CN216982181U - Printed board structure of high power density power module - Google Patents
Printed board structure of high power density power module Download PDFInfo
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- CN216982181U CN216982181U CN202122984955.3U CN202122984955U CN216982181U CN 216982181 U CN216982181 U CN 216982181U CN 202122984955 U CN202122984955 U CN 202122984955U CN 216982181 U CN216982181 U CN 216982181U
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- circuit board
- printed circuit
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- power density
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Abstract
The utility model discloses a printed board structure of a high-power-density power supply module, which comprises a multilayer printed circuit board, a thin printed circuit board and leads, wherein the multilayer printed circuit board is used for mounting a magnetic device and a power device, the thin printed circuit board is arranged opposite to the multilayer printed circuit board and is used for mounting components, the thin printed circuit board is electrically connected with the multilayer printed circuit board by the leads, the multilayer printed circuit board is provided with a first surface opposite to the thin printed circuit board and a second surface far away from the thin printed circuit board, and the magnetic device is embedded in the first surface and the second surface of the multilayer printed circuit board. The utility model solves the problem of lower power density of a single multilayer thick copper printed circuit board.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a printed board structure of a high-power-density power module.
Background
In recent years, with the development of aerospace and aviation equipment in China towards intellectualization, informatization, light weight and the like, the requirements of a multi-electrochemical and all-electric power supply system are put forward for the aerospace and aviation equipment, so that the requirements of intellectualization, light weight and the like of the equipment are met.
Conventional circuit board structures typically employ either a single-sided aluminum substrate or a single multilayer thick copper printed circuit board. The advantages are that: simple structure and easy operation. The disadvantages are that: the aluminum substrate can only be provided with single-layer components, the utilization rate is low, the welding strength of the patch lead is insufficient, and the aluminum substrate cannot adapt to high-reliability occasions; the power density of the single multilayer thick copper printed circuit board is low, and only the occasion with low power density is applied.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a printed board structure of a high-power-density power supply module, which solves the technical problem of low power density of a single multilayer thick copper printed circuit board.
In order to achieve the above object, the present invention provides a printed board structure of a high power density power supply module, including:
the multilayer printed circuit board is used for mounting a magnetic device and a power device;
a thin printed circuit board disposed opposite to the multilayer printed circuit board and used for mounting components;
the thin printed circuit board is electrically connected with the multilayer copper printed circuit board by a lead;
the multilayer printed circuit board is provided with a first surface opposite to the thin printed circuit board and a second surface far away from the thin printed circuit board, and the magnetic device is embedded in the first surface and the second surface of the multilayer printed circuit board.
Optionally, the power device is disposed proximate to the second side of the multilayer printed circuit board.
Optionally, the thin printed circuit board has a first surface opposite to the multilayer printed circuit board and a second surface far away from the multilayer printed circuit board, and the component is disposed on the second surface of the thin printed circuit board.
Optionally, the multilayer printed circuit board is provided with at least one magnetic core slot, the magnetic device includes a winding and a magnetic core, the winding is wound on the multilayer printed circuit board, and the magnetic core slot is used for fixing the magnetic core.
Optionally, the thin printed circuit board is electrically connected to the multilayer copper printed circuit board by a lead.
Optionally, the wire is a copper wire.
Optionally, the lead includes a first segment, a second segment, and a third segment, the first segment, the second segment, and the third segment are integrally formed, a diameter of the second segment is greater than a diameter of the first segment, and a diameter of the second segment is greater than a diameter of the third segment.
Optionally, the first end of the first segment is connected to the multi-layer printed circuit board by means of through-hole soldering, and the first end of the third segment is connected to the thin printed circuit board by means of through-hole soldering.
Optionally, the printed board structure of the high power density power module further includes a housing and a cover, the housing and the cover are capable of being covered, and when the housing and the cover are covered, a housing cavity for housing the multilayer printed circuit board, the thin printed circuit board, the magnetic device, the power device, and the component is formed.
Optionally, the housing is an aluminum housing and is disposed proximate to the second side of the multilayer printed circuit board.
Optionally, the printed board structure of the high power density power module further includes a magnetic device, a power device, and a component, where the magnetic device, the power device, and the component form a power circuit.
Among the above-mentioned technical scheme, the printed board structure of high power density power module includes multilayer printed circuit board, slim printed circuit board and lead wire, wherein, through slim printed circuit board with multilayer printed circuit board sets up relatively, and with slim printed circuit board with multilayer copper printed circuit board fixed connection, multilayer printed circuit board at this moment can be used for installing magnetic device and power device, and slim printed circuit board can be used for installing components and parts, multilayer printed circuit board have with relative first face of slim printed circuit board and keep away from slim printed circuit board's second face, magnetic device inlay in multilayer printed circuit board's first face and second face. Through the scheme, the magnetic device and the power device occupying larger volume can be arranged between the multilayer printed circuit board and the thin printed circuit board, so that the power density of the height space is improved, and the technical problem that the power density of a single multilayer thick copper printed circuit board is lower is solved.
Drawings
The utility model is further described below with reference to the accompanying drawings and examples;
fig. 1 is an exploded view of a printed board structure of a high power density power module according to an embodiment.
Fig. 2 is an assembly diagram of a printed board structure of a high power density power module in one embodiment.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In one embodiment, as shown in fig. 1, the printed board structure of the high power density power module includes a multi-layer printed circuit board 10 and a thin printed circuit board 20, the thin printed circuit board 20 is disposed opposite to the multi-layer printed circuit board 10, the thin printed circuit board 20 is electrically connected to the multi-layer copper printed circuit board by using leads 102, the multi-layer printed circuit board 10 has a first surface opposite to the thin printed circuit board 20 and a second surface far from the thin printed circuit board 20, and magnetic devices are embedded in the first surface and the second surface of the multi-layer printed circuit board 10.
According to the technical scheme, the magnetic device and the power device which occupy larger volume can be arranged between the multilayer printed circuit board 10 and the thin printed circuit board 20, so that the power density of the height space is improved, and the technical problem that the power density of a single multilayer thick copper printed circuit board is lower is solved. It should be noted that the multilayer printed circuit board 10 is used for mounting the magnetic device and the power device so as to be more beneficial to saving space, thereby making full use of the height space to increase the power density, but if there is still more space besides mounting the magnetic device and the power device, other components may be mounted on the multilayer printed circuit board 10.
Optionally, the multilayer printed circuit board 10 is a multilayer thick copper printed circuit board.
In one embodiment, the thin printed circuit board 20 is electrically connected to the multi-layer copper printed circuit board by leads 102.
The leads 102 not only have the function of fixing the thin printed circuit board 20 and the multilayer copper printed circuit board, but also can perform signal interaction between the thin printed circuit board 20 and the multilayer copper printed circuit board, and the specific number and the position of the leads 102 can be set according to the signal interaction between the thin printed circuit board 20 and the multilayer copper printed circuit board, so that the multiplexing of the leads 102 is realized.
In one embodiment, the power device is disposed proximate to the second side of the multi-layer printed circuit board 10.
Since the second surface of the multi-layer printed circuit board 10 is distant from the thin printed circuit board 20 and is structurally close to the metal housing 30, heat dissipation can be facilitated.
In an embodiment, the thin printed circuit board 20 has a first surface opposite to the multi-layer printed circuit board 10 and a second surface far away from the multi-layer printed circuit board 10, and the components are disposed on the second surface of the thin printed circuit board 20 and structurally far away from the heat-generating power device, so that heat dissipation can be facilitated and influence from other heat sources can be avoided.
The components are arranged on the second surface of the thin printed circuit board 20, and the middle of the thin printed circuit board 20 and the multilayer printed circuit board 10 is avoided, so that the multilayer printed circuit board 10 can be conveniently and further produced, processed and debugged.
In one embodiment, as shown in fig. 1, the multi-layer printed circuit board 10 is provided with at least one magnetic core slot 101, and the magnetic device comprises a winding and a magnetic core, wherein the winding is wound on the multi-layer printed circuit board 10, and the magnetic core slot is used for fixing the magnetic core.
At this time, the magnetic core slot 101 is provided for installing the winding and the magnetic core, so that the position stability of the magnetic device in the subsequent use and transportation process can be ensured. The power density can be further increased by utilizing the height space and the volume space of the multilayer printed circuit board 10.
In one embodiment, the leads 102 are copper leads.
The copper lead has good structural support characteristics and conductive performance.
In one embodiment, the lead 102 includes a first section, a second section and a third section, the first section, the second section and the third section are integrally formed, the second section has a diameter larger than that of the first section, and the second section has a diameter larger than that of the third section.
At this time, the lead 102 is configured such that the first section and the second section have a smaller diameter than the third section, so that the relative distance between the thin printed circuit board 20 and the multilayer printed circuit board 10 can be easily limited, and the magnetic device disposed therebetween can be prevented from being pressed.
In one embodiment, the first end of the first segment is connected to the multi-layer printed circuit board 10 by through-hole soldering, and the first end of the third segment is connected to the low profile printed circuit board 20 by through-hole soldering.
Through-hole soldering allows for tighter connections between the leads 102 and the multilayer printed circuit board 10 and between the leads 102 and the thin printed circuit board 20.
In an embodiment, as shown in fig. 2, the printed board structure of the high power density power module further includes a housing 30 and a cover 40, where the housing 30 and the cover 40 can be covered and form a receiving cavity for receiving the multilayer printed circuit board 10, the thin printed circuit board 20, the magnetic device, the power device, and the components when covered.
The cover body 40 is actually a cap, and can enclose the components in the accommodating cavity after the multilayer printed circuit board 10, the thin printed circuit board 20, the magnetic device, the power device and the components are combined, so that the structure and the electronic device are separated from the external environment, corrosion of external water vapor, dust and the like to the circuit board or the electronic components is effectively prevented, and a better protection effect is achieved.
Alternatively, the housing 30 is an aluminum housing disposed adjacent to the second side of the multilayer printed circuit board 10, so that better heat dissipation can be achieved.
In an embodiment, the printed board structure of the high power density power module further includes a magnetic device, a power device, and components, and the magnetic device, the power device, and the components form a power circuit.
In the prior art, the demand for power supplies, in particular DC/DC converters, is increasing, and higher demands are made on the power and power density of DC/DC converters. In the present application, by adopting the printed board structure of the high power density power module, the magnetic device and the power device of the power circuit are mounted on the multilayer printed circuit board 10, and the components of the power circuit are mounted on the thin printed circuit board 20, so that the power density of the height space of the single multilayer thick copper printed circuit board is improved.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
Claims (10)
1. A printed board structure of a high power density power supply module, the printed board structure of the high power density power supply module comprising:
the multilayer printed circuit board is used for mounting a magnetic device and a power device;
a thin printed circuit board disposed opposite to the multilayer printed circuit board and used for mounting components;
the thin printed circuit board is electrically connected with the multilayer printed circuit board by a lead;
the multilayer printed circuit board is provided with a first surface opposite to the thin printed circuit board and a second surface far away from the thin printed circuit board, and the magnetic device is embedded in the first surface and the second surface of the multilayer printed circuit board.
2. The printed board structure of a high power density power supply module according to claim 1, wherein said power device is disposed adjacent to a second side of said multilayer printed circuit board.
3. The printed board structure of a high power density power module of claim 1, wherein the low profile printed circuit board has a first side opposite the multilayer printed circuit board and a second side remote from the multilayer printed circuit board, the component being disposed on the second side of the low profile printed circuit board.
4. The printed board structure of a high power density power module according to claim 1, wherein the multilayer printed circuit board is provided with at least one magnetic core slot, and the magnetic device comprises a winding and a magnetic core, the winding is wound on the multilayer printed circuit board, and the magnetic core slot is used for fixing the magnetic core.
5. The printed board structure of a high power density power module according to claim 1, wherein said thin printed circuit board is electrically connected to said multilayer printed circuit board by leads.
6. The printed board structure of a high power density power module according to claim 5, wherein the lead comprises a first section, a second section and a third section, the first section, the second section and the third section are integrally formed, the diameter of the second section is larger than that of the first section, and the diameter of the second section is larger than that of the third section.
7. The printed board structure of a high power density power supply module according to claim 6, wherein the first end of the first segment is connected to the multi-layer printed circuit board by through-hole soldering, and the first end of the third segment is connected to the thin printed circuit board by through-hole soldering.
8. The printed board structure of a high power density power module according to claim 1, wherein the printed board structure of a high power density power module further comprises a housing and a cover, the housing and the cover can be covered and form a cavity for accommodating the multilayer printed circuit board, the thin printed circuit board, the magnetic device, the power device and the components when the housing and the cover are covered.
9. The printed board structure of a high power density power supply module according to claim 8, wherein said housing is an aluminum housing and is disposed adjacent to a second side of said multilayer printed circuit board.
10. The printed board structure of a high power density power module according to any one of claims 1-9, wherein the printed board structure of a high power density power module further comprises a magnetic device, a power device and components, and the magnetic device, the power device and the components form a power circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122984955.3U CN216982181U (en) | 2021-11-29 | 2021-11-29 | Printed board structure of high power density power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122984955.3U CN216982181U (en) | 2021-11-29 | 2021-11-29 | Printed board structure of high power density power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216982181U true CN216982181U (en) | 2022-07-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122984955.3U Active CN216982181U (en) | 2021-11-29 | 2021-11-29 | Printed board structure of high power density power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216982181U (en) |
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2021
- 2021-11-29 CN CN202122984955.3U patent/CN216982181U/en active Active
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