CN219780500U - Ultra-thick copper circuit board - Google Patents
Ultra-thick copper circuit board Download PDFInfo
- Publication number
- CN219780500U CN219780500U CN202321000806.1U CN202321000806U CN219780500U CN 219780500 U CN219780500 U CN 219780500U CN 202321000806 U CN202321000806 U CN 202321000806U CN 219780500 U CN219780500 U CN 219780500U
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- CN
- China
- Prior art keywords
- circuit board
- board main
- main body
- thick copper
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 46
- 239000010949 copper Substances 0.000 title claims abstract description 46
- 238000013016 damping Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 230000035939 shock Effects 0.000 abstract description 12
- 238000007664 blowing Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- -1 10 mu m and 18 mu m Chemical compound 0.000 description 2
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Abstract
The utility model discloses an ultra-thick copper circuit board which comprises a fixed base and a circuit board main body, wherein a supporting plate is fixedly arranged on the front side of the fixed base, a heat radiating assembly is arranged, the heat radiating assembly can rapidly radiate heat on the circuit board main body, the heat radiating performance of the circuit board main body can be effectively improved, a heat radiating fan is arranged, the heat radiating fan can radiate heat through blowing the circuit board main body, the heat radiating efficiency of the circuit board main body can be effectively improved, a damping gasket is arranged, the damping gasket has good damping performance, the damping and shock-resistant performance of the circuit board main body can be improved, the service life of the circuit board main body can be prolonged, a spring buckle is arranged, the spring buckle is clamped into a limiting clamping hole and can be fast clamped and fixed, the spring buckle can be pressed out from the limiting clamping hole, the supporting plate can be conveniently assembled and disassembled, and the circuit board main body is convenient to overhaul and maintain.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an ultra-thick copper circuit board.
Background
The printed circuit board is an important electronic component, is a support of the electronic component and is a carrier for electric connection of the electronic component, the printed circuit board is usually adhered with a layer of copper foil on a glass epoxy substrate, the thickness of the copper foil is usually 18 mu m, 35 mu m, 55 mu m and 70 mu m4, the most commonly used copper foil is 35 mu m, the domestic copper foil thickness is usually 35-50 mu m, the copper foil is thinner than the copper foil, such as 10 mu m and 18 mu m, and the copper foil is thicker than the copper foil, such as 70 mu m, the types of the circuit boards on the market are various nowadays, the use requirements of people can be basically met, but certain defects still exist, the specific problems are that one layer of copper is required to be completely etched in the processing process of the traditional circuit board, and the rest of the copper foil is required to form a circuit finally, and the circuit board is easy to be damaged due to over etching during etching.
The utility model with the application number of 202121651513.0 discloses an inner-layer ultra-thick copper circuit board with an etching-resistant layering, which comprises a circuit board substrate, a thick copper plate shell, guide point elements, a heat dissipation structure and a dry film resistant layer.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
The present utility model provides an ultra-thick copper circuit board to solve the above-mentioned problems of the prior art.
For this purpose, the utility model adopts the following specific technical scheme:
the utility model provides an ultra-thick copper circuit board, includes unable adjustment base and circuit board main part, unable adjustment base front side is fixed to be equipped with the backup pad, backup pad tip one side is equipped with the spring buckle, circuit board main part outside parcel has the protection frame, protection frame both ends symmetry is equipped with the slot, spacing card hole has been seted up to slot one side, circuit board main part front side fixed surface is equipped with thick copper, thick copper surface is equipped with the corrosion-resistant dry film layer, corrosion-resistant dry film layer surface is equipped with the oil green insulating layer, circuit board main part rear side fixed surface is equipped with radiating component.
Preferably, the heat dissipation assembly comprises a heat conduction patch, and heat dissipation fins are fixedly arranged on the surface of the heat conduction patch at equal intervals.
Preferably, a shock pad is fixedly arranged between the fixed base and the supporting plate.
Preferably, the front surface of the fixed base is fixedly provided with a heat dissipation fan.
Preferably, the fixing base is symmetrically provided with fixing mounting holes.
Preferably, the heat conducting patch is any one of an aluminum plate and a copper plate.
The beneficial effects of the utility model are as follows: through setting up thick copper, thick copper not only can protect the circuit board main part be difficult for being damaged by the etching, and increased the bulk strength of circuit board main part in addition, can prevent to take place the fracture when the circuit board main part uses, through setting up the corrosion-resistant dry film layer, the corrosion-resistant dry film layer can cover thick copper completely, circuit component job stabilization in the circuit board main part can be guaranteed, can make the circuit board main part be difficult for being damaged by the etching, through setting up radiator unit, radiator unit can distribute away the heat in the circuit board main part fast, can effectively improve the heat dispersion of circuit board main part, through setting up the radiator fan, the radiator fan can blow the heat dissipation to the circuit board main part, can effectively improve the radiating efficiency of circuit board main part, through setting up the shock pad, shock pad has good shock attenuation performance, can improve the shock attenuation shock resistance of circuit board main part, through setting up the spring buckle, the spring buckle card is fixed to the backup pad card fast, can dismantle the backup pad from spacing card downthehole pressing, the convenience is dismantled the circuit board main part and is installed the maintenance of being convenient.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of an ultra-thick copper circuit board according to an embodiment of the utility model;
FIG. 2 is a block diagram of a mounting base for an ultra-thick copper circuit board according to an embodiment of the utility model;
FIG. 3 is a diagram of a protective outer frame of an ultra-thick copper circuit board according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of a circuit board main body structure of an ultra-thick copper circuit board according to an embodiment of the present utility model.
In the figure:
1. a fixed base; 2. a circuit board main body; 3. a support plate; 4. a spring buckle; 5. a protective outer frame; 6. a slot; 7. limiting clamping holes; 8. a thick copper plate; 9. a dry film resist layer; 10. an oil green insulating layer; 11. a heat dissipation assembly; 12. a thermally conductive patch; 13. a heat radiation fin; 14. damping pad; 15. a heat dissipation fan; 16. and fixing the mounting hole.
Description of the embodiments
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the present utility model, an ultra-thick copper circuit board is provided.
Examples
As shown in fig. 1-4, an ultra-thick copper circuit board according to an embodiment of the utility model comprises a fixing base 1 and a circuit board main body 2, wherein a supporting plate 3 is fixedly arranged at the front side of the fixing base 1, a spring buckle 4 is arranged at one side of the end part of the supporting plate 3, the spring buckle 4 is clamped into a limit clamping hole 7 to rapidly clamp and fix the supporting plate 3, the spring buckle 4 is pressed out of the limit clamping hole 7 to detach the supporting plate 3, the circuit board main body 2 is convenient to mount and detach, the overhaul and maintenance are convenient, a protective outer frame 5 is wrapped at the outer side of the circuit board main body 2, slots 6 are symmetrically arranged at two ends of the protective outer frame 5, the limit clamping hole 7 is arranged at one side of the slot 6, a thick copper plate 8 is fixedly arranged on the surface of the front side of the circuit board main body 2, the thick copper plate 8 not only can protect the circuit board main body 2 from being damaged by etching, but also increases the integral strength of the circuit board main body 2, the circuit board can prevent the circuit board main body 1 from breaking when in use, the surface of the thick copper plate 8 is provided with a dry-film-resistant layer 9, the dry-film-resistant layer 9 can completely cover the thick copper plate 8, the circuit components on the circuit board main body 2 can be ensured to work stably, the circuit board main body 2 is not easy to be damaged by etching, the surface of the dry-film-resistant layer 9 is provided with a greenish-insulating layer 10, the rear side surface of the circuit board main body 2 is fixedly provided with a heat dissipation component 11, the heat on the circuit board main body 2 can be rapidly dissipated through the heat dissipation component 11, the heat dissipation performance of the circuit board main body 2 can be effectively improved, the heat dissipation component 11 comprises a heat conduction patch 12, the heat dissipation fins 13 are fixedly arranged on the surface of the heat conduction patch 12 at equal intervals, a shock absorption gasket 14 is fixedly arranged between the fixed base 1 and the support plate 3, the shock absorption gasket 14 has good shock absorption performance, the shock absorption and shock resistance performance of the circuit board main body 2 can be improved, the service life of the circuit board main body 2 can be improved.
Examples
As shown in fig. 1-4, an ultra-thick copper circuit board according to the embodiment of the utility model comprises a fixed base 1 and a circuit board main body 2, wherein a supporting plate 3 is fixedly arranged on the front side of the fixed base 1, a spring buckle 4 is arranged on one side of the end part of the supporting plate 3, the spring buckle 4 is clamped into a limit clamping hole 7 and can be used for rapidly clamping and fixing the supporting plate 3, the spring buckle 4 is pressed out of the limit clamping hole 7 and can be used for disassembling the supporting plate 3, the circuit board main body 2 is convenient to assemble and disassemble, overhaul and maintenance are facilitated, a protective outer frame 5 is wrapped on the outer side of the circuit board main body 2, slots 6 are symmetrically arranged at two ends of the protective outer frame 5, a limit clamping hole 7 is formed in one side of the slots 6, a thick copper plate 8 is fixedly arranged on the front side surface of the circuit board main body 2, the thick copper plate 8 can not only be used for protecting the circuit board main body 2 and is not easy to be damaged by etching, but also the integral strength of the circuit board main body 2 is increased, the circuit board main body 1 can be prevented from being broken when being used, a dry film layer 9 is arranged on the surface of the thick copper plate 9 can be completely covered, circuit board main body 2 can be guaranteed to be stably assembled and disassembled, a circuit element on the circuit board main body 2 can be stably arranged, a circuit board main body can not be easily damaged by etching the dry film layer 2 can be easily is provided with a dry film layer 9, a dry film layer can be used for rapidly damaged by etching the dry film layer 2, a fan can be rapidly arranged on the surface of the circuit board main body 2 can be rapidly damaged by the dry film 2, and can be rapidly damaged by the dry film is an insulating film 2, and can be rapidly damaged by a fan, and can be a fan is provided with an insulating film, and has an insulating heat-insulating film, and a heat radiation device can and has heat radiation performance can and a heat radiation performance can and has a heat radiation effect.
Examples
As shown in fig. 1-4, an ultra-thick copper circuit board according to an embodiment of the utility model comprises a fixing base 1 and a circuit board main body 2, wherein a supporting plate 3 is fixedly arranged at the front side of the fixing base 1, a spring buckle 4 is arranged at one side of the end part of the supporting plate 3, the spring buckle 4 is clamped into a limit clamping hole 7 to rapidly clamp and fix the supporting plate 3, the spring buckle 4 is pressed out of the limit clamping hole 7 to detach the supporting plate 3, the circuit board main body 2 is convenient to mount and detach, the maintenance is convenient, a protective outer frame 5 is wrapped at the outer side of the circuit board main body 2, slots 6 are symmetrically arranged at two ends of the protective outer frame 5, the limit clamping hole 7 is arranged at one side of the slot 6, a thick copper plate 8 is fixedly arranged on the surface of the front side of the circuit board main body 2, the thick copper plate 8 can not only protect the circuit board main body 2 from being damaged by etching, and increased the bulk strength of circuit board main part 2, can prevent that circuit board main part 1 from breaking when using, thick copper 8 surface is equipped with corrosion-resistant dry film layer 9, and corrosion-resistant dry film layer 9 can cover thick copper 8 completely, can guarantee that circuit component job stabilization on the circuit board main part 2 can make circuit board main part 2 be difficult for being damaged by the etching, and corrosion-resistant dry film layer 9 surface is equipped with oil green insulating layer 10, and circuit board main part 2 rear side fixed surface is equipped with radiator unit 11, can distribute away the heat on the circuit board main part 2 fast through radiator unit 11, can effectively improve the heat dispersion of circuit board main part 2, and fixed mounting hole 16 has been seted up to the symmetry on unable adjustment base 1, and heat conduction paster 12 is any one of aluminum plate, the copper, and aluminum plate, copper all have good heat conductivility.
In summary, by means of the technical scheme of the utility model, when the device is used, the spring buckle 4 is clamped into the limiting clamping hole 7 to rapidly clamp and fix the supporting plate 3, the spring buckle 4 is pressed out of the limiting clamping hole 7 to detach the supporting plate 3, the circuit board main body 2 can be detached and overhauled by detaching the supporting plate 3, the thick copper plate 8 not only can protect the circuit board main body 2 and prevent the circuit board main body 2 from being damaged by etching, but also can increase the overall strength of the circuit board main body 2, the circuit board main body 1 can be prevented from being broken when in use, the thick copper plate 8 can be completely covered by the dry film resistant layer 9, the circuit elements on the circuit board main body 2 can be ensured to work stably, the circuit board main body 2 can not be damaged by etching, the heat on the circuit board main body 2 can be rapidly dissipated through the heat dissipation assembly 11, the heat dissipation performance of the circuit board main body 2 can be effectively improved, and the circuit board main body 2 can be subjected to heat dissipation by the heat dissipation fan 15.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (6)
1. The utility model provides an ultra-thick copper circuit board, includes unable adjustment base (1) and circuit board main part (2), its characterized in that: the fixed base (1) front side is fixed and is equipped with backup pad (3), backup pad (3) tip one side is equipped with spring buckle (4), circuit board main part (2) outside parcel has protective outer frame (5), protective outer frame (5) both ends symmetry is equipped with slot (6), spacing card hole (7) have been seted up to slot (6) one side, circuit board main part (2) front side fixed surface is equipped with thick copper (8), thick copper (8) surface is equipped with resist dry film layer (9), resist dry film layer (9) surface is equipped with oil green insulating layer (10), circuit board main part (2) rear side fixed surface is equipped with radiator unit (11).
2. An ultra-thick copper circuit board according to claim 1, wherein: the heat dissipation assembly (11) comprises a heat conduction patch (12), and heat dissipation fins (13) are fixedly arranged on the surface of the heat conduction patch (12) at equal intervals.
3. An ultra-thick copper circuit board according to claim 2, wherein: a damping gasket (14) is fixedly arranged between the fixed base (1) and the supporting plate (3).
4. An ultra-thick copper circuit board according to claim 3, wherein: the front side surface of the fixed base (1) is fixedly provided with a heat dissipation fan (15).
5. An ultra-thick copper circuit board according to claim 4, wherein: and the fixed base (1) is symmetrically provided with fixed mounting holes (16).
6. An ultra-thick copper circuit board according to claim 5, wherein: the heat conduction patch (12) is any one of an aluminum plate and a copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321000806.1U CN219780500U (en) | 2023-04-28 | 2023-04-28 | Ultra-thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321000806.1U CN219780500U (en) | 2023-04-28 | 2023-04-28 | Ultra-thick copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780500U true CN219780500U (en) | 2023-09-29 |
Family
ID=88107858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321000806.1U Active CN219780500U (en) | 2023-04-28 | 2023-04-28 | Ultra-thick copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780500U (en) |
-
2023
- 2023-04-28 CN CN202321000806.1U patent/CN219780500U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |