and the second airflow driver 31 are both axial flow fans.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims

1. The utility model provides a computer machine case cooling system, its characterized in that includes quick-witted case (1) and host computer thermal module (2) and CPU thermal module (3) of setting in quick-witted case (1), wherein, host computer thermal module (2) includes:

the first air flow driving part (21) is arranged in the case (1) and is configured to suck cold air flow from an air inlet hole on the front side of the case (1) and drive the cold air flow to be discharged from an air outlet hole on the rear side of the case (1) after electrical elements in the case (1) are cooled;

the CPU heat dissipation module (3) comprises:

a second airflow driver (31);

the air inlet channel (32) is arranged at an air inlet of the second airflow driving part (31), and the air inlet end of the air inlet channel (32) is arranged close to the CPU mainboard and is suitable for sucking cold airflow from three directions close to the front surface, the bottom surface and the top surface of the case (1);

the air outlet channel (33) is arranged at the air outlet of the second air flow driving piece (31), and the air outlet end of the air outlet channel (33) extends to a side plate of the case (1) and is communicated with the air outlet hole in the side plate;

the second airflow driving part (31) is suitable for driving the air inlet channel (32) to suck cold airflow from three directions close to the front surface, the bottom surface and the top surface of the case (1) so as to cool the CPU mainboard in an air cooling way and discharge the cooled hot airflow through the exhaust holes in the side plates.

2. The computer case heat dissipation system of claim 1, wherein the case (1) is enclosed by a front panel (11), a rear panel (12), a top panel (13), a bottom panel (14), and a first side panel (15) and a second side panel (16) which are oppositely arranged, the CPU board is installed and fixed on the first side panel (15), and the CPU heat dissipation module (3) is installed on the first side panel (15) corresponding to the CPU board;

the air exhaust holes are formed in the second side plate (16) and the rear plate (12) respectively, the air inlet channel (32) is located close to the side of the first side plate (15), the air outlet channel (33) is located close to the side of the second side plate (16), and the air outlet end of the air outlet channel (33) abuts against the inner wall of the second side plate (16) and is communicated with the air exhaust holes in the second side plate (16).

3. The heat dissipation system of claim 2, wherein the air inlet end of the air inlet channel (32) is covered outside the CPU motherboard, and an air inlet is disposed on a peripheral wall of the air inlet channel (32) near the air inlet end, and the air inlet includes:

the front side air inlet (321) is arranged on the side wall of one side of the air inlet channel (32) close to the front panel (11) and is suitable for sucking cold air flow from the front of the case (1);

the top air inlet (322) is arranged on the side wall of one side, close to the top plate (13), of the air inlet channel (32) and is suitable for sucking cold air flow from the top surface of the case (1);

and the bottom air inlet (323) is arranged on the side wall of one side of the air inlet channel (32) close to the bottom plate (14) and is suitable for sucking cold air flow from the bottom surface of the case (1).

4. The computer case cooling system according to claim 3, wherein a cavity is formed in the case (1), and the air inlet hole in the front panel (11), the air outlet hole in the rear panel (12), and the air inlet of the air inlet channel (32) are all communicated with the cavity.

5. The heat dissipation system of claim 4, wherein the host heat dissipation module (2) is disposed at a rear position close to the rear plate (12), and the CPU heat dissipation module (3) is disposed between the host heat dissipation module (2) and the front plate (11);

the air inlet channel (32) is provided with a first air guide shell (324), the first air guide shell (324) is arranged close to the opening of the front panel (11) side to form the front side air inlet (321), and the first air guide shell (324) comprises a first air guide side wall (325) arranged close to the rear panel (12) side and two second air guide side walls (326) connected to the upper side and the lower side of the first air guide side wall (325);

wherein, first wind-guiding lateral wall (325) is connected between the air intake and first curb plate (15) of second air current driving piece (31), two second wind-guiding lateral wall (326) one end with the air intake connection of second air current driving piece (31), be respectively between the other end and first curb plate (15) and set for the clearance setting, the clearance between two second wind-guiding lateral walls (326) and first curb plate (15) constitutes respectively top air intake (322) and bottom air intake (323).

6. The heat dissipation system of computer case as claimed in claim 5, wherein the height of the first air guiding sidewall (325) is set to h1, and the height of the second air guiding sidewall (326) is set to h2, wherein h1 is not less than h2.

7. The heat dissipation system of computer case as claimed in any one of claims 2 to 6, wherein the air outlet channel (33) has a second air guiding casing (331) with two open ends and a closed periphery, one end of the second air guiding casing (331) is open and connected to the air outlet of the second airflow driving member (31), and the other end of the second air guiding casing (331) is open and extended towards the second side plate (16) and abuts against the second side plate (16), and is communicated with the air outlet on the second side plate (16).

8. The heat dissipation system of computer case as claimed in any one of claims 3-5, wherein the CPU heat dissipation module (3) further comprises:

the cooling fin (34), with CPU mainboard contact or relative setting, in order to right the CPU mainboard cools down, cooling fin (34) install in be close to the one end of air inlet end in inlet air channel (32), cold air current is suitable for getting into in inlet air channel (32) from the air intake of cooling fin (34) bottom and periphery to behind cooling fin (34), discharge through air outlet channel (33) and the exhaust hole on second curb plate (16).

9. The heat dissipation system of any one of claims 1-5, wherein the first airflow driver (21) and the second airflow driver (31) are fans.