CN213280432U - Unmanned intelligent platform is little terminal heat radiation structure of network deployment communication certainly - Google Patents
Unmanned intelligent platform is little terminal heat radiation structure of network deployment communication certainly Download PDFInfo
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- CN213280432U CN213280432U CN202021298241.6U CN202021298241U CN213280432U CN 213280432 U CN213280432 U CN 213280432U CN 202021298241 U CN202021298241 U CN 202021298241U CN 213280432 U CN213280432 U CN 213280432U
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Abstract
The utility model discloses an unmanned intelligent platform is little terminal heat radiation structure of network deployment communication. The problem that the calculated amount is big, calorific capacity is high when carrying out the ad hoc network communication to unmanned intelligent platform micro terminal, through the metal heat radiation structure device that adopts the reinforcing design and multilayer structure's conducting material, increase heat radiating area effectively to aluminium system product shell through inner wall and heat conduction material contact takes out the heat of inside fast, adopts the flexible heat conduction material of one deck to strengthen the radiating effect when multilayer structure conducting material top unevenness. Use the utility model provides a radiator structure can dispel the heat more fast effectively, guarantees the working property of chip, maintains terminal equipment and entire system's normal work.
Description
Technical Field
The utility model relates to a heat radiation structure, especially a little terminal heat radiation structure of unmanned intelligent platform ad hoc network communication.
Background
With the development of the artificial intelligence technology, the application of the unmanned intelligent equipment and the platform is more and more extensive. Unmanned intelligent platforms such as intelligent robot, intelligent car, unmanned aerial vehicle need carry out the ad hoc network communication when the operation to guarantee the interconnection between the equipment.
When the electronic components work, a large amount of heat is generated, so that the temperature of the electronic components and the equipment and the system to which the electronic components belong is increased. When the temperature is too high, the performance of the electronic components and the system thereof is reduced. Therefore, the installation of a heat sink on an electronic device to help discharge the heat generated by the electronic device plays an important role in ensuring the normal operation of the electronic device and system.
The mainboard chip on the ad hoc network communication micro-terminal device of the unmanned intelligent platform has the advantages of large calculation amount to be processed, high communication requirement, large chip power consumption and more generated heat. Therefore, the design of the heat sink structure has a great impact on the performance of the unmanned smart platform.
The conventional heat dissipation mode of electronic equipment is to add heat conduction materials between the contact surfaces of electronic components and radiators, and to make the heat generated by the electronic components be dissipated through the shielding cover or the shell of the metal structure through heat conduction silica gel or heat conduction silicone grease. Fig. 1 shows a heat dissipation structure of a conventional product. Wherein 101 is a printed circuit board, 102 and 103 are electronic components mounted on the printed circuit board, 104 is a metal structure shielding case mounted on the printed circuit board, and 105 is a heat conductive silicone or a heat conductive silicone grease for enhancing the heat dissipation effect of 102. However, the main processing module of the communication micro terminal of the unmanned intelligent platform device usually comprises a CPU and a GPU with strong performance, a large amount of operations are required, and heat dissipation cannot be sufficiently performed only by the heat-conducting silicone grease attached to the core components, thereby affecting the performance of the whole device and system.
Disclosure of Invention
Object of the Invention
The utility model aims at providing a heat radiation structure to the little terminal of unmanned intelligent platform ad hoc network communication because the calculated amount is big, the communication requires highly and the high, the big problem of calorific capacity of consumption that leads to. Through the metal heat radiation structure device and the conducting material of multilayer structure who adopts the reinforcing design, increase heat radiating area effectively to aluminium system product shell through inner wall and heat conduction material contact takes away inside heat fast. Use the utility model provides a heat radiation structure can dispel the heat more fast effectively, guarantees the working property of chip, maintains terminal equipment and entire system's normal work.
Technical solution
In order to satisfy a large amount of heat dissipation demands that unmanned intelligent platform micro terminal carried out ad hoc network communication and intelligence and calculated, the utility model provides a heat radiation structure adopts following technical scheme: the utility model provides an unmanned intelligent platform ad hoc network communication micro terminal device with heat radiation structure is suitable for includes circuit board, input/output subassembly and construction assembly etc. as shown in figure 2.
The utility model provides a heat radiation structure, including printed circuit board, electronic components, metallic structure shield cover, heat conduction silica gel or heat conduction silicone grease, metal heat radiation structure device, multilayer structure conducting material and aluminium system product shell. Furthermore, the metal structure shielding cover is arranged on the printed circuit board and covers a plurality of electronic components which are attached to the printed circuit board and have large heat productivity, and the contact surfaces of the metal structure shielding cover and the electronic components are coated with heat conduction silica gel or heat conduction silica grease.
Furthermore, the metal heat dissipation structure device is attached to the printed circuit board and located beside the metal structure shielding case, and is used for discharging heat generated by the electronic components accumulated on the printed circuit board.
Furthermore, the multilayer structure conductive material is attached above the metal structure shielding cover on the printed circuit board and the metal heat dissipation structure device, and the lower surface of the multilayer structure conductive material is contacted with the upper surfaces of the metal structure shielding cover and the metal heat dissipation structure device.
Furthermore, when the top ends of the metal structure shielding cover and the metal heat dissipation structure device on the printed circuit board are not on the same horizontal plane, a layer of flexible heat conduction material is added above the multi-layer structure conductive material to assist in contact and heat dissipation.
Furthermore, the aluminum shell with the rapid heat dissipation capability has the rapid heat dissipation capability, and the inner wall of the aluminum shell is in contact with the multi-layer structure conductive material or the flexible heat conduction material, so that heat generated in the electronic equipment can be rapidly taken out.
The utility model provides a heat radiation structure has increased heat radiating area effectively to aluminium system product shell through with the heat conduction material contact has further accelerated the speed of heat conduction.
Technical effects
The utility model provides a heat radiation structure has increased heat radiating area through the conducting material who adopts metal heat radiation structure device and multilayer structure effectively to aluminium system product shell through inner wall and heat conduction material contact takes the heat of inside out fast. Compare and only rely on heat conduction silicone grease or heat conduction silica gel of pasting on core components and parts to dispel the heat in general heat radiation structure, the utility model provides a heat radiation structure can dispel the heat more fast effectively, guarantees the working property of chip. When each micro terminal of the unmanned intelligent platform needs to perform ad hoc network communication and action decision, heat caused by a large amount of calculation can be rapidly discharged, so that normal work of terminal equipment and the whole system is guaranteed.
Drawings
Fig. 1 is a schematic diagram of a heat dissipation structure of a conventional general product. In the figure: 101-a printed circuit board; 102-electronic components; 103-electronic components; 104-metallic structural shielding case; 105-thermally conductive silicone or thermally conductive silicone grease.
Fig. 2 is a schematic diagram of an electronic device implemented.
Fig. 3 is a schematic view of an example of an improved heat sink structure design of the present invention. In the figure: 101-a printed circuit board; 102-electronic components; 103-electronic components; 104-metallic structural shielding case; 105-thermally conductive silicone or thermally conductive silicone grease; 106-conductive material of multilayer structure; 107-aluminum housing; 108-metal heat sink structure means.
Fig. 4 is a schematic diagram of an example of an improved heat sink structure design of the present invention. In the figure: 101-a printed circuit board; 102-electronic components; 103-electronic components; 104-metallic structural shielding case; 105-thermally conductive silicone or thermally conductive silicone grease; 106-conductive material of multilayer structure; 107-aluminum housing; 108-a metal heat sink structure device; 109-thermally conductive material.
Detailed Description
The following detailed description is made of the heat dissipation structure according to the present invention with reference to the following embodiments and accompanying drawings:
fig. 1 shows a design of a heat dissipation structure of a conventional general product, where 101 is a printed circuit board, 102 and 103 are electronic components mounted on the printed circuit board, 104 is a metal structure shield mounted on the printed circuit board, and 105 is a heat conductive silicone or a heat conductive silicone grease for enhancing a heat dissipation effect of 102.
When the micro terminal is used for the micro terminal of the unmanned intelligent platform, as the micro terminal needs to carry out a large amount of calculation when carrying out the decision of ad hoc network communication and action, more heat can be generated, and the generated large amount of heat is difficult to effectively discharge by only depending on the heat-conducting silicone grease or the heat-conducting silicone rubber attached to the core component for heat dissipation.
The example of the heat dissipation structure provided by the utility model is shown in fig. 3. Wherein 101 is a printed circuit board, 102 and 103 are electronic components mounted on the printed circuit board, 104 is a metal structure shielding case mounted on the printed circuit board, and 105 is a heat conductive silicone or a heat conductive silicone grease for enhancing the heat dissipation effect of 102. 108 is a metal heat dissipation structure device with enhanced design, which is attached to 101 and can dissipate the heat accumulated on the printed circuit board to enhance the heat dissipation capability of the whole product. 107 is a specially designed aluminum housing with rapid heat dissipation capability. 106 are conductive materials with a multilayer structure, which can increase the heat dissipation area of the product. Which is attached over 104 and 108 for contact with the product structure housing 107.
When the top ends of 104 and 108 are not at the same level, a layer of flexible heat conducting material 109 is added, as shown in fig. 4. 109 is used to assist 106 and 107 contact, improve the uneven top of 106 caused by the height difference between 104 and 108, and quickly take out the heat inside the electronic device through the aluminum shell, thus enhancing the heat dissipation effect.
Claims (2)
1. The utility model provides a little terminal heat radiation structure of unmanned intelligent platform ad hoc network communication which characterized in that: the heat dissipation structure comprises a printed circuit board, electronic components, a metal structure shielding cover, heat conduction silica gel or heat conduction silicone grease, a metal heat dissipation structure device, a multilayer structure conductive material and an aluminum product shell; the electronic component is arranged on the printed circuit board; the metal structure shielding cover is arranged on the printed circuit board and covers the electronic component with large heat productivity; the heat-conducting silica gel or the heat-conducting silica gel is coated on the contact surface of the electronic component with large heat productivity and the metal structure shielding case; the metal heat dissipation structure device is attached to the printed circuit board and positioned beside the metal structure shielding cover; the multilayer structure conductive material is arranged above the metal structure shielding cover and the metal heat dissipation structure device, and the lower surface of the multilayer structure conductive material is contacted with the upper surfaces of the metal structure shielding cover and the metal heat dissipation structure device; the aluminum product housing is mounted over the other components with the inner wall in contact with the multi-layer structure conductive material.
2. The unmanned intelligent platform ad hoc network communication micro-terminal heat dissipation structure of claim 1, wherein: when the top ends of the metal structure shielding cover and the metal heat dissipation structure device are not on the same horizontal plane, a layer of flexible heat conduction material is pasted above the multi-layer structure conductive material, and at the moment, the inner wall of the aluminum product shell is in contact with the flexible heat conduction material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021298241.6U CN213280432U (en) | 2020-07-06 | 2020-07-06 | Unmanned intelligent platform is little terminal heat radiation structure of network deployment communication certainly |
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| CN202021298241.6U CN213280432U (en) | 2020-07-06 | 2020-07-06 | Unmanned intelligent platform is little terminal heat radiation structure of network deployment communication certainly |
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| CN213280432U true CN213280432U (en) | 2021-05-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698887A (en) * | 2020-07-06 | 2020-09-22 | 塔盾信息技术(上海)有限公司 | Novel unmanned intelligent platform ad hoc network communication micro-terminal radiator structure device |
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2020
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698887A (en) * | 2020-07-06 | 2020-09-22 | 塔盾信息技术(上海)有限公司 | Novel unmanned intelligent platform ad hoc network communication micro-terminal radiator structure device |
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