CN211047750U - Support component - Google Patents

Abstract

An embodiment of the utility model provides a bracket component, include: the circuit board comprises a bracket, a circuit board and a chip; the chip is mounted on the circuit board; the circuit board is fixedly connected with the bracket; the bracket is provided with groove ribs corresponding to the chip; the chip is attached to the bracket through a heat dissipation material. In the embodiment of the utility model, the chip is contacted with the bracket by the heat dissipation material, so that the effective heat dissipation effect is generated on the chip; meanwhile, due to the structural characteristics of the groove ribs relative to the chip, a good shielding effect is achieved on the chip. Therefore, the embodiment of the utility model provides a both can solve among the prior art because of adopting the relatively poor problem of chip radiating effect that the support shield cover leads to, can also play better shielding effect to the chip.

Description

Support component

Technical Field

The utility model relates to a circuit board support technical field especially indicates a bracket component.

Background

When electronic components such as chips mounted on the circuit board work, electromagnetic radiation can be generated to interfere with each other, and in addition, the normal work of the chips can be influenced by external electromagnetic interference. To avoid the effect of electromagnetic radiation, it is common practice to provide a shield outside the chip. However, the chip generates a large amount of heat during operation, and the heat dissipation of the chip needs to be ensured while shielding electromagnetic radiation.

At present, the conventional heat dissipation method is to add heat dissipation material on the surface of the shielding case, so as to contact with the metal shell and the sheet metal part to conduct heat dissipation. The shielding cover comprises a shielding support and a shielding cover, the shielding cover is fixedly connected to the top of the shielding support, a gap is formed between the top of the shielding support, the shielding support is provided with an accommodating space communicated with the gap, the shielding support is used for being installed on a circuit board, and a chip is located in the accommodating space, so that heat generated by the chip is conducted to the outside of the shielding cover through the accommodating space, the gap and the through hole in sequence.

However, the following drawbacks exist with this form of construction: the heat that the chip produced is on the shield cover is conducted through the radiating mode of air to the minority, and on the mainboard was conducted through circuit board copper line to the majority, did not reach the radiating purpose of shield cover, and the radiating effect is relatively poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a bracket component can solve among the prior art because of adopting the relatively poor problem of chip radiating effect that the support shield cover leads to, can also play better shielding effect to the chip.

In order to solve the above technical problem, an embodiment of the present invention provides the following solutions:

a bracket assembly, comprising: the circuit board comprises a bracket, a circuit board and a chip;

the chip is mounted on the circuit board;

the circuit board is fixedly connected with the bracket;

the bracket is provided with groove ribs corresponding to the chip;

the chip is attached to the bracket through a heat dissipation material.

Optionally, a gap is provided between the groove rib and the circuit board.

Optionally, the groove rib is provided with a metal glue filling the gap.

Optionally, the metal glue contains metal particles and carbon particles.

Optionally, the height of the gap is 0.1 mm.

Optionally, the bracket is a die-cast bracket.

Optionally, the heat dissipation material is heat dissipation silica gel.

Optionally, the circuit board is fixedly connected with the bracket in a screwing manner.

The above technical scheme of the utility model at least include following beneficial effect:

according to the scheme of the utility model, the chip is in contact with the bracket through the heat dissipation material, so that the chip is effectively radiated; meanwhile, due to the structural characteristics of the groove ribs relative to the chip, a good shielding effect is achieved on the chip. Therefore, the above technical scheme of the utility model both can solve among the prior art because of adopting the relatively poor problem of chip radiating effect that the support shield cover leads to, can also play better shielding effect to the chip.

Drawings

Fig. 1 is a schematic structural view of a bracket according to an embodiment of the bracket assembly of the present invention;

fig. 2 is a schematic top view of a bracket according to an embodiment of the present invention;

fig. 3 is a schematic overall structure diagram of an embodiment of the bracket structure of the present invention;

fig. 4 is a schematic overall top view of an embodiment of the bracket structure of the present invention.

Fig. 5 is a schematic cross-sectional view taken along line D-D in fig. 4.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

As shown in fig. 1-5, an embodiment of the present invention provides a bracket assembly, including: a support 11, a circuit board 21 and a chip 22.

The chip 22 is mounted on the circuit board 21. Here, the number of the chips 22 may be 1 or more, depending on the need.

The circuit board 21 is fixedly connected with the bracket 11. The connection is generally fixed by screws (i.e. fixed by screwing).

The bracket 11 is provided with a groove rib 12 corresponding to the chip 22. The shape of the groove rib 12 is generally closed, and the shape thereof may be determined according to the design requirements of the circuit board 21.

The chip 22 is attached to the support 11 by a heat sink material 23. Usually, before the circuit board 21 and the bracket 11 are mounted and fixed, the heat dissipation material 23 (such as heat dissipation silica gel with good heat dissipation performance) is filled (or coated) on the chip 22, and then when the circuit board 21 and the bracket 11 are mounted and fixed, the chip 22 can be closely attached and contacted with the bracket 11 through the heat dissipation material 23, so that heat generated by the chip 22 can be conducted to the bracket 11 through the heat dissipation material 23, and further effective heat dissipation of the chip 22 is realized (the heat conduction efficiency is higher than that of the conventional air conduction efficiency). In addition, because the groove rib 12 is arranged on the bracket 11, when the circuit board 21 and the bracket 11 are fixedly mounted, the chip 22 correspondingly falls (enters) into the groove formed by the groove rib 12, and therefore the groove rib 12 can have a good shielding effect on the chip 22. Of course, if the gap between the groove rib 12 and the circuit board 21 is filled with a shielding material, the shielding effect is better.

As can be seen from the above, in the embodiment of the bracket assembly of the present invention, the chip 22 is in contact with the bracket 11 through the heat dissipation material 23, so that an effective heat dissipation effect is generated on the chip 22; meanwhile, due to the structural characteristics of the groove ribs 12 relative to the chip 22, a good shielding effect is achieved on the chip 22. Therefore, the embodiment of the utility model provides a both can solve among the prior art because of adopting the relatively poor problem of chip radiating effect that the support shield cover leads to, can also play better shielding effect to the chip.

In another embodiment of the bracket assembly of the present invention, a gap is left between the groove rib 12 and the circuit board 21. The height of clearance can be set to 0.1mm to it is right to do benefit to follow-up through shielding material thereby it fills to reach and solve the too big problem of shielding gap, and realize right the better shielding effect of chip 22.

In another embodiment of the bracket assembly of the present invention, the groove rib 12 is filled with the metal glue in the gap, so that there is no gap between the groove rib 12 and the circuit board 21, and the better shielding effect of the chip 22 is achieved. In operation, metal paste can be dispensed on the groove rib 12 at the position corresponding to the circuit board 21 to solve the problem of too large shielding gap. The metal glue can contain metal particles and carbon particles, so that the metal glue can be compressed and elastic after being dried, and the shielding effect is improved.

In another embodiment of the present invention, the bracket 11 is formed by die casting, so as to save material cost.

To sum up, the utility model discloses the embodiment of bracket component has not only overcome the relatively poor problem of support shield cover radiating effect among the prior art, has also cancelled the shield cover moreover, has consequently simplified technology and has saved the material cost.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims (8)

1. A mount assembly, comprising: the circuit board comprises a bracket, a circuit board and a chip;

the chip is mounted on the circuit board;

the circuit board is fixedly connected with the bracket;

the bracket is provided with groove ribs corresponding to the chip;

the chip is attached to the bracket through a heat dissipation material.

2. The bracket assembly of claim 1, wherein a gap is provided between the channel rib and the circuit board.

3. The bracket assembly of claim 2, wherein the recessed ribs have a metal glue thereon that fills the gaps.

4. The stent assembly of claim 3, wherein the metal gel comprises metal particles and carbon particles.

5. The bracket assembly of claim 2, wherein the gap has a height of 0.1 mm.

6. The bracket assembly of claim 1, wherein the bracket is a die cast bracket.

7. The bracket assembly of claim 1, wherein the heat dissipating material is a heat dissipating silicone.

8. The bracket assembly of claim 1, wherein the circuit board is fixedly coupled to the bracket in a threaded manner.

Images