CN216217745U

CN216217745U - Be used for compound PCB circuit board

Info

Publication number: CN216217745U
Application number: CN202122784421.6U
Authority: CN
Inventors: 蒋建芳
Original assignee: Suzhou Difeite Electronics Co ltd
Current assignee: Suzhou Difeite Electronics Co ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-04-05
Anticipated expiration: 2031-11-15

Abstract

The utility model discloses a composite PCB (printed circuit board), and relates to the technical field of circuit boards. Including lower casing, the upper surface outside of casing installs the casing through fixed establishment down, the casing includes first net frame and waterproof ventilated membrane down, fixed paste has waterproof ventilated membrane on the inner wall of first net frame, fixed mounting has first installation mechanism on the downside inner wall of casing down, fixed mounting has second installation mechanism on the upside inner wall of last casing, the centre gripping is fixed in circuit board mechanism between first installation mechanism and the second installation mechanism, be close to middle part position fixed mounting on the downside inner wall of casing down and have cooling mechanism. The circuit board mechanism provided by the utility model has the advantages that the waterproof, shielding and anticorrosion functions of the circuit board mechanism are added, the circuit board mechanism is not easy to short circuit and corrode, is not easy to be interfered by external signals, has better damping, buffering and heat dissipation effects, is not easy to vibrate or overheat and damage, and has a long service life.

Description

Be used for compound PCB circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a composite PCB circuit board.

Background

The PCB, also called as printed circuit board or printed circuit board, is an important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components.

Among the prior art, traditional PCB circuit board is direct exposed installation more, lacks waterproof, shielding and anticorrosive function, and in the in-process of using, causes spare part not hard up or drops when very easily receiving vibrations, leads to the unable normal use of circuit board, and the radiating effect is not good, and life is short, is difficult to satisfy and uses under the multiple environment.

SUMMERY OF THE UTILITY MODEL

The utility model provides a composite PCB (printed circuit board) for solving the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a be used for compound PCB circuit board, includes lower casing, the upper surface outside of casing installs the casing through fixed establishment down, lower casing includes first net frame and waterproof ventilated membrane, fixed pasting has waterproof ventilated membrane on the inner wall of first net frame, fixed mounting has first installation mechanism on the downside inner wall of casing down, first installation mechanism includes spring and second net frame, the spring is rectangle fixed mounting on the downside inner wall of first net frame, and fixed mounting has the net frame of second between the upper surface of spring, fixed mounting has second installation mechanism on the upside inner wall of last casing, the centre gripping is fixed in circuit board mechanism between first installation mechanism and the second installation mechanism, be close to middle part position fixed mounting on the downside inner wall of casing down and have cooling mechanism.

Further, the structure of the upper shell is the same as that of the lower shell.

Further, the fixing mechanism comprises a threaded hole and a locking bolt, the left side wall and the right side wall of the lower shell and the left side wall of the upper shell are provided with rectangular threaded holes, and the locking bolt is installed in the threaded holes.

Furthermore, the second installation mechanism is the same as the first installation mechanism in structure, and the second installation mechanism is arranged in a mirror image mode for the first installation mechanism.

Furthermore, a guide rod is fixedly installed on the inner wall of the lower side of the lower shell corresponding to the spring, the guide rod is movably inserted into the second installation mechanism, and a through hole for the guide rod to pass through is formed in the side wall of the second grid frame corresponding to the guide rod.

Further, cooling mechanism includes temperature sensor and cooling fan, temperature sensor and cooling fan all fixed mounting are on the downside inner wall of casing down.

Furthermore, circuit board mechanism includes circuit board body, epoxy and shielding net, the surface coating of circuit board body has epoxy, epoxy's surface is provided with the shielding net.

Compared with the prior art, the utility model provides a composite PCB circuit board, which has the following beneficial effects:

1. this be used for compound PCB circuit board, through setting up waterproof ventilated membrane in casing and the last casing down, epoxy and shielding net in the circuit board mechanism increase the waterproof, shielding and the anticorrosive function of circuit board mechanism, be difficult for the short circuit and corroded, be difficult for receiving external signal simultaneously and disturb.

2. This be used for compound PCB circuit board through setting up first installation mechanism and second installation mechanism, makes circuit board mechanism have better shock attenuation buffering, and difficult vibration damage, and rethread cooling mechanism dispels the heat to circuit board mechanism, and simultaneously casing and last casing heat radiating area are big down, and the radiating effect is more, and circuit board mechanism is difficult for the overheated operation, increase of service life.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the present invention;

fig. 3 is a cross-sectional view of the circuit board mechanism of the present invention.

In the figure: 1. a lower housing; 101. a first grid frame; 102. a waterproof breathable film; 2. a fixing mechanism; 201. a threaded hole; 202. locking the bolt; 3. an upper housing; 4. a first mounting mechanism; 401. a spring; 402. a second grid frame; 5. a second mounting mechanism; 6. a circuit board mechanism; 601. a circuit board body; 602. an epoxy resin; 603. a shielding mesh; 7. a cooling mechanism; 701. a temperature sensor; 702. a heat radiation fan; 8. a guide bar; 9. a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention discloses a composite PCB circuit board, including a lower housing 1, an upper housing 3 is mounted on the outer side of the upper surface of the lower housing 1 through a fixing mechanism 2, the lower housing 1 includes a first grid frame 101 and a waterproof breathable film 102, the waterproof breathable film 102 is fixedly adhered on the inner wall of the first grid frame 101, the first grid frame 101 has good heat dissipation performance, a first mounting mechanism 4 is fixedly mounted on the inner wall of the lower side of the lower housing 1, the first mounting mechanism 4 includes a spring 401 and a second grid frame 402, the spring 401 is fixedly mounted on the inner wall of the lower side of the first grid frame 101 in a rectangular shape, a second grid frame 402 is fixedly mounted between the upper surfaces of the spring 401, the second grid frame 402 prevents the heat dissipation of the circuit board mechanism 6 from being affected, a second mounting mechanism 5 is fixedly mounted on the inner wall of the upper side of the upper housing 3, the circuit board mechanism 6 is clamped and fixed between the first mounting mechanism 4 and the second mounting mechanism 5, and the cooling mechanism 7 is fixedly mounted on the lower inner wall of the lower shell 1 close to the middle of the lower inner wall.

Specifically, the structure of the upper housing 3 is the same as that of the lower housing 1.

In this embodiment, the upper case 3 has a good heat dissipation and waterproof effect as the lower case 1.

Specifically, the fixing mechanism 2 includes a threaded hole 201 and a locking bolt 202, the threaded hole 201 is formed in the left and right side walls of the lower casing 1 and the upper casing 3 in a rectangular shape, and the locking bolt 202 is installed in the threaded hole 201 in an internal thread manner.

In this embodiment, the locking bolt 202 is installed in the threaded hole 201 in a threaded manner, so that the lower shell 1 and the upper shell 3 can be conveniently fixed, and otherwise, the lower shell 1 and the upper shell 3 can be conveniently detached.

Specifically, the second mounting mechanism 5 has the same structure as the first mounting mechanism 4, and the second mounting mechanism 5 is a mirror image of the first mounting mechanism 4.

In this embodiment, the second mounting mechanism 5 can press and fix the upper surface of the circuit board mechanism 6.

Specifically, a guide rod 8 is fixedly installed on the inner wall of the lower side of the lower housing 1 corresponding to the spring 401, the guide rod 8 is movably inserted into the second installation mechanism 5, and a through hole 9 for the guide rod 8 to pass through is formed in the side wall of the second grid frame 402 corresponding to the guide rod 8.

In this embodiment, the guide rod 8 guides the spring 401 in the first mounting mechanism 4 and the second mounting mechanism 5, so that the extending and retracting process of the spring 401 is stable.

Specifically, the cooling mechanism 7 includes a temperature sensor 701 and a heat dissipation fan 702, and both the temperature sensor 701 and the heat dissipation fan 702 are fixedly mounted on the inner wall of the lower side of the lower housing 1.

In this embodiment, the temperature sensor 701 monitors the temperature of the circuit board mechanism 6, and when the temperature is higher than a set value, the heat dissipation fan 702 operates to start blowing and heat dissipation.

Specifically, the circuit board mechanism 6 includes a circuit board body 601, an epoxy 602 and a shielding mesh 603, the epoxy 602 is coated on the outer surface of the circuit board body 601, and the shielding mesh 603 is disposed on the outer surface of the epoxy 602.

In this embodiment, the epoxy resin 602 increases the corrosion prevention function of the circuit board body 601, and the shielding net 603 can shield the interference of the external signal to the circuit board body 601.

When in use, the circuit board mechanism 6 is placed in the second grid frame 402 in the first mounting mechanism 4, and then the locking bolt 202 in the fixing mechanism 2 is screwed into the threaded hole 201, so that the lower housing 1 and the upper housing 3 are locked and fixed, meanwhile, the second mounting mechanism 5 presses and fixes the upper surface of the circuit board mechanism 6, the spring 401 in the first mounting mechanism 4 and the second mounting mechanism 5 enables the second grid frame 402 to have a buffering and damping effect, namely, the circuit board mechanism 6 has a buffering and damping effect and is not easy to be damaged by vibration, meanwhile, the epoxy resin 602 in the circuit board mechanism 6 increases the anti-corrosion function of the circuit board body 601, the shielding net 603 can shield the interference of external signals to the circuit board body 601, then the temperature sensor 701 in the cooling mechanism 7 monitors the temperature of the circuit board mechanism 6, when the temperature is higher than a set value, the cooling fan 702 works, the hot air is blown out through the waterproof breathable film 102 and the first grid frame 101, so that the service life of the circuit board body 601 is prolonged.

To sum up, this a PCB circuit board for it is compound increases waterproof, shielding and anticorrosive function of circuit board mechanism 6, is difficult for the short circuit and is corroded, is difficult for receiving external signal simultaneously and disturbs, has better shock attenuation buffering and radiating effect, difficult vibration or overheated damage, long service life.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A PCB circuit board for compound type, includes casing (1) down, its characterized in that: the upper surface outside of lower casing (1) installs last casing (3) through fixed establishment (2), casing (1) includes first net frame (101) and waterproof ventilated membrane (102) down, fixed pasting has waterproof ventilated membrane (102) on the inner wall of first net frame (101), fixed installation has first installation mechanism (4) on the downside inner wall of casing (1) down, first installation mechanism (4) include spring (401) and second net frame (402), spring (401) are rectangle fixed mounting on the downside inner wall of first net frame (101), and fixed mounting has second net frame (402) between the upper surface of spring (401), fixed mounting has second installation mechanism (5) on the upside inner wall of last casing (3), centre gripping is fixed in circuit board mechanism (6) between first installation mechanism (4) and second installation mechanism (5), and a cooling mechanism (7) is fixedly arranged on the inner wall of the lower side of the lower shell (1) close to the middle part.

2. A PCB board for composite type according to claim 1, wherein: the structure of the upper shell (3) is the same as that of the lower shell (1).

3. A PCB board for composite type according to claim 1, wherein: the fixing mechanism (2) comprises a threaded hole (201) and a locking bolt (202), the left side wall and the right side wall of the lower shell (1) and the upper shell (3) are provided with the threaded hole (201) in a rectangular shape, and the locking bolt (202) is installed in the threaded hole (201) in an internal thread mode.

4. A PCB board for composite type according to claim 1, wherein: the second installation mechanism (5) is the same as the first installation mechanism (4) in structure, and the second installation mechanism (5) is arranged in a mirror image mode for the first installation mechanism (4).

5. A PCB board for composite type according to claim 1, wherein: and a guide rod (8) is fixedly installed on the inner wall of the lower side of the lower shell (1) corresponding to the spring (401), the guide rod (8) is movably inserted into the second installation mechanism (5), and a through hole (9) for the guide rod (8) to pass through is formed in the side wall of the second grid frame (402) corresponding to the guide rod (8).

6. A PCB board for composite type according to claim 1, wherein: the cooling mechanism (7) comprises a temperature sensor (701) and a heat dissipation fan (702), wherein the temperature sensor (701) and the heat dissipation fan (702) are fixedly installed on the inner wall of the lower side of the lower shell (1).

7. A PCB board for composite type according to claim 1, wherein: the circuit board mechanism (6) comprises a circuit board body (601), epoxy resin (602) and a shielding net (603), wherein the epoxy resin (602) is coated on the outer surface of the circuit board body (601), and the shielding net (603) is arranged on the outer surface of the epoxy resin (602).