CN220457762U - Embedded integrated circuit programmer - Google Patents
Embedded integrated circuit programmer Download PDFInfo
- Publication number
- CN220457762U CN220457762U CN202321496999.4U CN202321496999U CN220457762U CN 220457762 U CN220457762 U CN 220457762U CN 202321496999 U CN202321496999 U CN 202321496999U CN 220457762 U CN220457762 U CN 220457762U
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- CN
- China
- Prior art keywords
- integrated circuit
- radiating
- circuit board
- heat dissipation
- fixedly arranged
- Prior art date
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000741 silica gel Substances 0.000 claims abstract description 17
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims description 47
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920002631 room-temperature vulcanizate silicone Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 6
- 235000017491 Bambusa tulda Nutrition 0.000 description 6
- 241001330002 Bambuseae Species 0.000 description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 6
- 239000011425 bamboo Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910021389 graphene Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an embedded integrated circuit programmer, which comprises an integrated circuit board, wherein a component is fixedly arranged on the outer surface of the upper end of the integrated circuit board, a connecting plug is fixedly arranged on one side of the outer surface of the upper end of the component, a mounting plate is fixedly arranged on the outer surface of one side of the integrated circuit board, a radiating component is fixedly arranged on the outer surface of one end of the integrated circuit board, radiating fins are arranged on the lower portion of the integrated circuit board, the radiating component comprises a radiating box, a second radiating fan, a radiating cavity and an air outlet, and the upper portion of the outer surface of one side of the radiating box is fixedly connected with the outer surface of one end of the integrated circuit board. According to the embedded integrated circuit programmer, heat in the programmer space is conveniently radiated through the first radiating fan, the integrated circuit board is conveniently radiated through the heat conducting silica gel and the radiating fins, and the radiating effect is improved through the radiating component.
Description
Technical Field
The utility model relates to the technical field of integrated circuits, in particular to an embedded integrated circuit programmer.
Background
Electronic products with certain intelligent functions, such as mobile phones, PDAs, MP4, washing machines, refrigerators, air conditioners, high-grade sound equipment and the like, all have a processor and a memory, and software with corresponding functions is arranged in the processor and the memory, and the software needs to be written into the processor or the memory by corresponding tools, and the tools are programmers.
In the prior art, in a chinese patent document with the authority of CN217641293U, an embedded integrated circuit device is described, this patent adopts graphene attaching plate, arc heat dissipation wing, accept a section of thick bamboo, hollow section of thick bamboo and the combination of a collection section of thick bamboo, through the design of graphene attaching plate, can absorb the heat on the integrated circuit device body, then in giving off the air with the heat through the cooperation of arc heat dissipation wing, when dispel the heat with the help of external fan, can catch the radiating wind through a collection section of thick bamboo, then with the surface of wind direction graphene attaching plate through the inner chamber of a hollow section of thick bamboo and accept a section of thick bamboo, and then promote the heat dispersion of graphene attaching plate, realize carrying out high-efficient radiating function to the integrated circuit device body, avoid the integrated circuit device body to damage the problem because of the natural heat dissipation speed is slower, prolong the life of the integrated circuit device body.
The heat on the integrated circuit board is mainly dissipated through the radiating fins, the heat in the space is dissipated by means of the external fan, however, the quantity of the heat dissipated by the radiating fins is small, the heat dissipation performance has a certain space for improving, and an embedded integrated circuit programmer is provided.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides an embedded integrated circuit programmer which has the advantages of fast heat dissipation of an embedded integrated circuit, increased heat dissipation effect and the like, and can effectively solve the problems in the background art.
(II) technical scheme
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides an embedded integrated circuit programmer, includes the integrated circuit board, the upper end surface fixed mounting of integrated circuit board has components and parts, one side fixed mounting of components and parts upper end surface has connecting plug, one side surface fixed mounting of integrated circuit board has the mounting panel, one end surface fixed mounting of integrated circuit board has radiating component, the lower part of integrated circuit board is provided with radiating fin, just radiating component includes radiating bin, second radiating fan, heat dissipation chamber and gas outlet, the upper portion of radiating bin one side surface and one end surface fixed connection of integrated circuit board.
Preferably, the first heat dissipation fans are fixedly installed on the outer surface of one side of the mounting plate, and the number of the first heat dissipation fans is five.
Preferably, a heat-conducting silica gel is arranged between the heat-radiating fins and the integrated circuit board, the heat-conducting silica gel is fixedly arranged on the outer surface of the lower end of the integrated circuit board, and the heat-radiating fins are fixedly arranged on the outer surface of the lower end of the heat-conducting silica gel.
Preferably, the heat radiating fins are made of all-copper materials, and the heat conducting silica gel is dealcoholized single-component RTV silicone rubber prepared by using heat conducting fillers.
Preferably, the number of the second heat dissipation fans is three, and the three second heat dissipation fans are fixedly arranged on the outer surface of the upper end of the heat dissipation box.
Preferably, the heat dissipation cavity is formed in the heat dissipation box, the air outlet is formed in the outer surface of one side of the second heat dissipation fan, and the air outlet is communicated with the heat dissipation cavity.
(III) beneficial effects
Compared with the prior art, the utility model provides an embedded integrated circuit programmer, which has the following beneficial effects:
1. the first heat dissipation fan is arranged on the inner side of the programmer space, and the first heat dissipation fan is used for dissipating heat in the inner side of the programmer space.
2. According to the embedded integrated circuit programmer, heat dissipation is conducted on an integrated circuit board conveniently through the arranged heat conducting silica gel and the heat dissipation fins.
3. According to the embedded integrated circuit programmer, through the arranged heat dissipation assembly, the flow speed between air and the heat dissipation fins is increased, and the heat dissipation effect is improved.
Drawings
FIG. 1 is a schematic diagram of an integrated circuit programmer according to the present utility model.
FIG. 2 is a schematic diagram of a partial structure of an embedded integrated circuit programmer according to the present utility model.
FIG. 3 is an enlarged view of the embedded integrated circuit programmer of FIG. 2 at A according to the present utility model.
Fig. 4 is a schematic structural diagram of a heat dissipating device in an embedded integrated circuit programmer according to the present utility model.
In the figure: 1. an integrated circuit board; 2. a component; 3. a connection plug; 4. thermally conductive silica gel; 5. a heat radiation fin; 6. a heat dissipation assembly; 7. a mounting plate; 8. a first heat dissipation fan; 9. a heat radiation box; 10. a second heat dissipation fan; 11. a heat dissipation cavity; 12. and an air outlet.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
The present embodiment is an embedded integrated circuit programmer.
As shown in fig. 1-4, the integrated circuit board 1 is included, component 2 is fixedly installed on the outer surface of the upper end of integrated circuit board 1, connecting plug 3 is fixedly installed on one side of the outer surface of the upper end of component 2, mounting plate 7 is fixedly installed on the outer surface of one side of integrated circuit board 1, radiating component 6 is fixedly installed on the outer surface of one end of integrated circuit board 1, radiating fins 5 are arranged on the lower portion of integrated circuit board 1, radiating component 6 comprises radiating box 9, second radiating fan 10, radiating cavity 11 and air outlet 12, and the upper portion of the outer surface of one side of radiating box 9 is fixedly connected with the outer surface of one end of integrated circuit board 1.
The outer surface of one side of the mounting plate 7 is fixedly provided with first radiating fans 8, and the number of the first radiating fans 8 is five; a heat conduction silica gel 4 is arranged between the heat dissipation fins 5 and the integrated circuit board 1, the heat conduction silica gel 4 is fixedly arranged on the outer surface of the lower end of the integrated circuit board 1, and the heat dissipation fins 5 are fixedly arranged on the outer surface of the lower end of the heat conduction silica gel 4; the heat radiating fins 5 are made of all-copper materials, and the heat conducting silica gel 4 is dealcoholized single-component RTV silicone rubber prepared by using heat conducting fillers; the number of the second heat dissipation fans 10 is three, and the three groups of the second heat dissipation fans 10 are fixedly arranged on the outer surface of the upper end of the heat dissipation box 9; the heat dissipation cavity 11 is arranged in the heat dissipation box 9, the air outlet 12 is arranged on the outer surface of one side of the second heat dissipation fan 10, and the air outlet 12 is communicated with the heat dissipation cavity 11.
It should be noted that, the utility model is an embedded integrated circuit programmer, the mounting board 7 is fixedly mounted on one side outer surface of the integrated circuit board 1, the first heat dissipation fan 8 is mounted on one side outer surface of the mounting board 7, and the heat in the programmer space is conveniently dissipated through the operation of the first heat dissipation fan 8; the heat conduction silica gel 4 of setting, heat conduction silica gel 4 is convenient for on leading-in radiating fin 5 with the heat on the integrated circuit board 1, radiating fin 5 has increased the area of contact with the air, the radiating of being convenient for, through the radiating component 6 of setting, through the operation of second radiator fan 10 for the wind blows radiating fin 5 through gas outlet 12, and the wind direction is parallel with radiating fin 5, increases the flow velocity of the nearby air of radiating fin 5, increases radiating fin 5's radiating effect, is convenient for carry out quick heat dissipation to integrated circuit board 1.
It should be noted that in this document, relational terms such as first and second (first and second), and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. An embedded integrated circuit programmer comprising an integrated circuit board (1), characterized in that: the integrated circuit board (1) is characterized in that a component (2) is fixedly arranged on the outer surface of the upper end of the integrated circuit board (1), a connecting plug (3) is fixedly arranged on one side of the outer surface of the upper end of the component (2), a mounting plate (7) is fixedly arranged on one side of the outer surface of the integrated circuit board (1), a radiating component (6) is fixedly arranged on one end of the outer surface of the integrated circuit board (1), radiating fins (5) are arranged on the lower portion of the integrated circuit board (1), the radiating component (6) comprises a radiating box (9), a second radiating fan (10), a radiating cavity (11) and an air outlet (12), and the upper portion of one side of the outer surface of the radiating box (9) is fixedly connected with one end of the outer surface of the integrated circuit board (1).
2. An embedded integrated circuit programmer according to claim 1, wherein: the outer surface of one side of the mounting plate (7) is fixedly provided with first radiating fans (8), and the number of the first radiating fans (8) is five.
3. An embedded integrated circuit programmer according to claim 2, wherein: the heat dissipation fin is characterized in that a heat conduction silica gel (4) is arranged between the heat dissipation fin (5) and the integrated circuit board (1), the heat conduction silica gel (4) is fixedly arranged on the outer surface of the lower end of the integrated circuit board (1), and the heat dissipation fin (5) is fixedly arranged on the outer surface of the lower end of the heat conduction silica gel (4).
4. An embedded integrated circuit programmer according to claim 3, wherein: the heat dissipation fins (5) are made of all-copper materials, and the heat conduction silica gel (4) is dealcoholized single-component RTV silicone rubber prepared by using heat conduction fillers.
5. An embedded integrated circuit programmer according to claim 4, wherein: the number of the second radiating fans (10) is three, and the three groups of the second radiating fans (10) are fixedly arranged on the outer surface of the upper end of the radiating box (9).
6. An embedded integrated circuit programmer according to claim 5, wherein: the heat dissipation cavity (11) is formed in the heat dissipation box (9), the air outlet (12) is formed in the outer surface of one side of the second heat dissipation fan (10), and the air outlet (12) is communicated with the heat dissipation cavity (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321496999.4U CN220457762U (en) | 2023-06-13 | 2023-06-13 | Embedded integrated circuit programmer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321496999.4U CN220457762U (en) | 2023-06-13 | 2023-06-13 | Embedded integrated circuit programmer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220457762U true CN220457762U (en) | 2024-02-06 |
Family
ID=89726650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321496999.4U Active CN220457762U (en) | 2023-06-13 | 2023-06-13 | Embedded integrated circuit programmer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220457762U (en) |
-
2023
- 2023-06-13 CN CN202321496999.4U patent/CN220457762U/en active Active
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| GR01 | Patent grant | ||
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